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8
H8/3048B Group
Hardware Manual Renesas 8-Bit Single-Chip Microcomputer H8 Family/H8/300H Series
H8/3048B H8/3048F-ONE HD6433048B HD6433048BV HD64F3048B HD64F3048BV
Rev. 3.00 Revision Date: Sep 27, 2006
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any thirdparty's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
Rev. 3.00 Sep 27, 2006 page ii of xxvi
General Precautions on Handling of Product
1. Treatment of NC Pins Note: Do not connect anything to the NC pins. The NC (not connected) pins are either not connected to any of the internal circuitry or are used as test pins or to reduce noise. If something is connected to the NC pins, the operation of the LSI is not guaranteed. 2. Treatment of Unused Input Pins Note: Fix all unused input pins to high or low level. Generally, the input pins of CMOS products are high-impedance input pins. If unused pins are in their open states, intermediate levels are induced by noise in the vicinity, a passthrough current flows internally, and a malfunction may occur. 3. Processing before Initialization Note: When power is first supplied, the product's state is undefined. The states of internal circuits are undefined until full power is supplied throughout the chip and a low level is input on the reset pin. During the period where the states are undefined, the register settings and the output state of each pin are also undefined. Design your system so that it does not malfunction because of processing while it is in this undefined state. For those products which have a reset function, reset the LSI immediately after the power supply has been turned on. 4. Prohibition of Access to Undefined or Reserved Addresses Note: Access to undefined or reserved addresses is prohibited. The undefined or reserved addresses may be used to expand functions, or test registers may have been be allocated to these addresses. Do not access these registers; the system's operation is not guaranteed if they are accessed.
Rev. 3.00 Sep 27, 2006 page iii of xxvi
Rev. 3.00 Sep 27, 2006 page iv of xxvi
Preface
The H8/3048B Group is a series of high-performance microcontrollers that integrate system supporting functions together with an H8/300H CPU core. In addition, the H8/3048F-ONE is 2 equipped with an on-chip emulator (E10T)* . The H8/300H CPU has a 32-bit internal architecture with sixteen 16-bit general registers, and a concise, optimized instruction set designed for speed. It can address a 16-Mbyte linear address space.
2 The on-chip emulator (E10T)* has functions that allow it to emulate directly a microcontroller mounted on the user board. This makes possible on-board program debugging.
The on-chip supporting functions include ROM, RAM, a 16-bit integrated timer unit (ITU), a programmable timing pattern controller (TPC), a watchdog timer (WDT), a serial communication interface (SCI), an A/D converter, a D/A converter, I/O ports, a direct memory access controller (DMAC), a refresh controller, and other facilities. Of the two SCI channels, one has been expanded to support the ISO/IEC7816-3 smart card interface. Functions have also been added to reduce power consumption in battery-powered applications: individual modules can be placed in standby, and the frequency of the system clock supplied to the chip can be divided down under software control. The address space is divided into eight areas. The data bus width and access cycle length can be selected independently in each area, simplifying the connection of different types of memory. Seven operating modes (modes 1 to 7) are provided, offering a choice of data bus width and address space size. With these features, the H8/3048B Group can be used to implement compact, high-performance systems easily.
1 Versions with either flash memory (F-ZTATTM* ) or mask ROM as the on-chip ROM are available. This enables users to respond quickly and flexibly to changing application specifications from the initial production stage through full-scale volume production.
This manual describes the H8/3048B Group hardware. For information on H8/3048 Group products, please refer to the H8/3048 Group Hardware Manual. For details of the instruction set, refer to the H8/300H Series Programming Manual. Notes: 1. F-ZTAT (Flexible ZTAT) is a trademark of Renesas Technology Corp. 2. An on-chip emulator (E10T) is not provided in the mask ROM version.
Rev. 3.00 Sep 27, 2006 page v of xxvi
Notes on using the on-chip emulator (E10T) installed in the H8/3048F-ONE H8/3048 Group products and H8/3048B Group products have different specifications regarding the pin arrangement (pin 1, VCL), flash memory, and maximum operating frequency. Refer to Comparison of H8/3048 Group Product Specifications for details of these differences. Notes: When using an on-chip emulator (E10T) for H8/3048 program development and debugging, the following restrictions must be noted. 1. Only programs in the on-chip flash memory can be developed and debugged. Consequently, emulation is not possible for programs in external memory or in the no-ROM mode. 2. Refresh controller and DMAC operation are not supported, so settings should not be made to the registers for these modules. 3. During break mode of on-chip emulation, the watchdog timer stops counting. Accordingly, the counter value may be invalid after resuming from the break mode. 4. The FWE (BRK) pin and pins P91, P93, and P95 are reserved for the E10T, and cannot be used. 5. Area H'F7000 to H'F7FFF in 1-M address mode (area H'FF7000 to H'FF77FF in 16-M address mode) is used by the E10T, and is not available to the user. 6. The initial program instructions following a reset should be initialize stack pointer (SP) and read mode register (MDCR). (After initializing SP using the MOV.L instruction, use the MOV.B instruction to read the MDCR register.) 7. Emulation of the hardware standby mode is not supported.
Rev. 3.00 Sep 27, 2006 page vi of xxvi
Comparison of H8/3048 Group Product Specifications
There are eight members of the H8/3048 Group; the H8/3048F-ZTAT (H8/3048F* , H8/3048F2 ONE* ), H8/3048ZTAT, H8/3048 mask ROM version, H8/3048B mask ROM version, H8/3047
1
mask ROM version, H8/3045 mask ROM version, and H8/3044 mask ROM version. The specifications of each model is compared below. Notes: 1. H8/3048F has dual power supply with flash memory installed. 2. H8/3048F-ONE has single power supply with flash memory and E10T installed.
Hardware Manual ROM Type Model Type ZTAT H8/3048 H8/3048 Group (Rev. 7.0) Mask ROM H8/3048 mask ROM version H8/3047 mask ROM version H8/3045 mask ROM version H8/3044 mask ROM version Mask ROM model H8/3048F F-ZTAT H8/3048F-ONE H8/3048B Group (Rev. 3.0) Mask ROM H8/3048B mask ROM version
Model Spec
PROM model
Dual power supply, flash memory is installed
Mask ROM Single power model supply, flash memory installed, internal stepdown (5 V operation model), high-speed operation model Refer to 1.4.3, Differences between H8/3048F and H8/3048F-ONE. HD64F3048B (5 V operation model) HD64F3048BV (3 V operation model) HD6433048B (5 V operation model) HD6433048BV (3 V operation model)
Refer to 1.4, Differences between H8/3048F and H8/3048F-ONE. Model Type No. HD6473048 HD6433048 HD6433047 HD6433045 HD6433044 HD64F3048
Pin Assignment
Refer to figure 1.2, Pin Arrangement of H8/3048ZTAT, H8/3048 Mask ROM Version, H8/3047 Mask ROM Version, H8/3045 Mask ROM Version, H8/3044 Mask ROM Version, and H8/3048F (FP-100B or TFP-100B, Top View), in section 1.
5-V operation models have a VCL pin and an external capacitor must be connected. Refer to figure 1.3, H8/3048F-ONE Pin Arrangement (FP-100B or TFP100B, Top View), in section 1.
Rev. 3.00 Sep 27, 2006 page vii of xxvi
Hardware Manual ROM Type ZTAT
H8/3048 Group (Rev. 7.0) Mask ROM H8/3048: 4 kbytes H8/3047: 4 kbytes H8/3045: 2 kbytes H8/3044: 2 kbytes H8/3048: 128 kbytes H8/3047: 96 kbytes H8/3045: 64 kbytes H8/3044: 32 kbytes -- 4 kbytes F-ZTAT 4 kbytes
H8/3048B Group (Rev. 3.0) Mask ROM
RAM Capacity 4 kbytes
ROM Capacity 128 kbytes
128 kbytes
128 kbytes
Flash Memory
--
Refer to section 19, Flash Memory (H8/3048F Dual Power Supply).
Refer to section 18, ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
--
Clock Pulse Generator Power-Down State
Refer to section 20, Clock Pulse Generator. Refer to section 21, Power-Down State.
Refer to section 19, Clock Pulse Generator. Refer to section 20, Power-Down State.
Clock oscillator settling time: Waiting time of up to 131072 Clock oscillator settling time: Waiting states time of up to 262144 states Electrical Refer to table 22.1, Electrical Characteristics of H8/3048 Characteristics Group Products, in section 22. (Clock Rate) 1 to 18 MHz 1 to 16 MHz Refer to table 21.1, Electrical Characteristics of H8/3048 Group and H8/3048B Group Products, in section 21. 5 V operation models: 2 to 25 MHz, 3 V operation models: 2 to 25 MHz.
List of Registers
Refer to table B.1, Comparison of H8/3048 Group Internal I/O Register Specifications, in appendix B. Refer to appendix B.1, Addresses.
Notes on Usage
--
--
--
Refer to section 1.4, Notes on H8/3048F-ONE (Single Power Supply) On-chip emulator (E10T)
--
On-chip Emulator (E10T)
--
--
--
--
Rev. 3.00 Sep 27, 2006 page viii of xxvi
Main Revisions for This Edition
Item All Page -- Revision (See Manual for Details) * Notification of change in company name amended (Before) Hitachi, Ltd. (After) Renesas Technology Corp. * Product naming convention amended (Before) H8/3048B Series (After) H8/3048B Group 1.3.1 Pin Arrangement Figure 1.3 H8/3048B Group Pin Arrangement (FP100B or TFP-100B, Top View) 1.3.3 Pin Functions Table 1.4 Pin Functions 18, 19 8 Note amended Note: 1. For the 5 V operation product, this pin is used as the VCL terminal, and for the 3 V operation models, this pin is used as the VCC terminal that requires an external capacitor.
Table amended
Type A/D and D/A converters Symbol AVCC Pin No. 76 I/O Input Name and Function Power supply pin for the A/D and D/A converters. Connect to the system power supply (VCC) when not using the A/D and D/A converters. Ground pin for the A/D and D/A converters. Connect to system ground (VSS). Reference voltage input pin for the A/D and D/A converters. Connect to the system power supply (VCC) when not using the A/D and D/A converters.
AVSS VREF
86 77
Input Input
1.4.2 Product Type Names and Markings Table 1.5 Differences in H8/3048F and H8/3048F-ONE
21
Sample markings amended
Dual Power Supply Model: H8/3048F Sample markings H8/3048
3J1 HD 64F3048F16
Single Power Supply Model: H8/3048F-ONE
64F3048F25 H8/3048F-ONE
PGM 5.0 BK80090 B 0021
64F3048VF25 H8/3048F-ONE
PGM 3.3 BK80090 B 0021
Rev. 3.00 Sep 27, 2006 page ix of xxvi
Item
Page
Revision (See Manual for Details) Figure amended
IRQaF
5.5.4 Usage Notes on 120 External Interrupts Figure 5.9 IRQnF Flag When Interrupt Processing Is Not Conducted
Read Write 1 0
Read Write 1 0
IRQbF
Read Write IRQb 1 1 Execution
Read 0
Write 0
Clear in error Occurrence condition 1 Occurrence condition 2
10.2.3 Timer Mode Register (TMDR) Bit 6--Phase Counting Mode Flag (MDF) 13.2.8 Bit Rate Register (BRR) Table 13.3 Examples of Bit Rates and BRR Settings in Asynchronous Mode
335
Table amended
Counting Direction TCLKA pin TCLKB pin Down-Counting Low High High Low Up-Counting High Low Low High
473, 475
Table amended
(MHz) 3 Bit Rate (bits/s) 110 150 300 600 1200 2400 4800 9600 19200 31250 38400 n 1 1 1 0 0 0 0 0 0 0 0 N 212 155 77 155 77 38 19 9 4 2 1 Error (%) 0.03 0.16 0.16 0.16 0.16 0.16 -2.34 -2.34 -2.34 0.00 22.07 n 2 1 1 0 0 0 0 0 0 0 0 3.6864 N 64 191 95 191 95 47 23 11 5 3 2 Error (%) 0.70 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 -7.84 0.00 n 3 3 2 2 1 1 0 0 0 0 0 N 110 80 162 80 162 80 162 80 40 24 19 25 Error (%) -0.02 0.47 -0.15 0.47 -0.15 0.47 -0.15 0.47 -0.76 0.00 1.73
13.3.2 Operation in Asynchronous Mode Figure 13.8 Example of SCI Receive Operation (8-Bit Data with Parity and One Stop Bit)
492
Figure amended
1
Start bit
0
Data D0 D1 D7
Parity Stop Start bit bit bit 0/1
1 0
Data D0 D1 D7
Parity Stop bit bit 0/1
1
1
Idle (mark) state
RDRF
FER RXI request 1 frame RXI interrupt handler reads data in RDR and clears RDRF flag to 0
Framing error, ERI request
Rev. 3.00 Sep 27, 2006 page x of xxvi
Item
Page
Revision (See Manual for Details) Figure amended
Multiprocessor bit
1
13.3.3 Multiprocessor 495 Communication Figure 13.11 Example of SCI Transmit Operation (8-Bit Data with Multiprocessor Bit and One Stop Bit)
Multiprocessor bit Data D0 D1 D7 0/1 Stop bit
1 1
Start bit
0
Data D0 D1 D7 0/1
Stop Start bit bit
1 0
Idle (mark) state
TDRE TEND
TXI request
TXI interrupt handler writes data in TDR and clears TDRE flag to 0 1 frame
TXI request
TEI request
13.3.4 Synchronous Operation Clock
500
Description amended An internal clock generated by the on-chip baud rate generator or an external clock input from the SCK pin can be selected by setting the C/A bit in SMR and the CKE1 and CKE0 bits in SCR. See table 13.9.
14.2.3 Serial Mode Register (SMR) Bit 7--GSM Mode (GM)
521
Table amended
Bit 7: GM 0 Description Using the regular smart card interface mode * * 1 * * The TEND flag is set 12.5 etu after the beginning of the start bit Clock output on/off control only The TEND flag is set 11.0 etu after the beginning of the start bit Clock output on/off and fixed-high/fixed-low control (set by SCR) (Initial value)
Using the GSM mode smart card interface mode
18.5.1 Flash Memory Control Register 1 (FLMCR1) Bit 1--Erase Bit (E) Section 21 Electrical Characteristics Table 21.1 Electrical Characteristics of H8/3048 Group and H8/3048B Group Products
587
Note amended Note: * Do not access flash memory while the E bit is set to 1.
653, 654
Table amended
H8/3048B Group Item H8/3048 F-ONE H8/3048B Mask (Single ROM Power Supply) -- --
H8/3048 ZTAT
Absolute maximum ratings Flash memory characteristics*4
VPP pin rating
Yes
--
See table 21.11
--
Rev. 3.00 Sep 27, 2006 page xi of xxvi
Item 21.2 Electrical Characteristics of H8/3048B (Mask ROM) 21.2.2 DC Characteristics Table 21.13 DC Characteristics (2) B.1 Addresses (For H8/3048F-ONE, H8/3048B Mask ROM Version)
Page 675 to 689
Revision (See Manual for Details) Preliminary deleted
678
Conditions amended Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, 1 VREF = 3.0 V to AVCC, VSS = AVSS = 0 V* , Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications)
742
Note amended Note: 4. Byte data must be used to access FLMCR1, FLMCR2, EBR, and RAMCR. Registers FLMCR1, FLMCR2, EBR, and RAMCR are implemented in the flash memory version only. The mask ROM version does not have these registers.
B.3 Function ADCR
829
Table amended
H8/3048F-ONE H8/3048F H8/3048B mask ROM version H8/3048ZTAT H8/3048 mask ROM version H8/3047 mask ROM version H8/3045 mask ROM version H8/3044 mask ROM version Not include this register Include this register
ADCR
829
Table amended
H8/3048F-ONE H8/3048F H8/3048B mask ROM version H8/3048ZTAT H8/3048 mask ROM version H8/3047 mask ROM version H8/3045 mask ROM version H8/3044 mask ROM version Include this register Not include this register
SYSCR
833
Table amended
Standby timer select 2 to 0 Bit 6 Bit 5 Bit 4 STS2 STS1 STS0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Standby Timer H8/3048F-ONE * H8/3048B mask ROM version Waiting time = 8,192 states Waiting time = 8,192 states Waiting time = 16,384 states Waiting time = 16,384 states Waiting time = 32,768 states Waiting time = 32,768 states Waiting time = 65,536 states Waiting time = 65,536 states Waiting time = 131,072 states Waiting time = 131,072 states Waiting time = 262,144 states Waiting time = 1,024 states Waiting time = 1,024 states Illegal setting Illegal setting Illegal setting
Note: * H8/3048F H8/3048ZTAT H8/3048 mask ROM version H8/3047 mask ROM version H8/3045 mask ROM version H8/3044 mask ROM version
Rev. 3.00 Sep 27, 2006 page xii of xxvi
Contents
Section 1 Overview.............................................................................................................
1.1 1.2 1.3 Overview........................................................................................................................... Block Diagram .................................................................................................................. Pin Description.................................................................................................................. 1.3.1 Pin Arrangement .................................................................................................. 1.3.2 Pin Assignments in Each Mode ........................................................................... 1.3.3 Pin Functions ....................................................................................................... Notes on H8/3048F-ONE (Single Power Supply) ............................................................ 1.4.1 Voltage Application ............................................................................................. 1.4.2 Product Type Names and Markings..................................................................... 1.4.3 Differences between H8/3048F and H8/3048F-ONE .......................................... 1.4.4 VCL Pin.................................................................................................................. 1.4.5 Note on Changeover to H8/3048 Group Mask ROM Version ............................. Setting Oscillation Settling Wait Time ............................................................................. Notes on Crystal Resonator Connection ........................................................................... 1 1 6 7 7 9 15 20 20 21 21 26 27 28 28
1.4
1.5 1.6
Section 2 CPU ...................................................................................................................... 29
2.1 Overview........................................................................................................................... 2.1.1 Features................................................................................................................ 2.1.2 Differences from H8/300 CPU ............................................................................ CPU Operating Modes ...................................................................................................... Address Space................................................................................................................... Register Configuration...................................................................................................... 2.4.1 Overview.............................................................................................................. 2.4.2 General Registers ................................................................................................. 2.4.3 Control Registers ................................................................................................. 2.4.4 Initial CPU Register Values................................................................................. Data Formats..................................................................................................................... 2.5.1 General Register Data Formats ............................................................................ 2.5.2 Memory Data Formats ......................................................................................... Instruction Set ................................................................................................................... 2.6.1 Instruction Set Overview ..................................................................................... 2.6.2 Instructions and Addressing Modes ..................................................................... 2.6.3 Tables of Instructions Classified by Function...................................................... 2.6.4 Basic Instruction Formats .................................................................................... 2.6.5 Notes on Use of Bit Manipulation Instructions.................................................... Addressing Modes and Effective Address Calculation ..................................................... 2.7.1 Addressing Modes ............................................................................................... 29 29 30 31 32 33 33 34 35 36 37 37 39 40 40 41 42 52 53 54 54
2.2 2.3 2.4
2.5
2.6
2.7
Rev. 3.00 Sep 27, 2006 page xiii of xxvi
2.8
2.9
2.7.2 Effective Address Calculation ............................................................................. Processing States............................................................................................................... 2.8.1 Overview.............................................................................................................. 2.8.2 Program Execution State...................................................................................... 2.8.3 Exception-Handling State .................................................................................... 2.8.4 Exception-Handling Sequences ........................................................................... 2.8.5 Bus-Released State............................................................................................... 2.8.6 Reset State............................................................................................................ 2.8.7 Power-Down State ............................................................................................... Basic Operational Timing ................................................................................................. 2.9.1 Overview.............................................................................................................. 2.9.2 On-Chip Memory Access Timing........................................................................ 2.9.3 On-Chip Supporting Module Access Timing ...................................................... 2.9.4 Access to External Address Space .......................................................................
58 62 62 62 63 64 65 66 66 67 67 67 68 69
Section 3 MCU Operating Modes .................................................................................. 71
3.1 Overview........................................................................................................................... 3.1.1 Operating Mode Selection ................................................................................... 3.1.2 Register Configuration......................................................................................... Mode Control Register (MDCR) ...................................................................................... System Control Register (SYSCR) ................................................................................... Operating Mode Descriptions ........................................................................................... 3.4.1 Mode 1 ................................................................................................................. 3.4.2 Mode 2 ................................................................................................................. 3.4.3 Mode 3 ................................................................................................................. 3.4.4 Mode 4 ................................................................................................................. 3.4.5 Mode 5 ................................................................................................................. 3.4.6 Mode 6 ................................................................................................................. 3.4.7 Mode 7 ................................................................................................................. Pin Functions in Each Operating Mode ............................................................................ Memory Map in Each Operating Mode ............................................................................ 71 71 72 72 73 75 75 75 75 76 76 76 76 77 77
3.2 3.3 3.4
3.5 3.6
Section 4 Exception Handling ......................................................................................... 81
4.1 Overview........................................................................................................................... 4.1.1 Exception Handling Types and Priority............................................................... 4.1.2 Exception Handling Operation............................................................................. 4.1.3 Exception Vector Table ....................................................................................... Reset.................................................................................................................................. 4.2.1 Overview.............................................................................................................. 4.2.2 Reset Sequence .................................................................................................... 4.2.3 Interrupts after Reset............................................................................................ 81 81 81 82 84 84 84 87
4.2
Rev. 3.00 Sep 27, 2006 page xiv of xxvi
4.3 4.4 4.5 4.6
Interrupts ........................................................................................................................... Trap Instruction................................................................................................................. Stack Status after Exception Handling.............................................................................. Notes on Stack Usage .......................................................................................................
88 89 89 90
Section 5 Interrupt Controller .......................................................................................... 91
5.1 Overview........................................................................................................................... 5.1.1 Features................................................................................................................ 5.1.2 Block Diagram ..................................................................................................... 5.1.3 Pin Configuration................................................................................................. 5.1.4 Register Configuration......................................................................................... Register Descriptions ........................................................................................................ 5.2.1 System Control Register (SYSCR) ...................................................................... 5.2.2 Interrupt Priority Registers A and B (IPRA, IPRB)............................................. 5.2.3 IRQ Status Register (ISR).................................................................................... 5.2.4 IRQ Enable Register (IER) .................................................................................. 5.2.5 IRQ Sense Control Register (ISCR) .................................................................... Interrupt Sources............................................................................................................... 5.3.1 External Interrupts ............................................................................................... 5.3.2 Internal Interrupts................................................................................................. 5.3.3 Interrupt Vector Table.......................................................................................... Interrupt Operation............................................................................................................ 5.4.1 Interrupt Handling Process................................................................................... 5.4.2 Interrupt Sequence ............................................................................................... 5.4.3 Interrupt Response Time...................................................................................... Usage Notes ...................................................................................................................... 5.5.1 Contention between Interrupt and Interrupt-Disabling Instruction ...................... 5.5.2 Instructions That Inhibit Interrupts ...................................................................... 5.5.3 Interrupts during EEPMOV Instruction Execution.............................................. 5.5.4 Usage Notes on External Interrupts ..................................................................... 5.5.5 Notes on Non-Maskable Interrupts (NMI)........................................................... 91 91 92 93 93 94 94 95 102 103 104 105 105 107 107 111 111 116 117 118 118 119 119 119 121
5.2
5.3
5.4
5.5
Section 6 Bus Controller ................................................................................................... 123
6.1 Overview........................................................................................................................... 6.1.1 Features................................................................................................................ 6.1.2 Block Diagram ..................................................................................................... 6.1.3 Input/Output Pins ................................................................................................. 6.1.4 Register Configuration......................................................................................... Register Descriptions ........................................................................................................ 6.2.1 Bus Width Control Register (ABWCR)............................................................... 6.2.2 Access State Control Register (ASTCR) ............................................................. 123 123 124 125 126 126 126 127
6.2
Rev. 3.00 Sep 27, 2006 page xv of xxvi
6.3
6.4
6.2.3 Wait Control Register (WCR).............................................................................. 6.2.4 Wait State Controller Enable Register (WCER) .................................................. 6.2.5 Bus Release Control Register (BRCR) ................................................................ 6.2.6 Chip Select Control Register (CSCR).................................................................. Operation .......................................................................................................................... 6.3.1 Area Division ....................................................................................................... 6.3.2 Chip Select Signals .............................................................................................. 6.3.3 Data Bus............................................................................................................... 6.3.4 Bus Control Signal Timing .................................................................................. 6.3.5 Wait Modes.......................................................................................................... 6.3.6 Interconnections with Memory (Example) .......................................................... 6.3.7 Bus Arbiter Operation.......................................................................................... Usage Notes ...................................................................................................................... 6.4.1 Connection to Dynamic RAM and Pseudo-Static RAM...................................... 6.4.2 Register Write Timing ......................................................................................... 6.4.3 BREQ Input Timing............................................................................................. 6.4.4 Transition To Software Standby Mode ................................................................
128 129 130 132 133 133 135 136 137 145 151 153 156 156 156 158 158
Section 7 Refresh Controller ............................................................................................ 159
7.1 Overview........................................................................................................................... 7.1.1 Features................................................................................................................ 7.1.2 Block Diagram ..................................................................................................... 7.1.3 Input/Output Pins ................................................................................................. 7.1.4 Register Configuration......................................................................................... Register Descriptions ........................................................................................................ 7.2.1 Refresh Control Register (RFSHCR)................................................................... 7.2.2 Refresh Timer Control/Status Register (RTMCSR) ............................................ 7.2.3 Refresh Timer Counter (RTCNT)........................................................................ 7.2.4 Refresh Time Constant Register (RTCOR) ......................................................... Operation .......................................................................................................................... 7.3.1 Overview.............................................................................................................. 7.3.2 DRAM Refresh Control ....................................................................................... 7.3.3 Pseudo-Static RAM Refresh Control ................................................................... 7.3.4 Interval Timer ...................................................................................................... Interrupt Source ................................................................................................................ Usage Notes ...................................................................................................................... 159 159 161 162 162 163 163 166 168 168 169 169 171 185 190 196 196
7.2
7.3
7.4 7.5
Section 8 DMA Controller................................................................................................ 199
8.1 Overview........................................................................................................................... 199 8.1.1 Features................................................................................................................ 199 8.1.2 Block Diagram ..................................................................................................... 200
Rev. 3.00 Sep 27, 2006 page xvi of xxvi
8.2
8.3
8.4
8.5 8.6
8.1.3 Functional Overview............................................................................................ 8.1.4 Input/Output Pins ................................................................................................. 8.1.5 Register Configuration......................................................................................... Register Descriptions (Short Address Mode).................................................................... 8.2.1 Memory Address Registers (MAR) ..................................................................... 8.2.2 I/O Address Registers (IOAR) ............................................................................. 8.2.3 Execute Transfer Count Registers (ETCR).......................................................... 8.2.4 Data Transfer Control Registers (DTCR) ............................................................ Register Descriptions (Full Address Mode)...................................................................... 8.3.1 Memory Address Registers (MAR) ..................................................................... 8.3.2 I/O Address Registers (IOAR) ............................................................................. 8.3.3 Execute Transfer Count Registers (ETCR).......................................................... 8.3.4 Data Transfer Control Registers (DTCR) ............................................................ Operation .......................................................................................................................... 8.4.1 Overview.............................................................................................................. 8.4.2 I/O Mode.............................................................................................................. 8.4.3 Idle Mode............................................................................................................. 8.4.4 Repeat Mode ........................................................................................................ 8.4.5 Normal Mode....................................................................................................... 8.4.6 Block Transfer Mode ........................................................................................... 8.4.7 DMAC Activation................................................................................................ 8.4.8 DMAC Bus Cycle ................................................................................................ 8.4.9 DMAC Multiple-Channel Operation ................................................................... 8.4.10 External Bus Requests, Refresh Controller, and DMAC ..................................... 8.4.11 NMI Interrupts and DMAC.................................................................................. 8.4.12 Aborting a DMA Transfer ................................................................................... 8.4.13 Exiting Full Address Mode.................................................................................. 8.4.14 DMAC States in Reset State, Standby Modes, and Sleep Mode ......................... Interrupts ........................................................................................................................... Usage Notes ...................................................................................................................... 8.6.1 Note on Word Data Transfer................................................................................ 8.6.2 DMAC Self-Access ............................................................................................. 8.6.3 Longword Access to Memory Address Registers ................................................ 8.6.4 Note on Full Address Mode Setup ....................................................................... 8.6.5 Note on Activating DMAC by Internal Interrupts ............................................... 8.6.6 NMI Interrupts and Block Transfer Mode ........................................................... 8.6.7 Memory and I/O Address Register Values .......................................................... 8.6.8 Bus Cycle when Transfer Is Aborted ...................................................................
201 203 203 205 205 206 206 208 211 211 211 212 214 220 220 222 224 227 231 234 239 241 247 248 249 250 251 252 253 254 254 254 254 254 254 256 256 257
Section 9 I/O Ports .............................................................................................................. 259
9.1 Overview........................................................................................................................... 259
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9.2
Port 1................................................................................................................................. 9.2.1 Overview.............................................................................................................. 9.2.2 Register Descriptions ........................................................................................... 9.3 Port 2................................................................................................................................. 9.3.1 Overview.............................................................................................................. 9.3.2 Register Descriptions ........................................................................................... 9.4 Port 3................................................................................................................................. 9.4.1 Overview.............................................................................................................. 9.4.2 Register Descriptions ........................................................................................... 9.5 Port 4................................................................................................................................. 9.5.1 Overview.............................................................................................................. 9.5.2 Register Descriptions ........................................................................................... 9.6 Port 5................................................................................................................................. 9.6.1 Overview.............................................................................................................. 9.6.2 Register Descriptions ........................................................................................... 9.7 Port 6................................................................................................................................. 9.7.1 Overview.............................................................................................................. 9.7.2 Register Descriptions ........................................................................................... 9.8 Port 7................................................................................................................................. 9.8.1 Overview.............................................................................................................. 9.8.2 Register Description............................................................................................. 9.9 Port 8................................................................................................................................. 9.9.1 Overview.............................................................................................................. 9.9.2 Register Descriptions ........................................................................................... 9.10 Port 9................................................................................................................................. 9.10.1 Overview.............................................................................................................. 9.10.2 Register Descriptions ........................................................................................... 9.11 Port A................................................................................................................................ 9.11.1 Overview.............................................................................................................. 9.11.2 Register Descriptions ........................................................................................... 9.11.3 Pin Functions ....................................................................................................... 9.12 Port B ................................................................................................................................ 9.12.1 Overview.............................................................................................................. 9.12.2 Register Descriptions ........................................................................................... 9.12.3 Pin Functions .......................................................................................................
263 263 264 266 266 267 270 270 270 272 272 273 276 276 277 280 280 281 284 284 285 286 286 287 292 292 293 297 297 299 301 309 309 311 313
Section 10 16-Bit Integrated Timer Unit (ITU).......................................................... 319
10.1 Overview........................................................................................................................... 10.1.1 Features................................................................................................................ 10.1.2 Block Diagrams ................................................................................................... 10.1.3 Input/Output Pins .................................................................................................
Rev. 3.00 Sep 27, 2006 page xviii of xxvi
319 319 322 327
10.1.4 Register Configuration......................................................................................... 10.2 Register Descriptions ........................................................................................................ 10.2.1 Timer Start Register (TSTR)................................................................................ 10.2.2 Timer Synchro Register (TSNC) ......................................................................... 10.2.3 Timer Mode Register (TMDR) ............................................................................ 10.2.4 Timer Function Control Register (TFCR)............................................................ 10.2.5 Timer Output Master Enable Register (TOER) ................................................... 10.2.6 Timer Output Control Register (TOCR) .............................................................. 10.2.7 Timer Counters (TCNT) ...................................................................................... 10.2.8 General Registers A, B (GRA, GRB) .................................................................. 10.2.9 Buffer Registers A, B (BRA, BRB) ..................................................................... 10.2.10 Timer Control Registers (TCR) ........................................................................... 10.2.11 Timer I/O Control Register (TIOR) ..................................................................... 10.2.12 Timer Status Register (TSR)................................................................................ 10.2.13 Timer Interrupt Enable Register (TIER) .............................................................. 10.3 CPU Interface.................................................................................................................... 10.3.1 16-Bit Accessible Registers ................................................................................. 10.3.2 8-Bit Accessible Registers ................................................................................... 10.4 Operation .......................................................................................................................... 10.4.1 Overview.............................................................................................................. 10.4.2 Basic Functions.................................................................................................... 10.4.3 Synchronization ................................................................................................... 10.4.4 PWM Mode.......................................................................................................... 10.4.5 Reset-Synchronized PWM Mode......................................................................... 10.4.6 Complementary PWM Mode ............................................................................... 10.4.7 Phase Counting Mode .......................................................................................... 10.4.8 Buffering.............................................................................................................. 10.4.9 ITU Output Timing .............................................................................................. 10.5 Interrupts ........................................................................................................................... 10.5.1 Setting of Status Flags ......................................................................................... 10.5.2 Timing of Clearing of Status Flags ...................................................................... 10.5.3 Interrupt Sources and DMA Controller Activation.............................................. 10.6 Usage Notes ......................................................................................................................
328 331 331 332 334 337 339 341 342 343 344 345 348 350 352 353 353 356 357 357 359 367 369 373 376 385 387 392 395 395 398 398 400
Section 11 Programmable Timing Pattern Controller............................................... 415
11.1 Overview........................................................................................................................... 11.1.1 Features................................................................................................................ 11.1.2 Block Diagram ..................................................................................................... 11.1.3 TPC Pins .............................................................................................................. 11.1.4 Registers............................................................................................................... 11.2 Register Descriptions ........................................................................................................ 415 415 416 417 418 419
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11.2.1 Port A Data Direction Register (PADDR) ........................................................... 11.2.2 Port A Data Register (PADR) .............................................................................. 11.2.3 Port B Data Direction Register (PBDDR)............................................................ 11.2.4 Port B Data Register (PBDR) .............................................................................. 11.2.5 Next Data Register A (NDRA) ............................................................................ 11.2.6 Next Data Register B (NDRB)............................................................................. 11.2.7 Next Data Enable Register A (NDERA).............................................................. 11.2.8 Next Data Enable Register B (NDERB) .............................................................. 11.2.9 TPC Output Control Register (TPCR) ................................................................. 11.2.10 TPC Output Mode Register (TPMR) ................................................................... 11.3 Operation .......................................................................................................................... 11.3.1 Overview.............................................................................................................. 11.3.2 Output Timing...................................................................................................... 11.3.3 Normal TPC Output............................................................................................. 11.3.4 Non-Overlapping TPC Output ............................................................................. 11.3.5 TPC Output Triggering by Input Capture ............................................................ 11.4 Usage Notes ...................................................................................................................... 11.4.1 Operation of TPC Output Pins ............................................................................. 11.4.2 Note on Non-Overlapping Output........................................................................
419 419 420 420 421 423 425 426 427 429 431 431 432 433 435 437 438 438 438
Section 12 Watchdog Timer............................................................................................. 441
12.1 Overview........................................................................................................................... 12.1.1 Features................................................................................................................ 12.1.2 Block Diagram ..................................................................................................... 12.1.3 Pin Configuration................................................................................................. 12.1.4 Register Configuration......................................................................................... 12.2 Register Descriptions ........................................................................................................ 12.2.1 Timer Counter (TCNT)........................................................................................ 12.2.2 Timer Control/Status Register (TCSR) ................................................................ 12.2.3 Reset Control/Status Register (RSTCSR) ............................................................ 12.2.4 Notes on Register Rewriting ................................................................................ 12.3 Operation .......................................................................................................................... 12.3.1 Watchdog Timer Operation ................................................................................. 12.3.2 Interval Timer Operation ..................................................................................... 12.3.3 Timing of Setting of Overflow Flag (OVF) ......................................................... 12.3.4 Timing of Setting of Watchdog Timer Reset Bit (WRST) .................................. 12.4 Interrupts ........................................................................................................................... 12.5 Usage Notes ...................................................................................................................... 12.6 Notes ................................................................................................................................. 441 441 442 442 443 443 443 444 446 447 449 449 450 450 451 452 452 453
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Section 13 Serial Communication Interface ................................................................ 455
13.1 Overview........................................................................................................................... 13.1.1 Features................................................................................................................ 13.1.2 Block Diagram ..................................................................................................... 13.1.3 Input/Output Pins ................................................................................................. 13.1.4 Register Configuration......................................................................................... 13.2 Register Descriptions ........................................................................................................ 13.2.1 Receive Shift Register (RSR) .............................................................................. 13.2.2 Receive Data Register (RDR) .............................................................................. 13.2.3 Transmit Shift Register (TSR) ............................................................................. 13.2.4 Transmit Data Register (TDR)............................................................................. 13.2.5 Serial Mode Register (SMR)................................................................................ 13.2.6 Serial Control Register (SCR).............................................................................. 13.2.7 Serial Status Register (SSR) ................................................................................ 13.2.8 Bit Rate Register (BRR) ...................................................................................... 13.3 Operation .......................................................................................................................... 13.3.1 Overview.............................................................................................................. 13.3.2 Operation in Asynchronous Mode ....................................................................... 13.3.3 Multiprocessor Communication........................................................................... 13.3.4 Synchronous Operation........................................................................................ 13.4 SCI Interrupts.................................................................................................................... 13.5 Usage Notes ...................................................................................................................... 455 455 457 458 458 459 459 459 460 460 461 464 468 472 481 481 483 492 499 508 509
Section 14 Smart Card Interface ..................................................................................... 515
14.1 Overview........................................................................................................................... 14.1.1 Features................................................................................................................ 14.1.2 Block Diagram ..................................................................................................... 14.1.3 Input/Output Pins ................................................................................................. 14.1.4 Register Configuration......................................................................................... 14.2 Register Descriptions ........................................................................................................ 14.2.1 Smart Card Mode Register (SCMR) .................................................................... 14.2.2 Serial Status Register (SSR) ................................................................................ 14.2.3 Serial Mode Register (SMR)................................................................................ 14.2.4 Serial Control Register (SCR).............................................................................. 14.3 Operation .......................................................................................................................... 14.3.1 Overview.............................................................................................................. 14.3.2 Pin Connections ................................................................................................... 14.3.3 Data Format ......................................................................................................... 14.3.4 Register Settings .................................................................................................. 14.3.5 Clock.................................................................................................................... 14.3.6 Transmitting and Receiving Data ........................................................................ 515 515 516 517 517 518 518 519 521 522 523 523 523 524 526 528 530
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14.4 Usage Notes ...................................................................................................................... 538
Section 15 A/D Converter................................................................................................. 541
15.1 Overview........................................................................................................................... 15.1.1 Features................................................................................................................ 15.1.2 Block Diagram ..................................................................................................... 15.1.3 Input Pins ............................................................................................................. 15.1.4 Register Configuration......................................................................................... 15.2 Register Descriptions ........................................................................................................ 15.2.1 A/D Data Registers A to D (ADDRA to ADDRD).............................................. 15.2.2 A/D Control/Status Register (ADCSR) ............................................................... 15.2.3 A/D Control Register (ADCR) ............................................................................ 15.3 CPU Interface.................................................................................................................... 15.4 Operation .......................................................................................................................... 15.4.1 Single Mode (SCAN = 0) .................................................................................... 15.4.2 Scan Mode (SCAN = 1)....................................................................................... 15.4.3 Input Sampling and A/D Conversion Time ......................................................... 15.4.4 External Trigger Input Timing............................................................................. 15.5 Interrupts ........................................................................................................................... 15.6 Usage Notes ...................................................................................................................... 541 541 542 543 544 545 545 546 548 549 550 550 552 554 555 556 556
Section 16 D/A Converter................................................................................................. 561
16.1 Overview ............................................................................................................................ 16.1.1 Features ................................................................................................................. 16.1.2 Block Diagram ..................................................................................................... 16.1.3 Input/Output Pins ................................................................................................. 16.1.4 Register Configuration......................................................................................... 16.2 Register Descriptions ........................................................................................................ 16.2.1 D/A Data Registers 0 and 1 (DADR0, DADR1) ................................................. 16.2.2 D/A Control Register (DACR) ............................................................................ 16.2.3 D/A Standby Control Register (DASTCR).......................................................... 16.3 Operation .......................................................................................................................... 16.4 D/A Output Control .......................................................................................................... 561 561 562 563 563 564 564 564 566 567 568 569 569 570 570 571 572
Section 17 RAM .................................................................................................................. 17.1 Overview........................................................................................................................... 17.1.1 Block Diagram ..................................................................................................... 17.1.2 Register Configuration......................................................................................... 17.2 System Control Register (SYSCR) ................................................................................... 17.3 Operation ..........................................................................................................................
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)................................................................ 573
18.1 Flash Memory Overview .................................................................................................. 18.1.1 Notes on H8/3048F-ONE (Single Power Supply) ............................................... 18.1.2 Mode Pin Settings ................................................................................................ 18.2 Flash Memory Features..................................................................................................... 18.2.1 Block Diagram ..................................................................................................... 18.2.2 Mode Transitions ................................................................................................. 18.2.3 On-Board Programming Modes........................................................................... 18.2.4 Flash Memory Emulation in RAM ...................................................................... 18.2.5 Differences between Boot Mode and User Program Mode ................................. 18.2.6 Block Configuration ............................................................................................ 18.3 Flash Memory Pin Configuration...................................................................................... 18.4 Flash Memory Register Configuration.............................................................................. 18.5 Flash Memory Register Descriptions................................................................................ 18.5.1 Flash Memory Control Register 1 (FLMCR1)..................................................... 18.5.2 Flash Memory Control Register 2 (FLMCR2)..................................................... 18.5.3 Erase Block Register (EBR) ................................................................................ 18.5.4 RAM Control Register (RAMCR) ....................................................................... 18.6 Flash Memory On-Board Programming Modes................................................................ 18.6.1 Boot Mode ........................................................................................................... 18.6.2 User Program Mode............................................................................................. 18.7 Programming/Erasing Flash Memory ............................................................................... 18.7.1 Program Mode ..................................................................................................... 18.7.2 Program-Verify Mode.......................................................................................... 18.7.3 Erase Mode .......................................................................................................... 18.7.4 Erase-Verify Mode .............................................................................................. 18.8 Flash Memory Protection.................................................................................................. 18.8.1 Hardware Protection ............................................................................................ 18.8.2 Software Protection.............................................................................................. 18.8.3 Error Protection.................................................................................................... 18.8.4 NMI Input Disable Conditions............................................................................. 18.9 Flash Memory Emulation in RAM ................................................................................... 18.10 Flash Memory PROM Mode............................................................................................. 18.10.1 Socket Adapters and Memory Map ..................................................................... 18.10.2 Notes on Use of PROM Mode ............................................................................. 18.11 Notes on Flash Memory Programming/Erasing................................................................ 18.12 Mask ROM (H8/3048B Mask ROM Version) Overviews................................................ 18.12.1 Block Diagram ..................................................................................................... 18.13 Notes on Ordering Mask ROM Version Chips ................................................................. 573 573 574 575 576 576 579 581 582 583 583 584 584 584 588 589 590 592 593 598 600 602 603 607 607 609 609 611 612 614 615 616 617 618 619 625 625 626
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18.14 Notes when Converting the F-ZTAT (Single Power Supply) Application Software to the Mask-ROM Versions .............................................................................................. 627
Section 19 Clock Pulse Generator .................................................................................. 629
19.1 Overview........................................................................................................................... 19.1.1 Block Diagram ..................................................................................................... 19.2 Oscillator Circuit............................................................................................................... 19.2.1 Connecting a Crystal Resonator........................................................................... 19.2.2 External Clock Input ............................................................................................ 19.3 Duty Adjustment Circuit................................................................................................... 19.4 Prescalers .......................................................................................................................... 19.5 Frequency Divider ............................................................................................................ 19.5.1 Register Configuration......................................................................................... 19.5.2 Division Control Register (DIVCR) .................................................................... 19.5.3 Usage Notes ......................................................................................................... 629 630 630 630 633 636 636 636 637 637 638
Section 20 Power-Down State ......................................................................................... 639
20.1 Overview........................................................................................................................... 639 20.2 Register Configuration...................................................................................................... 641 20.2.1 System Control Register (SYSCR) ...................................................................... 641 20.2.2 Module Standby Control Register (MSTCR)....................................................... 643 20.3 Sleep Mode ....................................................................................................................... 645 20.3.1 Transition to Sleep Mode..................................................................................... 645 20.3.2 Exit from Sleep Mode.......................................................................................... 645 20.4 Software Standby Mode.................................................................................................... 645 20.4.1 Transition to Software Standby Mode ................................................................. 645 20.4.2 Exit from Software Standby Mode ...................................................................... 646 20.4.3 Selection of Waiting Time for Exit from Software Standby Mode...................... 646 20.4.4 Sample Application of Software Standby Mode.................................................. 648 20.4.5 Note...................................................................................................................... 648 20.5 Hardware Standby Mode .................................................................................................. 649 20.5.1 Transition to Hardware Standby Mode ................................................................ 649 20.5.2 Exit from Hardware Standby Mode ..................................................................... 649 20.5.3 Timing for Hardware Standby Mode ................................................................... 649 20.6 Module Standby Function ................................................................................................. 650 20.6.1 Module Standby Timing ...................................................................................... 650 20.6.2 Read/Write in Module Standby............................................................................ 650 20.6.3 Usage Notes ......................................................................................................... 651 20.7 System Clock Output Disabling Function......................................................................... 652
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Section 21 Electrical Characteristics.............................................................................. 653
21.1 Electrical Characteristics of H8/3048F-ONE (Single-Power Supply) .............................. 21.1.1 Absolute Maximum Ratings ................................................................................ 21.1.2 DC Characteristics ............................................................................................... 21.1.3 AC Characteristics ............................................................................................... 21.1.4 A/D Conversion Characteristics........................................................................... 21.1.5 D/A Conversion Characteristics........................................................................... 21.1.6 Flash Memory Characteristics ............................................................................. 21.2 Electrical Characteristics of H8/3048B (Mask ROM) ...................................................... 21.2.1 Absolute Maximum Ratings ................................................................................ 21.2.2 DC Characteristics ............................................................................................... 21.2.3 AC Characteristics ............................................................................................... 21.2.4 A/D Conversion Characteristics........................................................................... 21.2.5 D/A Conversion Characteristics........................................................................... 21.3 Operational Timing ........................................................................................................... 21.3.1 Bus Timing .......................................................................................................... 21.3.2 Refresh Controller Bus Timing............................................................................ 21.3.3 Control Signal Timing ......................................................................................... 21.3.4 Clock Timing ....................................................................................................... 21.3.5 TPC and I/O Port Timing..................................................................................... 21.3.6 ITU Timing .......................................................................................................... 21.3.7 SCI Input/Output Timing ..................................................................................... 21.3.8 DMAC Timing..................................................................................................... 655 655 656 663 669 670 671 675 675 676 682 688 689 690 690 694 699 701 701 702 703 704
Appendix A Instruction Set .............................................................................................. 705
A.1 A.2 A.3 Instruction List .................................................................................................................. 705 Operation Code Map......................................................................................................... 720 Number of States Required for Execution ........................................................................ 723
Appendix B Internal I/O Register................................................................................... 734
B.1 B.2 B.3 Addresses (For H8/3048F-ONE, H8/3048B Mask ROM Version) .................................. 735 Addresses (For H8/3048F, H8/3048ZTAT, H8/3048 Mask-ROM, H8/3047 Mask-ROM, H8/3045 Mask-ROM, and H8/3044 Mask-ROM Versions) ............................................. 743 Function ............................................................................................................................ 751
Appendix C I/O Port Block Diagrams........................................................................... 837
C.1 C.2 C.3 C.4 C.5 Port 1 Block Diagram ....................................................................................................... Port 2 Block Diagram ....................................................................................................... Port 3 Block Diagram ....................................................................................................... Port 4 Block Diagram ....................................................................................................... Port 5 Block Diagram ....................................................................................................... 837 838 839 840 841
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C.6 C.7 C.8 C.9 C.10 C.11
Port 6 Block Diagrams...................................................................................................... Port 7 Block Diagrams...................................................................................................... Port 8 Block Diagrams...................................................................................................... Port 9 Block Diagrams...................................................................................................... Port A Block Diagrams ..................................................................................................... Port B Block Diagrams .....................................................................................................
842 846 847 850 854 858
Appendix D Pin States ....................................................................................................... 862
D.1 D.2 Port States in Each Mode .................................................................................................. 862 Pin States at Reset ............................................................................................................. 865
Appendix E Timing of Transition to and Recovery from Hardware Standby Mode............................................................................................... 868 Appendix F Product Code Lineup.................................................................................. 869 Appendix G Package Dimensions................................................................................... 871
Rev. 3.00 Sep 27, 2006 page xxvi of xxvi
Section 1 Overview
Section 1 Overview
1.1 Overview
The H8/3048B Group is a series of microcontrollers (MCUs) that integrate system supporting functions together with an H8/300H CPU core having an original Renesas Technology 2 architecture. In addition, the H8/3048F-ONE is equipped with an on-chip emulator (E10T)* . The H8/300H CPU has a 32-bit internal architecture with sixteen 16-bit general registers, and a concise, optimized instruction set designed for speed. It can address a 16-Mbyte linear address space. Its instruction set is upward-compatible at the object-code level with the H8/300 CPU, enabling easy porting of software from the H8/300 Series. The on-chip system supporting functions include ROM, RAM, a 16-bit integrated timer unit (ITU), a programmable timing pattern controller (TPC), a watchdog timer (WDT), a serial communication interface (SCI), an A/D converter, a D/A converter, I/O ports, a direct memory access controller (DMAC), a refresh controller, and other facilities. The H8/3048B Group has 128 kbytes of on-chip ROM and 4 kbytes of on-chip RAM. Seven MCU operating modes offer a choice of data bus width and address space size. The modes (modes 1 to 7) include one single-chip mode and six expanded modes.
1 In addition to mask ROM products, the H8/3048B Group includes F-ZTATTM* version products with on-chip user-programmable flash memory. It enables users to respond quickly and flexibly to changing application specifications as well as to conditions when ramping up from initial to full 2 volume production. The on-chip emulator (E10T)* is capable of direct emulation of the microcontroller when mounted in the user's system, thereby making possible on-board program debugging.
Table 1.1 summarizes the features of the H8/3048B Group. Notes: 1. F-ZTAT (Flexible ZTAT) is a trademark of Renesas Technology Corp. 2. An on-chip emulator (E10T) is not provided in the mask ROM version.
Rev. 3.00 Sep 27, 2006 page 1 of 872 REJ09B0325-0300
Section 1 Overview
Table 1.1
Feature CPU
Features
Description Upward-compatible with the H8/300 CPU at the object-code level * General-register machine Sixteen 16-bit general registers (also usable as sixteen 8-bit registers + eight 16-bit registers or eight 32bit registers) * High-speed operation (flash memory version) Maximum clock rate: 25 MHz Add/subtract: 80 ns Multiply/divide: 560 ns 16-Mbyte address space * Instruction features 8/16/32-bit data transfer, arithmetic, and logic instructions Signed and unsigned multiply instructions (8 bits x 8 bits, 16 bits x 16 bits) Signed and unsigned divide instructions (16 bits / 8 bits, 32 bits / 16 bits) Bit accumulator function Bit manipulation instructions with register-indirect specification of bit positions
Memory Interrupt controller
* * * * * * * * * * *
ROM: 128 kbytes RAM: 4 kbytes Seven external interrupt pins: NMI, IRQ0 to IRQ5 30 internal interrupts Three selectable interrupt priority levels Address space can be partitioned into eight areas, with independent bus specifications in each area Chip select output available for areas 0 to 7 8-bit access or 16-bit access selectable for each area Two-state or three-state access selectable for each area Selection of four wait modes Bus arbitration function
Bus controller
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Section 1 Overview Feature Refresh controller Description * DRAM refresh Directly connectable to 16-bit-wide DRAM CAS-before-RAS refresh Self-refresh mode selectable * * DMA controller (DMAC) * Pseudo-static RAM refresh Self-refresh mode selectable Usable as an interval timer Short address mode Maximum four channels available Selection of I/O mode, idle mode, or repeat mode Can be activated by compare match/input capture A interrupts from ITU channels 0 to 3, transmit-data-empty and receive-data-full interrupts from SCI channel 0, or external requests * Full address mode Maximum two channels available Selection of normal mode or block transfer mode Can be activated by compare match/input capture A interrupts from ITU channels 0 to 3, external requests, or auto-request 16-bit integrated timer unit (ITU) * * * * * * * * * * Five 16-bit timer channels, capable of processing up to 12 pulse outputs or 10 pulse inputs One 16-bit timer counter (channels 0 to 4) Two multiplexed output compare/input capture pins (channels 0 to 4) Operation can be synchronized (channels 0 to 4) PWM mode available (channels 0 to 4) Phase counting mode available (channel 2) Buffering available (channels 3 and 4) Reset-synchronized PWM mode available (channels 3 and 4) Complementary PWM mode available (channels 3 and 4) DMAC can be activated by compare match/input capture A interrupts (channels 0 to 3)
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Section 1 Overview Feature Programmable timing pattern controller (TPC) Description * * * * Watchdog timer (WDT), 1 channel Serial communication interface (SCI), 2 channels A/D converter * * * * * * * * * * * D/A converter * * * I/O ports Operating modes * * * Maximum 16-bit pulse output, using ITU as time base Up to four 4-bit pulse output groups (or one 16-bit group, or two 8-bit groups) Non-overlap mode available Output data can be transferred by DMAC Reset signal can be generated by overflow Usable as an interval timer Selection of asynchronous or synchronous mode Full duplex: can transmit and receive simultaneously On-chip baud-rate generator Smart card interface functions added (SCI0 only) Resolution: 10 bits Eight channels, with selection of single or scan mode Variable analog conversion voltage range Sample-and-hold function A/D conversion can be externally triggered Resolution: 8 bits Two channels D/A outputs can be sustained in software standby mode 70 input/output pins 8 input-only pins Seven MCU operating modes
Address Space 1 Mbyte 1 Mbyte 16 Mbytes 16 Mbytes 1 Mbyte 16 Mbytes 1 Mbyte Address Pins A19 to A0 A19 to A0 A23 to A0 A23 to A0 A19 to A0 A23 to A0 -- Initial Bus Width 8 bits 16 bits 8 bits 16 bits 8 bits 8 bits -- Max. Bus Width 16 bits 16 bits 16 bits 16 bits 16 bits 16 bits --
Mode Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Mode 7
*
On-chip ROM is disabled in modes 1 to 4
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Section 1 Overview Feature Power-down state Description * * * * * Other features Product lineup * Sleep mode Software standby mode Hardware standby mode Module standby function Programmable system clock frequency division On-chip clock pulse generator
Model (3 V) Package ROM Remarks Flash E10T is memory installed Mask ROM E10T is not installed
Model (5 V)
HD64F3048BTE HD64F3048BVTE 100-pin TQFP (TFP-100B) HD64F3048BF HD64F3048BVF 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B)
HD6433048BTE HD6433048BVTE HD6433048BF HD6433048BVF
Rev. 3.00 Sep 27, 2006 page 5 of 872 REJ09B0325-0300
Section 1 Overview
1.2
Block Diagram
Figure 1.1 shows an internal block diagram.
P37/D15 P36/D14 P35/D13 P34/D12 P33/D11 P32/D10 P31/D9 P30/D8 P47/D7 P46/D6 P45/D5 P44/D4 P43/D3 P42/D2 P41/D1 P40/D0
VCC
*2
VCC
VCC
VSS
VSS
VSS
VSS
VSS
VSS
Port 3 Address bus
Port 4 P53/A19 Port 5 Port 2 Bus controller Port 1 Port 9 Port 7 VREF AVCC AVSS P77/AN7/DA1 P76/AN6/DA0 P75/AN5 P74/AN4 P73/AN3 P72/AN2 P71/AN1 P70/AN0
MD2 MD1 MD0 EXTAL XTAL STBY RES RESO/FWE
*1
Data bus (upper) Data bus (lower)
P52/A18 P51/A17 P50/A16
Clock pulse generator
P27/A15 H8/300H CPU P26/A14 P25/A13 P24/A12 P23/A11 P22/A10 P21/A9 P20/A8 P17/A7 P16/A6 P15/A5 Refresh controller RAM P14/A4 P13/A3 P12/A2 P11/A1 Watchdog timer (WDT) P10/A0
NMI P66/LWR P65/HWR P63/AS P62/BACK P61/BREQ P60/WAIT Port 6 P64/RD
Interrupt controller DMA controller (DMAC) ROM (mask ROM, or flash memory)
P84/CS0 P82/CS2/IRQ2 P81/CS3/IRQ1 P80/RFSH/IRQ0 Port 8 P83/CS1/IRQ3
16-bit integrated timer unit (ITU)
Serial communication interface (SCI) x 2 channels P95/SCK1/IRQ5 P94/SCK0/IRQ4 P93/RxD1 P92/RxD0 P91/TxD1 P90/TxD0
Programmable timing pattern controller (TPC)
A/D converter D/A converter
Port B PB6/TP14/DREQ0/CS7 PA7/TP7/TIOCB2/A20 PB5/TP13/TOCXB4 PB4/TP12/TOCXA4 PB3/TP11/TIOCB4 PB2/TP10/TIOCA4 PB1/TP9/TIOCB3 PB0/TP8/TIOCA3 PA6/TP6/TIOCA2/A21/CS4 PA5/TP5/TIOCB1/A22/CS5 PB7/TP15/DREQ1/ADTRG
Port A PA4/TP4/TIOCA1/A23/CS6 PA3/TP3/TIOCB0/TCLKD PA2/TP2/TIOCA0/TCLKC PA1/TP1/TEND1/TCLKB PA0/TP0/TEND0/TCLKA
Notes: 1. This pin functions as the FWE (input) pin on the H8/3048F-ONE (single power supply on-chip flash memory version). On H8/300H Series versions with on-chip mask ROM it functions as the RESO (output) pin, and on dual power supply flash memory versions (VPP = 12 V) and on-chip PROM versions it functions as the RESO (output)/VPP (input) pin. 2. Pin 1 on the H8/3048B Group which operates at 5 V is not used as the VCC terminal, but is used as the VCL terminal; the external capacitor must be connected. Pin 1 is the VCC pin on versions that operate on 3 V.
Figure 1.1 Block Diagram
Rev. 3.00 Sep 27, 2006 page 6 of 872 REJ09B0325-0300
Section 1 Overview
1.3
1.3.1
Pin Description
Pin Arrangement
Figure 1.3 shows the pin arrangement of the H8/3048B Group. The pin arrangement of the H8/3048B Group is shown in figure 1.3. Differences in the H8/3048 Group pin arrangements are shown in table 1.2. The 5 V operation models of the H8/3048B Group have a VCL pin. The 3 V operation models of the H8/3048B Group have pin 1, which is the VCC power supply pin. See section 1.4, Notes on H8/3048F-ONE (Single Power Supply). Except for the differences shown in table 1.2, the pin arrangements are the same. Table 1.2 Comparison of H8/3048B Group and H8/3048 Group Pin Arrangements
H8/3048B Mask ROM Version H8/3048 H8/3048F ZTAT
H8/3048F-ONE Package Pin Number
3V 5V 3V 5V Operation Operation Operation Operation Model Model Model Model VCL FWE VCC FWE VCL RESO VCC RESO
H8/3048 H8/3047 H8/3045 H8/3044 Mask Mask Mask Mask ROM ROM ROM ROM Version Version Version Version
FP-100B (TFP-100B)
1 10
VCC VPP/ RESO
VCC VPP/ RESO
VCC RESO
VCC RESO
VCC RESO
VCC RESO
1 (VCL)
1 (VCC)
VCC
H8/3048B Group and H8/3048F-ONE 5 V operation model
H8/3048B Group and H8/3048F-ONE 3 V operation model and H8/3048 Group
Figure 1.2 Connection of Pin 1
Rev. 3.00 Sep 27, 2006 page 7 of 872 REJ09B0325-0300
Section 1 Overview
P61 /BREQ
P62 /BACK
P65 /HWR
P66 /LWR
P60 /WAIT
P53 /A 19
P52 /A 18
P51 /A 17
P50 /A 16 53
P27 /A 15 52
P64 /RD
P63 /AS
EXTAL
STBY
XTAL
RES
MD2
MD1
MD0
VCC
NMI
VSS
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
51
P26 /A 14
VSS
AVCC VREF P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 P76/AN6/DA0 P77/AN7/DA1 AVSS P80/RFSH/IRQ0 P81/CS3/IRQ1 P82/CS2/IRQ2 P83/CS1/IRQ3 P84/CS0 VSS PA0/TP0/TEND0/TCLKA PA1/TP1/TEND1/TCLKB PA2/TP2/TIOCA0/TCLKC PA3/TP3/TIOCB0/TCLKD PA4/TP4/TIOCA1/A23/CS6 PA5/TP5/TIOCB1/A22/CS5 PA6/TP6/TIOCA2/A21/CS4 PA7/TP7/TIOCB2/A20
76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
50 49 48 47 46 45 44 43 42 41 Top view (FP-100B, TFP-100B) 40 39 38 37 36 35 34 33 32 31 30 29 28 27
25
A13/P25 A12/P24 A11/P23 A10/P22 A9/P21 A8/P20 VSS A7/P17 A6/P16 A5/P15 A4/P14 A3/P13 A2/P12 A1/P11 A0/P10 VCC D15/P37 D14/P36 D13/P35 D12/P34 D11/P33 D10/P32 D9/P31 D8/P30 D7/P47
100
1 2 3 4 5 6 7 8 9
26
TIOCA3 /TP 8 /PB 0
TIOCB3 /TP 9 /PB 1
TIOCA4 /TP10 /PB 2
TIOCB4 /TP11 /PB 3
TOCXA4 /TP12 /PB 4
TOCXB4 /TP13 /PB 5
CS7/DREQ 0 /TP14 /PB 6
ADTRG/DREQ 1 /TP15 /PB 7
RESO/ FWE*2
VSS
TxD0 /P9 0
TxD1 /P9 1
RxD0 /P9 2
RxD1 /P9 3
IRQ 4/SCK0 /P9 4
IRQ 5/SCK1 /P9 5
D0 /P4 0
D1 /P4 1
D2 /P4 2
D3 /P4 3
VSS
D4 /P4 4
D5 /P4 5
VCC/VCL*1
D6 /P4 6
1 0.1 F
Notes: 1. For the 5 V operation product, this pin is used as the VCL terminal, and for the 3 V operation models, this pin is used as the VCC terminal that requires an external capacitor. 2. (1) Pin 10 of the H8/3048F-ONE (single power supply version) functions as the FWE pin. The H8/3048F-ONE has no RESO output. Pin 10 functions as the RESO pin in on-chip mask ROM versions and as the RESO/VPP pin in on-chip PROM versions and dual power supply flash memory versions. (2) Do NOT apply 12 V to the H8/3048F-ONE (single power supply), or to H8/3048 Group or H8/3048B Group mask ROM products as the chip will be destroyed.
Figure 1.3 H8/3048B Group Pin Arrangement (FP-100B or TFP-100B, Top View)
Rev. 3.00 Sep 27, 2006 page 8 of 872 REJ09B0325-0300
Section 1 Overview
1.3.2
Pin Assignments in Each Mode
Table 1.3 lists the pin assignments in each mode. Table 1.3 Pin Assignments in Each Mode (FP-100B or TFP-100B)
Pin Name Pin No. 1*3 PROM Mode Mode 1 VCL (VCC) Mode 2 VCL (VCC) Mode 3 VCL (VCC) Mode 4 VCL (VCC) Mode 5 VCL (VCC) Mode 6 VCL (VCC) Mode 7 VCL (VCC) EPROM Flash -- VCL (VCC) Remarks Flash memory version with single power supply. H8/3048 B maskROM version VCC VCC VCC VCC VCC VCC VCC VCC VCC H8/3048 Group, Mask ROM version, PROM version and flash memory version with dual power supply.
2 3 4 5 6 7
PB0/TP8/ TIOCA3 PB1/TP9/ TIOCB3
PB0/TP8/ TIOCA3 PB1/TP9/ TIOCB3
PB0/TP8/ TIOCA3 PB1/TP9/ TIOCB3
PB0/TP8/ TIOCA3 PB1/TP9/ TIOCB3
PB0/TP8/ TIOCA3 PB1/TP9/ TIOCB3
PB0/TP8/ TIOCA3 PB1/TP9/ TIOCB3
PB0/TP8/ TIOCA3 PB1/TP9/ TIOCB3
NC NC
NC NC NC NC NC NC
PB2/TP10/ PB2/TP10/ PB2/TP10/ PB2/TP10/ PB2/TP10/ PB2/TP10/ PB2/TP10/ NC TIOCA4 TIOCA4 TIOCA4 TIOCA4 TIOCA4 TIOCA4 TIOCA4 PB3/TP11/ PB3/TP11/ PB3/TP11/ PB3/TP11/ PB3/TP11/ PB3/TP11/ PB3/TP11/ NC TIOCB4 TIOCB4 TIOCB4 TIOCB4 TIOCB4 TIOCB4 TIOCB4 PB4/TP12/ PB4/TP12/ PB4/TP12/ PB4/TP12/ PB4/TP12/ PB4/TP12/ PB4/TP12/ NC TOCXA4 TOCXA4 TOCXA4 TOCXA4 TOCXA4 TOCXA4 TOCXA4 PB5/TP13/ PB5/TP13/ PB5/TP13/ PB5/TP13/ PB5/TP13/ PB5/TP13/ PB5/TP13/ NC TOCXB4 TOCXB4 TOCXB4 TOCXB4 TOCXB4 TOCXB4 TOCXB4
Rev. 3.00 Sep 27, 2006 page 9 of 872 REJ09B0325-0300
Section 1 Overview
Pin Name Pin No. 8 PROM Mode Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Mode 7 EPROM Flash NC Remarks
PB6/TP14/ PB6/TP14/ PB6/TP14/ PB6/TP14/ PB6/TP14/ PB6/TP14/ PB6/TP14/ NC DREQ0/ DREQ0/ DREQ0/ DREQ0/ DREQ0/ DREQ0/ DREQ0 CS7 CS7 CS7 CS7 CS7 CS7 PB7/TP15/ PB7/TP15/ PB7/TP15/ PB7/TP15/ PB7/TP15/ PB7/TP15/ PB7/TP15/ NC DREQ1/ DREQ1/ DREQ1/ DREQ1/ DREQ1/ DREQ1/ DREQ1/ ADTRG ADTRG ADTRG ADTRG ADTRG ADTRG ADTRG FWE FWE FWE FWE FWE FWE --
9
NC
10*4 FWE
FWE
Flash memory version with single power supply. Mask ROM version, PROM version and flash memory version with dual power supply.
RESO
RESO
RESO
RESO
RESO
RESO
RESO
VPP
VPP
11 12 13 14 15 16 17 18 19 20 21 22
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS NC NC NC NC NC NC NC NC NC NC VSS
P90/TxD0 P90/TxD0 P90/TxD0 P90/TxD0 P90/TxD0 P90/TxD0 P90/TxD0 NC P91/TxD1 P91/TxD1 P91/TxD1 P91/TxD1 P91/TxD1 P91/TxD1 P91/TxD1 NC P92/RxD0 P92/RxD0 P92/RxD0 P92/RxD0 P92/RxD0 P92/RxD0 P92/RxD0 NC P93/RxD1 P93/RxD1 P93/RxD1 P93/RxD1 P93/RxD1 P93/RxD1 P93/RxD1 NC P94/SCK0/ P94/SCK0/ P94/SCK0/ P94/SCK0/ P94/SCK0/ P94/SCK0/ P94/SCK0/ NC IRQ4 IRQ4 IRQ4 IRQ4 IRQ4 IRQ4 IRQ4 P95/SCK1/ P95/SCK1/ P95/SCK1/ P95/SCK1/ P95/SCK1/ P95/SCK1/ P95/SCK1/ NC IRQ5 IRQ5 IRQ5 IRQ5 IRQ5 IRQ5 IRQ5 P40/D0*1 P41/D1*
2 2 1
P40/D0*2 P41/D1*
2 2 2
P40/D0*1 P41/D1*
2 2 1
P40/D0*2 P41/D1*
2 2 2
P40/D0*1 P41/D1*
2 2 1
P40/D0*1 P41/D1*1 P4 /D *1
2 2
P40 P41 P42 P43 VSS
NC NC NC NC VSS
P4 /D *1 P43/D3*1 VSS
P4 /D *2 P43/D3*2 VSS
P4 /D *1 P43/D3*1 VSS
P4 /D *2 P43/D3*2 VSS
P4 /D *1 P43/D3*1 VSS
P43/D3*1 VSS
Rev. 3.00 Sep 27, 2006 page 10 of 872 REJ09B0325-0300
Section 1 Overview
Pin Name Pin No. 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 PROM Mode Mode 1 P4 /D *1
4 4
Mode 2 P4 /D *2
4 4
Mode 3 P4 /D *1
4 4
Mode 4 P4 /D *2
4 4
Mode 5 P4 /D *1
4 4
Mode 6 P4 /D *1
4 4
Mode 7 P44 P45 P46 P47 P30 P31 P32 P33 P34 P35 P36 P37 VCC P10 P11 P12 P13 P14 P15 P16 P17 VSS P20 P21 P22 P23 P24 P25 P26 P27 P50 P51
EPROM Flash NC NC NC NC EO0 EO1 EO2 EO3 EO4 EO5 EO6 EO7 VCC EA0 EA1 EA2 EA3 EA4 EA5 EA6 EA7 VSS EA8 OE EA10 EA11 EA12 EA13 EA14 CE VCC VCC NC NC NC NC I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 VCC A0 A1 A2 A3 A4 A5 A6 A7 VSS A8 OE A10 A11 A12 A13 A14 CE VCC VCC
Remarks
P45/D5*1 P4 /D *1
6 6
P45/D5*2 P4 /D *2
6 6
P45/D5*1 P4 /D *1
6 6
P45/D5*2 P4 /D *2
6 6
P45/D5*1 P4 /D *1
6 6
P45/D5*1 P4 /D *1
6 6
P47/D7*1 D8 D9 D10 D11 D12 D13 D14 D15 VCC A0 A1 A2 A3 A4 A5 A6 A7 VSS A8 A9 A10 A11 A12 A13 A14 A15 A16 A17
P47/D7*2 D8 D9 D10 D11 D12 D13 D14 D15 VCC A0 A1 A2 A3 A4 A5 A6 A7 VSS A8 A9 A10 A11 A12 A13 A14 A15 A16 A17
P47/D7*1 D8 D9 D10 D11 D12 D13 D14 D15 VCC A0 A1 A2 A3 A4 A5 A6 A7 VSS A8 A9 A10 A11 A12 A13 A14 A15 A16 A17
P47/D7*2 D8 D9 D10 D11 D12 D13 D14 D15 VCC A0 A1 A2 A3 A4 A5 A6 A7 VSS A8 A9 A10 A11 A12 A13 A14 A15 A16 A17
P47/D7*1 D8 D9 D10 D11 D12 D13 D14 D15 VCC P10/A0 P11/A1 P12/A2 P13/A3 P14/A4 P15/A5 P16/A6 P17/A7 VSS P20/A8 P21/A9 P22/A10 P23/A11 P24/A12 P25/A13 P26/A14 P27/A15 P50/A16 P51/A17
P47/D7*1 D8 D9 D10 D11 D12 D13 D14 D15 VCC P10/A0 P11/A1 P12/A2 P13/A3 P14/A4 P15/A5 P16/A6 P17/A7 VSS P20/A8 P21/A9 P22/A10 P23/A11 P24/A12 P25/A13 P26/A14 P27/A15 P50/A16 P51/A17
Rev. 3.00 Sep 27, 2006 page 11 of 872 REJ09B0325-0300
Section 1 Overview
Pin Name Pin No. 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 PROM Mode Mode 1 A18 A19 VSS P60/ WAIT P61/ BREQ P62/ BACK STBY RES NMI VSS EXTAL XTAL VCC AS RD HWR LWR MD0 MD1 MD2 AVCC VREF P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 Mode 2 A18 A19 VSS P60/ WAIT P61/ BREQ P62/ BACK STBY RES NMI VSS EXTAL XTAL VCC AS RD HWR LWR MD0 MD1 MD2 AVCC VREF P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 Mode 3 A18 A19 VSS P60/ WAIT P61/ BREQ P62/ BACK STBY RES NMI VSS EXTAL XTAL VCC AS RD HWR LWR MD0 MD1 MD2 AVCC VREF P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 Mode 4 A18 A19 VSS P60/ WAIT P61/ BREQ P62/ BACK STBY RES NMI VSS EXTAL XTAL VCC AS RD HWR LWR MD0 MD1 MD2 AVCC VREF P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 Mode 5 P52/A18 P53/A19 VSS P60/ WAIT P61/ BREQ P62/ BACK STBY RES NMI VSS EXTAL XTAL VCC AS RD HWR LWR MD0 MD1 MD2 AVCC VREF P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 Mode 6 P52/A18 P53/A19 VSS P60/ WAIT P61/ BREQ P62/ BACK STBY RES NMI VSS EXTAL XTAL VCC AS RD HWR LWR MD0 MD1 MD2 AVCC VREF P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 Mode 7 P52 P53 VSS P60 P61 P62 STBY RES NMI VSS EXTAL XTAL VCC P63 P64 P65 P66 MD0 MD1 MD2 AVCC VREF P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 EPROM Flash NC NC VSS EA15 NC NC NC VSS NC EA9 VSS NC NC VCC NC NC NC NC VSS VSS VSS VCC VCC NC NC NC NC NC NC NC NC VSS A15 NC NC NC VCC RES A9 VSS EXTAL XTAL VCC A16 NC VCC NC VSS VSS VSS VCC VCC NC NC NC NC NC NC Remarks
Rev. 3.00 Sep 27, 2006 page 12 of 872 REJ09B0325-0300
Section 1 Overview
Pin Name Pin No. 84 85 86 87 PROM Mode Mode 1 P76/AN6/ DA0 P77/AN7/ DA1 AVSS P80/ RFSH/ IRQ0 P81/CS3/ IRQ1 P82/CS2/ IRQ2 P83/CS1/ IRQ3 P84/CS0 VSS PA0/TP0/ TEND0/ TCLKA PA1/TP1/ TEND1/ TCLKB PA2/TP2/ TIOCA0/ TCLKC PA3/TP3/ TIOCB0/ TCLKD PA4/TP4/ TIOCA1/ CS6 PA5/TP5/ TIOCB1/ CS5 PA6/TP6/ TIOCA2/ CS4 PA7/TP7/ TIOCB2 Mode 2 P76/AN6/ DA0 P77/AN7/ DA1 AVSS P80/ RFSH/ IRQ0 P81/CS3/ IRQ1 P82/CS2/ IRQ2 P83/CS1/ IRQ3 P84/CS0 VSS PA0/TP0/ TEND0/ TCLKA PA1/TP1/ TEND1/ TCLKB PA2/TP2/ TIOCA0/ TCLKC PA3/TP3/ TIOCB0/ TCLKD PA4/TP4/ TIOCA1/ CS6 PA5/TP5/ TIOCB1/ CS5 PA6/TP6/ TIOCA2/ CS4 PA7/TP7/ TIOCB2 Mode 3 P76/AN6/ DA0 P77/AN7/ DA1 AVSS P80/ RFSH/ IRQ0 P81/CS3/ IRQ1 P82/CS2/ IRQ2 P83/CS1/ IRQ3 P84/CS0 VSS PA0/TP0/ TEND0/ TCLKA PA1/TP1/ TEND1/ TCLKB PA2/TP2/ TIOCA0/ TCLKC PA3/TP3/ TIOCB0/ TCLKD PA4/TP4/ TIOCA1/ CS6 PA5/TP5/ TIOCB1/ CS5 PA6/TP6/ TIOCA2/ CS4 A20 Mode 4 P76/AN6/ DA0 P77/AN7/ DA1 AVSS P80/ RFSH/ IRQ0 P81/CS3/ IRQ1 P82/CS2/ IRQ2 P83/CS1/ IRQ3 P84/CS0 VSS PA0/TP0/ TEND0/ TCLKA PA1/TP1/ TEND1/ TCLKB PA2/TP2/ TIOCA0/ TCLKC PA3/TP3/ TIOCB0/ TCLKD PA4/TP4/ TIOCA1/ CS6 PA5/TP5/ TIOCB1/ CS5 PA6/TP6/ TIOCA2/ CS4 A20 Mode 5 P76/AN6/ DA0 P77/AN7/ DA1 AVSS P80/ RFSH/ IRQ0 P81/CS3/ IRQ1 P82/CS2/ IRQ2 P83/CS1/ IRQ3 P84/CS0 VSS PA0/TP0/ TEND0/ TCLKA PA1/TP1/ TEND1/ TCLKB PA2/TP2/ TIOCA0/ TCLKC PA3/TP3/ TIOCB0/ TCLKD PA4/TP4/ TIOCA1/ CS6 PA5/TP5/ TIOCB1/ CS5 PA6/TP6/ TIOCA2/ CS4 PA7/TP7/ TIOCB2 Mode 6 P76/AN6/ DA0 P77/AN7/ DA1 AVSS P80/ RFSH/ IRQ0 P81/CS3/ IRQ1 P82/CS2/ IRQ2 P83/CS1/ IRQ3 P84/CS0 VSS PA0/TP0/ TEND0/ TCLKA PA1/TP1/ TEND1/ TCLKB PA2/TP2/ TIOCA0/ TCLKC PA3/TP3/ TIOCB0/ TCLKD PA4/TP4/ TIOCA1/ A23/CS6 PA5/TP5/ TIOCB1/ A22/CS5 PA6/TP6/ TIOCA2/ A21/CS4 A20 Mode 7 P76/AN6/ DA0 P77/AN7/ DA1 AVSS P80/IRQ0 EPROM Flash NC NC VSS EA16 NC NC VSS NC Remarks
88 89 90 91 92 93
P81/IRQ1 P82/IRQ2 P83/IRQ3 P84 VSS PA0/TP0/ TEND0/ TCLKA PA1/TP1/ TEND1/ TCLKB PA2/TP2/ TIOCA0/ TCLKC PA3/TP3/ TIOCB0/ TCLKD PA4/TP4/ TIOCA1 PA5/TP5/ TIOCB1 PA6/TP6/ TIOCA2 PA7/TP7/ TIOCB2
PGM NC NC NC VSS NC
NC VCC WE NC VSS NC
94
NC
NC
95
NC
NC
96
NC
NC
97
NC
NC
98
NC
NC
99
NC
NC
100
NC
NC
Rev. 3.00 Sep 27, 2006 page 13 of 872 REJ09B0325-0300
Section 1 Overview Notes: Pins marked NC should be left unconnected. For details on PROM mode see section 18, ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version). 1. In modes 1, 3, 5, and 6 the P40 to P47 functions of pins P40/D0 to P47/D7 are selected after a reset, but they can be changed by software. 2. In modes 2 and 4 the D0 to D7 functions of pins P40/D0 to P47/D7 are selected after a reset, but they can be changed by software. 3. For the H8/3048B Group which operates at 5 V, this pin is also used as the VCL terminal, and for those at 3 V, VCC terminal. For the H8/3048 ZTAT version, H8/3048F version, H8/3048 mask ROM version, H8/3047 mask ROM version, H8/3045 mask ROM version, and H8/3044 mask ROM version, this pin is also used as the VCC terminal. 4. This pin functions as the FWE pin on the single power supply on-chip flash memory version. Under no circumstances should 12 V be applied to the single power supply onchip flash memory version (H8/3048F-ONE), or to H8/3048 Group or H8/3048B Group mask ROM products. Doing so will destroy the chip. This pin functions as an overview control signal in modes 5, 6, and 7. The pin functions as the RESO pin in on-chip mask ROM versions, on-chip PROM versions, and dual power supply flash memory versions.
Rev. 3.00 Sep 27, 2006 page 14 of 872 REJ09B0325-0300
Section 1 Overview
1.3.3
Pin Functions
Table 1.4 summarizes the pin functions. For the H8/3048B Group which operates at 5 V, the external capacitor is required for the VCL pin. Table 1.4
Type Power
Pin Functions
Symbol VCC Pin No.
1 1* , 35, 68
I/O Input
Name and Function Power: For connection to the power supply. Connect all VCC pins to the system power supply. Ground: For connection to ground (0 V). Connect all VSS pins to the 0-V system power supply. The external capacitor must be connected between the VCL and GND (0 V). Do not connect to VCC.
VCL 0.1 F
VSS
11, 22, 44, 57, 65, 92 1*
2
Input
Internal stepdown pin
VCL
Output
Clock
XTAL
67
Input
For connection to a crystal resonator. For examples of crystal resonator and external clock input, see section 19, Clock Pulse Generator. For connection to a crystal resonator or input of an external clock signal. For examples of crystal resonator and external clock input, see section 19, Clock Pulse Generator. System clock: Supplies the system clock to external devices.
EXTAL
66
Input
61
Output
Rev. 3.00 Sep 27, 2006 page 15 of 872 REJ09B0325-0300
Section 1 Overview Type Symbol Pin No. 75 to 73 I/O Input Name and Function Mode 2 to mode 0: For setting the operating mode, as follows. Inputs at these pins must not be changed during operation. MD2 0 0 0 0 1 1 1 1 System control RES RESO 63 10 Input Output MD1 0 0 1 1 0 0 1 1 MD0 0 1 0 1 0 1 0 1 Operating Mode -- Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Mode 7
Operating mode MD2 to MD0 control
Reset input: When driven low, this pin resets the chip Reset output: For the mask ROM version, outputs a reset signal to external devices Also used as a power supply for on-board programming of the flash memory version with dual power supply.
(RESO/VPP)
3 FWE*
10
Input
Write enable signal: Write-control signal for writing to flash memory for the flash memory version with single power supply Standby: When driven low, this pin forces a transition to hardware standby mode Bus request: Used by an external bus master to request the bus right Bus request acknowledge: Indicates that the bus has been granted to an external bus master Nonmaskable interrupt: Requests a nonmaskable interrupt Interrupt request 5 to 0: Maskable interrupt request pins Address bus: Outputs address signals
STBY BREQ BACK
62 59 60
Input Input Output
Interrupts
NMI IRQ5 to IRQ0
64 17, 16, 90 to 87 97 to 100, 56 to 45, 43 to 36 34 to 23, 21 to 18
Input Input Output
Address bus
A23 to A0
Data bus
D15 to D0
Input/ output
Data bus: Bidirectional data bus
Rev. 3.00 Sep 27, 2006 page 16 of 872 REJ09B0325-0300
Section 1 Overview Type Bus control Symbol CS7 to CS0 AS RD HWR Pin No. 8, 97 to 99, 88 to 91 69 70 71 I/O Output Output Output Output Name and Function Chip select: Select signals for areas 7 to 0 Address strobe: Goes low to indicate valid address output on the address bus Read: Goes low to indicate reading from the external address space High write: Goes low to indicate writing to the external address space; indicates valid data on the upper data bus (D15 to D8). Low write: Goes low to indicate writing to the external address space; indicates valid data on the lower data bus (D7 to D0). Wait: Requests insertion of wait states in bus cycles during access to the external address space Refresh: Indicates a refresh cycle Row address strobe RAS Row address RAS: strobe signal for DRAM connected to area 3 Column address strobe CAS: Column CAS address strobe signal for DRAM connected to area 3; used with 2WE DRAM. Write enable WE Write enable signal for WE: DRAM connected to area 3; used with 2CAS DRAM. HWR 71 Output Upper write UW Write enable signal for UW: DRAM connected to area 3; used with 2WE DRAM. Upper column address strobe UCAS UCAS: Column address strobe signal for DRAM connected to area 3; used with 2CAS DRAM. LWR 72 Output Lower write LW Write enable signal for LW: DRAM connected to area 3; used with 2WE DRAM. Lower column address strobe LCAS LCAS: Column address strobe signal for DRAM connected to area 3; used with 2CAS DRAM.
LWR
72
Output
WAIT
58
Input
Refresh controller
RFSH CS3 RD
87 88 70
Output Output Output
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Section 1 Overview Type DMA controller (DMAC) Symbol DREQ1, DREQ0 TEND1, TEND0 16-bit integrated TCLKD to timer unit (ITU) TCLKA TIOCA4 to TIOCA0 TIOCB4 to TIOCB0 TOCXA4 TOCXB4 Programmable TP15 to TP0 timing pattern controller (TPC) Serial communication interface (SCI) TxD1, TxD0 RxD1, RxD0 Pin No. 9, 8 94, 93 I/O Input Output Name and Function DMA request 1 and 0: DMAC activation requests Transfer end 1 and 0: These signals indicate that the DMAC has ended a data transfer Clock input D to A: External clock inputs Input capture/output compare A4 to A0: GRA4 to GRA0 output compare or input capture, or PWM output Input capture/output compare B4 to B0: GRB4 to GRB0 output compare or input capture Output compare XA4: PWM output Output compare XB4: PWM output TPC output 15 to 0: Pulse output
96 to 93 4, 2, 99, 97, 95 5, 3, 100, 98, 96 6 7 9 to 2, 100 to 93 13, 12 15, 14
Input Input/ output Input/ output Output Output Output
Output Input Input/ output Input Input Output Input
Transmit data (channels 0 and 1): SCI data output Receive data (channels 0 and 1): SCI data input Serial clock (channels 0 and 1): SCI clock input/output Analog 7 to 0: Analog input pins A/D trigger: External trigger input for starting A/D conversion Analog output: Analog output from the D/A converter Power supply pin for the A/D and D/A converters. Connect to the system power supply (VCC) when not using the A/D and D/A converters. Ground pin for the A/D and D/A converters. Connect to system ground (VSS).
SCK1, SCK0 17, 16 A/D converter AN7 to AN0 ADTRG D/A converter A/D and D/A converters DA1, DA0 AVCC 85 to 78 9 85, 84 76
AVSS
86
Input
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Section 1 Overview Type A/D and D/A converters Symbol VREF Pin No. 77 I/O Input Name and Function Reference voltage input pin for the A/D and D/A converters. Connect to the system power supply (VCC) when not using the A/D and D/A converters. Port 1: Eight input/output pins. The direction of each pin can be selected in the port 1 data direction register (P1DDR). Port 2: Eight input/output pins. The direction of each pin can be selected in the port 2 data direction register (P2DDR). Port 3: Eight input/output pins. The direction of each pin can be selected in the port 3 data direction register (P3DDR). Port 4: Eight input/output pins. The direction of each pin can be selected in the port 4 data direction register (P4DDR). Port 5: Four input/output pins. The direction of each pin can be selected in the port 5 data direction register (P5DDR). Port 6: Seven input/output pins. The direction of each pin can be selected in the port 6 data direction register (P6DDR). Port 7: Eight input pins Port 8: Five input/output pins. The direction of each pin can be selected in the port 8 data direction register (P8DDR). Port 9: Six input/output pins. The direction of each pin can be selected in the port 9 data direction register (P9DDR). Port A: Eight input/output pins. The direction of each pin can be selected in the port A data direction register (PADDR). Port B: Eight input/output pins. The direction of each pin can be selected in the port B data direction register (PBDDR).
I/O ports
P17 to P10
43 to 36
Input/ output Input/ output Input/ output Input/ output Input/ output Input/ output Input Input/ output Input/ output Input/ output Input/ output
P27 to P20
52 to 45
P37 to P30
34 to 27
P47 to P40
26 to 23, 21 to 18 56 to 53
P53 to P50
P66 to P60
72 to 69, 60 to 58 85 to 78 91 to 87
P77 to P70 P84 to P80
P95 to P90
17 to 12
PA7 to PA0
100 to 93
PB7 to PB0
9 to 2
Notes: 1. For H8/3048 Group products and H8/3048B Group models operating at 3 V. 2. For the H8/3048B Group which operates at 5 V. 3. Do NOT apply 12 V to the H8/3048B Group as the chip will be destroyed.
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Section 1 Overview
1.4
Notes on H8/3048F-ONE (Single Power Supply)
There are two models of the H8/3048F-ZTAT with on-chip flash memory: a dual power supply model (H8/3048F) and single power supply model (H8/3048F-ONE). Points to be noted when using the single power supply H8/3048F-ONE are given below. 1.4.1 Voltage Application
12 V must not be applied to the H8/3048F-ONE (single power supply), as this will permanently damage the device. The flash memory programming power source for the H8/3048F-ONE (single power supply) is VCC. The programming power source for the dual power supply model was the VPP pin (12 V), but there is no VPP pin in the single power supply models. In the H8/3048F-ONE the FWE pin is provided at the same pin position as the VPP pin in the dual power supply model, but FWE is not a power source pin-it is used to control flash memory write enabling. Also, in boot mode, 12 V must be applied to the MD2 pin in the dual power supply model, but this is not necessary in the H8/3048F-ONE (single power supply). The maximum rating of the FWE and MD2 pins in the H8/3048F-ONE (single power supply) is VCC +0.3 V. Applying a voltage in excess of the maximum rating will permanently damage the device. Do not select the HN28F101 programmer setting for the H8/3048F-ONE (single power supply). If this setting is made by mistake, 12.0 V may be applied to the FWE pin, causing permanent damage to the device. When using a PROM programmer to program the on-chip flash memory in the H8/3048F-ONE model (single power supply), use a PROM programmer that supports Renesas Technology microcomputer device types with 128-kbyte on-chip flash memory.
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Section 1 Overview
1.4.2
Product Type Names and Markings
Table 1.5 shows examples of product type names and markings for the H8/3048F (dual power supply model), H8/3048F-ONE (single power supply), and the differences in flash memory programming power source. Table 1.5 Differences in H8/3048F and H8/3048F-ONE
Dual Power Supply Model: H8/3048F Product type name Sample markings
H8/3048
3J1 HD 64F3048F16
Single Power Supply Model: H8/3048F-ONE HD64F3048BF25 HD64F3048BVF25
HD64F3048F16
64F3048F25 H8/3048F-ONE
PGM 5.0 BK80090 B 0021
64F3048VF25 H8/3048F-ONE
PGM 3.3 BK80090 B 0021
Flash memory VPP power source programming (12.0 0.6 V) power source
VCC power source (5.0 10%)
VCC power source (3.0 to 3.6 V)
1.4.3
Differences between H8/3048F and H8/3048F-ONE
Table 1.6 shows the differences between the H8/3048F (dual power supply model) and H8/3048FONE (single power supply model).
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Section 1 Overview
Table 1.6
Item
Differences between H8/3048F and H8/3048F-ONE
Models with Dual Power Supply: 1 H8/3048F* Pin 1: VCC Models with Single Power Supply: H8/3048F-ONE Pin 1: VCL (when a model which operates at 5 V is used) Connected to VSS with 0.1 F externally applied. Pin 1 becomes VCC when a model which operates at 3 V is used. Pin 10: VPP/RESO Pin 10: FWE 128-kbyte flash memory with single power supply, RAM: 4 kbytes Writing in 128-byte units Application of 12 V is not required. VCC single power supply FWE function only (no RESO function)
FWE = 1
MD0 1 0 1
MD2 MD1 0 0 0 1 0 1 Set to mode 1 in mode 5 Set to mode 2 in mode 6 Set to mode 3 in mode 7 Cancelled by reset Mode 5 Mode 6 Mode 7 MD0 1 0 1
Pin specifications
ROM/RAM Units of onboard writing Write/erase voltage Boot mode settings
128-kbyte flash memory with dual power supply, RAM: 4 kbytes Writing in 1-byte units 12 V is externally applied from VPP pin
VPP pin functions Multiplexes with RESO
RESO = 12 V
MD2 MD1 Mode 5 12 V 0 Mode 6 12 V 1 Mode 7 12 V 1 Cancelled by reset
Settings for user program mode
RESO = 12 V
MD2 MD1 Mode 5 1 0 Mode 6 1 1 Mode 7 1 1 Cancelled by reset MD0 1 0 1
FWE = 1
MD2 MD1 1 0 1 1 1 1 Cancelled by reset Mode 5 Mode 6 Mode 7 MD0 1 0 1
Prewrite processing Erasing blocks
Necessary before erasing More than one block can be erased at the same time (verifies in block units and erases only the unerased blocks)
Not necessary Erases in one block units. More than one block cannot be erased at the same time (the erasing flow is different)
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Section 1 Overview Models with Dual Power Supply: 1 H8/3048F* Before writing, sets the block with the address to be written to EBR1/EBR2
FLMCR (H'FF40)
VPP VPPE EV PV E P
Item Write processing FLMCR
Models with Single Power Supply: H8/3048F-ONE No setting
FLMCR1 (H'FF40)
FWE SWE ESU PSU EV PV E P
FLMCR2 (H'FF41)
FLER
EBR
EBR1 (H'FF42)
LB7 LB6 LB5 LB4 LB3 LB2 LB1 LB0
EBR (H'FF42)
EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0
EBR2 (H'FF43)
SB7 SB6 SB5 SB4 SB3 SB2 SB1 SB0
Only one block can be selected(setting for erasing)
More than one block can be selected (setting for writing/erasing) RAMCR
RAMCR (H'FF48)
FLER RAMS RAM2 RAM1 RAM0
RAMCR (H'FF47)
RAMS RAM2 RAM1 --
Division of flash memory block
Division in 16 blocks 16 kbytes x 7: LB0 to LB6 12 kbytes x 1: LB7 512 kbytes x 8: SB0 to SB7
Flash memory LB0 (16 kbytes) LB1 (16 kbytes) LB2 (16 kbytes) LB3 (16 kbytes) LB4 (16 kbytes) LB5 (16 kbytes) LB6 (16 kbytes) LB7 (12 kbytes) SB0 (512 bytes) SB1 (512 bytes) SB2 (512 bytes) SB3 (512 bytes) SB4 (512 bytes) SB5 (512 bytes) SB6 (512 bytes) SB7 (512 bytes) H'00000
Division in 8 blocks 1 kbyte x 4: EB0 to EB3 28 kbytes x 1: EB4 32 kbytes x 3: EB5 to EB7
Flash memory H'00000 EB0 (1 kbyte) EB1 (1 kbyte) EB2 (1 kbyte) EB3 (1 kbyte) EB4 (28 kbytes) EB5 (32 kbytes) EB6 (32 kbytes) EB7 (32 kbytes) H'1FFFF
H'1FFFF
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Section 1 Overview Models with Dual Power Supply: 1 H8/3048F*
On-chip RAM H'EF10 H'F000 H'F1FF H'1EFFF H'1F000 H'1F200 H'1F400 H'FF0F H'1F600 H'1F800 H'1FA00 H'1FC00 H'1FE00 H'1FFFF Flash memory H'00000
Item Division of RAM emulation block
Models with Single Power Supply: H8/3048F-ONE
On-chip RAM Flash memory
H'EF10 H'F000
H'00000 H'00400 H'00800 H'00C00
H'F3FF
H'01000
H'FF0F
H'1FFFF
Reset during operation A/D ADCR
The RES signal must be kept low during The RES signal must be kept low during at least 6 system clock (6) cycles. at least 20 system clock (20) cycles. (RES pulse width tRESW = min. 6.0 tcyc) (RES pulse width tRESW = min. 20 tcyc) ADCR (H'FFE9) Initial value: H'7F Only bit 7 can be read or written. ADCR (H'FFE9) Initial value: H'7E Only bit 7 can be read or written.
Other bits are reserved and always read Bit 0 is reserved and must not be set to 1. as 1; writing to these bits is invalid. Other bits are reserved and always read as 1; writing to these bits is invalid. WDT RSTCSR RSTCSR (H'FFAB) Initial value: H'3F RSTCSR (H'FFAB) Initial value: H'3F
Only bits 7 and 6 can be read or written. Only bit 7 can be read or written. Other bits are reserved and always read Bit 6 is reserved and must not be set to 1. as 1; writing to these bits is invalid. Other bits are reserved and always read as 1; writing to these bits is invalid.
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Section 1 Overview Models with Dual Power Supply: 1 H8/3048F*
Setting of standby timer select bits 2 to 0
STS2 STS1 STS0 0 0 1 1 0 1 0 1 0 1 0 1
Item Clock oscillator settling time (SYSCR STS2 to STS0)
Models with Single Power Supply: H8/3048F-ONE
Setting of standby timer select bits 2 to 0
STS2 0 STS1 0 1 1 0 1 STS0 0 1 0 1 0 1 0 1 Description 8,192 states 16,384 states 32,768 states 65,536 states 131,072 states 262,144 states 1,024 states Illegal setting
Description 8,192 states 16,384 states 32,768 states 65,536 states 131,072 states 1,024 states Illegal setting
Details on flash Refer to section 19, Flash Memory memory (H8/3048F, Dual Power Supply). Electrical characteristics (clock rate) Clock rate: 1 to 16 MHz Refer to section 22, Table 22.1 Electrical Characteristics of H8/3048 2 Group Products.*
Refer to section 18, ROM (H8/3048FONE: Single Power Supply, H8/3048B Mask ROM Version) Clock rate: 2 to 25 MHz Refer to section 21, Table 21.1 Electrical Characteristics of H8/3048 Group and H8/3048B Group Products. Refer to appendix B, Table B.1 Comparison of H8/3048 Group Internal 2 I/O Register Specifications* Refer to appendix B.1, Addresses (For H8/3048F-ONE, H8/3048B Mask 2 ROM Version)*
List of registers Refer to appendix B, Table B.1 Comparison of H8/3048 Group Internal 2 I/O Register Specifications* Refer to appendix B.2, Addresses (For H8/3048F, H8/3048ZTAT, H8/3048 Mask-ROM, H8/3047 MaskROM, H8/3045 Mask-ROM, and 2 H8/3044 Mask-ROM Versions)* On-chip emulator --
On-chip emulator (E10T)
Notes: 1. Refer to the "H8/3048 Group, H8/3048F-ZTATTM Hardware Manual" for information about H8/3048F. 2. H8/3048F and H8/3048F-ONE can be referred to also on this manual.
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Section 1 Overview
1.4.4
VCL Pin
The H8/3048B Group 5 V operation models have a VCL (internal step-down) pin, to which a 0.1 F internal voltage stabilization capacitor must be connected. The method of connecting the external capacitor is shown in figure 1.4. Do not connect the VCC power supply to the VCL pin. (Connect the VCC power supply to other VCC pins as usual.) Note that the VCL output pin occupies the same location as a VCC pin in the H8/3048F, H8/3048ZTAT and on-chip mask ROM models (H8/3048, H8/3047, H8/3045, and H8/3044).
VCC power supply External capacitor 0.1 F VCL (Pin 1) H8/3048B Group (5 V operation model) VCC (Pin 1) H8/3048B Group (3 V operation model) H8/3048 Group
Do not connect the VCC power supply to the VCL pin. (Connect the VCC power supply to other VCC pins as usual.) Place the capacitor close to the pin.
These versions have a VCC power supply pin in the same pin position as a VCC pin in the H8/3048F-ONE.
Figure 1.4 Method of Connecting H8/3048B Group VCL Capacitor The 3 V operation models of the H8/3048B Group do not have a VCL pin. The 3 V operation models have a VCC power supply pin at the location of the VCL pin in the 5 V operation models. Therefore, 3 V operation models do not require connection of an external capacitor, and this pin should be connected to the power supply in the same way as other VCC pins.
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Section 1 Overview
VCC power supply External capacitor 0.1 F 5 V operation model VCL VCC 3 V operation model
Figure 1.5 Difference between 5 V and 3 V Operation Models 1.4.5 Note on Changeover to H8/3048 Group Mask ROM Version
Care is required when changing from the H8/3048F-ONE with on-chip flash memory to a model with on-chip H8/3048 Group mask ROM (H8/3048, H8/3047, H8/3045, or H8/3044). An external capacitor must be connected to the VCL pin of the H8/3048F-ONE (5 V model). This VCL pin occupies the same location as a VCC pin in the on-chip mask ROM versions. Changeover to a mask ROM version must therefore be taken into account when undertaking pattern design, etc., in the board design stage.
VCC power supply
H8/3048F-ONE (5 V operation model)
VCC pin
VCL pin
Land pattern for mask ROM version (0 resistance mounted) Land pattern for H8/3048F-ONE (5 V operation model) (0.1 F capacitor mounted)
Figure 1.6 Example of Board Pattern Providing for External Capacitor
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Section 1 Overview
1.5
Setting Oscillation Settling Wait Time
When software standby mode is used, after exiting software standby mode a wait period must be provided to allow the clock to stabilize. Select the length of time for which the CPU and peripheral functions are to wait by setting bits STS2 to STS0 in the system control register (SYSCR) and bits DIV1 and DIV0 in the division ratio control register (DIVCR) according to the operating frequency of the chip. For the H8/3048B Group, ensure that the oscillation settling wait time is at least 0.1 ms when operating on an external clock. For setting details, see section 20.4.3, Selection of Waiting Time for Exit from Software Standby Mode.
1.6
Notes on Crystal Resonator Connection
The H8/3048B Group support an operating frequency of up to 25 MHz. If a crystal resonator with a frequency higher than 20 MHz is connected, attention must be paid to circuit constants such as external load capacitance values. For details see section 19.2.1, Connecting a Crystal Resonator.
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Section 2 CPU
Section 2 CPU
2.1 Overview
The H8/300H CPU is a high-speed central processing unit with an internal 32-bit architecture that is upward-compatible with the H8/300 CPU. The H8/300H CPU has sixteen 16-bit general registers, can address a 16-Mbyte linear address space, and is ideal for realtime control. 2.1.1 Features
The H8/300H CPU has the following features. * Upward compatibility with H8/300 CPU Can execute H8/300 Series object programs * General-register architecture Sixteen 16-bit general registers (also usable as sixteen 8-bit registers or eight 32-bit registers) * Sixty-two basic instructions 8/16/32-bit data transfer and arithmetic and logic instructions Multiply and divide instructions Powerful bit-manipulation instructions * Eight addressing modes Register direct [Rn] Register indirect [@ERn] Register indirect with displacement [@(d:16, ERn) or @(d:24, ERn)] Register indirect with post-increment or pre-decrement [@ERn+ or @-ERn] Absolute address [@aa:8, @aa:16, or @aa:24] Immediate [#xx:8, #xx:16, or #xx:32] Program-counter relative [@(d:8, PC) or @(d:16, PC)] Memory indirect [@@aa:8] * 16-Mbyte linear address space * High-speed operation All frequently-used instructions execute in two to four states Maximum clock frequency: 8 x 8-bit register-register multiply: 16 / 8-bit register-register divide: 25 MHz (H8/3048B Group) 560 ns @ 25 MHz/875 ns @ 16 MHz 560 ns @ 25 MHz/875 ns @ 16 MHz
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8/16/32-bit register-register add/subtract: 80 ns @ 25 MHz/125 ns @ 16 MHz
Section 2 CPU
16 x 16-bit register-register multiply: 32 / 16-bit register-register divide: * Two CPU operating modes
880 ns @ 25 MHz/1,375 ns @ 16 MHz 880 ns @ 25 MHz/1,375 ns @ 16 MHz
Normal mode (not available in the H8/3048B Group) Advanced mode * Low-power mode Transition to power-down state by SLEEP instruction 2.1.2 Differences from H8/300 CPU
In comparison to the H8/300 CPU, the H8/300H has the following enhancements. * More general registers Eight 16-bit registers have been added. * Expanded address space Advanced mode supports a maximum 16-Mbyte address space. Normal mode supports the same 64-kbyte address space as the H8/300 CPU. (Normal mode is not available in the H8/3048B Group.) * Enhanced addressing The addressing modes have been enhanced to make effective use of the 16-Mbyte address space. * Enhanced instructions Data transfer, arithmetic, and logic instructions can operate on 32-bit data. Signed multiply/divide instructions and other instructions have been added.
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Section 2 CPU
2.2
CPU Operating Modes
The H8/300H CPU has two operating modes: normal and advanced. Normal mode supports a maximum 64-kbyte address space. Advanced mode supports up to 16 Mbytes. See figure 2.1. The H8/3048B Group can be used only in advanced mode. (Information from this point on will apply to advanced mode unless otherwise stated.)
Maximum 64 kbytes, program and data areas combined
Normal mode
CPU operating modes Maximum 16 Mbytes, program and data areas combined
Advanced mode
Figure 2.1 CPU Operating Modes
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Section 2 CPU
2.3
Address Space
The maximum address space of the H8/300H CPU is 16 Mbytes. The H8/3048B Group has various operating modes (MCU modes), some providing a 1-Mbyte address space, the others supporting the full 16 Mbytes. Figure 2.2 shows the address ranges of the H8/3048B Group. For further details see section 3.6, Memory Map in Each Operating Mode. The 1-Mbyte operating modes use 20-bit addressing. The upper 4 bits of effective addresses are ignored.
H'00000
H'000000
H'FFFFF
H'FFFFFF a. 1-Mbyte modes b. 16-Mbyte modes
Figure 2.2 Memory Map
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Section 2 CPU
2.4
2.4.1
Register Configuration
Overview
The H8/300H CPU has the internal registers shown in figure 2.3. There are two types of registers: general registers and control registers.
General Registers (ERn) 15 ER0 ER1 ER2 ER3 ER4 ER5 ER6 ER7 Control Registers (CR) 23 PC 76543210 CCR I UI H U N Z V C Legend: SP: Stack pointer PC: Program counter CCR: Condition code register Interrupt mask bit I: User bit or interrupt mask bit UI: Half-carry flag H: User bit U: Negative flag N: Zero flag Z: Overflow flag V: Carry flag C: 0 E0 E1 E2 E3 E4 E5 E6 E7 (SP) 07 R0H R1H R2H R3H R4H R5H R6H R7H 07 R0L R1L R2L R3L R4L R5L R6L R7L 0
Figure 2.3 CPU Internal Registers
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Section 2 CPU
2.4.2
General Registers
The H8/300H CPU has eight 32-bit general registers. These general registers are all functionally alike and can be used without distinction between data registers and address registers. When a general register is used as a data register, it can be accessed as a 32-bit, 16-bit, or 8-bit register. When the general registers are used as 32-bit registers or as address registers, they are designated by the letters ER (ER0 to ER7). The ER registers divide into 16-bit general registers designated by the letters E (E0 to E7) and R (R0 to R7). These registers are functionally equivalent, providing a maximum sixteen 16-bit registers. The E registers (E0 to E7) are also referred to as extended registers. The R registers divide into 8-bit general registers designated by the letters RH (R0H to R7H) and RL (R0L to R7L). These registers are functionally equivalent, providing a maximum sixteen 8-bit registers. Figure 2.4 illustrates the usage of the general registers. The usage of each register can be selected independently.
* Address registers * 32-bit registers
* 16-bit registers E registers (extended registers) E0 to E7
* 8-bit registers
ER registers ER0 to ER7 R registers R0 to R7
RH registers R0H to R7H
RL registers R0L to R7L
Figure 2.4 Usage of General Registers
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Section 2 CPU
General register ER7 has the function of stack pointer (SP) in addition to its general-register function, and is used implicitly in exception handling and subroutine calls. Figure 2.5 shows the stack.
Free area SP (ER7) Stack area
Figure 2.5 Stack 2.4.3 Control Registers
The control registers are the 24-bit program counter (PC) and the 8-bit condition code register (CCR). Program Counter (PC) This 24-bit counter indicates the address of the next instruction the CPU will execute. The length of all CPU instructions is 2 bytes (one word) or a multiple of 2 bytes, so the least significant PC bit is ignored. When an instruction is fetched, the least significant PC bit is regarded as 0. Condition Code Register (CCR) This 8-bit register contains internal CPU status information, including the interrupt mask bit (I) and half-carry (H), negative (N), zero (Z), overflow (V), and carry (C) flags. * Bit 7--Interrupt Mask Bit (I): Masks interrupts other than NMI when set to 1. NMI is accepted regardless of the I bit setting. The I bit is set to 1 at the start of an exception-handling sequence. * Bit 6--User Bit or Interrupt Mask Bit (UI): Can be written and read by software using the LDC, STC, ANDC, ORC, and XORC instructions. This bit can also be used as an interrupt mask bit. For details see section 5, Interrupt Controller. * Bit 5--Half-Carry Flag (H): When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B, or NEG.B instruction is executed, this flag is set to 1 if there is a carry or borrow at bit 3, and cleared to 0 otherwise. When the ADD.W, SUB.W, CMP.W, or NEG.W instruction is
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Section 2 CPU
executed, the H flag is set to 1 if there is a carry or borrow at bit 11, and cleared to 0 otherwise. When the ADD.L, SUB.L, CMP.L, or NEG.L instruction is executed, the H flag is set to 1 if there is a carry or borrow at bit 27, and cleared to 0 otherwise. * Bit 4--User Bit (U): Can be written and read by software using the LDC, STC, ANDC, ORC, and XORC instructions. * Bit 3--Negative Flag (N): Indicates the most significant bit (sign bit) of data. * Bit 2--Zero Flag (Z): Set to 1 to indicate zero data, and cleared to 0 to indicate non-zero data. * Bit 1--Overflow Flag (V): Set to 1 when an arithmetic overflow occurs, and cleared to 0 at other times. * Bit 0--Carry Flag (C): Set to 1 when a carry occurs, and cleared to 0 otherwise. Used by: Add instructions, to indicate a carry Subtract instructions, to indicate a borrow Shift and rotate instructions, to store the value shifted out of the end bit The carry flag is also used as a bit accumulator by bit manipulation instructions. Some instructions leave flag bits unchanged. Operations can be performed on CCR by the LDC, STC, ANDC, ORC, and XORC instructions. The N, Z, V, and C flags are used by conditional branch (Bcc) instructions. For the action of each instruction on the flag bits, see appendix A.1, Instruction List. For the I and UI bits, see section 5, Interrupt Controller. 2.4.4 Initial CPU Register Values
In reset exception handling, PC is initialized to a value loaded from the vector table, and the I bit in CCR is set to 1. The other CCR bits and the general registers are not initialized. In particular, the stack pointer (ER7) is not initialized. The stack pointer must therefore be initialized by an MOV.L instruction executed immediately after a reset.
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Section 2 CPU
2.5
Data Formats
The H8/300H CPU can process 1-bit, 4-bit (BCD), 8-bit (byte), 16-bit (word), and 32-bit (longword) data. Bit-manipulation instructions operate on 1-bit data by accessing bit n (n = 0, 1, 2, ..., 7) of byte operand data. The DAA and DAS decimal-adjust instructions treat byte data as two digits of 4-bit BCD data. 2.5.1 General Register Data Formats
Figures 2.6 and 2.7 show the data formats in general registers.
General Register
Data Type
Data Format 7 0 Don't care 7 0
1-bit data
RnH
76543210
1-bit data
RnL 7
Don't care 43 0
76543210
4-bit BCD data
RnH
Upper digit Lower digit
Don't care 7 43 0
4-bit BCD data
RnL 7
Don't care 0
Upper digit Lower digit
Byte data
RnH MSB LSB 7
Don't care 0 LSB
Byte data
RnL
Don't care MSB
Figure 2.6 General Register Data Formats (1)
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Section 2 CPU
Data Type
General Register
Data Format 15 0 LSB
Word data
Rn MSB 15 0 LSB 16 15 0 LSB
Word data
En MSB 31
Longword data ERn MSB Legend: ERn: General register En: General register E Rn: General register R RnH: General register RH RnL: General register RL MSB: Most significant bit LSB: Least significant bit
Figure 2.7 General Register Data Formats (2)
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Section 2 CPU
2.5.2
Memory Data Formats
Figure 2.8 shows the data formats on memory. The H8/300H CPU can access word data and longword data on memory, but word or longword data must begin at an even address. If an attempt is made to access word or longword data at an odd address, no address error occurs but the least significant bit of the address is regarded as 0, so the access starts at the preceding address. This also applies to instruction fetches.
Data Type Address Data Format
7 1-bit data Byte data Word data Address L Address L Address 2M Address 2M + 1 Address 2N Longword data Address 2N + 1 Address 2N + 2 Address 2N + 3
MSB
0 6 5 4 3 2 1 0
LSB
7
MSB
MSB LSB
LSB
Figure 2.8 Memory Data Formats When ER7 (SP) is used as an address register to access the stack, the operand size should be word size or longword size.
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Section 2 CPU
2.6
2.6.1
Instruction Set
Instruction Set Overview
The H8/300H CPU has 62 types of instructions, which are classified in table 2.1. Table 2.1
Function Data transfer Arithmetic operations
Instruction Classification
Instruction MOV, PUSH* , POP* , MOVTPE* , MOVFPE*
1 1 2 2
Types 3 18
ADD, SUB, ADDX, SUBX, INC, DEC, ADDS, SUBS, DAA, DAS, MULXU, MULXS, DIVXU, DIVXS, CMP, NEG, EXTS, EXTU AND, OR, XOR, NOT SHAL, SHAR, SHLL, SHLR, ROTL, ROTR, ROTXL, ROTXR BSET, BCLR, BNOT, BTST, BAND, BIAND, BOR, BIOR, BXOR, BIXOR, BLD, BILD, BST, BIST 3 Bcc* , JMP, BSR, JSR, RTS TRAPA, RTE, SLEEP, LDC, STC, ANDC, ORC, XORC, NOP EEPMOV
Logic operations Shift operations Bit manipulation Branch System control Block data transfer
4 8 14 5 9 1 Total 62 types
Notes: 1. POP.W Rn is identical to MOV.W @SP+, Rn. PUSH.W Rn is identical to MOV.W Rn, @-SP. POP.L ERn is identical to MOV.L @SP+, Rn. PUSH.L ERn is identical to MOV.L Rn, @-SP. 2. Not available in the H8/3048B Group. 3. Bcc is a generic branching instruction.
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2.6.2
Instructions and Addressing Modes
Table 2.2 indicates the instructions available in the H8/300H CPU. Table 2.2 Instructions and Addressing Modes
Addressing Modes @ERn+/@-ERn @(d:16,ERn) @(d:24,ERn)
@(d:8,PC)
Function
Instruction @ERn
@(d:16,PC)
@@aa:8 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- --
@aa:16
@aa:24
@aa:8
#xx
Rn
Data transfer
MOV POP, PUSH MOVFPE*, MOVTPE* ADD, CMP SUB ADDX, SUBX ADDS, SUBS INC, DEC DAA, DAS MULXU, MULXS, DIVXU, DIVXS NEG EXTU, EXTS
BWL -- -- BWL WL B -- -- -- -- -- -- BWL -- -- -- -- -- -- -- -- -- B -- B -- --
BWL -- -- BWL BWL B L BWL B BW BWL WL BWL BWL BWL B -- -- -- -- -- -- B B -- -- --
BWL -- -- -- -- -- -- -- -- -- -- -- -- -- -- B -- -- -- -- -- W W -- -- --
BWL -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- W W -- -- --
BWL -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- W W -- -- --
BWL -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- W W -- -- --
B -- -- -- -- -- -- -- -- -- -- -- -- -- -- B -- -- -- -- -- -- -- -- -- -- --
BWL -- B -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- W W -- -- --
BWL -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- --
-- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- --
-- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- --
-- WL -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- --
Arithmetic operations
Logic operations
AND, OR, XOR NOT
Shift instructions Bit manipulation Branch Bcc, BSR JMP, JSR RTS System control TRAPA RTE SLEEP LDC STC ANDC, ORC, XORC NOP Block data transfer Legend: B: Byte W: Word L: Longword
-- -- -- -- W W -- -- --
-- -- -- -- -- -- -- -- --
-- -- --
BW
Note: * Not availabe in the H8/3048B Group.
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Section 2 CPU
2.6.3
Tables of Instructions Classified by Function
Tables 2.3 to 2.10 summarize the instructions in each functional category. The operation notation used in these tables is defined next. Operation Notation
Rd Rs Rn ERn (EAd) (EAs) CCR N Z V C PC SP #IMM disp + - x / :3/:8/:16/:24 Note: * General register (destination)* General register (source)* General register* General register (32-bit register or address register) Destination operand Source operand Condition code register N (negative) flag of CCR Z (zero) flag of CCR V (overflow) flag of CCR C (carry) flag of CCR Program counter Stack pointer Immediate data Displacement Addition Subtraction Multiplication Division AND logical OR logical Exclusive OR logical Move NOT (logical complement) 3-, 8-, 16-, or 24-bit length General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0 to R7, E0 to E7), and 32-bit data or address registers (ER0 to ER7).
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Section 2 CPU
Table 2.3
Instruction MOV
Data Transfer Instructions
Size* B/W/L Function (EAs) Rd, Rs (EAd) Moves data between two general registers or between a general register and memory, or moves immediate data to a general register.
MOVFPE MOVTPE POP
B B W/L
(EAs) Rd Cannot be used in the H8/3048B Group. Rs (EAs) Cannot be used in the H8/3048B Group. @SP+ Rn Pops a general register from the stack. POP.W Rn is identical to MOV.W @SP+, Rn. Similarly, POP.L ERn is identical to MOV.L @SP+, ERn.
PUSH
W/L
Rn @-SP Pushes a general register onto the stack. PUSH.W Rn is identical to MOV.W Rn, @-SP. Similarly, PUSH.L ERn is identical to MOV.L ERn, @-SP.
Note:
*
Size refers to the operand size. B: Byte W: Word L: Longword
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Section 2 CPU
Table 2.4
Instruction ADD, SUB
Arithmetic Operation Instructions
Size* B/W/L Function Rd Rs Rd, Rd #IMM Rd Performs addition or subtraction on data in two general registers, or on immediate data and data in a general register. (Immediate byte data cannot be subtracted from data in a general register. Use the SUBX or ADD instruction.)
ADDX, SUBX
B
Rd Rs C Rd, Rd #IMM C Rd Performs addition or subtraction with carry or borrow on data in two general registers, or on immediate data and data in a general register.
INC, DEC
B/W/L
Rd 1 Rd, Rd 2 Rd Increments or decrements a general register by 1 or 2. (Byte operands can be incremented or decremented by 1 only.)
ADDS, SUBS
L
Rd 1 Rd, Rd 2 Rd, Rd 4 Rd Adds or subtracts the value 1, 2, or 4 to or from data in a 32-bit register.
DAA, DAS
B
Rd decimal adjust Rd Decimal-adjusts an addition or subtraction result in a general register by referring to CCR to produce 4-bit BCD data.
MULXU
B/W
Rd x Rs Rd Performs unsigned multiplication on data in two general registers: either 8 bits x 8 bits 16 bits or 16 bits x 16 bits 32 bits.
MULXS
B/W
Rd x Rs Rd Performs signed multiplication on data in two general registers: either 8 bits x 8 bits 16 bits or 16 bits x 16 bits 32 bits.
DIVXU
B/W
Rd / Rs Rd Performs unsigned division on data in two general registers: either 16 bits / 8 bits 8-bit quotient and 8-bit remainder or 32 bits / 16 bits 16-bit quotient and 16-bit remainder.
DIVXS
B/W
Rd / Rs Rd Performs signed division on data in two general registers: either 16 bits / 8 bits 8-bit quotient and 8-bit remainder, or 32 bits / 16 bits 16-bit quotient and 16-bit remainder.
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Section 2 CPU Instruction CMP Size* B/W/L Function Rd - Rs, Rd - #IMM Compares data in a general register with data in another general register or with immediate data, and sets CCR according to the result. NEG B/W/L 0 - Rd Rd Takes the two's complement (arithmetic complement) of data in a general register. EXTS W/L Rd (sign extension) Rd Extends byte data in the lower 8 bits of a 16-bit register to word data, or extends word data in the lower 16 bits of a 32-bit register to longword data, by extending the sign bit. EXTU W/L Rd (zero extension) Rd Extends byte data in the lower 8 bits of a 16-bit register to word data, or extends word data in the lower 16 bits of a 32-bit register to longword data, by padding with zeros. Note: * Size refers to the operand size. B: Byte W: Word L: Longword
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Section 2 CPU
Table 2.5
Instruction AND
Logic Operation Instructions
Size* B/W/L Function Rd Rs Rd, Rd #IMM Rd Performs a logical AND operation on a general register and another general register or immediate data.
OR
B/W/L
Rd Rs Rd, Rd #IMM Rd Performs a logical OR operation on a general register and another general register or immediate data.
XOR
B/W/L
Rd Rs Rd, Rd #IMM Rd Performs a logical exclusive OR operation on a general register and another general register or immediate data.
NOT Note: *
B/W/L
Rd Rd Takes the one's complement of general register contents.
Size refers to the operand size. B: Byte W: Word L: Longword
Table 2.6
Instruction SHAL, SHAR SHLL, SHLR ROTL, ROTR ROTXL, ROTXR Note: *
Shift Instructions
Size* B/W/L B/W/L B/W/L B/W/L Function Rd (shift) Rd Performs an arithmetic shift on general register contents. Rd (shift) Rd Performs a logical shift on general register contents. Rd (rotate) Rd Rotates general register contents. Rd (rotate) Rd Rotates general register contents through the carry bit. Size refers to the operand size. B: Byte W: Word L: Longword
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Section 2 CPU
Table 2.7
Instruction BSET
Bit Manipulation Instructions
Size* B Function 1 ( of ) Sets a specified bit in a general register or memory operand to 1. The bit number is specified by 3-bit immediate data or the lower 3 bits of a general register.
BCLR
B
0 ( of ) Clears a specified bit in a general register or memory operand to 0. The bit number is specified by 3-bit immediate data or the lower 3 bits of a general register.
BNOT
B
( of ) ( of ) Inverts a specified bit in a general register or memory operand. The bit number is specified by 3-bit immediate data or the lower 3 bits of a general register.
BTST
B
( of ) Z Tests a specified bit in a general register or memory operand and sets or clears the Z flag accordingly. The bit number is specified by 3-bit immediate data or the lower 3 bits of a general register.
BAND
B
C ( of ) C ANDs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag.
BIAND
B
C [ ( of )] C ANDs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data.
BOR
B
C ( of ) C ORs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag.
BIOR
B
C [ ( of )] C ORs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data.
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Section 2 CPU Instruction BXOR Size* B Function C ( of ) C Exclusive-ORs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag. BIXOR B C [ ( of )] C Exclusive-ORs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data. BLD B ( of ) C Transfers a specified bit in a general register or memory operand to the carry flag. BILD B ( of ) C Transfers the inverse of a specified bit in a general register or memory operand to the carry flag. The bit number is specified by 3-bit immediate data. BST B C ( of ) Transfers the carry flag value to a specified bit in a general register or memory operand. BIST B C ( of ) Transfers the inverse of the carry flag value to a specified bit in a general register or memory operand. The bit number is specified by 3-bit immediate data. Note: * Size refers to the operand size. B: Byte
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Section 2 CPU
Table 2.8
Instruction Bcc
Branching Instructions
Size -- Function Branches to a specified address if a specified condition is true. The branching conditions are listed below. Mnemonic BRA (BT) BRN (BF) BHI BLS Bcc (BHS) BCS (BLO) BNE BEQ BVC BVS BPL BMI BGE BLT BGT BLE Description Always (true) Never (false) High Low or same Carry clear (high or same) Carry set (low) Not equal Equal Overflow clear Overflow set Plus Minus Greater or equal Less than Greater than Less or equal Condition Always Never CZ=0 CZ=1 C=0 C=1 Z=0 Z=1 V=0 V=1 N=0 N=1 NV=0 NV=1 Z (N V) = 0 Z (N V) = 1
JMP BSR JSR RTS
-- -- -- --
Branches unconditionally to a specified address Branches to a subroutine at a specified address Branches to a subroutine at a specified address Returns from a subroutine
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Section 2 CPU
Table 2.9
Instruction TRAPA RTE SLEEP LDC
System Control Instructions
Size* -- -- -- B/W Function Starts trap-instruction exception handling Returns from an exception-handling routine Causes a transition to the power-down state (EAs) CCR Moves the source operand contents to the condition code register. The condition code register size is one byte, but in transfer from memory, data is read by word access.
STC
B/W
CCR (EAd) Transfers the CCR contents to a destination location. The condition code register size is one byte, but in transfer to memory, data is written by word access.
ANDC ORC XORC
B B B
CCR #IMM CCR Logically ANDs the condition code register with immediate data. CCR #IMM CCR Logically ORs the condition code register with immediate data. CCR #IMM CCR Logically exclusive-ORs the condition code register with immediate data.
NOP Note: *
--
PC + 2 PC Only increments the program counter.
Size refers to the operand size. B: Byte W: Word
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Section 2 CPU
Table 2.10 Block Transfer Instruction
Instruction EEPMOV.B Size -- Function if R4L 0 then repeat until else next; EEPMOV.W -- if R4 0 then repeat until else next; Transfers a data block according to parameters set in general registers R4L or R4, ER5, and ER6. R4L or R4: Size of block (bytes) ER5: Starting source address ER6: Starting destination address Execution of the next instruction begins as soon as the transfer is completed. @ER5+ @ER6+, R4 - 1 R4 R4 = 0 @ER5+ @ER6+, R4L - 1 R4L R4L = 0
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Section 2 CPU
2.6.4
Basic Instruction Formats
The H8/300H instructions consist of 2-byte (1-word) units. An instruction consists of an operation field (OP field), a register field (r field), an effective address extension (EA field), and a condition field (cc). Operation Field: Indicates the function of the instruction, the addressing mode, and the operation to be carried out on the operand. The operation field always includes the first 4 bits of the instruction. Some instructions have two operation fields. Register Field: Specifies a general register. Address registers are specified by 3 bits, data registers by 3 bits or 4 bits. Some instructions have two register fields. Some have no register field. Effective Address Extension: Eight, 16, or 32 bits specifying immediate data, an absolute address, or a displacement. A 24-bit address or displacement is treated as 32-bit data in which the first 8 bits are 0 (H'00). Condition Field: Specifies the branching condition of Bcc instructions.
Figure 2.9 shows examples of instruction formats.
Operation field only op Operation field and register fields op rn rm ADD.B Rn, Rm, etc. NOP, RTS, etc.
Operation field, register fields, and effective address extension op EA (disp) Operation field, effective address extension, and condition field op cc EA (disp) BRA d:8 rn rm MOV.B @(d:16, Rn), Rm
Figure 2.9 Instruction Formats
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2.6.5
Notes on Use of Bit Manipulation Instructions
The BSET, BCLR, BNOT, BST, and BIST instructions read a byte of data, modify a bit in the byte, then write the byte back. Care is required when these instructions are used to access registers with write-only bits, or to access ports. The BCLR instruction can be used to clear flags in the internal I/O registers. In an interrupthandling routine, for example, if it is known that the flag is set to 1, it is not necessary to read the flag ahead of time.
Step 1 2 3 Read Bit manipulation Write Description Read data (byte unit) at the specified address Modify the specified bit in the read data Write the modified data (byte unit) to the specified address
In the following example, a BCLR instruction is executed on the data direction register (DDR) of port 4. P47 and P46 are set as input pins, and are inputting low-level and high-level signals, respectively. P45 to P40 are set as output pins, and are in the low-level output state. In this example, the BCLR instruction is used to make P40 an input port. Before Execution of BCLR Instruction
P47 Input/output DDR DR Input 0 1 P46 Input 0 0 P45 Output 1 0 P44 Output 1 0 P43 Output 1 0 P42 Output 1 0 P41 Output 1 0 P40 Output 1 0
Execution of BCLR Instruction BCLR #0, @P4DDR ; Execute BCLR instruction on DDR
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After Execution of BCLR Instruction
P47 Input/output DDR DR Output 1 1 P46 Output 1 0 P45 Output 1 0 P44 Output 1 0 P43 Output 1 0 P42 Output 1 0 P41 Output 1 0 P40 Input 0 0
Explanation of BCLR Instruction To execute the BCLR instruction, the CPU begins by reading P4DDR. Since P4DDR is a writeonly register, it is read as H'FF, even though its true value is H'3F. Next the CPU clears bit 0 of the read data, changing the value to H'FE. Finally, the CPU writes this value (H'FE) back to DDR to complete the BCLR instruction. As a result, P40DDR is cleared to 0, making P40 an input pin. In addition, P47DDR and P46DDR are set to 1, making P47 and P46 output pins. The BCLR instruction can be used to clear flags in the internal I/O registers to 0. In an interrupthandling routine, for example, if it is known that the flag is set to 1, it is not necessary to read the flag ahead of time.
2.7
2.7.1
Addressing Modes and Effective Address Calculation
Addressing Modes
The H8/300H CPU supports the eight addressing modes listed in table 2.11. Each instruction uses a subset of these addressing modes. Arithmetic and logic instructions can use the register direct and immediate modes. Data transfer instructions can use all addressing modes except programcounter relative and memory indirect. Bit manipulation instructions use register direct, register indirect, or absolute (@aa:8) addressing mode to specify an operand, and register direct (BSET, BCLR, BNOT, and BTST instructions) or immediate (3-bit) addressing mode to specify a bit number in the operand.
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Table 2.11 Addressing Modes
No. 1 2 3 4 5 6 7 8 Addressing Mode Register direct Register indirect Register indirect with displacement Register indirect with post-increment Register indirect with pre-decrement Absolute address Immediate Program-counter relative Memory indirect Symbol Rn @ERn @(d:16, ERn)/@(d:24, ERn) @ERn+ @-ERn @aa:8/@aa:16/@aa:24 #xx:8/#xx:16/#xx:32 @(d:8, PC)/@(d:16, PC) @@aa:8
1. Register Direct--Rn The register field of the instruction code specifies an 8-, 16-, or 32-bit register containing the operand. R0H to R7H and R0L to R7L can be specified as 8-bit registers. R0 to R7 and E0 to E7 can be specified as 16-bit registers. ER0 to ER7 can be specified as 32-bit registers. 2. Register Indirect--@ERn The register field of the instruction code specifies an address register (ERn), the lower 24 bits of which contain the address of the operand. 3. Register Indirect with Displacement--@(d:16, ERn) or @(d:24, ERn) A 16-bit or 24-bit displacement contained in the instruction code is added to the contents of an address register (ERn) specified by the register field of the instruction, and the lower 24 bits of the sum specify the address of a memory operand. A 16-bit displacement is sign-extended when added.
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Section 2 CPU
4. Register Indirect with Post-Increment or Pre-Decrement--@ERn+ or @-ERn * Register indirect with post-increment--@ERn+ The register field of the instruction code specifies an address register (ERn) the lower 24 bits of which contain the address of a memory operand. After the operand is accessed, 1, 2, or 4 is added to the address register contents (32 bits) and the sum is stored in the address register. The value added is 1 for byte access, 2 for word access, or 4 for longword access. For word or longword access, the register value should be even. * Register indirect with pre-decrement--@-ERn The value 1, 2, or 4 is subtracted from an address register (ERn) specified by the register field in the instruction code, and the lower 24 bits of the result become the address of a memory operand. The result is also stored in the address register. The value subtracted is 1 for byte access, 2 for word access, or 4 for longword access. For word or longword access, the resulting register value should be even. 5. Absolute Address--@aa:8, @aa:16, or @aa:24 The instruction code contains the absolute address of a memory operand. The absolute address may be 8 bits long (@aa:8), 16 bits long (@aa:16), or 24 bits long (@aa:24). For an 8-bit absolute address, the upper 16 bits are all assumed to be 1 (H'FFFF). For a 16-bit absolute address the upper 8 bits are a sign extension. A 24-bit absolute address can access the entire address space. Table 2.12 indicates the accessible address ranges. Table 2.12 Absolute Address Access Ranges
Absolute Address 8 bits (@aa:8) 16 bits (@aa:16) 1-Mbyte Modes H'FFF00 to H'FFFFF (1048320 to 1048575) H'00000 to H'07FFF, H'F8000 to H'FFFFF (0 to 32767, 1015808 to 1048575) H'00000 to H'FFFFF (0 to 1048575) 16-Mbyte Modes H'FFFF00 to H'FFFFFF (16776960 to 16777215) H'000000 to H'007FFF, H'FF8000 to H'FFFFFF (0 to 32767, 16744448 to 16777215) H'000000 to H'FFFFFF (0 to 16777215)
24 bits (@aa:24)
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Section 2 CPU
6. Immediate--#xx:8, #xx:16, or #xx:32 The instruction code contains 8-bit (#xx:8), 16-bit (#xx:16), or 32-bit (#xx:32) immediate data as an operand. The instruction codes of the ADDS, SUBS, INC, and DEC instructions contain immediate data implicitly. The instruction codes of some bit manipulation instructions contain 3-bit immediate data specifying a bit number. The TRAPA instruction code contains 2-bit immediate data specifying a vector address. 7. Program-Counter Relative--@(d:8, PC) or @(d:16, PC) This mode is used in the Bcc and BSR instructions. An 8-bit or 16-bit displacement contained in the instruction code is sign-extended to 24 bits and added to the 24-bit PC contents to generate a 24-bit branch address. The PC value to which the displacement is added is the address of the first byte of the next instruction, so the possible branching range is -126 to +128 bytes (-63 to +64 words) or -32766 to +32768 bytes (-16383 to +16384 words) from the branch instruction. The resulting value should be an even number. 8. Memory Indirect--@@aa:8 This mode can be used by the JMP and JSR instructions. The instruction code contains an 8-bit absolute address specifying a memory operand. This memory operand contains a branch address. The memory operand is accessed by longword access. The first byte of the memory operand is ignored, generating a 24-bit branch address. See figure 2.10. The upper bits of the 8-bit absolute address are assumed to be 0 (H'0000), so the address range is 0 to 255 (H'000000 to H'0000FF). Note that the first part of this range is also the exception vector area. For further details see section 5, Interrupt Controller.
Specified by @aa:8
Reserved
Branch address
Figure 2.10 Memory-Indirect Branch Address Specification
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Section 2 CPU
When a word-size or longword-size memory operand is specified, or when a branch address is specified, if the specified memory address is odd, the least significant bit is regarded as 0. The accessed data or instruction code therefore begins at the preceding address. See section 2.5.2, Memory Data Formats. 2.7.2 Effective Address Calculation
Table 2.13 explains how an effective address is calculated in each addressing mode. In the 1-Mbyte operating modes the upper 4 bits of the calculated address are ignored in order to generate a 20-bit effective address.
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Table 2.13 Effective Address Calculation
No. 1 Addressing Mode and Instruction Format Register direct (Rn)
op rm rn
Effective Address Calculation
Effective Address Operand is general register contents
2
Register indirect (@ERn)
31 General register contents op r 0 23 0
3
Register indirect with displacement @(d:16, ERn)/@(d:24, ERn)
31 General register contents 23 op r disp 0 0
Sign extension
disp
4.
Register indirect with post-increment or pre-decrement * Register indirect with post-increment @ERn+
31 General register contents 0 23 0
op
r 1, 2, or 4
*
Register indirect with pre-decrement @-ERn
31 General register contents 23 op r 1, 2, or 4 1 for a byte operand, 2 for a word operand, 4 for a longword operand 0 0
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Section 2 CPU Addressing Mode and Instruction Format Absolute address
@aa:8
op abs 23 H'FFFF 87 0
No. 5
Effective Address Calculation
Effective Address
@aa:16
op abs
23 16 15 Sign extension
0
@aa:24
op abs 23 0
6
Immediate #xx:8, #xx:16, or #xx:32
op IMM
Operand is immediate data
7
Program-counter relative @(d:8, PC) or @(d:16, PC)
23 PC contents 0 23 0
Sign extension op disp
disp
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Section 2 CPU Addressing Mode and Instruction Format Memory indirect @@aa:8 * Normal mode
op abs
No. 8
Effective Address Calculation
Effective Address
23 H'0000
87 abs
0
15 Memory contents
0
23
16 15
0
H'00
*
Advanced mode
op abs
23 H'0000
87 abs
0
31 Memory contents
0
23
0
Legend: r, rm, rn: Register field op: Operation field disp: Displacement IMM: Immediate data abs: Absolute address
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Section 2 CPU
2.8
2.8.1
Processing States
Overview
The H8/300H CPU has five processing states: the program execution state, exception-handling state, power-down state, reset state, and bus-released state. The power-down state includes sleep mode, software standby mode, and hardware standby mode. Figure 2.11 classifies the processing states. Figure 2.13 indicates the state transitions.
Processing states
Program execution state The CPU executes program instructions in sequence Exception-handling state A transient state in which the CPU executes a hardware sequence (saving PC and CCR, fetching a vector, etc.) in response to a reset, interrupt, or other exception
Bus-released state The external bus has been released in response to a bus request signal from a bus master other than the CPU Reset state The CPU and all on-chip supporting modules are initialized and halted
Power-down state The CPU is halted to conserve power
Sleep mode
Software standby mode
Hardware standby mode
Figure 2.11 Processing States 2.8.2 Program Execution State
In this state the CPU executes program instructions in normal sequence.
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Section 2 CPU
2.8.3
Exception-Handling State
The exception-handling state is a transient state that occurs when the CPU alters the normal program flow due to a reset, interrupt, or trap instruction. The CPU fetches a starting address from the exception vector table and branches to that address. In interrupt and trap exception handling the CPU references the stack pointer (ER7) and saves the program counter and condition code register. Types of Exception Handling and Their Priority: Exception handling is performed for resets, interrupts, and trap instructions. Table 2.14 indicates the types of exception handling and their priority. Trap instruction exceptions are accepted at all times in the program execution state. Table 2.14 Exception Handling Types and Priority
Priority High Type of Exception Reset Interrupt Detection Timing Synchronized with clock End of instruction execution or end of exception handling* When TRAPA instruction is executed Start of Exception Handling Exception handling starts immediately when RES changes from low to high When an interrupt is requested, exception handling starts at the end of the current instruction or current exception-handling sequence Exception handling starts when a trap (TRAPA) instruction is executed
Trap instruction Low Note: *
Interrupts are not detected at the end of the ANDC, ORC, XORC, and LDC instructions, or immediately after reset exception handling.
Figure 2.12 classifies the exception sources. For further details about exception sources, vector numbers, and vector addresses, see section 4, Exception Handling, and section 5, Interrupt Controller.
Reset External interrupts Exception sources Interrupt Internal interrupts (from on-chip supporting modules) Trap instruction
Figure 2.12 Classification of Exception Sources
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End of bus release Bus request Program execution state End of bus release Bus request Exception Bus-released state End of exception handling Exception-handling state
SLEEP instruction with SSBY = 0 Sleep mode
Interrupt NMI, IRQ 0 , IRQ 1, or IRQ 2 interrupt
SLEEP instruction with SSBY = 1
Software standby mode
RES = High STBY = High, RES = Low
Reset state*1
Hardware standby mode*2 Power-down state
Notes: 1. From any state except hardware standby mode, a transition to the reset state occurs whenever RES goes low. 2. From any state, a transition to hardware standby mode occurs when STBY goes low.
Figure 2.13 State Transitions 2.8.4 Exception-Handling Sequences
Reset Exception Handling: Reset exception handling has the highest priority. The reset state is entered when the RES signal goes low. Reset exception handling starts after that, when RES changes from low to high. When reset exception handling starts the CPU fetches a start address from the exception vector table and starts program execution from that address. All interrupts, including NMI, are disabled during the reset exception-handling sequence and immediately after it ends. Interrupt Exception Handling and Trap Instruction Exception Handling: When these exception-handling sequences begin, the CPU references the stack pointer (ER7) and pushes the program counter and condition code register on the stack. Next, if the UE bit in the system control register (SYSCR) is set to 1, the CPU sets the I bit in the condition code register to 1. If the UE bit
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Section 2 CPU
is cleared to 0, the CPU sets both the I bit and the UI bit in the condition code register to 1. Then the CPU fetches a start address from the exception vector table and execution branches to that address.
Figure 2.14 shows the stack after the exception-handling sequence.
SP - 4 SP - 3 SP - 2 SP - 1 SP (ER7) Stack area
SP (ER7) SP + 1 SP + 2 SP + 3 SP + 4
CCR
PC
Even address
Before exception handling starts Legend: CCR: Condition code register SP: Stack pointer
Pushed on stack
After exception handling ends
Notes: 1. PC is the address of the first instruction executed after the return from the exception-handling routine. 2. Registers must be saved and restored by word access or longword access, starting at an even address.
Figure 2.14 Stack Structure after Exception Handling 2.8.5 Bus-Released State
In this state the bus is released to a bus master other than the CPU, in response to a bus request. The bus masters other than the CPU are the DMA controller, the refresh controller, and an external bus master. While the bus is released, the CPU halts except for internal operations. Interrupt requests are not accepted. For details see section 6.3.7, Bus Arbiter Operation.
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Section 2 CPU
2.8.6
Reset State
When the RES input goes low all current processing stops and the CPU enters the reset state. The I bit in the condition code register is set to 1 by a reset. All interrupts are masked in the reset state. Reset exception handling starts when the RES signal changes from low to high. The reset state can also be entered by a watchdog timer overflow. For details see section 12, Watchdog Timer. 2.8.7 Power-Down State
In the power-down state the CPU stops operating to conserve power. There are three modes: sleep mode, software standby mode, and hardware standby mode. Sleep Mode: A transition to sleep mode is made if the SLEEP instruction is executed while the SSBY bit is cleared to 0 in the system control register (SYSCR). CPU operations stop immediately after execution of the SLEEP instruction, but the contents of CPU registers are retained. Software Standby Mode: A transition to software standby mode is made if the SLEEP instruction is executed while the SSBY bit is set to 1 in SYSCR. The CPU and clock halt and all on-chip supporting modules stop operating. The on-chip supporting modules are reset, but as long as a specified voltage is supplied the contents of CPU registers and on-chip RAM are retained. The I/O ports also remain in their existing states. Hardware Standby Mode: A transition to hardware standby mode is made when the STBY input goes low. As in software standby mode, the CPU and all clocks halt and the on-chip supporting modules are reset, but as long as a specified voltage is supplied, on-chip RAM contents are retained. For further information see section 20, Power-Down State.
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Section 2 CPU
2.9
2.9.1
Basic Operational Timing
Overview
The H8/300H CPU operates according to the system clock (). The interval from one rise of the system clock to the next rise is referred to as a "state." A memory cycle or bus cycle consists of two or three states. The CPU uses different methods to access on-chip memory, the on-chip supporting modules, and the external address space. Access to the external address space can be controlled by the bus controller. 2.9.2 On-Chip Memory Access Timing
On-chip memory is accessed in two states. The data bus is 16 bits wide, permitting both byte and word access. Figure 2.15 shows the on-chip memory access cycle. Figure 2.16 indicates the pin states.
Bus cycle T1 state Internal address bus Internal read signal Internal data bus (read access) Internal write signal Internal data bus (write access) Write data Read data Address T2 state
Figure 2.15 On-Chip Memory Access Cycle
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Section 2 CPU
T1 Address bus AS , RD, HWR , LWR Address
T2
High High-impedance
D15 to D0
Figure 2.16 Pin States during On-Chip Memory Access 2.9.3 On-Chip Supporting Module Access Timing
The on-chip supporting modules are accessed in three states. The data bus is 8 or 16 bits wide, depending on the register being accessed. Figure 2.17 shows the on-chip supporting module access timing. Figure 2.18 indicates the pin states.
Bus cycle T1 state Address bus Internal read signal Internal data bus Address T2 state T3 state
Read access
Read data
Internal write signal Write access Internal data bus Write data
Figure 2.17 Access Cycle for On-Chip Supporting Modules
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Section 2 CPU
T1 Address bus AS , RD, HWR , LWR
T2
T3
Address
High High-impedance
D15 to D0
Figure 2.18 Pin States during Access to On-Chip Supporting Modules 2.9.4 Access to External Address Space
The external address space is divided into eight areas (areas 0 to 7). Bus-controller settings determine whether each area is accessed via an 8-bit or 16-bit bus, and whether it is accessed in two or three states. For details see section 6, Bus Controller.
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Section 3 MCU Operating Modes
Section 3 MCU Operating Modes
3.1
3.1.1
Overview
Operating Mode Selection
The H8/3048B Group has seven operating modes (modes 1 to 7) that are selected by the mode pins (MD2 to MD0) as indicated in table 3.1. The input at these pins determines the size of the address space and the initial bus mode. Table 3.1 Operating Mode Selection
Mode Pins Operating Mode -- Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Mode 7 MD2 0 0 0 0 1 1 1 1 MD1 0 0 1 1 0 0 1 1 MD0 0 1 0 1 0 1 0 1 Address Space -- Expanded mode Expanded mode Expanded mode Expanded mode Expanded mode Expanded mode Single-chip advanced mode Description Initial Bus 1 Mode* -- 8 bits 16 bits 8 bits 16 bits 8 bits 8 bits -- On-Chip ROM -- Disabled Disabled Disabled Disabled Enabled Enabled Enabled On-Chip RAM -- Enabled* Enabled* Enabled* Enabled* Enabled* Enabled* Enabled
2
2
2
2
2
2
Notes: 1. In modes 1 to 6, an 8-bit or 16-bit data bus can be selected on a per-area basis by settings made in the area bus width control register (ABWCR). For details see section 6, Bus Controller. 2. If the RAME bit in SYSCR is cleared to 0, these addresses become external addresses.
For the address space size there are two choices: 1 Mbyte or 16 Mbytes. The external data bus is either 8 or 16 bits wide depending on ABWCR settings. If 8-bit access is selected for all areas, the external data bus is 8 bits wide. For details see section 6, Bus Controller. Modes 1 to 4 are externally expanded modes that enable access to external memory and peripheral devices and disable access to the on-chip ROM. Modes 1 and 2 support a maximum address space of 1 Mbyte. Modes 3 and 4 support a maximum address space of 16 Mbytes.
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Section 3 MCU Operating Modes
Modes 5 and 6 are externally expanded modes that enable access to external memory and peripheral devices and also enable access to the on-chip ROM. Mode 5 supports a maximum address space of 1 Mbyte. Mode 6 supports a maximum address space of 16 Mbytes. Mode 7 is a single-chip mode that operates using the on-chip ROM, RAM, and internal I/O registers, and makes all I/O ports available. Mode 7 supports a 1-Mbyte address space. The H8/3048B Group can be used only in modes 1 to 7. The inputs at the mode pins must select one of these seven modes. The inputs at the mode pins must not be changed during operation. 3.1.2 Register Configuration
The H8/3048B Group has a mode control register (MDCR) that indicates the inputs at the mode pins (MD2 to MD0), and a system control register (SYSCR). Table 3.2 summarizes these registers. Table 3.2
Address* H'FFF1 H'FFF2 Note: *
Registers
Name Mode control register System control register Abbreviation MDCR SYSCR R/W R R/W Initial Value Undetermined H'0B
The lower 16 bits of the address are indicated.
3.2
Mode Control Register (MDCR)
MDCR is an 8-bit read-only register that indicates the current operating mode of the H8/3048B Group.
Bit Initial value Read/Write 7 1 6 1 5 0 4 0 Reserved bits 3 0 2 MDS2 * R 1 MDS1 * R 0 MDS0 * R
Reserved bits
Mode select 2 to 0 Bits indicating the current operating mode
Note: * Determined by pins MD2 to MD0 .
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Bits 7 and 6--Reserved: Read-only bits, always read as 1. Bits 5 to 3--Reserved: Read-only bits, always read as 0. Bits 2 to 0--Mode Select 2 to 0 (MDS2 to MDS0): These bits indicate the logic levels at pins MD2 to MD0 (the current operating mode). MDS2 to MDS0 correspond to MD2 to MD0. MDS2 to MDS0 are read-only bits. The mode pin (MD2 to MD0) levels are latched into these bits when MDCR is read. Note: For the flash memory version with single power supply (H8/3048F-ONE), flash memory can be written to in the boot mode. In the boot mode, the inverted value of the MD2 signal is set to bit MDS2.
3.3
System Control Register (SYSCR)
SYSCR is an 8-bit register that controls the operation of the H8/3048B Group.
Bit Initial value Read/Write 7 SSBY 0 R/W 6 STS2 0 R/W 5 STS1 0 R/W 4 STS0 0 R/W 3 UE 1 R/W 2 NMIEG 0 R/W 1 1 0 RAME 1 R/W RAM enable Enables or disables on-chip RAM Reserved bit NMI edge select Selects the valid edge of the NMI input User bit enable Selects whether to use the UI bit in CCR as a user bit or an interrupt mask bit Standby timer select 2 to 0 These bits select the waiting time at recovery from software standby mode Software standby Enables transition to software standby mode
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Bit 7--Software Standby (SSBY): Enables transition to software standby mode. (For further information about software standby mode see section 20, Power-Down State.) When software standby mode is exited by an external interrupt, this bit remains set to 1. To clear this bit, write 0.
Bit 7: SSBY 0 1 Description SLEEP instruction causes transition to sleep mode SLEEP instruction causes transition to software standby mode (Initial value)
Bits 6 to 4--Standby Timer Select (STS2 to STS0): These bits select the length of time the CPU and on-chip supporting modules wait for the internal clock oscillator to settle when software standby mode is exited by an external interrupt. When using a crystal oscillator, set these bits so that the waiting time will be at least 7 ms at the system clock rate. For further information about waiting time selection, see section 20.4.3, Selection of Waiting Time for Exit from Software Standby Mode.
Bit 6: STS2 0 Bit 5: STS1 0 1 1 0 1 Bit 4: STS0 0 1 0 1 0 1 0 1 Description Waiting time = 8,192 states Waiting time = 16,384 states Waiting time = 32,768 states Waiting time = 65,536 states Waiting time = 131,072 states Waiting time = 262,144 states Waiting time = 1,024 states Illegal setting (Initial value)
Bit 3--User Bit Enable (UE): Selects whether to use the UI bit in the condition code register as a user bit or an interrupt mask bit.
Bit 3: UE 0 1 Description UI bit in CCR is used as an interrupt mask bit UI bit in CCR is used as a user bit (Initial value)
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Section 3 MCU Operating Modes
Bit 2--NMI Edge Select (NMIEG): Selects the valid edge of the NMI input.
Bit 2: NMIEG 0 1 Description An interrupt is requested at the falling edge of NMI An interrupt is requested at the rising edge of NMI (Initial value)
Bit 1--Reserved: Read-only bit, always read as 1. Bit 0--RAM Enable (RAME): Enables or disables the on-chip RAM. The RAME bit is initialized by the rising edge of the RES signal. It is not initialized in software standby mode.
Bit 0: RAME 0 1 Description On-chip RAM is disabled On-chip RAM is enabled (Initial value)
3.4
3.4.1
Operating Mode Descriptions
Mode 1
Ports 1, 2, and 5 function as address pins A19 to A0, permitting access to a maximum 1-Mbyte address space. The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. If at least one area is designated for 16-bit access in ABWCR, the bus mode switches to 16 bits. 3.4.2 Mode 2
Ports 1, 2, and 5 function as address pins A19 to A0, permitting access to a maximum 1-Mbyte address space. The initial bus mode after a reset is 16 bits, with 16-bit access to all areas. If all areas are designated for 8-bit access in ABWCR, the bus mode switches to 8 bits. 3.4.3 Mode 3
Ports 1, 2, and 5 and part of port A function as address pins A23 to A0, permitting access to a maximum 16-Mbyte address space. The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. If at least one area is designated for 16-bit access in ABWCR, the bus mode switches to 16 bits. A23 to A21 are valid when 0 is written in bits 7 to 5 of the bus release control register (BRCR). (In this mode A20 is always used for address output.)
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Section 3 MCU Operating Modes
3.4.4
Mode 4
Ports 1, 2, and 5 and part of port A function as address pins A23 to A0, permitting access to a maximum 16-Mbyte address space. The initial bus mode after a reset is 16 bits, with 16-bit access to all areas. If all areas are designated for 8-bit access in ABWCR, the bus mode switches to 8 bits. A23 to A21 are valid when 0 is written in bits 7 to 5 of BRCR. (In this mode A20 is always used for address output.) 3.4.5 Mode 5
Ports 1, 2, and 5 can function as address pins A19 to A0, permitting access to a maximum 1-Mbyte address space, but following a reset they are input ports. To use ports 1, 2, and 5 as an address bus, the corresponding bits in their data direction registers (P1DDR, P2DDR, and P5DDR) must be set to 1. The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. If at least one area is designated for 16-bit access in ABWCR, the bus mode switches to 16 bits. 3.4.6 Mode 6
Ports 1, 2, and 5 and part of port A function as address pins A23 to A0, permitting access to a maximum 16-Mbyte address space, but following a reset they are input ports. To use ports 1, 2, and 5 as an address bus, the corresponding bits in their data direction registers (P1DDR, P2DDR, and P5DDR) must be set to 1. For A23 to A21 output, clear bits 7 to 5 of BRCR to 0. (In this mode A20 is always used for address output.) The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. If at least one area is designated for 16-bit access in ABWCR, the bus mode switches to 16 bits. 3.4.7 Mode 7
This mode operates using the on-chip ROM, RAM, and internal I/O registers. All I/O ports are available. Mode 7 supports a 1-Mbyte address space.
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Section 3 MCU Operating Modes
3.5
Pin Functions in Each Operating Mode
The pin functions of ports 1 to 5 and port A vary depending on the operating mode. Table 3.3 indicates their functions in each operating mode. Table 3.3
Port Port 1 Port 2 Port 3 Port 4 Port 5 Port A
Pin Functions in Each Mode
Mode 2 A7 to A0 A15 to A8 D15 to D8 D7 to D0*1 A19 to A16 PA7 to PA4 Mode 3 A7 to A0 A15 to A8 D15 to D8 P47 to P40*1 A19 to A16
3
Mode 1 A7 to A0 A15 to A8 D15 to D8 P47 to P40*1 A19 to A16 PA7 to PA4
Mode 4 A7 to A0 A15 to A8 D15 to D8 D7 to D0*1 A19 to A16
3
Mode 5 P17 to P10*2 P27 to P20*2 D15 to D8 P47 to P40*1 P53 to P50*
2
Mode 6 P17 to P10*2 P27 to P20*2 D15 to D8 P47 to P40*1 P53 to P50* PA7 to PA5, A20*3
2
Mode 7 P17 to P10 P27 to P20 P37 to P30 P47 to P40 P53 to P50 PA7 to PA4
PA7 to PA5* , PA7 to PA5* , PA7 to PA4 A20 A20
Notes: 1. Initial state. The bus mode can be switched by settings in ABWCR. These pins function as P47 to P40 in 8-bit bus mode, and as D7 to D0 in 16-bit bus mode. 2. Initial state. These pins become address output pins when the corresponding bits in the data direction registers (P1DDR, P2DDR, P5DDR) are set to 1. 3. Initial state. A20 is always an address output pin. PA7 to PA5 are switched over to A23 to A21 output by writing 0 in bits 7 to 5 of BRCR.
3.6
Memory Map in Each Operating Mode
Figure 3.1 shows a memory map of the H8/3048B Group. The address space is divided into eight areas. The initial bus mode differs between modes 1 and 2, and also between modes 3 and 4. The address locations of the on-chip RAM and internal I/O registers differ between the 1-Mbyte modes (modes 1, 2, 5, and 7) and 16-Mbyte modes (modes 3, 4, and 6). The address range specifiable by the CPU in the 8- and 16-bit absolute addressing modes (@aa:8 and @aa:16) also differs.
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Section 3 MCU Operating Modes
Modes 1 and 2 (1-Mbyte expanded modes with on-chip ROM disabled) Memory-indirect branch addresses H'00000 Vector area
Modes 3 and 4 (16-Mbyte expanded modes with on-chip ROM disabled) Vector area Memory-indirect branch addresses Area 0 H'1FFFFF H'200000 Area 1 H'3FFFFF H'400000 Area 2 H'5FFFFF H'600000 H'7FFFFF H'800000 H'9FFFFF H'A00000 External address space Area 3 Area 4 Area 5 H'BFFFFF H'C00000 Area 6 H'DFFFFF H'E00000 Area 7 8-bit absolute addresses H'000000
16-bit absolute addresses
H'000FF
H'0000FF
H'07FFF
H'007FFF
H'1FFFF H'20000 H'3FFFF H'40000 H'5FFFF H'60000 External address space H'7FFFF H'80000 H'9FFFF H'A0000 H'BFFFF H'C0000 H'DFFFF H'E0000
Area 0 Area 1 Area 2 Area 3 Area 4 Area 5 Area 6 Area 7
H'F8000 16-bit absolute addresses H'FEF0F H'FEF10 H'FFF00 H'FFF0F H'FFF10 H'FFF1B H'FFF1C H'FFFFF
External address space Internal I/O registers
8-bit absolute addresses
On-chip RAM *
H'FF8000 16-bit absolute addresses H'FFEF0F H'FFEF10 H'FFFF00 H'FFFF0F H'FFFF10 H'FFFF1B H'FFFF1C H'FFFFFF
On-chip RAM*
External address space Internal I/O registers
Note: * External addresses can be accessed by disabling on-chip RAM.
Figure 3.1 H8/3048B Group Memory Map in Each Operating Mode
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16-bit absolute addresses
Section 3 MCU Operating Modes
Mode 5 (1-Mbyte expanded mode with on-chip ROM enabled)
Memory-indirect branch addresses
Mode 6 (16-Mbyte expanded mode with on-chip ROM enabled)
Memory-indirect branch addresses
Mode 7 (single-chip advanced mode) H'00000
16-bit absolute addresses
16-bit absolute addresses
H'000FF On-chip ROM H'07FFF
H'0000FF On-chip ROM H'007FFF
H'000FF On-chip ROM H'07FFF H'1FFFF
H'1FFFF H'20000 H'3FFFF H'40000 H'5FFFF H'60000 External address space H'7FFFF H'80000 H'9FFFF H'A0000 H'BFFFF H'C0000 H'DFFFF H'E0000
Area 0 Area 1 Area 2 Area 3 Area 4 Area 5 Area 6 Area 7
H'01FFFF H'020000 H'1FFFFF H'200000 H'3FFFFF H'400000 H'5FFFFF H'600000 H'7FFFFF H'800000 H'9FFFFF H'A00000
16-bit absolute addresses
Area 0
Area 1
Area 2 External address space
Area 3
Area 4
H'F8000 H'FEF0F H'FEF10 H'FFF00 H'FFF0F H'FFF10 H'FFF1B H'FFF1C H'FFFFF
H'F8000 H'FEF10 H'FFF00 H'FFF0F
8-bit absolute addresses 16-bit absolute addresses
8-bit absolute addresses
On-chip RAM *
H'BFFFFF H'C00000 H'DFFFFF H'E00000
Area 5
On-chip RAM Area 6
External address space Internal I/O registers
Area 7 H'FF8000
H'FFF1C H'FFFFF
Internal I/O registers
H'FFFF00 H'FFFF0F H'FFFF10 H'FFFF1B H'FFFF1C H'FFFFFF
External address space Internal I/O registers
Note: * External addresses can be accessed by disabling on-chip RAM.
Figure 3.1 H8/3048B Group Memory Map in Each Operating Mode (cont)
8-bit absolute addresses
On-chip RAM *
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16-bit absolute addresses
H'FFEF0F H'FFEF10
16-bit absolute addresses
Vector area
Vector area
Vector area
Memory-indirect branch addresses
H'00000
H'000000
Section 3 MCU Operating Modes
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Section 4 Exception Handling
Section 4 Exception Handling
4.1
4.1.1
Overview
Exception Handling Types and Priority
As table 4.1 indicates, exception handling may be caused by a reset, trap instruction, or interrupt. Exception handling is prioritized as shown in table 4.1. If two or more exceptions occur simultaneously, they are accepted and processed in priority order. Trap instruction exceptions are accepted at all times in the program execution state. Table 4.1
Priority High
Exception Types and Priority
Exception Type Reset Interrupt Start of Exception Handling Starts immediately after a low-to-high transition at the RES pin Interrupt requests are handled when execution of the current instruction or handling of the current exception is completed Started by execution of a trap instruction (TRAPA)
Low
Trap instruction (TRAPA)
4.1.2
Exception Handling Operation
Exceptions originate from various sources. Trap instructions and interrupts are handled as follows. 1. The program counter (PC) and condition code register (CCR) are pushed onto the stack. 2. The CCR interrupt mask bit is set to 1. 3. A vector address corresponding to the exception source is generated, and program execution starts from the address indicated in that address. Note: For a reset exception, steps 2 and 3 above are carried out.
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Section 4 Exception Handling
4.1.3
Exception Vector Table
The exception sources are classified as shown in figure 4.1. Different vectors are assigned to different exception sources. Table 4.2 lists the exception sources and their vector addresses.
* Reset External interrupts: NMI, IRQ 0 to IRQ5 Exception sources * Interrupts Internal interrupts: 30 interrupts from on-chip supporting modules
* Trap instruction
Figure 4.1 Exception Sources
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Section 4 Exception Handling
Table 4.2
Exception Vector Table
Vector Number 0 1 2 3 4 5 6 Vector Address* H'0000 to H'0003 H'0004 to H'0007 H'0008 to H'000B H'000C to H'000F H'0010 to H'0013 H'0014 to H'0017 H'0018 to H'001B H'001C to H'001F H'0020 to H'0023 H'0024 to H'0027 H'0028 to H'002B H'002C to H'002F H'0030 to H'0033 H'0034 to H'0037 H'0038 to H'003B H'003C to H'003F H'0040 to H'0043 H'0044 to H'0047 H'0048 to H'004B H'004C to H'004F H'0050 to H'0053 to H'00F0 to H'00F3
1
Exception Source Reset Reserved for system use
External interrupt (NMI) Trap instruction (4 sources)
7 8 9 10 11
External interrupt IRQ0 External interrupt IRQ1 External interrupt IRQ2 External interrupt IRQ3 External interrupt IRQ4 External interrupt IRQ5 Reserved for system use
2 Internal interrupts*
12 13 14 15 16 17 18 19 20 to 60
Notes: 1. Lower 16 bits of the address. 2. For the internal interrupt vectors, see section 5.3.3, Interrupt Vector Table.
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Section 4 Exception Handling
4.2
4.2.1
Reset
Overview
A reset is the highest-priority exception. When the RES pin goes low, all processing halts and the chip enters the reset state. A reset initializes the internal state of the CPU and the registers of the on-chip supporting modules. Reset exception handling begins when the RES pin changes from low to high. The chip can also be reset by overflow of the watchdog timer. For details see section 12, Watchdog Timer. 4.2.2 Reset Sequence
The chip enters the reset state when the RES pin goes low. To ensure that the chip is reset properly, hold the RES pin low for at least 20 ms at power-up. To reset the chip during operation, hold the RES pin low for at least 20 system clock () cycles. See appendix D.2, Pin States at Reset, for the states of the pins in the reset state. When the RES pin goes high after being held low for the necessary time, the chip starts reset exception handling as follows. * The internal state of the CPU and the registers of the on-chip supporting modules are initialized, and the I bit is set to 1 in CCR. * The contents of the reset vector address (H'0000 to H'0003) are read, and program execution starts from the address indicated in the vector address. Figure 4.2 shows the reset sequence in modes 1 and 3. Figure 4.3 shows the reset sequence in modes 2 and 4. Figure 4.4 shows the reset sequence in modes 5, 6, and 7.
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Vector fetch
Internal processing
Prefetch of first program instruction
RES
Address bus (1) (3) (5)
(7)
(9)
RD
HWR , LWR High (2) (4)
Figure 4.2 Reset Sequence (Modes 1 and 3)
(6) (8) Address of reset vector: (1) = H'00000, (3) = H'00001, (5) = H'00002, (7) = H'00003 Start address (contents of reset vector) Start address First instruction of program
D15 to D8
(10)
(1), (3), (5), (7) (2), (4), (6), (8) (9) (10)
Section 4 Exception Handling
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Note: After a reset, the wait-state controller inserts three wait states in every bus cycle.
Section 4 Exception Handling
Vector fetch
Internal processing
Prefetch of first program instruction
RES Address bus
(1)
(3)
(5)
RD HWR , LWR D15 to D0
High (2) (4) (6)
(1), (3) (2), (4) (5) (6)
Address of reset vector: (1) = H'000000, (3) = H'000002 Start address (contents of reset vector) Start address First instruction of program
Note: After a reset, the wait-state controller inserts three wait states in every bus cycle.
Figure 4.3 Reset Sequence (Modes 2 and 4)
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Section 4 Exception Handling
Vector fetch
Internal processing
Prefetch of first program instruction
RES Internal address bus Internal read signal Internal write signal Internal data bus (16 bits wide) (2) (4) (6)
(1)
(3)
(5)
(1), (3) (2), (4) (5) (6)
Address of reset vector ((1) = H'000000, (2) = H'000002) Start address (contents of reset vector) Start address First instruction of program
Figure 4.4 Reset Sequence (Modes 5, 6, and 7) 4.2.3 Interrupts after Reset
If an interrupt is accepted after a reset but before the stack pointer (SP) is initialized, PC and CCR will not be saved correctly, leading to a program crash. To prevent this, all interrupt requests, including NMI, are disabled immediately after a reset. The first instruction of the program is always executed immediately after the reset state ends. This instruction should initialize the stack pointer (example: MOV.L #xx:32, SP).
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Section 4 Exception Handling
4.3
Interrupts
Interrupt exception handling can be requested by seven external sources (NMI, IRQ0 to IRQ5) and 30 internal sources in the on-chip supporting modules. Figure 4.5 classifies the interrupt sources and indicates the number of interrupts of each type. The on-chip supporting modules that can request interrupts are the watchdog timer (WDT), refresh controller, 16-bit integrated timer unit (ITU), DMA controller (DMAC), serial communication interface (SCI), and A/D converter. Each interrupt source has a separate vector address. NMI is the highest-priority interrupt and is always accepted*. Interrupts are controlled by the interrupt controller. The interrupt controller can assign interrupts other than NMI to two priority levels, and arbitrate between simultaneous interrupts. Interrupt priorities are assigned in interrupt priority registers A and B (IPRA and IPRB) in the interrupt controller. For details on interrupts see section 5, Interrupt Controller. Note: * For the H8/3048F-ONE (single power supply with flash memory), the NMI input may be prohibited. For details, refer to section 18.8.4, NMI Input Disable Conditions.
External interrupts Interrupts NMI (1) IRQ 0 to IRQ 5 (6) WDT*1 (1) Refresh controller*2 (1) ITU (15) DMAC (4) SCI (8) A/D converter (1)
Internal interrupts
Notes: Numbers in parentheses are the number of interrupt sources. 1. When the watchdog timer is used as an interval timer, it generates an interrupt request at every counter overflow. 2. When the refresh controller is used as an interval timer, it generates an interrupt request at compare match.
Figure 4.5 Interrupt Sources and Number of Interrupts
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Section 4 Exception Handling
4.4
Trap Instruction
Trap instruction exception handling starts when a TRAPA instruction is executed. If the UE bit is set to 1 in the system control register (SYSCR), the exception handling sequence sets the I bit to 1 in CCR. If the UE bit is 0, the I and UI bits are both set to 1. The TRAPA instruction fetches a start address from a vector table entry corresponding to a vector number from 0 to 3, which is specified in the instruction code.
4.5
Stack Status after Exception Handling
Figure 4.6 shows the stack after completion of trap instruction exception handling and interrupt exception handling.
SP-4 SP-3 SP-2 SP-1 SP (ER7)
Stack area
SP (ER7) SP+1 SP+2 SP+3 SP+4
CCR PC E PC H PC L Even address
Before exception handling Pushed on stack
After exception handling
Legend: PCE: Bits 23 to 16 of program counter (PC) PCH: Bits 15 to 8 of program counter (PC) PCL: Bits 7 to 0 of program counter (PC) CCR: Condition code register SP: Stack pointer Notes: 1. PC indicates the address of the first instruction that will be executed after return. 2. Registers must be saved in word or longword size at even addresses.
Figure 4.6 Stack after Completion of Exception Handling
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Section 4 Exception Handling
4.6
Notes on Stack Usage
When accessing word data or longword data, the H8/3048B Group regards the lowest address bit as 0. The stack should always be accessed by word access or longword access, and the value of the stack pointer (SP:ER7) should always be kept even. Use the following instructions to save registers: PUSH.W Rn PUSH.L ERn (or MOV.W Rn, @-SP) (or MOV.L ERn, @-SP)
Use the following instructions to restore registers: POP.W Rn POP.L ERn (or MOV.W @SP+, Rn) (or MOV.L @SP+, ERn)
Setting SP to an odd value may lead to a malfunction. Figure 4.7 shows an example of what happens when the SP value is odd.
CCR SP PC
SP
R1L
H'FFFEFA H'FFFEFB
PC
H'FFFEFC H'FFFEFD
H'FFFEFF SP
TRAPA instruction executed
MOV. B R1L, @-ER7
SP set to H'FFFEFF Legend: CCR: Condition code register PC: Program counter R1L: General register R1L SP: Stack pointer
Data saved above SP
CCR contents lost
Note: The diagram illustrates modes 3 and 4.
Figure 4.7 Operation when SP Value Is Odd
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Section 5 Interrupt Controller
Section 5 Interrupt Controller
5.1
5.1.1
Overview
Features
The interrupt controller has the following features: * Interrupt priority registers (IPRs) for setting interrupt priorities Interrupts other than NMI can be assigned to two priority levels on a module-by-module basis in interrupt priority registers A and B (IPRA and IPRB). * Three-level masking by the I and UI bits in the CPU condition code register (CCR) * Independent vector addresses All interrupts are independently vectored; the interrupt service routine does not have to identify the interrupt source. * Seven external interrupt pins NMI has the highest priority and is always accepted*; either the rising or falling edge can be selected. For each of IRQ0 to IRQ5, sensing of the falling edge or level sensing can be selected independently. Note: * For the H8/3048F-ONE (single power supply with flash memory), the NMI input may be prohibited. For details, refer to section 18.8.4, NMI Input Disable Conditions.
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Section 5 Interrupt Controller
5.1.2
Block Diagram
Figure 5.1 shows a block diagram of the interrupt controller.
CPU ISCR NMI input IRQ input OVF TME . . . . . . . ADI ADIE IRQ input section ISR Priority decision logic IER IPRA, IPRB
Interrupt request Vector number
. . .
I Interrupt controller UE SYSCR Legend: ISCR: IER: ISR: IPRA: IPRB: SYSCR: IRQ sense control register IRQ enable register IRQ status register Interrupt priority register A Interrupt priority register B System control register UI
CCR
Figure 5.1 Interrupt Controller Block Diagram
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Section 5 Interrupt Controller
5.1.3
Pin Configuration
Table 5.1 lists the interrupt pins. Table 5.1
Name Nonmaskable interrupt External interrupt request 5 to 0 Note: *
Interrupt Pins
Abbreviation NMI IRQ5 to IRQ0 I/O Input Input Function Nonmaskable interrupt*, rising edge or falling edge selectable Maskable interrupts, falling edge or level sensing selectable
For the H8/3048F-ONE (single power supply with flash memory), the NMI input may be prohibited. For details, refer to section 18.8.4, NMI Input Disable Conditions.
5.1.4
Register Configuration
Table 5.2 lists the registers of the interrupt controller. Table 5.2
Address* H'FFF2 H'FFF4 H'FFF5 H'FFF6 H'FFF8 H'FFF9
1
Interrupt Controller Registers
Name System control register IRQ sense control register IRQ enable register IRQ status register Interrupt priority register A Interrupt priority register B Abbreviation SYSCR ISCR IER ISR IPRA IPRB R/W R/W R/W R/W
2 R/(W)*
Initial Value H'0B H'00 H'00 H'00 H'00 H'00
R/W R/W
Notes: 1. Lower 16 bits of the address. 2. Only 0 can be written, to clear flags.
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Section 5 Interrupt Controller
5.2
5.2.1
Register Descriptions
System Control Register (SYSCR)
SYSCR is an 8-bit readable/writable register that controls software standby mode, selects the action of the UI bit in CCR, selects the NMI edge, and enables or disables the on-chip RAM. Only bits 3 and 2 are described here. For the other bits, see section 3.3, System Control Register (SYSCR). SYSCR is initialized to H'0B by a reset and in hardware standby mode. It is not initialized in software standby mode.
Bit Initial value Read/Write 7 SSBY 0 R/W 6 STS2 0 R/W 5 STS1 0 R/W 4 STS0 0 R/W 3 UE 1 R/W 2 NMIEG 0 R/W 1 1 0 RAME 1 R/W
RAM enable Reserved bit Standby timer select 2 to 0 Software standby NMI edge select Selects the NMI input edge User bit enable Selects whether to use the UI bit in CCR as a user bit or interrupt mask bit
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Section 5 Interrupt Controller
Bit 3--User Bit Enable (UE): Selects whether to use the UI bit in CCR as a user bit or an interrupt mask bit.
Bit 3: UE 0 1 Description UI bit in CCR is used as interrupt mask bit UI bit in CCR is used as user bit (Initial value)
Bit 2--NMI Edge Select (NMIEG): Selects the NMI input edge.
Bit 2: NMIEG 0 1 Description Interrupt is requested at falling edge of NMI input Interrupt is requested at rising edge of NMI input (Initial value)
5.2.2
Interrupt Priority Registers A and B (IPRA, IPRB)
IPRA and IPRB are 8-bit readable/writable registers that control interrupt priority.
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Section 5 Interrupt Controller
Interrupt Priority Register A (IPRA) IPRA is an 8-bit readable/writable register in which interrupt priority levels can be set.
Bit Initial value Read/Write 7 IPRA7 0 R/W 6 IPRA6 0 R/W 5 IPRA5 0 R/W 4 IPRA4 0 R/W 3 IPRA3 0 R/W 2 IPRA2 0 R/W 1 IPRA1 0 R/W 0 IPRA0 0 R/W
Priority level A0 Selects the priority level of ITU channel 2 interrupt requests Priority level A1 Selects the priority level of ITU channel 1 interrupt requests Priority level A2 Selects the priority level of ITU channel 0 interrupt requests Priority level A3 Selects the priority level of WDT and refresh controller interrupt requests Priority level A4 Selects the priority level of IRQ4 and IRQ 5 interrupt requests Priority level A5 Selects the priority level of IRQ 2 and IRQ 3 interrupt requests Priority level A6 Selects the priority level of IRQ1 interrupt requests Priority level A7 Selects the priority level of IRQ 0 interrupt requests
IPRA is initialized to H'00 by a reset and in hardware standby mode.
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Section 5 Interrupt Controller
Bit 7--Priority Level A7 (IPRA7): Selects the priority level of IRQ0 interrupt requests.
Bit 7: IPRA7 0 1 Description IRQ0 interrupt requests have priority level 0 (low priority) IRQ0 interrupt requests have priority level 1 (high priority) (Initial value)
Bit 6--Priority Level A6 (IPRA6): Selects the priority level of IRQ1 interrupt requests.
Bit 6: IPRA6 0 1 Description IRQ1 interrupt requests have priority level 0 (low priority) IRQ1 interrupt requests have priority level 1 (high priority) (Initial value)
Bit 5--Priority Level A5 (IPRA5): Selects the priority level of IRQ2 and IRQ3 interrupt requests.
Bit 5: IPRA5 0 1 Description IRQ2 and IRQ3 interrupt requests have priority level 0 (low priority) (Initial value) IRQ2 and IRQ3 interrupt requests have priority level 1 (high priority)
Bit 4--Priority Level A4 (IPRA4): Selects the priority level of IRQ4 and IRQ5 interrupt requests.
Bit 4: IPRA4 0 1 Description IRQ4 and IRQ5 interrupt requests have priority level 0 (low priority) (Initial value) IRQ4 and IRQ5 interrupt requests have priority level 1 (high priority)
Bit 3--Priority Level A3 (IPRA3): Selects the priority level of WDT and refresh controller interrupt requests.
Bit 3: IPRA3 0 1 Description WDT and refresh controller interrupt requests have priority level 0 (low priority) (Initial value) WDT and refresh controller interrupt requests have priority level 1 (high priority)
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Section 5 Interrupt Controller
Bit 2--Priority Level A2 (IPRA2): Selects the priority level of ITU channel 0 interrupt requests.
Bit 2: IPRA2 0 1 Description ITU channel 0 interrupt requests have priority level 0 (low priority) (Initial value) ITU channel 0 interrupt requests have priority level 1 (high priority)
Bit 1--Priority Level A1 (IPRA1): Selects the priority level of ITU channel 1 interrupt requests.
Bit 1: IPRA1 0 1 Description ITU channel 1 interrupt requests have priority level 0 (low priority) (Initial value) ITU channel 1 interrupt requests have priority level 1 (high priority)
Bit 0--Priority Level A0 (IPRA0): Selects the priority level of ITU channel 2 interrupt requests.
Bit 0: IPRA0 0 1 Description ITU channel 2 interrupt requests have priority level 0 (low priority) (Initial value) ITU channel 2 interrupt requests have priority level 1 (high priority)
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Section 5 Interrupt Controller
Interrupt Priority Register B (IPRB) IPRB is an 8-bit readable/writable register in which interrupt priority levels can be set.
Bit Initial value Read/Write 7 IPRB7 0 R/W 6 IPRB6 0 R/W 5 IPRB5 0 R/W 4 0 R/W 3 IPRB3 0 R/W 2 IPRB2 0 R/W 1 IPRB1 0 R/W 0 0 R/W
Reserved bit Priority level B1 Selects the priority level of A/D converter interrupt request Priority level B2 Selects the priority level of SCI channel 1 interrupt requests Priority level B3 Selects the priority level of SCI channel 0 interrupt requests Reserved bit
Priority level B5 Selects the priority level of DMAC interrupt requests (channels 0 and 1) Priority level B6 Selects the priority level of ITU channel 4 interrupt requests Priority level B7 Selects the priority level of ITU channel 3 interrupt requests
IPRB is initialized to H'00 by a reset and in hardware standby mode.
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Section 5 Interrupt Controller
Bit 7--Priority Level B7 (IPRB7): Selects the priority level of ITU channel 3 interrupt requests.
Bit 7: IPRB7 0 1 Description ITU channel 3 interrupt requests have priority level 0 (low priority) (Initial value) ITU channel 3 interrupt requests have priority level 1 (high priority)
Bit 6--Priority Level B6 (IPRB6): Selects the priority level of ITU channel 4 interrupt requests.
Bit 6: IPRB6 0 1 Description ITU channel 4 interrupt requests have priority level 0 (low priority) (Initial value) ITU channel 4 interrupt requests have priority level 1 (high priority)
Bit 5--Priority Level B5 (IPRB5): Selects the priority level of DMAC interrupt requests (channels 0 and 1).
Bit 5: IPRB5 0 1 Description DMAC interrupt requests (channels 0 and 1) have priority level 0 (low priority) (Initial value) DMAC interrupt requests (channels 0 and 1) have priority level 1 (high priority)
Bit 4--Reserved: This bit can be written and read, but it does not affect interrupt priority.
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Section 5 Interrupt Controller
Bit 3--Priority Level B3 (IPRB3): Selects the priority level of SCI channel 0 interrupt requests.
Bit 3: IPRB3 0 1 Description SCI0 interrupt requests have priority level 0 (low priority) SCI0 interrupt requests have priority level 1 (high priority) (Initial value)
Bit 2--Priority Level B2 (IPRB2): Selects the priority level of SCI channel 1 interrupt requests.
Bit 2: IPRB2 0 1 Description SCI1 interrupt requests have priority level 0 (low priority) SCI1 interrupt requests have priority level 1 (high priority) (Initial value)
Bit 1--Priority Level B1 (IPRB1): Selects the priority level of A/D converter interrupt requests.
Bit 1: IPRB1 0 1 Description A/D converter interrupt requests have priority level 0 (low priority) (Initial value) A/D converter interrupt requests have priority level 1 (high priority)
Bit 0--Reserved: This bit can be written and read, but it does not affect interrupt priority.
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Section 5 Interrupt Controller
5.2.3
IRQ Status Register (ISR)
ISR is an 8-bit readable/writable register that indicates the status of IRQ0 to IRQ5 interrupt requests.
Bit Initial value Read/Write 7 0 6 0 5 IRQ5F 0 R/(W)* 4 IRQ4F 0 R/(W)* 3 IRQ3F 0 R/(W)* 2 IRQ2F 0 R/(W)* 1 IRQ1F 0 R/(W)* 0 IRQ0F 0 R/(W)*
Reserved bits
IRQ 5 to IRQ0 flags These bits indicate IRQ 5 to IRQ 0 interrupt request status
Note: * Only 0 can be written, to clear flags.
ISR is initialized to H'00 by a reset and in hardware standby mode. Bits 7 and 6--Reserved: Read-only bits, always read as 0. Bits 5 to 0--IRQ5 to IRQ0 Flags (IRQ5F to IRQ0F): These bits indicate the status of IRQ5 to IRQ0 interrupt requests.
Bits 5 to 0: IRQ5F to IRQ0F 0 Description [Clearing conditions] (Initial value) 0 is written in IRQnF after reading the IRQnF flag when IRQnF = 1. IRQnSC = 0, IRQn input is high, and interrupt exception handling is carried out. IRQnSC = 1 and IRQn interrupt exception handling is carried out. 1 [Setting conditions] IRQnSC = 0 and IRQn input is low. IRQnSC = 1 and IRQn input changes from high to low. Note: n = 5 to 0
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Section 5 Interrupt Controller
5.2.4
IRQ Enable Register (IER)
IER is an 8-bit readable/writable register that enables or disables IRQ0 to IRQ5 interrupt requests.
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 IRQ5E 0 R/W 4 IRQ4E 0 R/W 3 IRQ3E 0 R/W 2 IRQ2E 0 R/W 1 IRQ1E 0 R/W 0 IRQ0E 0 R/W
Reserved bits
IRQ 5 to IRQ0 enable These bits enable or disable IRQ 5 to IRQ 0 interrupts
IER is initialized to H'00 by a reset and in hardware standby mode. Bits 7 and 6--Reserved: These bits can be written and read, but they do not enable or disable interrupts. Bits 5 to 0--IRQ5 to IRQ0 Enable (IRQ5E to IRQ0E): These bits enable or disable IRQ5 to IRQ0 interrupts.
Bits 5 to 0: IRQ5E to IRQ0E 0 1 Description IRQ5 to IRQ0 interrupts are disabled IRQ5 to IRQ0 interrupts are enabled (Initial value)
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Section 5 Interrupt Controller
5.2.5
IRQ Sense Control Register (ISCR)
ISCR is an 8-bit readable/writable register that selects level sensing or falling-edge sensing of the inputs at pins IRQ5 to IRQ0.
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
IRQ5SC IRQ4SC IRQ3SC IRQ2SC IRQ1SC IRQ0SC
Reserved bits
IRQ 5 to IRQ0 sense control These bits select level sensing or falling-edge sensing for IRQ 5 to IRQ 0 interrupts
ISCR is initialized to H'00 by a reset and in hardware standby mode. Bits 7 and 6--Reserved: These bits can be written and read, but they do not select level or falling-edge sensing. Bits 5 to 0--IRQ5 to IRQ0 Sense Control (IRQ5SC to IRQ0SC): These bits select whether interrupts IRQ5 to IRQ0 are requested by level sensing of pins IRQ5 to IRQ0, or by falling-edge sensing.
Bits 5 to 0: IRQ5SC to IRQ0SC 0 1 Description Interrupts are requested when IRQ5 to IRQ0 inputs are low Interrupts are requested by falling-edge input at IRQ5 to IRQ0 (Initial value)
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Section 5 Interrupt Controller
5.3
Interrupt Sources
The interrupt sources include external interrupts (NMI, IRQ0 to IRQ5) and 30 internal interrupts. 5.3.1 External Interrupts
There are seven external interrupts: NMI, and IRQ0 to IRQ5. Of these, NMI, IRQ0, IRQ1, and IRQ2 can be used to exit software standby mode. NMI NMI is the highest-priority interrupt and is always accepted, regardless of the states of the I and UI bits in CCR. The NMIEG bit in SYSCR selects whether an interrupt is requested by the rising or falling edge of the input at the NMI pin*. NMI interrupt exception handling has vector number 7. Note: * For the H8/3048F-ONE (single power supply with flash memory), the NMI input may be prohibited. For details, refer to section 18.8.4, NMI Input Disable Conditions. IRQ0 to IRQ5 Interrupts These interrupts are requested by input signals at pins IRQ0 to IRQ5. The IRQ0 to IRQ5 interrupts have the following features. * ISCR settings can select whether an interrupt is requested by the low level of the input at pins IRQ0 to IRQ5, or by the falling edge. * IER settings can enable or disable the IRQ0 to IRQ5 interrupts. Interrupt priority levels can be assigned by four bits in IPRA (IPRA7 to IPRA4). * The status of IRQ0 to IRQ5 interrupt requests is indicated in ISR. The ISR flags can be cleared to 0 by software. Figure 5.2 shows a block diagram of interrupts IRQ0 to IRQ5.
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Section 5 Interrupt Controller
IRQnSC IRQnF Edge/level sense circuit IRQn input S R Clear signal Note: n = 5 to 0 Q
IRQnE
IRQn interrupt request
Figure 5.2 Block Diagram of Interrupts IRQ0 to IRQ5 Figure 5.3 shows the timing of the setting of the interrupt flags (IRQnF).
IRQn input pin IRQnF Note: n = 5 to 0
Figure 5.3 Timing of Setting of IRQnF Interrupts IRQ0 to IRQ5 have vector numbers 12 to 17. These interrupts are detected regardless of whether the corresponding pin is set for input or output. When using a pin for external interrupt input, clear its DDR bit to 0 and do not use the pin for chip select output, refresh output, or SCI input or output.
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Section 5 Interrupt Controller
5.3.2
Internal Interrupts
Thirty internal interrupts are requested from the on-chip supporting modules. * Each on-chip supporting module has status flags for indicating interrupt status, and enable bits for enabling or disabling interrupts. * Interrupt priority levels can be assigned in IPRA and IPRB. * ITU and SCI interrupt requests can activate the DMAC, in which case no interrupt request is sent to the interrupt controller, and the I and UI bits are disregarded. 5.3.3 Interrupt Vector Table
Table 5.3 lists the interrupt sources, their vector addresses, and their default priority order. In the default priority order, smaller vector numbers have higher priority. The priority of interrupts other than NMI can be changed in IPRA and IPRB. The priority order after a reset is the default order shown in table 5.3.
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Section 5 Interrupt Controller
Table 5.3
Interrupt Sources, Vector Addresses, and Priority
Origin External pins Vector Number 7 12 13 14 15 16 17 -- Watchdog timer Refresh controller -- ITU channel 0 18 19 20 21 22 23 24 Vector Address* H'001C to H'001F H'0030 to H'0033 H'0034 to H0037 H'0038 to H'003B H'003C to H'003F H'0040 to H'0043 H'0044 to H'0047 H'0048 to H'004B H'004C to H'004F H'0050 to H'0053 H'0054 to H'0057 H'0058 to H'005B H'005C to H'005F H'0060 to H'0063 IPRA2 IPRA3 IPRA4 IPR -- IPRA7 IPRA6 IPRA5 Priority High
Interrupt Source NMI IRQ0 IRQ1 IRQ2 IRQ3 IRQ4 IRQ5 Reserved WOVI (interval timer) CMI (compare match) Reserved IMIA0 (compare match/ input capture A0) IMIB0 (compare match/ input capture B0) OVI0 (overflow 0) Reserved IMIA1 (compare match/ input capture A1) IMIB1 (compare match/ input capture B1) OVI1 (overflow 1) Reserved
25
H'0064 to H'0067
26 -- ITU channel 1 27 28
H'0068 to H'006B H'006C to H'006F H'0070 to H'0073 IPRA1
29
H'0074 to H'0077
30 -- 31
H'0078 to H'007B H'007C to H'007F Low
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Section 5 Interrupt Controller Vector Number 32
Interrupt Source IMIA2 (compare match/ input capture A2) IMIB2 (compare match/ input capture B2) OVI2 (overflow 2) Reserved IMIA3 (compare match/ input capture A3) IMIB3 (compare match/ input capture B3) OVI3 (overflow 3) Reserved IMIA4 (compare match/ input capture A4) IMIB4 (compare match/ input capture B4) OVI4 (overflow 4) Reserved DEND0A DEND0B DEND1A DEND1B Reserved
Origin ITU channel 2
Vector Address* H'0080 to H'0083
IPR IPRA0
Priority High
33
H'0084 to H'0087
34 -- ITU channel 3 35 36
H'0088 to H'008B H'008C to H'008F H'0090 to H'0093 IPRB7
37
H'0094 to H'0097
38 -- ITU channel 4 39 40
H'0098 to H'009B H'009C to H'009F H'00A0 to H'00A3 IPRB6
41
H'00A4 to H'00A7
42 -- DMAC 43 44 45 46 47 -- 48 49 50 51
H'00A8 to H'00AB H'00AC to H'00AF H'00B0 to H'00B3 H'00B4 to H'00B7 H'00B8 to H'00BB H'00BC to H'00BF H'00C0 to H'00C3 H'00C4 to H'00C7 H'00C8 to H'00CB H'00CC to H'00CF Low -- IPRB5
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Section 5 Interrupt Controller Vector Number 52 53 54 55 SCI channel 1 56 57 58 59 A/D 60
Interrupt Source ERI0 (receive error 0) RXI0 (receive data full 0) TXI0 (transmit data empty 0) TEI0 (transmit end 0) ERI1 (receive error 1) RXI1 (receive data full 1) TXI1 (transmit data empty 1) TEI1 (transmit end 1) ADI (A/D end) Note: *
Origin SCI channel 0
Vector Address* H'00D0 to H'00D3 H'00D4 to H'00D7 H'00D8 to H'00DB H'00DC to H'00DF H'00E0 to H'00E3 H'00E4 to H'00E7 H'00E8 to H'00EB H'00EC to H'00EF H'00F0 to H'00F3
IPR IPRB3
Priority High
IPRB2
IPRB1
Low
Lower 16 bits of the address.
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Section 5 Interrupt Controller
5.4
5.4.1
Interrupt Operation
Interrupt Handling Process
The H8/3048B Group handles interrupts differently depending on the setting of the UE bit. When UE = 1, interrupts are controlled by the I bit. When UE = 0, interrupts are controlled by the I and UI bits. Table 5.4 indicates how interrupts are handled for all setting combinations of the UE, I, and UI bits. NMI interrupts are always accepted except in the reset and hardware standby states*. IRQ interrupts and interrupts from the on-chip supporting modules have their own enable bits. Interrupt requests are ignored when the enable bits are cleared to 0. Note: * For the H8/3048F-ONE (single power supply with flash memory), the NMI input may be prohibited. For details, refer to section 18.8.4, NMI Input Disable Conditions. Table 5.4
SYSCR UE 1 I 0 1 0 0 1
UE, I, and UI Bit Settings and Interrupt Handling
CCR UI -- -- -- 0 1 Description All interrupts are accepted. Interrupts with priority level 1 have higher priority. No interrupts are accepted except NMI. All interrupts are accepted. Interrupts with priority level 1 have higher priority. NMI and interrupts with priority level 1 are accepted. No interrupts are accepted except NMI.
UE = 1 Interrupts IRQ0 to IRQ5 and interrupts from the on-chip supporting modules can all be masked by the I bit in the CPU's CCR. Interrupts are masked when the I bit is set to 1, and unmasked when the I bit is cleared to 0. Interrupts with priority level 1 have higher priority. Figure 5.4 is a flowchart showing how interrupts are accepted when UE = 1.
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Section 5 Interrupt Controller
Program execution state
No Interrupt requested? Yes Yes NMI No No Priority level 1? Yes No No Pending
IRQ 0 Yes
IRQ 0 No Yes
IRQ 1 Yes
IRQ 1 Yes
No
ADI Yes
ADI Yes
No I=0 Yes Save PC and CCR I 1 Read vector address Branch to interrupt service routine
Figure 5.4 Process Up to Interrupt Acceptance when UE = 1
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Section 5 Interrupt Controller
* If an interrupt condition occurs and the corresponding interrupt enable bit is set to 1, an interrupt request is sent to the interrupt controller. * When the interrupt controller receives one or more interrupt requests, it selects the highestpriority request, following the IPR interrupt priority settings, and holds other requests pending. If two or more interrupts with the same IPR setting are requested simultaneously, the interrupt controller follows the priority order shown in table 5.3. * The interrupt controller checks the I bit. If the I bit is cleared to 0, the selected interrupt request is accepted. If the I bit is set to 1, only NMI is accepted; other interrupt requests are held pending. * When an interrupt request is accepted, interrupt exception handling starts after execution of the current instruction has been completed. * In interrupt exception handling, PC and CCR are saved to the stack area. The PC value that is saved indicates the address of the first instruction that will be executed after the return from the interrupt service routine. * Next the I bit is set to 1 in CCR, masking all interrupts except NMI. * The vector address of the accepted interrupt is generated, and the interrupt service routine starts executing from the address indicated by the contents of the vector address. UE = 0 The I and UI bits in the CPU's CCR and the IPR bits enable three-level masking of IRQ0 to IRQ5 interrupts and interrupts from the on-chip supporting modules. * Interrupt requests with priority level 0 are masked when the I bit is set to 1, and are unmasked when the I bit is cleared to 0. * Interrupt requests with priority level 1 are masked when the I and UI bits are both set to 1, and are unmasked when either the I bit or the UI bit is cleared to 0. For example, if the interrupt enable bits of all interrupt requests are set to 1, IPRA is set to H'20, and IPRB is set to H'00 (giving IRQ2 and IRQ3 interrupt requests priority over other interrupts), interrupts are masked as follows: a. If I = 0, all interrupts are unmasked (priority order: NMI > IRQ2 > IRQ3 >IRQ0 ...). b. If I = 1 and UI = 0, only NMI, IRQ2, and IRQ3 are unmasked. c. If I = 1 and UI = 1, all interrupts are masked except NMI. Figure 5.5 shows the transitions among the above states.
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Section 5 Interrupt Controller
I0 a. All interrupts are unmasked I 1, UI 0 b. Only NMI, IRQ 2 , and IRQ 3 are unmasked
I0
Exception handling, or I 1, UI 1
UI 0 Exception handling, or UI 1
c. All interrupts are masked except NMI
Figure 5.5 Interrupt Masking State Transitions (Example) Figure 5.6 is a flowchart showing how interrupts are accepted when UE = 0. * If an interrupt condition occurs and the corresponding interrupt enable bit is set to 1, an interrupt request is sent to the interrupt controller. * When the interrupt controller receives one or more interrupt requests, it selects the highestpriority request, following the IPR interrupt priority settings, and holds other requests pending. If two or more interrupts with the same IPR setting are requested simultaneously, the interrupt controller follows the priority order shown in table 5.3. * The interrupt controller checks the I bit. If the I bit is cleared to 0, the selected interrupt request is accepted regardless of its IPR setting, and regardless of the UI bit. If the I bit is set to 1 and the UI bit is cleared to 0, only NMI and interrupts with priority level 1 are accepted; interrupt requests with priority level 0 are held pending. If the I bit and UI bit are both set to 1, only NMI is accepted; all other interrupt requests are held pending. * When an interrupt request is accepted, interrupt exception handling starts after execution of the current instruction has been completed. * In interrupt exception handling, PC and CCR are saved to the stack area. The PC value that is saved indicates the address of the first instruction that will be executed after the return from the interrupt service routine. * The I and UI bits are set to 1 in CCR, masking all interrupts except NMI. * The vector address of the accepted interrupt is generated, and the interrupt service routine starts executing from the address indicated by the contents of the vector address.
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Section 5 Interrupt Controller
Program execution state
No Interrupt requested? Yes Yes NMI No No Priority level 1? Yes No No Pending
IRQ 0 Yes
IRQ 0 No Yes
IRQ 1 Yes
IRQ 1 Yes
No
ADI Yes
ADI Yes
No I=0 Yes No UI = 0 Yes I=0 Yes
No
Save PC and CCR I 1, UI 1 Read vector address Branch to interrupt service routine
Figure 5.6 Process Up to Interrupt Acceptance when UE = 0
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5.4.2
Interrupt accepted
Interrupt level decision and wait for end of instruction Instruction Internal prefetch processing Stack Vector fetch
Prefetch of interrupt Internal service routine processing instruction
Section 5 Interrupt Controller
Interrupt Sequence
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(1) (3) (5) (7) (9) (11) (13) High (2) (4) (6) (8) (10) (12) (14) (6), (8) PC and CCR saved to stack (9), (11) Vector address (10), (12) Starting address of interrupt service routine (contents of vector address) (13) Starting address of interrupt service routine; (13) = (10), (12) (14) First instruction of interrupt service routine
Interrupt request signal
Address bus
RD
HWR , LWR
D15 to D0
(1)
Instruction prefetch address (not executed; return address, same as PC contents) (2), (4) Instruction code (not executed) (3) Instruction prefetch address (not executed) (5) SP - 2 (7) SP - 4
Figure 5.7 shows the interrupt sequence in mode 2 when the program code and stack are in an external memory area accessed in two states via a 16-bit bus.
Figure 5.7 Interrupt Sequence (Mode 2, Two-State Access, Stack in External Memory)
Note: Mode 2, with program code and stack in external memory area accessed in two states via 16-bit bus.
Section 5 Interrupt Controller
5.4.3
Interrupt Response Time
Table 5.5 indicates the interrupt response time from the occurrence of an interrupt request until the first instruction of the interrupt service routine is executed. Table 5.5 Interrupt Response Time
External Memory On-Chip Memory
1 2*
8-Bit Bus 2 States
1 2*
16-Bit Bus 2 States
1 2*
No. 1 2
Item Interrupt priority decision Maximum number of states until end of current instruction Saving PC and CCR to stack Vector fetch Instruction prefetch* 3 Internal processing*
2
3 States
1 2*
3 States 2*
1
1 to 23*
5
56 6 1 to 27* * 1 to 41*
1 to 23*
5
1 to 25*
5
3 4 5 6 Total
4 4 4 4 19 to 41
8 8 8 4 31 to 57
12*
4
4 4 4 4 19 to 41
6*
4
12* 4 12*
4
6* 4 6*
4
4 43 to 83
4 25 to 49
Notes: 1. 1 state for internal interrupts. 2. Prefetch after the interrupt is accepted and prefetch of the first instruction in the interrupt service routine. 3. Internal processing after the interrupt is accepted and internal processing after prefetch. 4. The number of states increases if wait states are inserted in external memory access. 5. Example for DIVXS.W Rs,ERd and MULXS.W Rs,ERd 6. Example for MOV.L @(d:24,ERs),ERd and MOV.L ERs,@(d:24,ERd)
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Section 5 Interrupt Controller
5.5
5.5.1
Usage Notes
Contention between Interrupt and Interrupt-Disabling Instruction
When an instruction clears an interrupt enable bit to 0 to disable the interrupt, the interrupt is not disabled until after execution of the instruction is completed. If an interrupt occurs while a BCLR, MOV, or other instruction is being executed to clear its interrupt enable bit to 0, at the instant when execution of the instruction ends the interrupt is still enabled, so its interrupt exception handling is carried out. If a higher-priority interrupt is also requested, however, interrupt exception handling for the higher-priority interrupt is carried out, and the lower-priority interrupt is ignored. This also applies to the clearing of an interrupt flag. Figure 5.8 shows an example in which an IMIEA bit is cleared to 0 in TIER of the ITU.
TIER write cycle by CPU Internal address bus Internal write signal IMIEA IMIA exception handling
TIER address
IMIA IMFA interrupt signal
Figure 5.8 Contention between Interrupt and Interrupt-Disabling Instruction This type of contention will not occur if the interrupt is masked when the interrupt enable bit or flag is cleared to 0.
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Section 5 Interrupt Controller
5.5.2
Instructions That Inhibit Interrupts
The LDC, ANDC, ORC, and XORC instructions inhibit interrupts. When an interrupt occurs, after determining the interrupt priority, the interrupt controller requests a CPU interrupt. If the CPU is currently executing one of these interrupt-inhibiting instructions, however, when the instruction is completed the CPU always continues by executing the next instruction. 5.5.3 Interrupts during EEPMOV Instruction Execution
The EEPMOV.B and EEPMOV.W instructions differ in their reaction to interrupt requests. When the EEPMOV.B instruction is executing a transfer, no interrupts are accepted until the transfer is completed, not even NMI. When the EEPMOV.W instruction is executing a transfer, interrupt requests other than NMI are not accepted until the transfer is completed. If NMI is requested, NMI exception handling starts at a transfer cycle boundary. The PC value saved on the stack is the address of the next instruction. Programs should be coded as follows to allow for NMI interrupts during EEPMOV.W execution:
L1: EEPMOV.W MOV.W R4,R4 BNE L1
5.5.4
Usage Notes on External Interrupts
The IRQnF flag specification calls for the flag to be cleared by writing 0 to it after it has been read while set to 1. However, it is possible for the IRQnF flag to be cleared by mistake simply by writing 0 to it, irrespective of whether it has been read while set to 1, with the result that interrupt exception handling is not executed. This occurs when the following conditions are fulfilled. * Setting conditions 1. Multiple external interrupts (IRQa, IRQb) are being used. 2. Different clearing methods are being used: clearing by writing 0 for the IRQaF flag, and clearing by hardware for the IRQbF flag. 3. A bit manipulation instruction is used on the IRQ status register to clear the IRQaF flag, or else ISR is read as a byte unit, the IRQaF flag bit is cleared, and the values read in the other bits are written as a byte unit.
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Section 5 Interrupt Controller
* Occurrence conditions 1. When IRQaF = 1, for the IRQaF flag to clear, ISR register read is executed. Thereafter interrupt processing is carried out and IRQbF flag clears. 2. IRQaF flag clear and IRQbF flag generation compete (IRQaF flag setting). (The ISR read needed for IRQaF flag clear was at IRQbF = 0 but in the time taken for ISR write, IRQbF = 1 was reached.) In all of the setting conditions 1 to 3 and occurrence conditions 1 and 2 are generated, IRQbF clears in error during ISR write for occurrence condition 2 and interrupt processing is not carried out. However, if IRQbF flag reaches 0 between occurrence conditions 1 and 2, IRQbF flag does not clear in error.
IRQaF
Read Write 1 0
Read Write 1 0
IRQbF
Read Write IRQb 1 1 Execution
Read 0
Write 0
Clear in error Occurrence condition 1 Occurrence condition 2
Figure 5.9 IRQnF Flag When Interrupt Processing Is Not Conducted
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Section 5 Interrupt Controller
In this situation, conduct one of the following countermeasures. Countermeasure 1: When clears IRQaF flag, do not use the bit manipulation instruction, read the ISR in bytes. Then write a value in bytes which sets IRQaF flag to 0 and other bits to 1. For example, if a = 0
MOV.B @ISR,R0L MOV.B #HFE,R0L MOV.B R0L,@ISR
Countermeasure 2: During IRQb interrupt exception processing, carry out IRQbF flag clear dummy processing. For example, if b = 1
IRQB MOV.B #HFD,R0L MOV.B R0L,@ISR * * *
5.5.5
Notes on Non-Maskable Interrupts (NMI)
NMI is an exception processing that can be executed by the interrupt controller and CPU when the chip internal circuits are operating normally under a specified electrical characteristics. If an NMI is executed when the circuits are not operating normally due to some factors such as software or abnormal interrupt of input to the pins (runaway execution), the operation will not be guaranteed. Incorrect NMI Operation Factors: Software 1. When an interrupt exception processing is executed in an H8/300H CPU, it is assumed that the stack pointer (SP(ER7)) has already been set by software, and that the stack pointer (SP(ER7)) points to the stack area set in a system such as RAM. If the program is in a runaway execution, the stack pointer may be overflowed and updated illegally. Therefore, normal operation will not be guaranteed. 2. Requests for NMIs can be accepted on the rising or falling edge of a pin. Acceptance of the rising or falling edge depends on the setting of the bit NMIEG in the system control register (SYSCR). It is necessary for the customer to set the bit according to the designated system. When the program is in a runaway execution, this bit may be rewritten illegally. Therefore, the system may not operate as expected.
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Section 5 Interrupt Controller
3. This chip has a break function to implement on-board emulation for specific customers. To use this break function, execute the BRK instruction (H'5770). Note that the BRK instruction is usually undefined. Therefore, if the CPU accidentally executes the instruction, the chip will perform exceptional processing and will enter the break mode. In the break mode, interrupts including the NMI are inhibited and the count of the watch dog timer will be stopped. Then by executing the RTB (H'56F0) instruction, the break mode will be cancelled, and usual program execution will resume. When the execution is reset during break mode, the CPU enters the reset state and the break mode is cancelled. Once the reset has been cancelled, normal program execution will resume after the reset exception processing has been executed. Incorrect NMI Operation Factors: Abnormal Interrupts Input to the Chip Pins If an abnormal interrupt which was not specified in the electrical characteristics is input to a pin during a chip operation, the chip may be destroyed. In this case, the operation of the chip will not be guaranteed. When an abnormal interrupt has been input to a pin, the chip may not be destroyed; however, the internal circuits of the chip may partially or wholly malfunction, and the CPU may enter an unimagined undefined state when the CPU was designed. If this occurs, it will be impossible to control the operation of the chip by external pins other than the external reset and standby pins, and the operation of the NMI will not be guaranteed. In this case, after some specified signals have been input to the pins, input an external reset so that the chip can enter the normal program execution state again.
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Section 6 Bus Controller
Section 6 Bus Controller
6.1 Overview
The H8/3048B Group has an on-chip bus controller that divides the address space into eight areas and can assign different bus specifications to each. This enables different types of memory to be connected easily. A bus arbitration function of the bus controller controls the operation of the DMA controller (DMAC) and refresh controller. The bus controller can also release the bus to an external device. 6.1.1 Features
Features of the bus controller are listed below. * Independent settings for address areas 7 to 0 128-kbyte areas in 1-Mbyte modes; 2-Mbyte areas in 16-Mbyte modes. Chip select signals (CS7 to CS0) can be output for areas 7 to 0. Areas can be designated for 8-bit or 16-bit access. Areas can be designated for two-state or three-state access. * Four wait modes Programmable wait mode, pin auto-wait mode, and pin wait modes 0 and 1 can be selected. Zero to three wait states can be inserted automatically. * Bus arbitration function A built-in bus arbiter arbitrates the bus right to the CPU, DMAC, refresh controller, or an external bus master.
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Section 6 Bus Controller
6.1.2
Block Diagram
Figure 6.1 shows a block diagram of the bus controller.
CS7 to CS0 ABWCR Internal address bus ASTCR Area decoder Chip select control signals WCER CSCR Bus control circuit Internal signals Bus mode control signal Bus size control signal Access state control signal Wait request signal
WAIT
Wait-state controller WCR Internal signals
CPU bus request signal DMAC bus request signal Refresh controller bus request signal CPU bus acknowledge signal DMAC bus acknowledge signal Refresh controller bus acknowledge signal
BRCR Bus arbiter
BACK Legend: ABWCR: ASTCR: WCER: WCR: BRCR: CSCR: Bus width control register Access state control register Wait state controller enable register Wait control register Bus release control register Chip select control register BREQ
Figure 6.1 Block Diagram of Bus Controller
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Internal data bus
Section 6 Bus Controller
6.1.3
Input/Output Pins
Table 6.1 summarizes the bus controller's input/output pins. Table 6.1
Name Chip select 7 to 0 Address strobe Read High write
Bus Controller Pins
Abbreviation CS7 to CS0 AS RD HWR I/O Output Output Output Output Function Strobe signals selecting areas 7 to 0 Strobe signal indicating valid address output on the address bus Strobe signal indicating reading from the external address space Strobe signal indicating writing to the external address space, with valid data on the upper data bus (D15 to D8) Strobe signal indicating writing to the external address space, with valid data on the lower data bus (D7 to D0) Wait request signal for access to external three-state-access areas Request signal for releasing the bus to an external device Acknowledge signal indicating the bus is released to an external device
Low write
LWR
Output
Wait Bus request Bus acknowledge
WAIT BREQ BACK
Input Input Output
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Section 6 Bus Controller
6.1.4
Register Configuration
Table 6.2 summarizes the bus controller's registers. Table 6.2 Bus Controller Registers
Initial Value Address* H'FFEC H'FFED H'FFEE H'FFEF H'FFF3 H'FF5F Note: * Name Bus width control register Access state control register Wait control register Wait state controller enable register Bus release control register Chip select control register Lower 16 bits of the address. Abbreviation ABWCR ASTCR WCR WCER BRCR CSCR R/W R/W R/W R/W R/W R/W R/W Modes 1, 3, 5, 6 H'FF H'FF H'F3 H'FF H'FE H'0F Modes 2, 4, 7 H'00 H'FF H'F3 H'FF H'FE H'0F
6.2
6.2.1
Register Descriptions
Bus Width Control Register (ABWCR)
ABWCR is an 8-bit readable/writable register that selects 8-bit or 16-bit access for each area.
Bit
Modes 1, 3, 5, 6 Modes 2, 4, 7
7 ABW7 1 0 R/W
6 ABW6 1 0 R/W
5 ABW5 1 0 R/W
4 ABW4 1 0 R/W
3 ABW3 1 0 R/W
2 ABW2 1 0 R/W
1 ABW1 1 0 R/W
0 ABW0 1 0 R/W
Initial value
Read/Write
Bits selecting bus width for each area
When ABWCR contains H'FF (selecting 8-bit access for all areas), the chip operates in 8-bit bus mode: the upper data bus (D15 to D8) is valid, and port 4 is an input/output port. When at least one bit is cleared to 0 in ABWCR, the chip operates in 16-bit bus mode with a 16-bit data bus (D15 to D0). In modes 1, 3, 5, and 6 ABWCR is initialized to H'FF by a reset and in hardware standby mode. In modes 2, 4, and 7 ABWCR is initialized to H'00 by a reset and in hardware standby mode. ABWCR is not initialized in software standby mode.
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Section 6 Bus Controller
Bits 7 to 0--Areas 7 to 0 Bus Width Control (ABW7 to ABW0): These bits select 8-bit access or 16-bit access to the corresponding address areas.
Bits 7 to 0: ABW7 to ABW0 0 1 Description Areas 7 to 0 are 16-bit access areas Areas 7 to 0 are 8-bit access areas
ABWCR specifies the bus width of external memory areas. The bus width of on-chip memory and internal I/O registers is fixed and does not depend on ABWCR settings. These settings are therefore meaningless in single-chip mode (mode 7). 6.2.2 Access State Control Register (ASTCR)
ASTCR is an 8-bit readable/writable register that selects whether each area is accessed in two states or three states.
Bit Initial value Read/Write 7 AST7 1 R/W 6 AST6 1 R/W 5 AST5 1 R/W 4 AST4 1 R/W 3 AST3 1 R/W 2 AST2 1 R/W 1 AST1 1 R/W 0 AST0 1 R/W
Bits selecting number of states for access to each area
ASTCR is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 0--Areas 7 to 0 Access State Control (AST7 to AST0): These bits select whether the corresponding area is accessed in two or three states.
Bits 7 to 0: AST7 to AST0 0 1 Description Areas 7 to 0 are accessed in two states Areas 7 to 0 are accessed in three states (Initial value)
ASTCR specifies the number of states in which external areas are accessed. On-chip memory and internal I/O registers are accessed in a fixed number of states that does not depend on ASTCR settings. These settings are therefore meaningless in single-chip mode (mode 7).
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Section 6 Bus Controller
6.2.3
Wait Control Register (WCR)
WCR is an 8-bit readable/writable register that selects the wait mode for the wait-state controller (WSC) and specifies the number of wait states.
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 WMS1 0 R/W 2 WMS0 0 R/W 1 WC1 1 R/W 0 WC0 1 R/W
Reserved bits
Wait count 1/0 These bits select the number of wait states inserted Wait mode select 1/0 These bits select the wait mode
WCR is initialized to H'F3 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 4--Reserved: Read-only bits, always read as 1. Bits 3 and 2--Wait Mode Select 1 and 0 (WMS1, WMS0): These bits select the wait mode.
Bit 3: WMS1 0 1 Bit 2: WMS0 0 1 0 1 Description Programmable wait mode Pin wait mode 1 Pin auto-wait mode (Initial value)
No wait states inserted by wait-state controller
Bits 1 and 0--Wait Count 1 and 0 (WC1, WC0): These bits select the number of wait states inserted in access to external three-state-access areas.
Bit 1: WC1 0 1 Bit 0: WC0 0 1 0 1 Description No wait states inserted by wait-state controller 1 state inserted 2 states inserted 3 states inserted (Initial value)
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Section 6 Bus Controller
6.2.4
Wait State Controller Enable Register (WCER)
WCER is an 8-bit readable/writable register that enables or disables wait-state control of external three-state-access areas by the wait-state controller.
Bit Initial value Read/Write 7 WCE7 1 R/W 6 WCE6 1 R/W 5 WCE5 1 R/W 4 WCE4 1 R/W 3 WCE3 1 R/W 2 WCE2 1 R/W 1 WCE1 1 R/W 0 WCE0 1 R/W
Wait-state controller enable 7 to 0 These bits enable or disable wait-state control
WCER is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 0--Wait-State Controller Enable 7 to 0 (WCE7 to WCE0): These bits enable or disable wait-state control of external three-state-access areas.
Bits 7 to 0: WCE7 to WCE0 0 1 Description Wait-state control disabled (pin wait mode 0) Wait-state control enabled (Initial value)
Since WCER enables or disables wait-state control of external three-state-access areas, these settings are meaningless in single-chip mode (mode 7).
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Section 6 Bus Controller
6.2.5
Bus Release Control Register (BRCR)
BRCR is an 8-bit readable/writable register that enables address output on bus lines A23 to A21 and enables or disables release of the bus to an external device.
Bit Initial value 7 A23E 1 Read/ Modes 1, 2, 5, 7 Write Modes 3, 4, 6 R/W 6 A22E 1 R/W 5 A21E 1 R/W 4 1 3 1 2 1 1 1 0 BRLE 0 R/W R/W
Address 23 to 21 enable These bits enable PA 6 to PA 4 to be used for A 23 to A 21 address output
Reserved bits
Bus release enable Enables or disables release of the bus to an external device
BRCR is initialized to H'FE by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7--Address 23 Enable (A23E): Enables PA4 to be used as the A23 address output pin. Writing 0 in this bit enables A23 address output from PA4. In modes other than 3, 4, and 6 this bit cannot be modified and PA4 has its ordinary input/output functions.
Bit 7: A23E 0 1 Description PA4 is the A23 address output pin PA4 is the PA4/TP4/TIOCA1 input/output pin (Initial value)
Bit 6--Address 22 Enable (A22E): Enables PA5 to be used as the A22 address output pin. Writing 0 in this bit enables A22 address output from PA5. In modes other than 3, 4, and 6 this bit cannot be modified and PA5 has its ordinary input/output functions.
Bit 6: A22E 0 1 Description PA5 is the A22 address output pin PA5 is the PA5/TP5/TIOCB1 input/output pin (Initial value)
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Section 6 Bus Controller
Bit 5--Address 21 Enable (A21E): Enables PA6 to be used as the A21 address output pin. Writing 0 in this bit enables A21 address output from PA6. In modes other than 3, 4, and 6 this bit cannot be modified and PA6 has its ordinary input/output functions.
Bit 5: A21E 0 1 Description PA6 is the A21 address output pin PA6 is the PA6/TP6/TIOCA2 input/output pin (Initial value)
Bits 4 to 1--Reserved: Read-only bits, always read as 1. Bit 0--Bus Release Enable (BRLE): Enables or disables release of the bus to an external device.
Bit 0: BRLE 0 1 Description The bus cannot be released to an external device; BREQ and BACK can be used as input/output pins (Initial value) The bus can be released to an external device
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Section 6 Bus Controller
6.2.6
Chip Select Control Register (CSCR)
CSCR is an 8-bit readable/writable register that enables or disables output of chip select signals (CS7 to CS4). If a chip select signal (CS7 to CS4) output is selected in this register, the corresponding pin functions as a chip select signal (CS7 to CS4) output, this function taking priority over other functions. CSCR cannot be modified in single-chip mode.
Bit Initial value Read/Write 7 CS7E 0 R/W 6 CS6E 0 R/W 5 CS5E 0 R/W 4 CS4E 0 R/W 3 1 2 1 1 1 0 1
Chip select 7 to 4 enable These bits enable or disable chip select signal output
Reserved bits
CSCR is initialized to H'0F by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 4--Chip Select 7 to 4 Enable (CS7E to CS4E): These bits enable or disable output of the corresponding chip select signal.
Bit n: CSnE 0 1 Note: n = 7 to 4 Description Output of chip select signal CSn is disabled Output of chip select signal CSn is enabled (Initial value)
Bits 3 to 0--Reserved: Read-only bits, always read as 1.
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Section 6 Bus Controller
6.3
6.3.1
Operation
Area Division
The external address space is divided into areas 0 to 7. Each area has a size of 128 kbytes in the 1-Mbyte modes, or 2 Mbytes in the 16-Mbyte modes. Figure 6.2 shows a general view of the memory map.
H'00000 Area 0 (128 kbytes) H'1FFFF H'20000 Area 1 (128 kbytes) H'3FFFF H'40000 Area 2 (128 kbytes) H'5FFFF H'60000 Area 3 (128 kbytes) H'7FFFF H'80000 Area 4 (128 kbytes) H'9FFFF H'A0000 Area 5 (128 kbytes) H'BFFFF H'C0000 Area 6 (128 kbytes) H'DFFFF H'E0000 Area 7 (128 kbytes)
12 On-chip RAM* *
H'000000 Area 0 (2 Mbytes) H'1FFFFF H'200000 Area 1 (2 Mbytes) H'3FFFFF H'400000 Area 2 (2 Mbytes) H'5FFFFF H'600000 Area 3 (2 Mbytes) H'7FFFFF H'800000 Area 4 (2 Mbytes) H'9FFFFF H'A00000 Area 5 (2 Mbytes) H'BFFFFF H'C00000 Area 6 (2 Mbytes) H'DFFFFF H'E00000 Area 7 (2 Mbytes)
12 On-chip RAM* * 3
H'00000 H'1FFFF H'20000 H'3FFFF H'40000
On-chip ROM*
1
H'000000 H'1FFFFF H'200000 H'3FFFFF H'400000
On-chip ROM*
1
Area 0 (128 kbytes) Area 1 (128 kbytes)
Area 0 (2 Mbytes) Area 1 (2 Mbytes)
Area 2 (128 kbytes) H'5FFFF H'60000 Area 3 (128 kbytes) H'7FFFF H'80000 Area 4 (128 kbytes) H'9FFFF H'A0000 Area 5 (128 kbytes) H'BFFFF H'C0000 Area 6 (128 kbytes) H'DFFFF H'E0000 Area 7 (128 kbytes)
12 On-chip RAM* * 3 3 External address space*
Area 2 (2 Mbytes) H'5FFFFF H'600000 Area 3 (2 Mbytes) H'7FFFFF H'800000 Area 4 (2 Mbytes) H'9FFFFF H'A00000 Area 5 (2 Mbytes) H'BFFFFF H'C00000 Area 6 (2 Mbytes) H'DFFFFF H'E00000 Area 7 (2 Mbytes)
12 On-chip RAM* *
External address space* H'FFFFF
1 Internal I/O registers*
External address space* H'FFFFFF
1 Internal I/O registers*
External address space*3 H'FFFFFF Internal I/O registers *1 d. 16-Mbyte mode with on-chip ROM enabled (mode 6)
H'FFFFF
1 Internal I/O registers*
a. 1-Mbyte modes with on-chip ROM disabled (modes 1 and 2)
b. 16-Mbyte modes with on-chip ROM disabled (modes 3 and 4)
c. 1-Mbyte mode with on-chip ROM enabled (mode 5)
Notes: 1. The on-chip ROM, on-chip RAM, and internal I/O registers have a fixed bus width and are accessed in a fixed number of states. 2. When the RAME bit is cleared to 0 in SYSCR, this area conforms to the specifications of area 7. 3. This external address area conforms to the specifications of area 7.
Figure 6.2 Access Area Map for Modes 1 to 6
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Section 6 Bus Controller
Chip select signals (CS7 to CS0) can be output for areas 7 to 0. The bus specifications for each area can be selected in ABWCR, ASTCR, WCER, and WCR as shown in table 6.3. Table 6.3
ABWCR ABWn 0
Bus Specifications
ASTCR ASTn 0 1 WCER WCEn -- 0 1 WCR WMS1 -- -- 0 1 WMS0 -- -- 0 1 0 1 -- -- 0 1 1 0 1 Bus Width 16 16 16 16 16 16 8 8 8 8 8 8 Bus Specifications Access States Wait Mode 2 3 3 3 3 3 2 3 3 3 3 3 Disabled Pin wait mode 0 Programmable wait mode Disabled Pin wait mode 1 Pin auto-wait mode Disabled Pin wait mode 0 Programmable wait mode Disabled Pin wait mode 1 Pin auto-wait mode
1
0 1
-- 0 1
-- -- 0
Note: n = 0 to 7
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Section 6 Bus Controller
6.3.2
Chip Select Signals
For each of areas 7 to 0, the H8/3048B Group can output a chip select signal (CS7 to CS0) that goes low to indicate when the area is selected. Figure 6.3 shows the output timing of a CSn signal (n = 0 to 7). Output of CS3 to CS0: Output of CS3 to CS0 is enabled or disabled in the data direction register (DDR) of the corresponding port. In the expanded modes with on-chip ROM disabled, a reset leaves pin CS0 in the output state and pins CS3 to CS1 in the input state. To output chip select signals CS3 to CS1, the corresponding DDR bits must be set to 1. In the expanded modes with on-chip ROM enabled, a reset leaves pins CS3 to CS0 in the input state. To output chip select signals CS3 to CS0, the corresponding DDR bits must be set to 1. For details see section 9, I/O Ports. Output of CS7 to CS4: Output of CS7 to CS4 is enabled or disabled in the chip select control register (CSCR). A reset leaves pins CS7 to CS4 in the input state. To output chip select signals CS7 to CS4, the corresponding CSCR bits must be set to 1. For details see section 9, I/O Ports.
Address bus CSn
External address in area n
Figure 6.3 CSn Output Timing (n = 7 to 0) When the on-chip ROM, on-chip RAM, and internal I/O registers are accessed, CS7 and CS0 remain high. The CSn signals are decoded from the address signals. They can be used as chip select signals for SRAM and other devices.
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Section 6 Bus Controller
6.3.3
Data Bus
The H8/3048B Group allows either 8-bit access or 16-bit access to be designated for each of areas 7 to 0. An 8-bit-access area uses the upper data bus (D15 to D8). A 16-bit-access area uses both the upper data bus (D15 to D8) and lower data bus (D7 to D0). In read access the RD signal applies without distinction to both the upper and lower data bus. In write access the HWR signal applies to the upper data bus, and the LWR signal applies to the lower data bus. Table 6.4 indicates how the two parts of the data bus are used under different access conditions. Table 6.4
Area 8-bit-access area 16-bit-access area
Access Conditions and Data Bus Usage
Access Read/ Size Write -- Byte Read Write Read Write Word Read Write Valid Address Strobe -- -- Even Odd Even Odd -- -- HWR LWR RD HWR, LWR RD HWR RD Valid Invalid Valid Undetermined data Valid Valid Upper Data Bus (D15 to D8) Valid Lower Data Bus (D7 to D0) Invalid Undetermined data Invalid Valid Undetermined data Valid Valid Valid
Note: Undetermined data means that unpredictable data is output. Invalid means that the bus is in the input state and the input is ignored.
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Section 6 Bus Controller
6.3.4
Bus Control Signal Timing
8-Bit, Three-State-Access Areas Figure 6.4 shows the timing of bus control signals for an 8-bit, three-state-access area. The upper address bus (D15 to D8) is used to access these areas. The LWR pin is always high. Wait states can be inserted.
Bus cycle T1 T2 T3
Address bus
External address in area n
CS n
AS
RD
Read access
D15 to D8
Valid
D 7 to D 0 HWR
Invalid
Write access
LWR
High
D15 to D8
Valid
D 7 to D 0 Note: n = 7 to 0
Undetermined data
Figure 6.4 Bus Control Signal Timing for 8-Bit, Three-State-Access Area
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Section 6 Bus Controller
8-Bit, Two-State-Access Areas Figure 6.5 shows the timing of bus control signals for an 8-bit, two-state-access area. The upper address bus (D15 to D8) is used to access these areas. The LWR pin is always high. Wait states cannot be inserted.
Bus cycle T1 T2
Address bus
External address in area n
CSn
AS
RD
Read access
D15 to D8
Valid
D 7 to D 0
Invalid
HWR
Write access
LWR
High
D15 to D8
Valid
D 7 to D 0
Undetermined data
Note: n = 7 to 0
Figure 6.5 Bus Control Signal Timing for 8-Bit, Two-State-Access Area
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Section 6 Bus Controller
16-Bit, Three-State-Access Areas Figures 6.6 to 6.8 show the timing of bus control signals for a 16-bit, three-state-access area. In these areas, the upper address bus (D15 to D8) is used to access even addresses and the lower address bus (D7 to D0) is used to access odd addresses. Wait states can be inserted.
Bus cycle T1 T2 T3
Address bus
Even external address in area n
CS n
AS
RD
Read access
D15 to D8
Valid
D 7 to D 0 HWR
Invalid
Write access
LWR
High
D15 to D8
Valid
D 7 to D 0 Note: n = 7 to 0
Undetermined data
Figure 6.6 Bus Control Signal Timing for 16-Bit, Three-State-Access Area (1) (Byte Access to Even Address)
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Section 6 Bus Controller
Bus cycle T1 T2 T3
Address bus
Odd external address in area n
CS n
AS
RD
Read access
D15 to D8
Invalid
D 7 to D 0 HWR
Valid
High
Write access
LWR
D15 to D8
Undetermined data
D 7 to D 0
Valid
Note: n = 7 to 0
Figure 6.7 Bus Control Signal Timing for 16-Bit, Three-State-Access Area (2) (Byte Access to Odd Address)
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Section 6 Bus Controller
Bus cycle T1 T2 T3
Address bus
External address in area n
CS n
AS
RD
Read access
D15 to D8
Valid
D 7 to D 0 HWR
Valid
LWR Write access D15 to D8 Valid
D 7 to D 0
Valid
Note: n = 7 to 0
Figure 6.8 Bus Control Signal Timing for 16-Bit, Three-State-Access Area (3) (Word Access)
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Section 6 Bus Controller
16-Bit, Two-State-Access Areas Figures 6.9 to 6.11 show the timing of bus control signals for a 16-bit, two-state-access area. In these areas, the upper address bus (D15 to D8) is used to access even addresses and the lower address bus (D7 to D0) is used to access odd addresses. Wait states cannot be inserted.
Bus cycle T1 T2
Address bus
Even external address in area n
CS n
AS
RD
Read access
D15 to D8
Valid
D 7 to D 0 HWR
Invalid
Write access
LWR
High
D15 to D8
Valid
D 7 to D 0
Undetermined data
Note: n = 7 to 0
Figure 6.9 Bus Control Signal Timing for 16-Bit, Two-State-Access Area (1) (Byte Access to Even Address)
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Section 6 Bus Controller
Bus cycle T1 T2
Address bus
Odd external address in area n
CSn
AS
RD
Read access
D15 to D8
Invalid
D 7 to D 0
Valid
HWR
High
Write access
LWR
D15 to D8
Undetermined data
D 7 to D 0
Valid
Note: n = 7 to 0
Figure 6.10 Bus Control Signal Timing for 16-Bit, Two-State-Access Area (2) (Byte Access to Odd Address)
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Section 6 Bus Controller
Bus cycle T1 T2
Address bus
External address in area n
CSn
AS
RD
Read access
D15 to D8
Valid
D 7 to D 0 HWR
Valid
Write access
LWR
D15 to D8
Valid
D 7 to D 0
Valid
Note: n = 7 to 0
Figure 6.11 Bus Control Signal Timing for 16-Bit, Two-State-Access Area (3) (Word Access)
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Section 6 Bus Controller
6.3.5
Wait Modes
Four wait modes can be selected as shown in table 6.5. Table 6.5
ASTCR ASTn Bit 0 1
Wait Mode Selection
WCER WCEn Bit -- 0 1 WCR WMS1 Bit WMS0 Bit WSC Control -- -- 0 1 -- -- 0 1 0 1 Disabled Disabled Enabled Enabled Enabled Enabled Wait Mode No wait states Pin wait mode 0 Programmable wait mode No wait states Pin wait mode 1 Pin auto-wait mode
Note: n = 7 to 0
Wait Mode in Areas Where Wait-State Controller is Disabled External three-state access areas in which the wait-state controller is disabled (ASTn = 1, WCEn = 0) operate in pin wait mode 0. The other wait modes are unavailable. The settings of bits WMS1 and WMS0 are ignored in these areas. Pin Wait Mode 0: Wait states can only be inserted by WAIT pin control. During access to an external three-state-access area, if the WAIT pin is low at the fall of the system clock () in the T2 state, a wait state (TW) is inserted. If the WAIT pin remains low, wait states continue to be inserted until the WAIT signal goes high. Figure 6.12 shows the timing.
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Section 6 Bus Controller
Inserted by WAIT signal T1 T2 TW TW T3
*
*
*
WAIT pin Address bus AS RD Read access Data bus HWR , LWR Write access Data bus Note: * Arrows indicate time of sampling of the WAIT pin. Write data Read data External address
Figure 6.12 Pin Wait Mode 0 Wait Modes in Areas Where Wait-State Controller is Enabled External three-state access areas in which the wait-state controller is enabled (ASTn = 1, WCEn = 1) can operate in pin wait mode 1, pin auto-wait mode, or programmable wait mode, as selected by bits WMS1 and WMS0. Bits WMS1 and WMS0 apply to all areas, so all areas in which the waitstate controller is enabled operate in the same wait mode. Pin Wait Mode 1: In all accesses to external three-state-access areas, the number of wait states (TW) selected by bits WC1 and WC0 are inserted. If the WAIT pin is low at the fall of the system clock () in the last of these wait states, an additional wait state is inserted. If the WAIT pin remains low, wait states continue to be inserted until the WAIT signal goes high. Pin wait mode 1 is useful for inserting four or more wait states, or for inserting different numbers of wait states for different external devices. If the wait count is 0, this mode operates in the same way as pin wait mode 0.
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Section 6 Bus Controller
Figure 6.13 shows the timing when the wait count is 1 (WC1 = 0, WC0 = 1) and one additional wait state is inserted by WAIT input.
Inserted by wait count T1 T2 TW Inserted by WAIT signal TW T3
*
*
WAIT pin Address bus AS RD Read data Data bus HWR, LWR Write access Data bus Note: * Arrows indicate time of sampling of the WAIT pin. Write data External address
Read access
Figure 6.13 Pin Wait Mode 1
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Section 6 Bus Controller
Pin Auto-Wait Mode: If the WAIT pin is low, the number of wait states (TW) selected by bits WC1 and WC0 are inserted. In pin auto-wait mode, if the WAIT pin is low at the fall of the system clock () in the T2 state, the number of wait states (TW) selected by bits WC1 and WC0 are inserted. No additional wait states are inserted even if the WAIT pin remains low. Pin auto-wait mode can be used for an easy interface to low-speed memory, simply by routing the chip select signal to the WAIT pin. Figure 6.14 shows the timing when the wait count is 1.
T1 T2 T3 T1 T2 TW T3
*
*
WAIT
Address bus
External address
External address
AS RD Read access Data bus Read data Read data
HWR , LWR Write access Data bus Write data Write data
Note: * Arrows indicate time of sampling of the WAIT pin.
Figure 6.14 Pin Auto-Wait Mode
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Section 6 Bus Controller
Programmable Wait Mode: The number of wait states (TW) selected by bits WC1 and WC0 are inserted in all accesses to external three-state-access areas. Figure 6.15 shows the timing when the wait count is 1 (WC1 = 0, WC0 = 1).
T1 T2 TW T3
Address bus
External address
AS
RD Read access Data bus Read data
HWR, LWR Write access Data bus Write data
Figure 6.15 Programmable Wait Mode
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Section 6 Bus Controller
Example of Wait State Control Settings A reset initializes ASTCR and WCER to H'FF and WCR to H'F3, selecting programmable wait mode and three wait states for all areas. Software can select other wait modes for individual areas by modifying the ASTCR, WCER, and WCR settings. Figure 6.16 shows an example of wait mode settings.
3-state-access area, programmable wait mode (3 states inserted) 3-state-access area, programmable wait mode (3 states inserted) 3-state-access area, pin wait mode 0 3-state-access area, pin wait mode 0 2-state-access area, no wait states inserted 2-state-access area, no wait states inserted 2-state-access area, no wait states inserted 2-state-access area, no wait states inserted Bit: ASTCR H'0F: 7 0 6 0 5 0 4 0 3 1 2 1 1 1 0 1
Area 0 Area 1 Area 2 Area 3 Area 4 Area 5 Area 6 Area 7
WCER H'33:
0
0
1
1
0
0
1
1
WCR H'F3:

0
0
1
1
Note: Wait states cannot be inserted in areas designated for two-state access by ASTCR.
Figure 6.16 Wait Mode Settings (Example)
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Section 6 Bus Controller
6.3.6
Interconnections with Memory (Example)
For each area, the bus controller can select two- or three-state access and an 8- or 16-bit data bus width. In three-state-access areas, wait states can be inserted in a variety of modes, simplifying the connection of both high-speed and low-speed devices. Figure 6.18 shows an example of interconnections between the H8/3048B Group and memory. Figure 6.17 shows a memory map for this example. A 256-kword x 16-bit EPROM is connected to area 0. This device is accessed in three states via a 16-bit bus. Two 32-kword x 8-bit SRAM devices (SRAM1 and SRAM2) are connected to area 1. These devices are accessed in two states via a 16-bit bus. One 32-kword x 8-bit SRAM (SRAM3) is connected to area 2. This device is accessed via an 8-bit bus, using three-state access with an additional wait state inserted in pin auto-wait mode.
H'000000 EPROM H'07FFFF Not used H'1FFFFF H'200000 SRAM 1, 2 H'20FFFF H'210000 Not used H'3FFFFF H'400000 SRAM 3 H'407FFF Area 2 8-bit, three-state-access area (one auto-wait state) Not used H'5FFFFF Area 1 16-bit, two-state-access area Area 0 16-bit, three-state-access area
On-chip RAM H'FFFFFF Internal I/O registers
Figure 6.17 Memory Map (Example)
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Section 6 Bus Controller
EPROM A19 to A 1 A 18 to A 0 I/O 15 to I/O8 H8/3048B Group CS 0 CS 1 CS 2 SRAM1 (even addresses) A15 to A 1 A14 to A 0 I/O 7 to I/O 0 WAIT RD HWR LWR CS OE WE I/O 7 to I/O 0 CE OE
SRAM2 (odd addresses) A15 to A 1 A 14 to A 0 I/O 7 to I/O 0 CS OE WE
A 23 to A 0
D15 to D 8 D 7 to D 0 SRAM3 A14 to A 0 A 14 to A 0 I/O 7 to I/O 0 CS OE WE
Figure 6.18 Interconnections with Memory (Example)
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Section 6 Bus Controller
6.3.7
Bus Arbiter Operation
The bus controller has a built-in bus arbiter that arbitrates between different bus masters. There are four bus masters: the CPU, DMA controller (DMAC), refresh controller, and an external bus master. When a bus master has the bus right it can carry out read, write, or refresh access. Each bus master uses a bus request signal to request the bus right. At fixed times the bus arbiter determines priority and uses a bus acknowledge signal to grant the bus to a bus master, which can then operate using the bus. The bus arbiter checks whether the bus request signal from a bus master is active or inactive, and returns an acknowledge signal to the bus master if the bus request signal is active. When two or more bus masters request the bus, the highest-priority bus master receives an acknowledge signal. The bus master that receives an acknowledge signal can continue to use the bus until the acknowledge signal is deactivated. The bus master priority order is: (High) External bus master > refresh controller > DMAC > CPU (Low)
The bus arbiter samples the bus request signals and determines priority at all times, but it does not always grant the bus immediately, even when it receives a bus request from a bus master with higher priority than the current bus master. Each bus master has certain times at which it can release the bus to a higher-priority bus master. CPU The CPU is the lowest-priority bus master. If the DMAC, refresh controller, or an external bus master requests the bus while the CPU has the bus right, the bus arbiter transfers the bus right to the bus master that requested it. The bus right is transferred at the following times: * The bus right is transferred at the boundary of a bus cycle. If word data is accessed by two consecutive byte accesses, however, the bus right is not transferred between the two byte accesses. * If another bus master requests the bus while the CPU is performing internal operations, such as executing a multiply or divide instruction, the bus right is transferred immediately. The CPU continues its internal operations. * If another bus master requests the bus while the CPU is in sleep mode, the bus right is transferred immediately.
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Section 6 Bus Controller
DMAC When the DMAC receives an activation request, it requests the bus right from the bus arbiter. If the DMAC is bus master and the refresh controller or an external bus master requests the bus, the bus arbiter transfers the bus right from the DMAC to the bus master that requested the bus. The bus right is transferred at the following times. The bus right is transferred when the DMAC finishes transferring 1 byte or 1 word. A DMAC transfer cycle consists of a read cycle and a write cycle. The bus right is not transferred between the read cycle and the write cycle. There is a priority order among the DMAC channels. For details see section 8.4.9, DMAC Multiple-Channel Operation. Refresh Controller When a refresh cycle is requested, the refresh controller requests the bus right from the bus arbiter. When the refresh cycle is completed, the refresh controller releases the bus. For details see section 7, Refresh Controller. External Bus Master When the BRLE bit is set to 1 in BRCR, the bus can be released to an external bus master. The external bus master has highest priority, and requests the bus right from the bus arbiter by driving the BREQ signal low. Once the external bus master gets the bus, it keeps the bus right until the BREQ signal goes high. While the bus is released to an external bus master, the H8/3048B Group holds the address bus and data bus control signals (AS, RD, HWR, and LWR) in the highimpedance state, holds the chip select signals high (CSn: n = 7 to 0), and holds the BACK pin in the low output state. The bus arbiter samples the BREQ pin at the rise of the system clock (). If BREQ is low, the bus is released to the external bus master at the appropriate opportunity. The BREQ signal should be held low until the BACK signal goes low. When the BREQ pin is high in two consecutive samples, the BACK signal is driven high to end the bus-release cycle.
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Section 6 Bus Controller
Figure 6.19 shows the timing when the bus right is requested by an external bus master during a read cycle in a two-state-access area. There is a minimum interval of two states from when the BREQ signal goes low until the bus is released.
CPU cycles T1 Address bus CSn High-impedance Data bus High-impedance High-impedance Address High level T2 External bus released CPU cycles
AS , RD
High
HWR , LWR
High-impedance
BREQ
BACK Minimum 2 cycles 1 2 3 4 5 6
1 2 3 4, 5 6
Low BREQ signal is sampled at rise of T1 state. BACK signal goes low at end of CPU read cycle, releasing bus right to external bus master. BREQ pin continues to be sampled while bus is released to external bus master. High BREQ signal is sampled twice consecutively. BACK signal goes high, ending bus-release cycle.
Note: n = 7 to 0
Figure 6.19 External-Bus-Released State (Two-State-Access Area, During Read Cycle)
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Section 6 Bus Controller
6.4
6.4.1
Usage Notes
Connection to Dynamic RAM and Pseudo-Static RAM
A different bus control signal timing applies when dynamic RAM or pseudo-static RAM is connected to area 3. For details see section 7, Refresh Controller. 6.4.2 Register Write Timing
ABWCR, ASTCR, and WCER Write Timing Data written to ABWCR, ASTCR, or WCER takes effect starting from the next bus cycle. Figure 6.20 shows the timing when an instruction fetched from area 0 changes area 0 from three-state access to two-state access.
T1 Address bus 3-state access to area 0 ASTCR address T2 T3 T1 T2 T3 T1 T2
2-state access to area 0
Figure 6.20 ASTCR Write Timing
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Section 6 Bus Controller
DDR Write Timing Data written to a data direction register (DDR) to change a CSn pin from CSn output to generic input, or vice versa, takes effect starting from the T3 state of the DDR write cycle. Figure 6.21 shows the timing when the CS1 pin is changed from generic input to CS1 output.
T1 Address bus CS1 T2 T3
P8DDR address
High-impedance
Figure 6.21 DDR Write Timing BRCR Write Timing Data written to switch between A23, A22, or A21 output and generic input or output takes effect starting from the T3 state of the BRCR write cycle. Figure 6.22 shows the timing when a pin is changed from generic input to A23, A22, or A21 output.
T1 Address bus A 23 to A 21 T2 T3
BRCR address
High-impedance
Figure 6.22 BRCR Write Timing
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Section 6 Bus Controller
6.4.3
BREQ Input Timing
After driving the BREQ pin low, hold it low until BACK goes low. If BREQ returns to the high level before BACK goes low, the bus arbiter may operate incorrectly. To terminate the external-bus-released state, hold the BREQ signal high for at least three states. If BREQ is high for too short an interval, the bus arbiter may operate incorrectly. 6.4.4 Transition To Software Standby Mode
If contention occurs between a transition to software standby mode and a bus request from an external bus master, the bus may be released for one state just before the transition to software standby mode (see figure 6.23). When using software standby mode, clear the BRLE bit to 0 in BRCR before executing the SLEEP instruction.
Bus-released state BREQ BACK
Software standby mode
Address bus
Strobe
Figure 6.23 Contention between Bus-Released State and Software Standby Mode
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Section 7 Refresh Controller
Section 7 Refresh Controller
7.1 Overview
The H8/3048B Group has an on-chip refresh controller that enables direct connection of 16-bitwide DRAM or pseudo-static RAM (PSRAM). DRAM or pseudo-static RAM can be directly connected to area 3 of the external address space. A maximum 128 kbytes can be connected in modes 1, 2, and 5 (1-Mbyte modes). A maximum 2 Mbytes can be connected in modes 3, 4, and 6 (16-Mbyte modes). Systems that do not need to refresh DRAM or pseudo-static RAM can use the refresh controller as an 8-bit interval timer. When the refresh controller is not used, it can be independently halted to conserve power. For details see section 20.6, Module Standby Function. 7.1.1 Features
The refresh controller can be used for one of three functions: DRAM refresh control, pseudo-static RAM refresh control, or 8-bit interval timing. Features of the refresh controller are listed below. Features as a DRAM Refresh Controller: * Enables direct connection of 16-bit-wide DRAM * Selection of 2CAS or 2WE mode * Selection of 8-bit or 9-bit column address multiplexing for DRAM address input Examples: 1-Mbit DRAM: 8-bit row address x 8-bit column address 4-Mbit DRAM: 9-bit row address x 9-bit column address 4-Mbit DRAM: 10-bit row address x 8-bit column address * CAS-before-RAS refresh control * Software-selectable refresh interval * Software-selectable self-refresh mode * Wait states can be inserted
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Features as a Pseudo-Static RAM Refresh Controller: * RFSH signal output for refresh control * Software-selectable refresh interval * Software-selectable self-refresh mode * Wait states can be inserted Features as an Interval Timer: * Refresh timer counter (RTCNT) can be used as an 8-bit up-counter * Selection of seven counter clock sources: /2, /8, /32, /128, /512, /2048, /4096 * Interrupts can be generated by compare match between RTCNT and the refresh time constant register (RTCOR)
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7.1.2
Block Diagram
Figure 7.1 shows a block diagram of the refresh controller.
/2, /8, /32, /128, /512, /2048, /4096
Refresh signal
Clock selector Control logic Comparator CMI interrupt
RTMCSR
RFSHCR
RTCOR
RTCNT
Module data bus
Legend: RTCNT: RTCOR: RTMCSR: RFSHCR:
Refresh timer counter Refresh time constant register Refresh timer control/status register Refresh control register
Figure 7.1 Block Diagram of Refresh Controller
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Internal data bus
Bus interface
Section 7 Refresh Controller
7.1.3
Input/Output Pins
Table 7.1 summarizes the refresh controller's input/output pins. Table 7.1 Refresh Controller Pins
Signal Pin RFSH HWR LWR RD CS3 Name Refresh Upper write/upper column address strobe Lower write/lower column address strobe Column address strobe/ write enable Row address strobe Abbr. RFSH UW/UCAS LW/LCAS CAS/WE RAS I/O Output Output Output Output Output Function Goes low during refresh cycles; used to refresh DRAM and PSRAM Connects to the UW pin of 2WE DRAM or UCAS pin of 2CAS DRAM Connects to the LW pin of 2WE DRAM or LCAS pin of 2CAS DRAM Connects to the CAS pin of 2WE DRAM or WE pin of 2CAS DRAM Connects to the RAS pin of DRAM
7.1.4
Register Configuration
Table 7.2 summarizes the refresh controller's registers. Table 7.2
Address* H'FFAC H'FFAD H'FFAE H'FFAF Note: *
Refresh Controller Registers
Name Refresh control register Refresh timer control/status register Refresh timer counter Refresh time constant register Lower 16 bits of the address. Abbreviation RFSHCR RTMCSR RTCNT RTCOR R/W R/W R/W R/W R/W Initial Value H'02 H'07 H'00 H'FF
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7.2
7.2.1
Register Descriptions
Refresh Control Register (RFSHCR)
RFSHCR is an 8-bit readable/writable register that selects the operating mode of the refresh controller.
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 RFSHE 0 R/W 1 1 0 RCYCE 0 R/W
SRFMD PSRAME DRAME CAS/WE M9/M8
Refresh cycle enable Enables or disables insertion of refresh cycles Reserved bit Refresh pin enable Enables refresh signal output from the refresh pin Address multiplex mode select Selects the number of column address bits Strobe mode select Selects 2CAS or 2WE strobing of DRAM
PSRAM enable and DRAM enable These bits enable or disable connection of pseudo-static RAM and DRAM Self-refresh mode Selects self-refresh mode
RFSHCR is initialized to H'02 by a reset and in hardware standby mode.
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Bit 7--Self-Refresh Mode (SRFMD): Specifies DRAM or pseudo-static RAM self-refresh during software standby mode. When PSRAME = 1 and DRAME = 0, after the SRFMD bit is set to 1, pseudo-static RAM can be self-refreshed when the H8/3048B Group enters software standby mode. When PSRAME = 0 and DRAME = 1, after the SRFMD bit is set to 1, DRAM can be selfrefreshed when the H8/3048B Group enters software standby mode. In either case, the normal access state resumes on exit from software standby mode.
Bit 7: SRFMD 0 1 Description DRAM or PSRAM self-refresh is disabled in software standby mode (Initial value) DRAM or PSRAM self-refresh is enabled in software standby mode
Bit 6--PSRAM Enable (PSRAME) and Bit 5--DRAM Enable (DRAME): These bits enable or disable connection of pseudo-static RAM and DRAM to area 3 of the external address space. When DRAM or pseudo-static RAM is connected, the bus cycle and refresh cycle of area 3 consist of three states, regardless of the setting in the access state control register (ASTCR). If AST3 = 0 in ASTCR, wait states cannot be inserted. When the PSRAME or DRAME bit is set to 1, bits 0, 2, 3, and 4 in RFSHCR and registers RTMCSR, RTCNT, and RTCOR are write-disabled, except that the CMF flag in RTMCSR can be cleared by writing 0.
Bit 6: PSRAME 0 Bit 5: DRAME 0 1 1 0 1 Description Can be used as an interval timer DRAM can be directly connected PSRAM can be directly connected Illegal setting (Initial value) (DRAM and PSRAM cannot be directly connected)
Bit 4--Strobe Mode Select (CAS/WE Selects 2CAS or 2WE mode. The setting of this bit is WE): WE valid when PSRAME = 0 and DRAME = 1. This bit is write-disabled when the PSRAME or DRAME bit is set to 1.
Bit 4: CAS/WE WE 0 1 Description 2WE mode 2CAS mode (Initial value)
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Bit 3--Address Multiplex Mode Select (M9/M8 Selects 8-bit or 9-bit column addressing. M8): M8 The setting of this bit is valid when PSRAME = 0 and DRAME = 1. This bit is write-disabled when the PSRAME or DRAME bit is set to 1.
Bit 3: M9/M8 M8 0 1 Description 8-bit column address mode 9-bit column address mode (Initial value)
Bit 2--Refresh Pin Enable (RFSHE): Enables or disables refresh signal output from the RFSH pin. This bit is write-disabled when the PSRAME or DRAME bit is set to 1.
Bit 2: RFSHE 0 1 Description Refresh signal output at the RFSH pin is disabled (the RFSH pin can be used as a generic input/output port) (Initial value) Refresh signal output at the RFSH pin is enabled
Bit 1--Reserved: Read-only bit, always read as 1. Bit 0--Refresh Cycle Enable (RCYCE): Enables or disables insertion of refresh cycles. The setting of this bit is valid when PSRAME = 1 or DRAME = 1. When PSRAME = 0 and DRAME = 0, refresh cycles are not inserted regardless of the setting of this bit.
Bit 0: RCYCE 0 1 Description Refresh cycles are disabled Refresh cycles are enabled for area 3 (Initial value)
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7.2.2
Refresh Timer Control/Status Register (RTMCSR)
RTMCSR is an 8-bit readable/writable register that selects the clock source for RTCNT. It also enables or disables interrupt requests when the refresh controller is used as an interval timer.
Bit Initial value Read/Write 7 CMF 0 R/(W)* 6 CMIE 0 R/W 5 CKS2 0 R/W 4 CKS1 0 R/W 3 CKS0 0 R/W 2 1 1 1 Reserved bits 0 1
Clock select 2 to 0 These bits select an internal clock source for input to RTCNT
Compare match interrupt enable Enables or disables the CMI interrupt requested by CMF Compare match flag Status flag indicating that RTCNT has matched RTCOR Note: * Only 0 can be written, to clear the flag.
Bits 7 and 6 are initialized by a reset and in standby mode. Bits 5 to 3 are initialized by a reset and in hardware standby mode, but retain their previous values on transition to software standby mode. Bit 7--Compare Match Flag (CMF): This status flag indicates that the RTCNT and RTCOR values have matched.
Bit 7: CMF 0 1 Description [Clearing condition] Cleared by reading CMF when CMF = 1, then writing 0 in CMF [Setting condition] When RTCNT = RTCOR
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Bit 6--Compare Match Interrupt Enable (CMIE): Enables or disables the CMI interrupt requested when the CMF flag is set to 1 in RTMCSR. The CMIE bit is always cleared to 0 when PSRAME = 1 or DRAME = 1.
Bit 6: CMIE 0 1 Description The CMI interrupt requested by CMF is disabled The CMI interrupt requested by CMF is enabled (Initial value)
Bits 5 to 3--Clock Select 2 to 0 (CKS2 to CKS0): These bits select an internal clock source for input to RTCNT. When used for refresh control, the refresh controller outputs a refresh request at periodic intervals determined by compare match between RTCNT and RTCOR. When used as an interval timer, the refresh controller generates CMI interrupts at periodic intervals determined by compare match. These bits are write-disabled when the PSRAME bit or DRAME bit is set to 1.
Bit 5: CKS2 0 Bit 4: CKS1 0 1 1 0 1 Bit 3: CKS0 0 1 0 1 0 1 0 1 Description Clock input is disabled /2 clock source /8 clock source /32 clock source /128 clock source /512 clock source /2048 clock source /4096 clock source (Initial value)
Bits 2 to 0--Reserved: Read-only bits, always read as 1.
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7.2.3
Refresh Timer Counter (RTCNT)
RTCNT is an 8-bit readable/writable up-counter.
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
RTCNT is an up-counter that is incremented by an internal clock selected by bits CKS2 to CKS0 in RTMCSR. When RTCNT matches RTCOR (compare match), the CMF flag is set to 1 and RTCNT is cleared to H'00. RTCNT is write-disabled when the PSRAME bit or DRAME bit is set to 1. RTCNT is initialized to H'00 by a reset and in standby mode. 7.2.4 Refresh Time Constant Register (RTCOR)
RTCOR is an 8-bit readable/writable register that determines the interval at which RTCNT is compare matched.
Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W
RTCOR and RTCNT are constantly compared. When their values match, the CMF flag is set to 1 in RTMCSR, and RTCNT is simultaneously cleared to H'00. RTCOR is write-disabled when the PSRAME bit or DRAME bit is set to 1. RTCOR is initialized to H'FF by a reset and in hardware standby mode. In software standby mode it retains its previous value.
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7.3
7.3.1
Operation
Overview
One of three functions can be selected for the H8/3048B Group refresh controller: interfacing to DRAM connected to area 3, interfacing to pseudo-static RAM connected to area 3, or interval timing. Table 7.3 summarizes the register settings when these three functions are used. Table 7.3 Refresh Controller Settings
Usage Register Settings RFSHCR SRFMD PSRAME DRAME CAS/WE M9/M8 RFSHE RCYCE RTCOR RTMCSR CKS2 to CKS0 CMF CMIE P8DDR ABWCR P81DDR ABW3 DRAM Interface Selects self-refresh mode Cleared to 0 Set to 1 Selects 2CAS or 2WE mode Selects column addressing mode Selects RFSH signal output Selects insertion of refresh cycles Refresh interval setting Set to 1 when RTCNT = RTCOR Cleared to 0 Set to 1 (CS3 output) Cleared to 0 PSRAM Interface Selects self-refresh mode Set to 1 Cleared to 0 -- -- Selects RFSH signal output Selects insertion of refresh cycles Refresh interval setting Set to 1 when RTCNT = RTCOR Cleared to 0 Set to 1 (CS3 output) -- Interval Timer Cleared to 0 Cleared to 0 Cleared to 0 -- -- Cleared to 0 -- Interrupt interval setting Set to 1 when RTCNT = RTCOR Enables or disables interrupt requests Set to 0 or 1 --
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DRAM Interface To set up area 3 for connection to 16-bit-wide DRAM, initialize RTCOR, RTMCSR, and RFSHCR in that order, clearing bit PSRAME to 0 and setting bit DRAME to 1. Set bit P81DDR to 1 in the port 8 data direction register (P8DDR) to enable CS3 output. In ABWCR, make area 3 a 16-bit-access area. Pseudo-Static RAM Interface To set up area 3 for connection to pseudo-static RAM, initialize RTCOR, RTMCSR, and RFSHCR in that order, setting bit PSRAME to 1 and clearing bit DRAME to 0. Set bit P81DDR to 1 in P8DDR to enable CS3 output. Interval Timer When PSRAME = 0 and DRAME = 0, the refresh controller operates as an interval timer. After setting RTCOR, select an input clock in RTMCSR and set the CMIE bit to 1. CMI interrupts will be requested at compare match intervals determined by RTCOR and bits CKS2 to CKS0 in RTMCSR. When setting RTCOR, RTMCSR, and RFSHCR, make sure that PSRAME = 0 and DRAME = 0. Writing is disabled when either of these bits is set to 1.
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7.3.2
DRAM Refresh Control
Refresh Request Interval and Refresh Cycle Execution The refresh request interval is determined by the settings of RTCOR and bits CKS2 to CKS0 in RTMCSR. Figure 7.2 illustrates the refresh request interval.
RTCOR RTCNT
H'00 Refresh request
Figure 7.2 Refresh Request Interval (RCYCE = 1) Refresh requests are generated at regular intervals as shown in figure 7.2, but the refresh cycle is not actually executed until the refresh controller gets the bus right. Table 7.4 summarizes the relationship among area 3 settings, DRAM read/write cycles, and refresh cycles. Table 7.4 Area 3 Settings, DRAM Access Cycles, and Refresh Cycles
Read/Write Cycle by CPU or DMAC * * * * 3 states Wait states cannot be inserted 3 states Wait states can be inserted Refresh Cycle * * * * 3 states Wait states cannot be inserted 3 states Wait states can be inserted
Area 3 Settings 2-state-access area (AST3 = 0) 3-state-access area (AST3 = 1)
To insert refresh cycles, set the RCYCE bit to 1 in RFSHCR. Figure 7.3 shows the state transitions for execution of refresh cycles. When the first refresh request occurs after exit from the reset state or standby mode, the refresh controller does not execute a refresh cycle, but goes into the refresh request pending state. Note this point when using a DRAM that requires a refresh cycle for initialization.
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When a refresh request occurs in the refresh request pending state, the refresh controller acquires the bus right, then executes a refresh cycle. If another refresh request occurs during execution of the refresh cycle, it is ignored.
Exit from reset or standby mode
Refresh request Refresh request pending state End of refresh cycle*
Refresh request Refresh request* Requesting bus right
Bus granted Refresh request*
Executing refresh cycle
Note: * A refresh request is ignored if it occurs while the refresh controller is requesting the bus right or executing a refresh cycle.
Figure 7.3 State Transitions for Refresh Cycle Execution Address Multiplexing Address multiplexing depends on the setting of the M9/M8 bit in RFSHCR, as described in table 7.5. Figure 7.4 shows the address output timing. Address output is multiplexed only in area 3.
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Table 7.5
Address Multiplexing
A23 to A10 A23 to A10 A23 to A10 A23 to A10 A9 A9 A9 A18 A8 A8 A9 A17 A7 A7 A16 A16 A6 A6 A15 A15 A5 A5 A14 A14 A4 A4 A13 A13 A3 A3 A12 A12 A2 A2 A11 A11 A1 A1 A10 A10 A0 A0 A0 A0
Address Pins Address signals during row address output Address signals during column address output M9/M8 = 0 M9/M8 = 1
T1
T2
T3
A 23 to A 9 , A 0 Address bus A 8 to A 1 A 8 to A1 Row address a. M9/ M8 = 0
A 23 to A 9, A 0
A 16 to A 9 Column address
T1
T2
T3
A 23 to A10 , A 0 Address bus A 9 to A 1 A 9 to A1 Row address b. M9/ M8 = 1
A 23 to A10 , A 0
A 18 to A 10 Column address
Figure 7.4 Multiplexed Address Output (Example without Wait States)
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2CAS and 2WE Modes CAS WE The CAS/WE bit in RFSHCR can select two control modes for 16-bit-wide DRAM: one using UCAS and LCAS; the other using UW and LW. These DRAM pins correspond to H8/3048B Group pins as shown in table 7.6. Table 7.6 DRAM Pins and H8/3048B Group Pins
DRAM Pin H8/3048B Group Pin HWR LWR RD CS3 CAS/WE = 0 (2WE Mode) WE WE UW LW CAS RAS CAS/WE = 1 (2CAS Mode) WE CAS UCAS LCAS WE RAS
Figure 7.5 (1) shows the interface timing for 2WE DRAM. Figure 7.5 (2) shows the interface timing for 2CAS DRAM.
Read cycle Write cycle* Refresh cycle
Address bus CS 3 (RAS) RD (CAS) HWR (UW) LWR (LW) RFSH AS
Row
Column
Row
Column
Area 3 top address
Note: * 16-bit access
Figure 7.5(1) DRAM Control Signal Output Timing (2WE Mode) WE
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Read cycle
Write cycle*
Refresh cycle
Address bus CS 3 (RAS) HWR (UCAS) LWR (LCAS) RD (WE) RFSH AS Note: * 16-bit access
Row
Column
Row
Column
Area 3 top address
Figure 7.5(2) DRAM Control Signal Output Timing (2CAS Mode) CAS Refresh Cycle Priority Order When there are simultaneous bus requests, the priority order is: (High) External bus master > refresh controller > DMA controller > CPU (Low)
For details see section 6.3.7, Bus Arbiter Operation. Wait State Insertion When bit AST3 is set to 1 in ASTCR, bus controller settings can cause wait states to be inserted into bus cycles and refresh cycles. For details see section 6.3.5, Wait Modes.
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Self-Refresh Mode Some DRAM devices have a self-refresh function. After the SRFMD bit is set to 1 in RFSHCR, when a transition to software standby mode occurs, the CAS and RAS outputs go low in that order so that the DRAM self-refresh function can be used. On exit from software standby mode, the CAS and RAS outputs both go high. Table 7.7 shows the pin states in software standby mode. Figure 7.6 shows the signal output timing. Table 7.7 Pin States in Software Standby Mode (1) (PSRAME = 0, DRAME = 1)
Software Standby Mode SRFMD = 0 Signal HWR LWR RD CS3 RFSH CAS/WE = 0 WE High-impedance High-impedance High-impedance High High CAS/WE = 1 WE High-impedance High-impedance High-impedance High High SRFMD = 1 (self-refresh mode) CAS/WE = 0 WE High High Low Low Low CAS/WE = 1 WE Low Low High Low Low
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Software standby mode Address bus CS 3 (RAS) RD (CAS) HWR (UW) LWR (LW) RFSH High High-impedance
Oscillator settling time
High
a. 2WE mode (SRFMD = 1) Software standby mode Address bus CS 3 (RAS) HWR (UCAS) LWR (LCAS) RD (WE) RFSH b. 2CAS mode (SRFMD = 1) High-impedance Oscillator settling time
Figure 7.6 Signal Output Timing in Self-Refresh Mode (PSRAME = 0, DRAME = 1)
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Operation in Power-Down State The refresh controller operates in sleep mode. It does not operate in hardware standby mode. In software standby mode RTCNT is initialized, but RFSHCR, RTMCSR bits 5 to 3, and RTCOR retain their settings prior to the transition to software standby mode. Example 1: Connection to 2WE 1-Mbit DRAM (1-Mbyte Mode) WE Figure 7.7 shows typical interconnections to a 2WE 1-Mbit DRAM, and the corresponding address map. Figure 7.8 shows a setup procedure to be followed by a program for this example. After power-up the DRAM must be refreshed to initialize its internal state. Initialization takes a certain length of time, which can be measured by using an interrupt from another timer module, or by counting the number of times RTMCSR bit 7 (CMF) is set. Note that no refresh cycle is executed for the first refresh request after exit from the reset state or standby mode (the first time the CMF flag is set; see figure 7.3). When using this example, check the DRAM device characteristics carefully and use a procedure that fits them.
2WE 1-Mbit DRAM with x 16-bit organization H8/3048B Group A8 A7 A6 A5 A4 A3 A2 A1 CS 3 RD HWR LWR D15 to D 0 a. Interconnections (example) A7 A6 A5 A4 A3 A2 A1 A0 RAS CAS UW LW OE I/O 15 to I/O 0
H'60000 DRAM area H'7FFFF b. Address map Area 3 (1-Mbyte mode)
Figure 7.7 Interconnections and Address Map for 2WE 1-Mbit DRAM (Example) WE
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Set area 3 for 16-bit access
Set P81 DDR to 1 for CS3 output
Set RTCOR
Set bits CKS2 to CKS0 in RTMCSR
Write H'23 in RFSHCR
Wait for DRAM to be initialized
DRAM can be accessed
Figure 7.8 Setup Procedure for 2WE 1-Mbit DRAM (1-Mbyte Mode) WE
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Example 2: Connection to 2WE 4-Mbit DRAM (16-Mbyte Mode) WE Figure 7.9 shows typical interconnections to a single 2WE 4-Mbit DRAM, and the corresponding address map. Figure 7.10 shows a setup procedure to be followed by a program for this example. The DRAM in this example has 10-bit row addresses and 8-bit column addresses. Its address area is H'600000 to H'67FFFF.
2WE 4-Mbit DRAM with 10-bit row address, 8-bit column address, and x 16-bit organization H8/3048B Group
A18 A17 A8 A7 A6 A5 A4 A3 A2 A1 CS 3 RD HWR LWR
A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 RAS CAS UW LW OE I/O 15 to I/O 0
D15 to D 0
a. Interconnections (example)
H'600000 DRAM area H'67FFFF H'680000 Area 3 (16-Mbyte mode) Not used
H'7FFFFF b. Address map
Figure 7.9 Interconnections and Address Map for 2WE 4-Mbit DRAM (Example) WE
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Set area 3 for 16-bit access
Set P81 DDR to 1 for CS3 output
Set RTCOR
Set bits CKS2 to CKS0 in RTMCSR
Write H'23 in RFSHCR
Wait for DRAM to be initialized
DRAM can be accessed
Figure 7.10 Setup Procedure for 2WE 4-Mbit DRAM with 10-Bit Row Address and 8-Bit WE Column Address (16-Mbyte Mode)
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Example 3: Connection to 2CAS 4-Mbit DRAM (16-Mbyte Mode) CAS Figure 7.11 shows typical interconnections to a single 2CAS 4-Mbit DRAM, and the corresponding address map. Figure 7.12 shows a setup procedure to be followed by a program for this example. The DRAM in this example has 9-bit row addresses and 9-bit column addresses. Its address area is H'600000 to H'67FFFF.
2CAS 4-Mbit DRAM with 9-bit row address, 9-bit column address, and x 16-bit organization H8/3048B Group A9 A8 A7 A6 A5 A4 A3 A2 A1 CS 3 HWR LWR RD D15 to D 0 A8 A7 A6 A5 A4 A3 A2 A1 A0 RAS UCAS LCAS WE OE I/O 15 to I/O 0
a. Interconnections (example) H'600000 DRAM area H'67FFFF H'680000
Not used
Area 3 (16-Mbyte mode)
H'7FFFFF
b. Address map
Figure 7.11 Interconnections and Address Map for 2CAS 4-Mbit DRAM (Example) CAS
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Set area 3 for 16-bit access
Set P81 DDR to 1 for CS3 output
Set RTCOR
Set bits CKS2 to CKS0 in RTMCSR
Write H'3B in RFSHCR
Wait for DRAM to be initialized
DRAM can be accessed
Figure 7.12 Setup Procedure for 2CAS 4-Mbit DRAM with 9-Bit Row Address and 9-Bit CAS Column Address (16-Mbyte Mode) Example 4: Connection to Multiple 4-Mbit DRAM Chips (16-Mbyte Mode) Figure 7.13 shows an example of interconnections to two 2CAS 4-Mbit DRAM chips, and the corresponding address map. Up to four DRAM chips can be connected to area 3 by decoding upper address bits A19 and A20. Figure 7.14 shows a setup procedure to be followed by a program for this example. The DRAM in this example has 9-bit row addresses and 9-bit column addresses. Both chips must be refreshed simultaneously, so the RFSH pin must be used.
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2CAS 4-Mbit DRAM with 9-bit row address, 9-bit column address, and x 16-bit organization H8/3048B Group A19 A 9 to A 1 A 8 to A 0 RAS UCAS LCAS WE OE I/O15 to I/O 0
No. 1
A 8 to A 0 CS 3 HWR LWR RD RFSH D15 to D 0 a. Interconnections (example) H'600000 H'67FFFF H'680000 H'6FFFFF H'700000 No. 1 DRAM area No. 2 DRAM area Area 3 (16-Mbyte mode) Not used H'7FFFFF b. Address map RAS UCAS LCAS WE OE I/O15 to I/O 0 No. 2
Figure 7.13 Interconnections and Address Map for Multiple 2CAS 4-Mbit DRAM Chips CAS (Example)
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Set area 3 for 16-bit access
Set P81 DDR to 1 for CS 3 output
Set RTCOR
Set bits CKS2 to CKS0 in RTMCSR
Write H'3F in RFSHCR
Wait for DRAM to be initialized
DRAM can be accessed
Figure 7.14 Setup Procedure for Multiple 2CAS 4-Mbit DRAM Chips with 9-Bit Row CAS Address and 9-Bit Column Address (16-Mbyte Mode) 7.3.3 Pseudo-Static RAM Refresh Control
Refresh Request Interval and Refresh Cycle Execution The refresh request interval is determined as in a DRAM interface, by the settings of RTCOR and bits CKS2 to CKS0 in RTMCSR. The numbers of states required for pseudo-static RAM read/write cycles and refresh cycles are the same as for DRAM (see table 7.4). The state transitions are as shown in figure 7.3.
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Pseudo-Static RAM Control Signals Figure 7.15 shows the control signals for pseudo-static RAM read, write, and refresh cycles.
Read cycle Address bus CS 3 RD HWR LWR RFSH AS Area 3 top address Write cycle * Refresh cycle
Note: * 16-bit access
Figure 7.15 Pseudo-Static RAM Control Signal Output Timing Refresh Cycle Priority Order When there are simultaneous bus requests, the priority order is: (High) External bus master > refresh controller > DMA controller > CPU (Low)
For details see section 6.3.7, Bus Arbiter Operation. Wait State Insertion When bit AST3 is set to 1 in ASTCR, the wait state controller (WSC) can insert wait states into bus cycles and refresh cycles. For details see section 6.3.5, Wait Modes.
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Section 7 Refresh Controller
Self-Refresh Mode Some pseudo-static RAM devices have a self-refresh function. After the SRFMD bit is set to 1 in RFSHCR, when a transition to software standby mode occurs, the H8/3048B Group's CS3 output goes high and its RFSH output goes low so that the pseudo-static RAM self-refresh function can be used. On exit from software standby mode, the RFSH output goes high. Table 7.8 shows the pin states in software standby mode. Figure 7.16 shows the signal output timing. Table 7.8 Pin States in Software Standby Mode (2) (PSRAME = 1, DRAME = 0)
Software Standby Mode Signal CS3 RD HWR LWR RFSH SRFMD = 0 High High-impedance High-impedance High-impedance High SRFMD = 1 (Self-Refresh Mode) High High-impedance High-impedance High-impedance Low
Software standby mode Address bus CS3 RD HWR LWR RFSH High High-impedance High-impedance High-impedance High-impedance
Oscillator settling time
Figure 7.16 Signal Output Timing in Self-Refresh Mode (PSRAME = 1, DRAME = 0)
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Section 7 Refresh Controller
Operation in Power-Down State The refresh controller operates in sleep mode. It does not operate in hardware standby mode. In software standby mode RTCNT is initialized, but RFSHCR, RTMCSR bits 5 to 3, and RTCOR retain their settings prior to the transition to software standby mode. Example Pseudo-static RAM may have separate OE and RFSH pins, or these may be combined into a single OE/RFSH pin. Figure 7.17 shows an example of a circuit for generating an OE/RFSH signal. Check the device characteristics carefully, and design a circuit that fits them. Figure 7.18 shows a setup procedure to be followed by a program.
H8/3048B Group RD
PSRAM
OE/RFSH RFSH
Figure 7.17 Interconnection to Pseudo-Static RAM with OE RFSH Signal (Example) OE/RFSH
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Section 7 Refresh Controller
Set P81 DDR to 1 for CS 3 output
Set RTCOR
Set bits CKS2 to CKS0 in RTMCSR
Write H'47 in RFSHCR
Wait for PSRAM to be initialized
PSRAM can be accessed
Figure 7.18 Setup Procedure for Pseudo-Static RAM
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Section 7 Refresh Controller
7.3.4
Interval Timer
To use the refresh controller as an interval timer, clear the PSRAME and DRAME both to 0. After setting RTCOR, select a clock source with bits CKS2 to CKS0 in RTMCSR, and set the CMIE bit to 1. Timing of Setting of Compare Match Flag and Clearing by Compare Match The CMF flag in RTCSR is set to 1 by a compare match signal output when the RTCOR and RTCNT values match. The compare match signal is generated in the last state in which the values match (when RTCNT is updated from the matching value to a new value). Accordingly, when RTCNT and RTCOR match, the compare match signal is not generated until the next counter clock pulse. Figure 7.19 shows the timing.
RTCNT N H'00
RTCOR Compare match signal CMF flag
N
Figure 7.19 Timing of Setting of CMF Flag Operation in Power-Down State The interval timer function operates in sleep mode. It does not operate in hardware standby mode. In software standby mode RTCNT and RTMCSR bits 7 and 6 are initialized, but RTMCSR bits 5 to 3 and RTCOR retain their settings prior to the transition to software standby mode.
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Section 7 Refresh Controller
Contention between RTCNT Write and Counter Clear If a counter clear signal occurs in the T3 state of an RTCNT write cycle, clearing of the counter takes priority and the write is not performed. See figure 7.20.
RTCNT write cycle by CPU T1 T2 T3
Address bus
RTCNT address
Internal write signal Counter clear signal
RTCNT
N
H'00
Figure 7.20 Contention between RTCNT Write and Clear
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Section 7 Refresh Controller
Contention between RTCNT Write and Increment If an increment pulse occurs in the T3 state of an RTCNT write cycle, writing takes priority and RTCNT is not incremented. See figure 7.21.
RTCNT write cycle by CPU T1 T2 T3
Address bus
RTCNT address
Internal write signal RTCNT input clock
RTCNT
N
M
Counter write data
Figure 7.21 Contention between RTCNT Write and Increment
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Section 7 Refresh Controller
Contention between RTCOR Write and Compare Match If a compare match occurs in the T3 state of an RTCOR write cycle, writing takes priority and the compare match signal is inhibited. See figure 7.22.
RTCOR write cycle by CPU T1 T2 T3
Address bus
RTCNT address
Internal write signal
RTCNT
N
N+1
RTCOR
N
M RTCOR write data
Compare match signal Inhibited
Figure 7.22 Contention between RTCOR Write and Compare Match RTCNT Operation at Internal Clock Source Switchover Switching internal clock sources may cause RTCNT to increment, depending on the switchover timing. Table 7.9 shows the relation between the time of the switchover (by writing to bits CKS2 to CKS0) and the operation of RTCNT. The RTCNT input clock is generated from the internal clock source by detecting the falling edge of the internal clock. If a switchover is made from a high clock source to a low clock source, as in case No. 3 in table 7.9, the switchover will be regarded as a falling edge, an RTCNT clock pulse will be generated, and RTCNT will be incremented.
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Section 7 Refresh Controller
Table 7.9
No. 1
Internal Clock Switchover and RTCNT Operation
RTCNT Operation
1
CKS2 to CKS0 Write Timing Low low switchover*
Old clock source New clock source RTCNT clock
RTCNT
N CKS bits rewritten
N+1
2
Low high switchover*
2
Old clock source New clock source RTCNT clock
RTCNT
N
N+1
N+2
CKS bits rewritten
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Section 7 Refresh Controller CKS2 to CKS0 Write Timing High low switchover*
3
No. 3
RTCNT Operation
Old clock source New clock source RTCNT clock *4
RTCNT
N
N+1 CKS bits rewritten
N+2
4
High high switchover*
4
Old clock source New clock source RTCNT clock
RTCNT
N
N+1
N+2 CKS bits rewritten
Notes: 1. Including switchovers from a low clock source to the halted state, and from the halted state to a low clock source. 2. Including switchover from the halted state to a high clock source. 3. Including switchover from a high clock source to the halted state. 4. The switchover is regarded as a falling edge, causing RTCNT to increment.
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Section 7 Refresh Controller
7.4
Interrupt Source
Compare match interrupts (CMI) can be generated when the refresh controller is used as an interval timer. Compare match interrupt requests are masked/unmasked with the CMIE bit of RTMCSR.
7.5
Usage Notes
When using the DRAM or pseudo-static RAM refresh function, note the following points: * With the refresh controller, if directly connected DRAM or PSRAM is disconnected*, the P80/RFSH/IRQ0 pin and the P81/CS3/IRQ1 pin may both become low-level outputs simultaneously. Note: * When the DRAM enable bit (DRAME) or PSRAM enable bit (PSRAME) in the refresh control register (RFSHCR) is cleared to 0 after being set to 1.
Address bus P80/RFSH/IRQ0 P81/CS3/IRQ1
Area 3 start address
Figure 7.23 Operation when DRAM/PSRAM Connection Is Switched * Refresh cycles are not executed while the bus is released, during software standby mode, and when a bus cycle is greatly prolonged by insertion of wait states. When these conditions occur, other means of refreshing are required. * If refresh requests occur while the bus is released, the first request is held and one refresh cycle is executed after the bus-released state ends. Figure 7.24 shows the bus cycles in this case.
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Section 7 Refresh Controller
Bus-released state RFSH Refresh request BACK
Refresh cycle
CPU cycle
Refresh cycle
Figure 7.24 Refresh Cycles when Bus Is Released * If a bus cycle is prolonged by insertion of wait states, the first refresh request is held, as in the bus-released state. * If there is contention with a bus request from an external bus master when making a transition to software standby mode, a one-state bus-released state may occur immediately before the transition to software standby mode (see figure 7.25). When using software standby mode, clear the BRLE bit to 0 in BRCR before executing the SLEEP instruction. When making a transition to self-refresh mode, the strobe waveform output may not be guaranteed due to the same kind of contention. This, too, can be prevented by clearing the BRLE bit to 0 in BRCR.
External bus released state
Software standby mode
BREQ
BACK Address bus Strobe
Figure 7.25 Contention between Bus-Released State and Software Standby Mode
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Section 7 Refresh Controller
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Section 8 DMA Controller
Section 8 DMA Controller
8.1 Overview
The H8/3048B Group has an on-chip DMA controller (DMAC) that can transfer data on up to four channels. When the DMA controller is not used, it can be independently halted to conserve power. For details see section 20.6, Module Standby Function. 8.1.1 Features
DMAC features are listed below. * Selection of short address mode or full address mode Short address mode: 8-bit source address and 24-bit destination address, or vice versa Maximum four channels available Selection of I/O mode, idle mode, or repeat mode Full address mode: 24-bit source and destination addresses Maximum two channels available Selection of normal mode or block transfer mode * Directly addressable 16-Mbyte address space * Selection of byte or word transfer * Activation by internal interrupts, external requests, or auto-request (depending on transfer mode) 16-bit integrated timer unit (ITU) compare match/input capture interrupts (four) Serial communication interface (SCI channel 0) transmit-data-empty/receive-data-full interrupts External requests Auto-request
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Section 8 DMA Controller
8.1.2
Block Diagram
Figure 8.1 shows a DMAC block diagram.
Internal address bus
Internal interrupts
IMIA0 IMIA1 IMIA2 IMIA3 TXI0 RXI0 DREQ0 DREQ1 TEND0 TEND1 Control logic Channel 0
Address buffer Arithmetic-logic unit MAR0A Channel 0A IOAR0A
Module data bus
ETCR0A MAR0B Channel 0B IOAR0B ETCR0B MAR1A Channel 1A IOAR1A ETCR1A MAR1B Channel 1B IOAR1B ETCR1B
DTCR0A Interrupt DEND0A signals DEND0B DEND1A DEND1B DTCR0B DTCR1A DTCR1B Channel 1
Data buffer
Internal data bus Legend: DTCR: Data transfer control register MAR: Memory address register IOAR: I/O address register ETCR: Execute transfer count register
Figure 8.1 Block Diagram of DMAC
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Section 8 DMA Controller
8.1.3
Functional Overview
Table 8.1 gives an overview of the DMAC functions. Table 8.1 DMAC Functional Overview
Address Reg. Length Transfer Mode Short address mode I/O mode * * * Transfers one byte or one word per request Increments or decrements the memory address by 1 or 2 Executes 1 to 65,536 transfers * * Activation * Compare match/ input capture A interrupts from ITU channels 0 to 3 Transmit-data-empty interrupt from SCI channel 0 Receive-data-full interrupt from SCI channel 0 External request 8 24 Source 24 Destination 8
Idle mode * * * Transfers one byte or one word per request Holds the memory address fixed Executes 1 to 65,536 transfers
*
24
8
Repeat mode * * * Transfers one byte or one word per request Increments or decrements the memory address by 1 or 2 Executes a specified number (1 to 255) of transfers, then returns to the initial state and continues
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Section 8 DMA Controller Address Reg. Length Transfer Mode Full address mode Normal mode * Auto-request Retains the transfer request internally Executes a specified number (1 to 65,536) of transfers continuously Selection of burst mode or cycle-steal mode * External request Transfers one byte or one word per request Executes 1 to 65,536 transfers Block transfer * * * Transfers one block of a specified size per request Executes 1 to 65,536 transfers Allows either the source or destination to be a fixed block area Block size can be 1 to 255 bytes or words * * Compare match/ input capture A interrupts from ITU channels 0 to 3 External request 24 24 Activation * * Auto-request External request Source 24 Destination 24
*
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Section 8 DMA Controller
8.1.4
Input/Output Pins
Table 8.2 lists the DMAC pins. Table 8.2
Channel 0 1
DMAC Pins
Name DMA request 0 Transfer end 0 DMA request 1 Transfer end 1 Abbreviation DREQ0 TEND0 DREQ1 TEND1 Input/ Output Input Output Input Output Function External request for DMAC channel 0 Transfer end on DMAC channel 0 External request for DMAC channel 1 Transfer end on DMAC channel 1
Note: External requests cannot be made to channel A in short address mode.
8.1.5
Register Configuration
Table 8.3 lists the DMAC registers.
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Section 8 DMA Controller
Table 8.3
Channel 0
DMAC Registers
Address* H'FF20 H'FF21 H'FF22 H'FF23 H'FF26 H'FF24 H'FF25 H'FF27 H'FF28 H'FF29 H'FF2A H'FF2B H'FF2E H'FF2C H'FF2D H'FF2F Name Memory address register 0AR Memory address register 0AE Memory address register 0AH Memory address register 0AL I/O address register 0A Execute transfer count register 0AH Execute transfer count register 0AL Data transfer control register 0A Memory address register 0BR Memory address register 0BE Memory address register 0BH Memory address register 0BL I/O address register 0B Execute transfer count register 0BH Execute transfer count register 0BL Data transfer control register 0B Memory address register 1AR Memory address register 1AE Memory address register 1AH Memory address register 1AL I/O address register 1A Execute transfer count register 1AH Execute transfer count register 1AL Data transfer control register 1A Memory address register 1BR Memory address register 1BE Memory address register 1BH Memory address register 1BL I/O address register 1B Execute transfer count register 1BH Execute transfer count register 1BL Data transfer control register 1B Abbreviation MAR0AR MAR0AE MAR0AH MAR0AL IOAR0A ETCR0AH ETCR0AL DTCR0A MAR0BR MAR0BE MAR0BH MAR0BL IOAR0B ETCR0BH ETCR0BL DTCR0B MAR1AR MAR1AE MAR1AH MAR1AL IOAR1A ETCR1AH ETCR1AL DTCR1A MAR1BR MAR1BE MAR1BH MAR1BL IOAR1B ETCR1BH ETCR1BL DTCR1B R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Initial Value H'FF Undetermined Undetermined Undetermined Undetermined Undetermined Undetermined H'00 H'FF Undetermined Undetermined Undetermined Undetermined Undetermined Undetermined H'00 H'FF Undetermined Undetermined Undetermined Undetermined Undetermined Undetermined H'00 H'FF Undetermined Undetermined Undetermined Undetermined Undetermined Undetermined H'00
1
H'FF30 H'FF31 H'FF32 H'FF33 H'FF36 H'FF34 H'FF35 H'FF37 H'FF38 H'FF39 H'FF3A H'FF3B H'FF3E H'FF3C H'FF3D H'FF3F
Note:
*
The lower 16 bits of the address are indicated.
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Section 8 DMA Controller
8.2
Register Descriptions (Short Address Mode)
In short address mode, transfers can be carried out independently on channels A and B. Short address mode is selected by bits DTS2A and DTS1A in data transfer control register A (DTCRA) as indicated in table 8.4. Table 8.4
Channel 0
Selection of Short and Full Address Modes
Bit 2: DTS2A 1 Bit 1: DTS1A 1 Description DMAC channel 0 operates as one channel in full address mode DMAC channels 0A and 0B operate as two independent channels in short address mode DMAC channel 1 operates as one channel in full address mode DMAC channels 1A and 1B operate as two independent channels in short address mode
Other than above 1 1 1
Other than above
8.2.1
Memory Address Registers (MAR)
A memory address register (MAR) is a 32-bit readable/writable register that specifies a source or destination address. The transfer direction is determined automatically from the activation source. An MAR consists of four 8-bit registers designated MARR, MARE, MARH, and MARL. All bits of MARR are reserved: they cannot be modified and are always read as 1.
Bit 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value Read/Write
1
1
1
1
1
1
1
1
Undetermined
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W MARR MARE MARH MARL
Source or destination address
An MAR functions as a source or destination address register depending on how the DMAC is activated: as a destination address register if activation is by a receive-data-full interrupt from the serial communication interface (SCI) (channel 0), and as a source address register otherwise.
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Section 8 DMA Controller
The MAR value is incremented or decremented each time one byte or word is transferred, automatically updating the source or destination memory address. For details, see section 8.2.4, Data Transfer Control Registers (DTCR). The MARs are not initialized by a reset or in standby mode. 8.2.2 I/O Address Registers (IOAR)
An I/O address register (IOAR) is an 8-bit readable/writable register that specifies a source or destination address. The IOAR value is the lower 8 bits of the address. The upper 16 address bits are all 1 (H'FFFF).
Bit Initial value Read/Write R/W R/W R/W 7 6 5 4 3 2 1 0
Undetermined R/W R/W R/W R/W R/W
Source or destination address
An IOAR functions as a source or destination address register depending on how the DMAC is activated: as a source address register if activation is by a receive-data-full interrupt from the SCI (channel 0), and as a destination address register otherwise. The IOAR value is held fixed. It is not incremented or decremented when a transfer is executed. The IOARs are not initialized by a reset or in standby mode. 8.2.3 Execute Transfer Count Registers (ETCR)
An execute transfer count register (ETCR) is a 16-bit readable/writable register that specifies the number of transfers to be executed. These registers function in one way in I/O mode and idle mode, and another way in repeat mode.
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Section 8 DMA Controller
I/O mode and idle mode
Bit Initial value Read/Write 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Undetermined R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Transfer counter
In I/O mode and idle mode, ETCR functions as a 16-bit counter. The count is decremented by 1 each time one transfer is executed. The transfer ends when the count reaches H'0000. Repeat mode
Bit Initial value Read/Write R/W R/W R/W 7 6 5 4 3 2 1 0
Undetermined R/W R/W R/W R/W R/W
ETCRH Transfer counter Bit Initial value Read/Write R/W R/W R/W 7 6 5 4 3 2 1 0
Undetermined R/W R/W R/W R/W R/W
ETCRL Initial count
In repeat mode, ETCRH functions as an 8-bit transfer counter and ETCRL holds the initial transfer count. ETCRH is decremented by 1 each time one transfer is executed. When ETCRH reaches H'00, the value in ETCRL is reloaded into ETCRH and the same operation is repeated. The ETCRs are not initialized by a reset or in standby mode.
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Section 8 DMA Controller
8.2.4
Data Transfer Control Registers (DTCR)
A data transfer control register (DTCR) is an 8-bit readable/writable register that controls the operation of one DMAC channel.
Bit Initial value Read/Write 7 DTE 0 R/W 6 DTSZ 0 R/W 5 DTID 0 R/W 4 RPE 0 R/W 3 DTIE 0 R/W 2 DTS2 0 R/W 1 DTS1 0 R/W 0 DTS0 0 R/W
Data transfer enable Enables or disables data transfer Data transfer size Selects byte or word size Data transfer increment/decrement Selects whether to increment or decrement the memory address register Repeat enable Selects repeat mode
Data transfer select These bits select the data transfer activation source Data transfer interrupt enable Enables or disables the CPU interrupt at the end of the transfer
The DTCRs are initialized to H'00 by a reset and in standby mode. Bit 7--Data Transfer Enable (DTE): Enables or disables data transfer on a channel. When the DTE bit is set to 1, the channel waits for a transfer to be requested, and executes the transfer when activated as specified by bits DTS2 to DTS0. When DTE is 0, the channel is disabled and does not accept transfer requests. DTE is set to 1 by reading the register when DTE is 0, then writing 1.
Bit 7: DTE 0 1 Description Data transfer is disabled. In I/O mode or idle mode, DTE is cleared to 0 when the specified number of transfers have been completed. (Initial value) Data transfer is enabled
If DTIE is set to 1, a CPU interrupt is requested when DTE is cleared to 0.
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Section 8 DMA Controller
Bit 6--Data Transfer Size (DTSZ): Selects the data size of each transfer.
Bit 6: DTSZ 0 1 Description Byte-size transfer Word-size transfer (Initial value)
Bit 5--Data Transfer Increment/Decrement (DTID): Selects whether to increment or decrement the memory address register (MAR) after a data transfer in I/O mode or repeat mode.
Bit 5: DTID 0 Description MAR is incremented after each data transfer * * 1 * * If DTSZ = 0, MAR is incremented by 1 after each transfer If DTSZ = 1, MAR is incremented by 2 after each transfer If DTSZ = 0, MAR is decremented by 1 after each transfer If DTSZ = 1, MAR is decremented by 2 after each transfer
MAR is decremented after each data transfer
MAR is not incremented or decremented in idle mode. Bit 4--Repeat Enable (RPE): Selects whether to transfer data in I/O mode, idle mode, or repeat mode.
Bit 4: RPE 0 1 Bit 3: DTIE 0 1 0 1 Repeat mode Idle mode Description I/O mode (Initial value)
Operations in these modes are described in sections 8.4.2, I/O Mode, 8.4.3, Idle Mode, and 8.4.4, Repeat Mode. Bit 3--Data Transfer Interrupt Enable (DTIE): Enables or disables the CPU interrupt (DEND) requested when the DTE bit is cleared to 0.
Bit 3: DTIE 0 1 Description The DEND interrupt requested by DTE is disabled The DEND interrupt requested by DTE is enabled (Initial value)
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Section 8 DMA Controller
Bits 2 to 0--Data Transfer Select (DTS2, DTS1, DTS0): These bits select the data transfer activation source. Some of the selectable sources differ between channels A and B.* Note: * Refer to section 8.3.4, Data Transfer Control Registers (DTCR).
Bit 2: DTS2 0 Bit 1: DTS1 0 Bit 0: DTS0 0 1 1 0 1 1 0 1 0 1 0 1 Description Compare match/input capture A interrupt from ITU channel 0 (Initial value) Compare match/input capture A interrupt from ITU channel 1 Compare match/input capture A interrupt from ITU channel 2 Compare match/input capture A interrupt from ITU channel 3 Transmit-data-empty interrupt from SCI channel 0 Receive-data-full interrupt from SCI channel 0 Falling edge of DREQ input (channel B) Transfer in full address mode (channel A) Low level of DREQ input (channel B) Transfer in full address mode (channel A)
The same internal interrupt can be selected as an activation source for two or more channels at once. In that case the channels are activated in a priority order, highest-priority channel first. For the priority order, see section 8.4.9, DMAC Multiple-Channel Operation. When a channel is enabled (DTE = 1), its selected DMAC activation source cannot generate a CPU interrupt.
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Section 8 DMA Controller
8.3
Register Descriptions (Full Address Mode)
In full address mode the A and B channels operate together. Full address mode is selected as indicated in table 8.4. 8.3.1 Memory Address Registers (MAR)
A memory address register (MAR) is a 32-bit readable/writable register. MARA functions as the source address register of the transfer, and MARB as the destination address register. An MAR consists of four 8-bit registers designated MARR, MARE, MARH, and MARL. All bits of MARR are reserved: they cannot be modified and are always read as 1.
Bit 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value Read/Write
1
1
1
1
1
1
1
1
Undetermined
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W MARR MARE MARH MARL
Source or destination address
The MAR value is incremented or decremented each time one byte or word is transferred, automatically updating the source or destination memory address. For details, see section 8.3.4, Data Transfer Control Registers (DTCR). The MARs are not initialized by a reset or in standby mode. 8.3.2 I/O Address Registers (IOAR)
The I/O address registers (IOARs) are not used in full address mode.
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Section 8 DMA Controller
8.3.3
Execute Transfer Count Registers (ETCR)
An execute transfer count register (ETCR) is a 16-bit readable/writable register that specifies the number of transfers to be executed. The functions of these registers differ between normal mode and block transfer mode. Normal mode ETCRA:
Bit Initial value Read/Write 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Undetermined R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Block transfer counter
ETCRB: Is not used in normal mode. In normal mode ETCRA functions as a 16-bit transfer counter. The count is decremented by 1 each time one transfer is executed. The transfer ends when the count reaches H'0000. ETCRB is not used.
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Section 8 DMA Controller
Block transfer mode ETCRA:
Bit Initial value Read/Write R/W R/W R/W 7 6 5 4 3 2 1 0
Undetermined R/W R/W R/W R/W R/W
ETCRAH Block size counter Bit Initial value Read/Write R/W R/W R/W 7 6 5 4 3 2 1 0
Undetermined R/W R/W R/W R/W R/W
ETCRAL Initial block size
ETCRB:
Bit Initial value Read/Write 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Undetermined R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Block transfer counter
In block transfer mode, ETCRAH functions as an 8-bit block size counter. ETCRAL holds the initial block size. ETCRAH is decremented by 1 each time one byte or word is transferred. When the count reaches H'00, ETCRAH is reloaded from ETCRAL. Blocks consisting of an arbitrary number of bytes or words can be transferred repeatedly by setting the same initial block size value in ETCRAH and ETCRAL. In block transfer mode ETCRB functions as a 16-bit block transfer counter. ETCRB is decremented by 1 each time one block is transferred. The transfer ends when the count reaches H'0000. The ETCRs are not initialized by a reset or in standby mode.
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Section 8 DMA Controller
8.3.4
Data Transfer Control Registers (DTCR)
The data transfer control registers (DTCRs) are 8-bit readable/writable registers that control the operation of the DMAC channels. A channel operates in full address mode when bits DTS2A and DTS1A are both set to 1 in DTCRA. DTCRA and DTCRB have different functions in full address mode. DTCRA
Bit Initial value Read/Write 7 DTE 0 R/W 6 DTSZ 0 R/W 5 SAID 0 R/W 4 SAIDE 0 R/W 3 DTIE 0 R/W 2 DTS2A 0 R/W 1 DTS1A 0 R/W 0 DTS0A 0 R/W
Data transfer enable Enables or disables data transfer Data transfer size Selects byte or word size
Data transfer interrupt enable Enables or disables the CPU interrupt at the end of the transfer
Data transfer select 0A Selects block transfer mode
Source address increment/decrement Source address increment/ decrement enable These bits select whether the source address register (MARA) is incremented, decremented, or held fixed during the data transfer
Data transfer select 2A and 1A These bits must both be set to 1
DTCRA is initialized to H'00 by a reset and in standby mode. Bit 7--Data Transfer Enable (DTE): Together with the DTME bit in DTCRB, this bit enables or disables data transfer on the channel. When the DTME and DTE bits are both set to 1, the channel is enabled. If auto-request is specified, data transfer begins immediately. Otherwise, the channel waits for transfers to be requested. When the specified number of transfers have been completed, the DTE bit is automatically cleared to 0. When DTE is 0, the channel is disabled and does not accept transfer requests. DTE is set to 1 by reading the register when DTE is 0, then writing 1.
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Section 8 DMA Controller Bit 7: DTE 0 1 Description Data transfer is disabled (DTE is cleared to 0 when the specified number of transfers have been completed) (Initial value) Data transfer is enabled
If DTIE is set to 1, a CPU interrupt is requested when DTE is cleared to 0. Bit 6--Data Transfer Size (DTSZ): Selects the data size of each transfer.
Bit 6: DTSZ 0 1 Description Byte-size transfer Word-size transfer (Initial value)
Bit 5--Source Address Increment/Decrement (SAID) and Bit 4--Source Address Increment/Decrement Enable (SAIDE): These bits select whether the source address register (MARA) is incremented, decremented, or held fixed during the data transfer.
Bit 5: SAID 0 Bit 4: SAIDE 0 1 Description MARA is held fixed * * 1 0 1 (Initial value)
MARA is incremented after each data transfer If DTSZ = 0, MARA is incremented by 1 after each transfer If DTSZ = 1, MARA is incremented by 2 after each transfer
MARA is held fixed MARA is decremented after each data transfer * * If DTSZ = 0, MARA is decremented by 1 after each transfer If DTSZ = 1, MARA is decremented by 2 after each transfer
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Bit 3--Data Transfer Interrupt Enable (DTIE): Enables or disables the CPU interrupt (DEND) requested when the DTE bit is cleared to 0.
Bit 3: DTIE 0 1 Description The DEND interrupt requested by DTE is disabled The DEND interrupt requested by DTE is enabled (Initial value)
Bits 2 and 1--Data Transfer Select 2A and 1A (DTS2A, DTS1A): A channel operates in full address mode when DTS2A and DTS1A are both set to 1. Bit 0--Data Transfer Select 0A (DTS0A): Selects normal mode or block transfer mode.
Bit 0: DTS0A 0 1 Description Normal mode Block transfer mode (Initial value)
Operations in these modes are described in sections 8.4.5, Normal Mode, and 8.4.6, Block Transfer Mode.
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DTCRB
Bit Initial value Read/Write 7 DTME 0 R/W 6 0 R/W 5 DAID 0 R/W 4 DAIDE 0 R/W 3 TMS 0 R/W 2 DTS2B 0 R/W 1 DTS1B 0 R/W 0 DTS0B 0 R/W
Data transfer master enable Enables or disables data transfer, together with the DTE bit, and is cleared to 0 by an interrupt Reserved bit
Transfer mode select Selects whether the block area is the source or destination in block transfer mode Data transfer select 2B to 0B These bits select the data transfer activation source
Destination address increment/decrement Destination address increment/decrement enable These bits select whether the destination address register (MARB) is incremented, decremented, or held fixed during the data transfer
DTCRB is initialized to H'00 by a reset and in standby mode. Bit 7--Data Transfer Master Enable (DTME): Together with the DTE bit in DTCRA, this bit enables or disables data transfer. When the DTME and DTE bits are both set to 1, the channel is enabled. When an NMI interrupt occurs DTME is cleared to 0, suspending the transfer so that the CPU can use the bus. The suspended transfer resumes when DTME is set to 1 again. For further information on operation in block transfer mode, see section 8.6.6, NMI Interrupts and Block Transfer Mode. DTME is set to 1 by reading the register while DTME = 0, then writing 1.
Bit 7: DTME 0 1 Description Data transfer is disabled (DTME is cleared to 0 when an NMI interrupt occurs) (Initial value) Data transfer is enabled
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Bit 6--Reserved: Although reserved, this bit can be written and read. Bit 5--Destination Address Increment/Decrement (DAID) and Bit 4--Destination Address Increment/Decrement Enable (DAIDE): These bits select whether the destination address register (MARB) is incremented, decremented, or held fixed during the data transfer.
Bit 5: DAID 0 Bit 4: DAIDE 0 1 Description MARB is held fixed * * 1 0 1 (Initial value)
MARB is incremented after each data transfer If DTSZ = 0, MARB is incremented by 1 after each data transfer If DTSZ = 1, MARB is incremented by 2 after each data transfer
MARB is held fixed MARB is decremented after each data transfer * * If DTSZ = 0, MARB is decremented by 1 after each data transfer If DTSZ = 1, MARB is decremented by 2 after each data transfer
Bit 3--Transfer Mode Select (TMS): Selects whether the source or destination is the block area in block transfer mode.
Bit 3: TMS 0 1 Description Destination is the block area in block transfer mode Source is the block area in block transfer mode (Initial value)
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Bits 2 to 0--Data Transfer Select 2B to 0B (DTS2B, DTS1B, DTS0B): These bits select the data transfer activation source. The selectable activation sources differ between normal mode and block transfer mode. * Normal mode
Bit 2: DTS2B 0 Bit 1: DTS1B 0 1 1 0 1 Bit 0: DTS0B 0 1 0 1 0 1 0 1 Description Auto-request (burst mode) Cannot be used Auto-request (cycle-steal mode) Cannot be used Cannot be used Cannot be used Falling edge of DREQ Low level input at DREQ (Initial value)
* Block transfer mode
Bit 2: DTS2B 0 Bit 1: DTS1B 0 Bit 0: DTS0B 0 1 1 0 1 1 0 1 0 1 0 1 Description Compare match/input capture A interrupt from ITU channel 0 (Initial value) Compare match/input capture A interrupt from ITU channel 1 Compare match/input capture A interrupt from ITU channel 2 Compare match/input capture A interrupt from ITU channel 3 Cannot be used Cannot be used Falling edge of DREQ Cannot be used
The same internal interrupt can be selected to activate two or more channels. The channels are activated in a priority order, highest priority first. For the priority order, see section 8.4.9, DMAC Multiple-Channel Operation.
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8.4
8.4.1
Operation
Overview
Table 8.5 summarizes the DMAC modes. Table 8.5 DMAC Modes
Activation I/O mode Idle mode Repeat mode Compare match/input capture A interrupt from ITU channels 0 to 3 Transmit-data-empty and receive-data-full interrupts from SCI channel 0 External request Full address mode Normal mode Block transfer mode Auto-request External request Compare match/input capture A interrupt from ITU * channels 0 to 3 External request * A and B channels are paired; up to two channels are available Burst mode or cycle-steal mode can be selected for auto-requests Notes * * Up to four channels can operate independently Only the B channels support external requests
Transfer Mode Short address mode
A summary of operations in these modes follows. I/O Mode One byte or word is transferred per request. A designated number of these transfers are executed. A CPU interrupt can be requested at completion of the designated number of transfers. One 24-bit address and one 8-bit address are specified. The transfer direction is determined automatically from the activation source. Idle Mode One byte or word is transferred per request. A designated number of these transfers are executed. A CPU interrupt can be requested at completion of the designated number of transfers. One 24-bit address and one 8-bit address are specified. The addresses are held fixed. The transfer direction is determined automatically from the activation source.
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Repeat Mode One byte or word is transferred per request. A designated number of these transfers are executed. When the designated number of transfers are completed, the initial address and counter value are restored and operation continues. No CPU interrupt is requested. One 24-bit address and one 8-bit address are specified. The transfer direction is determined automatically from the activation source. Normal Mode Auto-request: The DMAC is activated by register setup alone, and continues executing transfers until the designated number of transfers have been completed. A CPU interrupt can be requested at completion of the transfers. Both addresses are 24-bit addresses. * Cycle-steal mode The bus is released to another bus master after each byte or word is transferred. * Burst mode Unless requested by a higher-priority bus master, the bus is not released until the designated number of transfers have been completed. External request: One byte or word is transferred per request. A designated number of these transfers are executed. A CPU interrupt can be requested at completion of the designated number of transfers. Both addresses are 24-bit addresses. Block Transfer Mode One block of a specified size is transferred per request. A designated number of block transfers are executed. At the end of each block transfer, one address is restored to its initial value. When the designated number of blocks have been transferred, a CPU interrupt can be requested. Both addresses are 24-bit addresses.
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Section 8 DMA Controller
8.4.2
I/O Mode
I/O mode can be selected independently for each channel. One byte or word is transferred at each transfer request in I/O mode. A designated number of these transfers are executed. One address is specified in the memory address register (MAR), the other in the I/O address register (IOAR). The direction of transfer is determined automatically from the activation source. The transfer is from the address specified in IOAR to the address specified in MAR if activated by an SCI channel 0 receive-data-full interrupt, and from the address specified in MAR to the address specified in IOAR otherwise. Table 8.6 indicates the register functions in I/O mode. Table 8.6 Register Functions in I/O Mode
Function Activated by SCI0 ReceiveData-Full Interrupt
0 MAR
Register
23
Other Activation Source address register Destination address register Transfer counter
Initial Setting Destination or source address
Operation Incremented or decremented once per transfer Held fixed
Destination address register Source address register Transfer counter
23 All 1s 15
7 IOAR
0
Source or destination address Number of transfers
0 ETCR
Decremented once per transfer until H'0000 is reached and transfer ends
Legend: MAR: Memory address register IOAR: I/O address register ETCR: Execute transfer count register
MAR and IOAR specify the source and destination addresses. MAR specifies a 24-bit source or destination address, which is incremented or decremented as each byte or word is transferred. IOAR specifies the lower 8 bits of a fixed address. The upper 16 bits are all 1s. IOAR is not incremented or decremented.
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Figure 8.2 illustrates how I/O mode operates.
Address T
Transfer
IOAR
1 byte or word is transferred per request
Address B
Legend: L = initial setting of MAR N = initial setting of ETCR Address T = L Address B = L + (-1) DTID * (2 DTSZ * N - 1)
Figure 8.2 Operation in I/O Mode The transfer count is specified as a 16-bit value in ETCR. The ETCR value is decremented by 1 at each transfer. When the ETCR value reaches H'0000, the DTE bit is cleared and the transfer ends. If the DTIE bit is set to 1, a CPU interrupt is requested at this time. The maximum transfer count is 65,536, obtained by setting ETCR to H'0000. Transfers can be requested (activated) by compare match/input capture A interrupts from ITU channels 0 to 3, transmit-data-empty and receive-data-full interrupts from SCI channel 0, and external request signals.
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For the detailed settings see section 8.2.4, Data Transfer Control Registers (DTCR). Figure 8.3 shows a sample setup procedure for I/O mode.
I/O mode setup
Set source and destination addresses
1
Set transfer count
2
Read DTCR
3
1. Set the source and destination addresses in MAR and IOAR. The transfer direction is determined automatically from the activation source. 2. Set the transfer count in ETCR. 3. Read DTCR while the DTE bit is cleared to 0. 4. Set the DTCR bits as follows. * Select the DMAC activation source with bits DTS2 to DTS0. * Set or clear the DTIE bit to enable or disable the CPU interrupt at the end of the transfer. * Clear the RPE bit to 0 to select I/O mode. * Select MAR increment or decrement with the DTID bit. * Select byte size or word size with the DTSZ bit. * Set the DTE bit to 1 to enable the transfer.
Set DTCR
4
I/O mode
Figure 8.3 I/O Mode Setup Procedure (Example) 8.4.3 Idle Mode
Idle mode can be selected independently for each channel. One byte or word is transferred at each transfer request in idle mode. A designated number of these transfers are executed. One address is specified in the memory address register (MAR), the other in the I/O address register (IOAR). The direction of transfer is determined automatically from the activation source. The transfer is from the address specified in IOAR to the address specified in MAR if activated by an SCI channel 0 receive-data-full interrupt, and from the address specified in MAR to the address specified in IOAR otherwise. Table 8.7 indicates the register functions in idle mode.
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Section 8 DMA Controller
Table 8.7
Register Functions in Idle Mode
Function Activated by SCI0 ReceiveData-Full Interrupt
0 MAR
Register
23
Other Activation Source address register Destination address register Transfer counter
Initial Setting Destination or source address Source or destination address Number of transfers
Operation Held fixed
Destination address register Source address register Transfer counter
23 All 1s 15
7 IOAR
0
Held fixed
0 ETCR
Decremented once per transfer until H'0000 is reached and transfer ends
Legend: MAR: Memory address register IOAR: I/O address register ETCR: Execute transfer count register
MAR and IOAR specify the source and destination addresses. MAR specifies a 24-bit source or destination address. IOAR specifies the lower 8 bits of a fixed address. The upper 16 bits are all 1s. MAR and IOAR are not incremented or decremented. Figure 8.4 illustrates how idle mode operates.
MAR
Transfer
IOAR
1 byte or word is transferred per request
Figure 8.4 Operation in Idle Mode
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The transfer count is specified as a 16-bit value in ETCR. The ETCR value is decremented by 1 at each transfer. When the ETCR value reaches H'0000, the DTE bit is cleared, the transfer ends, and a CPU interrupt is requested. The maximum transfer count is 65,536, obtained by setting ETCR to H'0000. Transfers can be requested (activated) by compare match/input capture A interrupts from ITU channels 0 to 3, transmit-data-empty and receive-data-full interrupts from SCI channel 0, and external request signals. For the detailed settings see section 8.2.4, Data Transfer Control Registers (DTCR). Figure 8.5 shows a sample setup procedure for idle mode.
Idle mode setup
Set source and destination addresses
1
Set transfer count
2
1. Set the source and destination addresses in MAR and IOAR. The transfer direction is determined automatically from the activation source. 2. Set the transfer count in ETCR. 3. Read DTCR while the DTE bit is cleared to 0. 4. Set the DTCR bits as follows. * Select the DMAC activation source with bits DTS2 to DTS0. * Set the DTIE and RPE bits to 1 to select idle mode. * Select byte size or word size with the DTSZ bit. * Set the DTE bit to 1 to enable the transfer.
Read DTCR
3
Set DTCR
4
Idle mode
Figure 8.5 Idle Mode Setup Procedure (Example)
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Section 8 DMA Controller
8.4.4
Repeat Mode
Repeat mode is useful for cyclically transferring a bit pattern from a table to the programmable timing pattern controller (TPC) in synchronization, for example, with ITU compare match. Repeat mode can be selected for each channel independently. One byte or word is transferred per request in repeat mode, as in I/O mode. A designated number of these transfers are executed. One address is specified in the memory address register (MAR), the other in the I/O address register (IOAR). At the end of the designated number of transfers, MAR and ETCR are restored to their original values and operation continues. The direction of transfer is determined automatically from the activation source. The transfer is from the address specified in IOAR to the address specified in MAR if activated by an SCI channel 0 receive-datafull interrupt, and from the address specified in MAR to the address specified in IOAR otherwise. Table 8.8 indicates the register functions in repeat mode.
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Section 8 DMA Controller
Table 8.8
Register Functions in Repeat Mode
Function Activated by SCI0 ReceiveData-Full Interrupt Destination address register
Register
Other Activation Source address register
Initial Setting Destination or source address
Operation Incremented or decremented at each transfer until H'0000, then restored to initial value Held fixed
23 MAR
0
23 All 1s
7 IOAR
0
Source address register Transfer counter
Destination address register Transfer counter
Source or destination address Number of transfers
7
0
ETCRH
7
0
Decremented once per transfer until H'0000 is reached, then reloaded from ETCRL Held fixed
ETCRL
Initial transfer count
Initial transfer Number of count transfers
Legend: MAR: Memory address register IOAR: I/O address register ETCR: Execute transfer count register
In repeat mode ETCRH is used as the transfer counter while ETCRL holds the initial transfer count. ETCRH is decremented by 1 at each transfer until it reaches H'00, then is reloaded from ETCRL. MAR is also restored to its initial value, which is calculated from the DTSZ and DTID bits in DTCR. Specifically, MAR is restored as follows: MAR MAR - (-1)DTID * 2DTSZ * ETCRL ETCRH and ETCRL should be initially set to the same value. In repeat mode transfers continue until the CPU clears the DTE bit to 0. After DTE is cleared to 0, if the CPU sets DTE to 1 again, transfers resume from the state at which DTE was cleared. No CPU interrupt is requested.
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As in I/O mode, MAR and IOAR specify the source and destination addresses. MAR specifies a 24-bit source or destination address. IOAR specifies the lower 8 bits of a fixed address. The upper 16 bits are all 1s. IOAR is not incremented or decremented. Figure 8.6 illustrates how repeat mode operates.
Address T
Transfer
IOAR
1 byte or word is transferred per request
Address B
Legend: L = initial setting of MAR N = initial setting of ETCRH and ETCRL Address T = L Address B = L + (-1)DTID * (2DTSZ * N - 1)
Figure 8.6 Operation in Repeat Mode The transfer count is specified as an 8-bit value in ETCRH and ETCRL. The maximum transfer count is 255, obtained by setting both ETCRH and ETCRL to H'FF. Transfers can be requested (activated) by compare match/input capture A interrupts from ITU channels 0 to 3, transmit-data-empty and receive-data-full interrupts from SCI channel 0, and external request signals. For the detailed settings see section 8.2.4, Data Transfer Control Registers (DTCR).
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Figure 8.7 shows a sample setup procedure for repeat mode.
Repeat mode
Set source and destination addresses
1
Set transfer count
2
Read DTCR
3
1. Set the source and destination addresses in MAR and IOAR. The transfer direction is determined automatically from the activation source. 2. Set the transfer count in both ETCRH and ETCRL. 3. Read DTCR while the DTE bit is cleared to 0. 4. Set the DTCR bits as follows. * Select the DMAC activation source with bits DTS2 to DTS0. * Clear the DTIE bit to 0 and set the RPE bit to 1 to select repeat mode. * Select MAR increment or decrement with the DTID bit. * Select byte size or word size with the DTSZ bit. * Set the DTE bit to 1 to enable the transfer.
Set DTCR
4
Repeat mode
Figure 8.7 Repeat Mode Setup Procedure (Example)
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Section 8 DMA Controller
8.4.5
Normal Mode
In normal mode the A and B channels are combined. One byte or word is transferred per request. A designated number of these transfers are executed. Addresses are specified in MARA and MARB. Table 8.9 indicates the register functions in I/O mode. Table 8.9
Register
23 MARA 23 MARB 15 ETCRA 0 0 0
Register Functions in Normal Mode
Function Source address register Destination address register Transfer counter Initial Setting Source address Operation Incremented or decremented once per transfer, or held fixed Incremented or decremented once per transfer, or held fixed Decremented once per transfer
Destination address Number of transfers
Legend: MARA: Memory address register A MARB: Memory address register B ETCRA: Execute transfer count register A
The source and destination addresses are both 24-bit addresses. MARA specifies the source address. MARB specifies the destination address. MARA and MARB can be independently incremented, decremented, or held fixed as data is transferred. The transfer count is specified as a 16-bit value in ETCRA. The ETCRA value is decremented by 1 at each transfer. When the ETCRA value reaches H'0000, the DTE bit is cleared and the transfer ends. If the DTIE bit is set, a CPU interrupt is requested at this time. The maximum transfer count is 65,536, obtained by setting ETCRA to H'0000. Figure 8.8 illustrates how normal mode operates.
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Address TA
Transfer
Address T B
Address BA
Address B B
Legend: L A = initial setting of MARA L B = initial setting of MARB N = initial setting of ETCRA TA = LA BA = L A + SAIDE * (-1)SAID * (2DTSZ * N - 1) TB = LB BB = L B + DAIDE * (-1)DAID * (2DTSZ * N - 1)
Figure 8.8 Operation in Normal Mode Transfers can be requested (activated) by an external request or auto-request. An auto-requested transfer is activated by the register settings alone. The designated number of transfers are executed automatically. Either cycle-steal or burst mode can be selected. In cycle-steal mode the DMAC releases the bus temporarily after each transfer. In burst mode the DMAC keeps the bus until the transfers are completed, unless there is a bus request from a higher-priority bus master. For the detailed settings see section 8.3.4, Data Transfer Control Registers (DTCR).
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Figure 8.9 shows a sample setup procedure for normal mode.
Normal mode
Set initial source address
1
1. 2. 3. 4.
Set initial destination address
2 5.
Set transfer count
3
Set DTCRB (1)
4
Set DTCRA (1)
5 6. 7. 8. 9.
Read DTCRB
6
Set the initial source address in MARA. Set the initial destination address in MARB. Set the transfer count in ETCRA. Set the DTCRB bits as follows. * Clear the DTME bit to 0. * Set the DAID and DAIDE bits to select whether MARB is incremented, decremented, or held fixed. * Select the DMAC activation source with bits DTS2B to DTS0B. Set the DTCRA bits as follows. * Clear the DTE bit to 0. * Select byte or word size with the DTSZ bit. * Set the SAID and SAIDE bits to select whether MARA is incremented, decremented, or held fixed. * Set or clear the DTIE bit to enable or disable the CPU interrupt at the end of the transfer. * Clear the DTS0A bit to 0 and set the DTS2A and DTS1A bits to 1 to select normal mode. Read DTCRB with DTME cleared to 0. Set the DTME bit to 1 in DTCRB. Read DTCRA with DTE cleared to 0. Set the DTE bit to 1 in DTCRA to enable the transfer.
Set DTCRB (2)
7
Read DTCRA
8
Set DTCRA (2)
9
Normal mode Note: Carry out settings 1 to 9 with the DEND interrupt masked in the CPU. If an NMI interrupt occurs during the setup procedure, it may clear the DTME bit to 0, in which case the transfer will not start.
Figure 8.9 Normal Mode Setup Procedure (Example)
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Section 8 DMA Controller
8.4.6
Block Transfer Mode
In block transfer mode the A and B channels are combined. One block of a specified size is transferred per request. A designated number of block transfers are executed. Addresses are specified in MARA and MARB. The block area address can be either held fixed or cycled. Table 8.10 indicates the register functions in block transfer mode. Table 8.10 Register Functions in Block Transfer Mode
Register
23 MARA 23 MARB 0 0
Function Source address register Destination address register Block size counter
Initial Setting Source address
Operation Incremented or decremented once per transfer, or held fixed Incremented or decremented once per transfer, or held fixed Decremented once per transfer until H'00 is reached, then reloaded from ETCRAL Held fixed
Destination address Block size
7
0
ETCRAH
7
0
Initial block size
Block size
ETCRAL
15 ETCRB 0
Block transfer counter
Number of block transfers
Decremented once per block transfer until H'0000 is reached and the transfer ends
Legend: MARA: MARB: ETCRA: ETCRB:
Memory address register A Memory address register B Execute transfer count register A Execute transfer count register B
The source and destination addresses are both 24-bit addresses. MARA specifies the source address. MARB specifies the destination address. MARA and MARB can be independently incremented, decremented, or held fixed as data is transferred. One of these registers operates as a block area register: even if it is incremented or decremented, it is restored to its initial value at the end of each block transfer. The TMS bit in DTCRB selects whether the block area is the source or destination.
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If M (1 to 255) is the size of the block transferred at each request and N (1 to 65,536) is the number of blocks to be transferred, then ETCRAH and ETCRAL should initially be set to M and ETCRB should initially be set to N. Figure 8.10 illustrates how block transfer mode operates. In this figure, bit TMS is cleared to 0, meaning the block area is the destination.
TA Transfer Block 1 Block area BA
Address T B
Address B B
Block 2 M bytes or words are transferred per request
Block N
Legend: L A = initial setting of MARA L B = initial setting of MARB M = initial setting of ETCRAH and ETCRAL N = initial setting of ETCRB T A = LA B A = L A + SAIDE * (-1)SAID * (2DTSZ * M - 1) T B = LB B B = L B + DAIDE * (-1)DAID * (2DTSZ * M - 1)
Figure 8.10 Operation in Block Transfer Mode
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When activated by a transfer request, the DMAC executes a burst transfer. During the transfer MARA and MARB are updated according to the DTCR settings, and ETCRAH is decremented. When ETCRAH reaches H'00, it is reloaded from ETCRAL to restore the initial value. The memory address register of the block area is also restored to its initial value, and ETCRB is decremented. If ETCRB is not H'0000, the DMAC then waits for the next transfer request. ETCRAH and ETCRAL should be initially set to the same value. The above operation is repeated until ETCRB reaches H'0000, at which point the DTE bit is cleared to 0 and the transfer ends. If the DTIE bit is set to 1, a CPU interrupt is requested at this time. Figure 8.11 shows examples of a block transfer with byte data size when the block area is the destination. In (a) the block area address is cycled. In (b) the block area address is held fixed. Transfers can be requested (activated) by compare match/input capture A interrupts from ITU channels 0 to 3, and by external request signals. For the detailed settings see section 8.3.4, Data Transfer Control Registers (DTCR).
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Start (DTE = DTME = 1)
Start (DTE = DTME = 1)
Transfer requested? Yes Get bus
No
Transfer requested? Yes Get bus
No
Read from MARA address MARA = MARA + 1 Write to MARB address MARB = MARB + 1 ETCRAH = ETCRAH - 1 No ETCRAH = H'00 Yes Release bus ETCRAH = ETCRAL MARB = MARB - ETCRAL ETCRB = ETCRB - 1 No
Read from MARA address MARA = MARA + 1 Write to MARB address
ETCRAH = ETCRAH - 1 No ETCRAH = H'00 Yes Release bus ETCRAH = ETCRAL ETCRB = ETCRB - 1 No
ETCRB = H'0000 Yes Clear DTE to 0 and end transfer
ETCRB = H'0000 Yes Clear DTE to 0 and end transfer
a. DTSZ = TMS = 0 SAID = DAID = 0 SAIDE = DAIDE = 1
b. DTSZ = TMS = 0 SAID = 0 SAIDE = 1 DAIDE = 0
Figure 8.11 Block Transfer Mode Flowcharts (Examples)
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Section 8 DMA Controller
Figure 8.12 shows a sample setup procedure for block transfer mode.
Block transfer mode
Set source address
1
Set destination address
2
Set block transfer count
3
Set block size
4
Set DTCRB (1)
5
Set DTCRA (1)
6
Read DTCRB
7
Set the source address in MARA. Set the destination address in MARB. Set the block transfer count in ETCRB. Set the block size (number of bytes or words) in both ETCRAH and ETCRAL. 5. Set the DTCRB bits as follows. * Clear the DTME bit to 0. * Set the DAID and DAIDE bits to select whether MARB is incremented, decremented, or held fixed. * Set or clear the TMS bit to make the block area the source or destination. * Select the DMAC activation source with bits DTS2B to DTS0B. 6. Set the DTCRA bits as follows. * Clear the DTE to 0. * Select byte size or word size with the DTSZ bit. * Set the SAID and SAIDE bits to select whether MARA is incremented, decremented, or held fixed. * Set or clear the DTIE bit to enable or disable the CPU interrupt at the end of the transfer. * Set bits DTS2A to DTS0A all to 1 to select block transfer mode. 7. Read DTCRB with DTME cleared to 0. 8. Set the DTME bit to 1 in DTCRB. 9. Read DTCRA with DTE cleared to 0. 10. Set the DTE bit to 1 in DTCRA to enable the transfer. 1. 2. 3. 4.
Set DTCRB (2)
8
Read DTCRA
9
Set DTCRA (2)
10
Block transfer mode Note: Carry out settings 1 to 10 with the DEND interrupt masked in the CPU. If an NMI interrupt occurs during the setup procedure, it may clear the DTME bit to 0, in which case the transfer will not start.
Figure 8.12 Block Transfer Mode Setup Procedure (Example)
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Section 8 DMA Controller
8.4.7
DMAC Activation
The DMAC can be activated by an internal interrupt, external request, or auto-request. The available activation sources differ depending on the transfer mode and channel as indicated in table 8.11. Table 8.11 DMAC Activation Sources
Short Address Mode Activation Source Internal interrupts IMIA0 IMIA1 IMIA2 IMIA3 TXI0 RXI0 External requests Falling edge of DREQ Low input at DREQ Auto-request Channels 0A and 1A Yes Yes Yes Yes Yes Yes No No No Channels 0B and 1B Yes Yes Yes Yes Yes Yes Yes Yes No Full Address Mode Normal No No No No No No Yes Yes Yes Block Yes Yes Yes Yes No No Yes No No
Activation by Internal Interrupts When an interrupt request is selected as a DMAC activation source and the DTE bit is set to 1, that interrupt request is not sent to the CPU. It is not possible for an interrupt request to activate the DMAC and simultaneously generate a CPU interrupt. When the DMAC is activated by an interrupt request, the interrupt request flag is cleared automatically. If the same interrupt is selected to activate two or more channels, the interrupt request flag is cleared when the highest-priority channel is activated, but the transfer request is held pending on the other channels in the DMAC, which are activated in their priority order.
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Section 8 DMA Controller
Activation by External Request If an external request (DREQ pin) is selected as an activation source, the DREQ pin becomes an input pin and the corresponding TEND pin becomes an output pin, regardless of the port data direction register (DDR) settings. The DREQ input can be level-sensitive or edge-sensitive. In short address mode and normal mode, an external request operates as follows. If edge sensing is selected, one byte or word is transferred each time a high-to-low transition of the DREQ input is detected. If the next edge is input before the transfer is completed, the next transfer may not be executed. If level sensing is selected, the transfer continues while DREQ is low, until the transfer is completed. The bus is released temporarily after each byte or word has been transferred, however. If the DREQ input goes high during a transfer, the transfer is suspended after the current byte or word has been transferred. When DREQ goes low, the request is held internally until one byte or word has been transferred. The TEND signal goes low during the last write cycle. In block transfer mode, an external request operates as follows. Only edge-sensitive transfer requests are possible in block transfer mode. Each time a high-to-low transition of the DREQ input is detected, a block of the specified size is transferred. The TEND signal goes low during the last write cycle in each block. Activation by Auto-Request The transfer starts as soon as enabled by register setup, and continues until completed. Cycle-steal mode or burst mode can be selected. In cycle-steal mode the DMAC releases the bus temporarily after transferring each byte or word. Normally, DMAC cycles alternate with CPU cycles. In burst mode the DMAC keeps the bus until the transfer is completed, unless there is a higherpriority bus request. If there is a higher-priority bus request, the bus is released after the current byte or word has been transferred.
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Section 8 DMA Controller
8.4.8
DMAC Bus Cycle
Figure 8.13 shows an example of the timing of the basic DMAC bus cycle. This example shows a word-size transfer from a 16-bit two-state access area to an 8-bit three-state access area. When the DMAC gets the bus from the CPU, after one dead cycle (Td), it reads from the source address and writes to the destination address. During these read and write operations the bus is not released even if there is another bus request. DMAC cycles comply with bus controller settings in the same way as CPU cycles.
CPU cycle T1 Source address Address bus RD Destination address T2 T1 T2 Td T1 DMAC cycle (word transfer) T2 T1 T2 T3 T1 T2 T3 T1 CPU cycle T2 T1 T2
HWR
LWR
Figure 8.13 DMA Transfer Bus Timing (Example)
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Section 8 DMA Controller
Figure 8.14 shows the timing when the DMAC is activated by low input at a DREQ pin. This example shows a word-size transfer from a 16-bit two-state access area to another 16-bit two-state access area. The DMAC continues the transfer while the DREQ pin is held low.
DMAC cycle (last transfer cycle) Td T1 T2 T1 T2
CPU cycle T1 T2 T3 Td
DMAC cycle T1 T2 T1 T2
CPU cycle T1 T2
CPU cycle T1 T2
DREQ Address bus RD
Source Destination address address
Source Destination address address
HWR , LWR
TEND
Figure 8.14 Bus Timing of DMA Transfer Requested by Low DREQ Input
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Section 8 DMA Controller
Figure 8.15 shows an auto-requested burst-mode transfer. This example shows a transfer of three words from a 16-bit two-state access area to another 16-bit two-state access area.
CPU cycle T1 Source address Address bus RD Destination address T2 Td T1 T2 T1 T2
DMAC cycle T1 T2 T1 T2 T1 T2 T1 T2
CPU cycle T1 T2
HWR , LWR
Figure 8.15 Bus Timing of Burst Mode DMA Transfer When the DMAC is activated from a DREQ pin there is a minimum interval of four states from when the transfer is requested until the DMAC starts operating. The DREQ pin is not sampled during the time between the transfer request and the start of the transfer. In short address mode and normal mode, the pin is next sampled at the end of the read cycle. In block transfer mode, the pin is next sampled at the end of one block transfer.
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Section 8 DMA Controller
Figure 8.16 shows the timing when the DMAC is activated by the falling edge of DREQ in normal mode.
CPU cycle T2 T1 T2
CPU cycle T2
DMAC cycle T2 Td T1 T2 T1
DMAC cycle Td T1 T2
T1
T2
T1
DREQ
Address bus
RD HWR, LWR
Minimum 4 states
Next sampling point
Figure 8.16 Timing of DMAC Activation by Falling Edge of DREQ in Normal Mode
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Section 8 DMA Controller
Figure 8.17 shows the timing when the DMAC is activated by level-sensitive low DREQ input in normal mode.
CPU cycle T2 DREQ Address bus RD HWR , LWR Minimum 4 states Next sampling point T1 T2 T1 T2 Td DMAC cycle T1 T2 T1 T2 T1 CPU cycle T2 T1 T2 T1
Figure 8.17 Timing of DMAC Activation by Low DREQ Level in Normal Mode
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Section 8 DMA Controller
Figure 8.18 shows the timing when the DMAC is activated by the falling edge of DREQ in block transfer mode.
End of 1 block transfer DMAC cycle T1 DREQ Address bus RD HWR , LWR T2 T1 T2 T1 T2 T1 T2 T1 CPU cycle T2 T1 T2 DMAC cycle Td T1 T2
TEND
Next sampling Minimum 4 states
Figure 8.18 Timing of DMAC Activation by Falling Edge of DREQ in Block Transfer Mode
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Section 8 DMA Controller
8.4.9
DMAC Multiple-Channel Operation
The DMAC channel priority order is: channel 0 > channel 1 and channel A > channel B. Table 8.12 shows the complete priority order. Table 8.12 Channel Priority Order
Short Address Mode Channel 0A Channel 0B Channel 1A Channel 1B Channel 1 Low Full Address Mode Channel 0 Priority High
If transfers are requested on two or more channels simultaneously, or if a transfer on one channel is requested during a transfer on another channel, the DMAC operates as follows. 1. When a transfer is requested, the DMAC requests the bus right. When it gets the bus right, it starts a transfer on the highest-priority channel at that time. 2. Once a transfer starts on one channel, requests to other channels are held pending until that channel releases the bus. 3. After each transfer in short address mode, and each externally-requested or cycle-steal transfer in normal mode, the DMAC releases the bus and returns to step 1. After releasing the bus, if there is a transfer request for another channel, the DMAC requests the bus again. 4. After completion of a burst-mode transfer, or after transfer of one block in block transfer mode, the DMAC releases the bus and returns to step 1. If there is a transfer request for a higher-priority channel or a bus request from a higher-priority bus master, however, the DMAC releases the bus after completing the transfer of the current byte or word. After releasing the bus, if there is a transfer request for another channel, the DMAC requests the bus again. Figure 8.19 shows the timing when channel 0A is set up for I/O mode and channel 1 for burst mode, and a transfer request for channel 0A is received while channel 1 is active.
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Section 8 DMA Controller
DMAC cycle (channel 1) T1 Address bus RD HWR , LWR T2 T1
CPU cycle T2 Td
DMAC cycle (channel 0A) T1 T2 T1 T2 T1
CPU cycle T2 Td
DMAC cycle (channel 1) T1 T2 T1 T2
Figure 8.19 Timing of Multiple-Channel Operations 8.4.10 External Bus Requests, Refresh Controller, and DMAC
During a DMA transfer, if the bus right is requested by an external bus request signal (BREQ) or by the refresh controller, the DMAC releases the bus after completing the transfer of the current byte or word. If there is a transfer request at this point, the DMAC requests the bus right again. Figure 8.20 shows an example of the timing of insertion of a refresh cycle during a burst transfer on channel 0.
Refresh cycle T2 T1 T2 Td
DMAC cycle (channel 0) T1 Address bus RD HWR , LWR T2 T1 T2 T1 T2 T1
DMAC cycle (channel 0) T1 T2 T1 T2 T1 T2
Figure 8.20 Bus Timing of Refresh Controller and DMAC
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Section 8 DMA Controller
8.4.11
NMI Interrupts and DMAC
NMI interrupts do not affect DMAC operations in short address mode. If an NMI interrupt occurs during a transfer in full address mode, the DMAC suspends operations. In full address mode, a channel is enabled when its DTE and DTME bits are both set to 1. NMI input clears the DTME bit to 0. After transferring the current byte or word, the DMAC releases the bus to the CPU. In normal mode, the suspended transfer resumes when the CPU sets the DTME bit to 1 again. Check that the DTE bit is set to 1 and the DTME bit is cleared to 0 before setting the DTME bit to 1. Figure 8.21 shows the procedure for resuming a DMA transfer in normal mode on channel 0 after the transfer was halted by NMI input.
Resuming DMA transfer in normal mode
1. Check that DTE = 1 and DTME = 0. 2. Read DTCRB while DTME = 0, then write 1 in the DTME bit. 1
DTE = 1 DTME = 0 Yes Set DTME to 1
No
2
DMA transfer continues
End
Figure 8.21 Procedure for Resuming a DMA Transfer Halted by NMI (Example) For information about NMI interrupts in block transfer mode, see section 8.6.6, NMI Interrupts and Block Transfer Mode.
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Section 8 DMA Controller
8.4.12
Aborting a DMA Transfer
When the DTE bit in an active channel is cleared to 0, the DMAC halts after transferring the current byte or word. The DMAC starts again when the DTE bit is set to 1. In full address mode, the DTME bit can be used for the same purpose. Figure 8.22 shows the procedure for aborting a DMA transfer by software.
DMA transfer abort
1. Clear the DTE bit to 0 in DTCR. To avoid generating an interrupt when aborting a DMA transfer, clear the DTIE bit to 0 simultaneously. 1
Set DTCR
DMA transfer aborted
Figure 8.22 Procedure for Aborting a DMA Transfer
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Section 8 DMA Controller
8.4.13
Exiting Full Address Mode
Figure 8.23 shows the procedure for exiting full address mode and initializing the pair of channels. To set the channels up in another mode after exiting full address mode, follow the setup procedure for the relevant mode.
Exiting full address mode
Halt the channel
1
1. Clear the DTE bit to 0 in DTCRA, or wait for the transfer to end and the DTE bit to be cleared to 0. 2. Clear all DTCRB bits to 0. 3. Clear all DTCRA bits to 0.
Initialize DTCRB
2
Initialize DTCRA
3
Initialized and halted
Figure 8.23 Procedure for Exiting Full Address Mode (Example)
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Section 8 DMA Controller
8.4.14
DMAC States in Reset State, Standby Modes, and Sleep Mode
When the chip is reset or enters hardware or software standby mode, the DMAC is initialized and halts. DMAC operations continue in sleep mode. Figure 8.24 shows the timing of a cycle-steal transfer in sleep mode.
Sleep mode CPU cycle T2 Td DMAC cycle T1 T2 T1 T2 Td DMAC cycle T1 T2 T1 T2 Td
Address bus RD HWR , LWR
Figure 8.24 Timing of Cycle-Steal Transfer in Sleep Mode
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Section 8 DMA Controller
8.5
Interrupts
The DMAC generates only DMA-end interrupts. Table 8.13 lists the interrupts and their priority. Table 8.13 DMAC Interrupts
Description Interrupt DEND0A DEND0B DEND1A DEND1B Short Address Mode End of transfer on channel 0A End of transfer on channel 0B End of transfer on channel 1A End of transfer on channel 1B Full Address Mode End of transfer on channel 0 -- End of transfer on channel 1 -- Low Interrupt Priority High
Each interrupt is enabled or disabled by the DTIE bit in the corresponding data transfer control register (DTCR). Separate interrupt signals are sent to the interrupt controller. The interrupt priority order among channels is channel 0 > channel 1 and channel A > channel B. Figure 8.25 shows the DMA-end interrupt logic. An interrupt is requested whenever DTE = 0 and DTIE = 1.
DTE DMA-end interrupt DTIE
Figure 8.25 DMA-End Interrupt Logic The DMA-end interrupt for the B channels (DENDB) is unavailable in full address mode. The DTME bit does not affect interrupt operations.
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Section 8 DMA Controller
8.6
8.6.1
Usage Notes
Note on Word Data Transfer
Word data cannot be accessed starting at an odd address. When word-size transfer is selected, set even values in the memory and I/O address registers (MAR and IOAR). 8.6.2 DMAC Self-Access
The DMAC itself cannot be accessed during a DMAC cycle. DMAC registers cannot be specified as source or destination addresses. 8.6.3 Longword Access to Memory Address Registers
A memory address register can be accessed as longword data at the MARR address. Example:
MOV.L MOV.L #LBL, ER0 ER0, @MARR
Four byte accesses are performed. Note that the CPU may release the bus between the second byte (MARE) and third byte (MARH). Memory address registers should be written and read only when the DMAC is halted. 8.6.4 Note on Full Address Mode Setup
Full address mode is controlled by two registers: DTCRA and DTCRB. Care must be taken to prevent the B channel from operating in short address mode during the register setup. The enable bits (DTE and DTME) should not be set to 1 until the end of the setup procedure. 8.6.5 Note on Activating DMAC by Internal Interrupts
When using an internal interrupt to activate the DMAC, make sure that the interrupt selected as the activating source does not occur during the interval after it has been selected but before the DMAC has been enabled. The on-chip supporting module that will generate the interrupt should not be activated until the DMAC has been enabled. If the DMAC must be enabled while the onchip supporting module is active, follow the procedure in figure 8.26.
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Section 8 DMA Controller
Enabling of DMAC
Yes Interrupt handling by CPU
Selected interrupt requested? No
1
1. While the DTE bit is cleared to 0, interrupt requests are sent to the CPU. 2. Clear the interrupt enable bit to 0 in the interrupt-generating on-chip supporting module. 3. Enable the DMAC. 4. Enable the DMAC-activating interrupt.
Clear selected interrupt's enable bit to 0
2
Enable DMAC
3
Set selected interrupt's enable bit to 1
4
DMAC operates
Figure 8.26 Procedure for Enabling DMAC while On-Chip Supporting Module Is Operating (Example) If the DTE bit is set to 1 but the DTME bit is cleared to 0, the DMAC is halted and the selected activating source cannot generate a CPU interrupt. If the DMAC is halted by an NMI interrupt, for example, the selected activating source cannot generate CPU interrupts. To terminate DMAC operations in this state, clear the DTE bit to 0 to allow CPU interrupts to be requested. To continue DMAC operations, carry out steps 2 and 4 in figure 8.26 before and after setting the DTME bit to 1. When an ITU interrupt activates the DMAC, make sure the next interrupt does not occur before the DMA transfer ends. If one ITU interrupt activates two or more channels, make sure the next interrupt does not occur before the DMA transfers end on all the activated channels. If the next interrupt occurs before a transfer ends, the channel or channels for which that interrupt was selected may fail to accept further activation requests.
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Section 8 DMA Controller
8.6.6
NMI Interrupts and Block Transfer Mode
If an NMI interrupt occurs in block transfer mode, the DMAC operates as follows. 1. When the NMI interrupt occurs, the DMAC finishes transferring the current byte or word, then clears the DTME bit to 0 and halts. The halt may occur in the middle of a block. It is possible to find whether a transfer was halted in the middle of a block by checking the block size counter. If the block size counter does not have its initial value, the transfer was halted in the middle of a block. 2. If the transfer is halted in the middle of a block, the activating interrupt flag is cleared to 0. The activation request is not held pending. 3. While the DTE bit is set to 1 and the DTME bit is cleared to 0, the DMAC is halted and does not accept activating interrupt requests. If an activating interrupt occurs in this state, the DMAC does not operate and does not hold the transfer request pending internally. Neither is a CPU interrupt requested. For this reason, before setting the DTME bit to 1, first clear the enable bit of the activating interrupt to 0. Then, after setting the DTME bit to 1, set the interrupt enable bit to 1 again. See section 8.6.5, Note on Activating DMAC by Internal Interrupts. 4. When the DTME bit is set to 1, the DMAC waits for the next transfer request. If it was halted in the middle of a block transfer, the rest of the block is transferred when the next transfer request occurs. Otherwise, the next block is transferred when the next transfer request occurs. 8.6.7 Memory and I/O Address Register Values
Table 8.14 indicates the address ranges that can be specified in the memory and I/O address registers (MAR and IOAR). Table 8.14 Address Ranges Specifiable in MAR and IOAR
1-Mbyte Mode MAR IOAR H'00000 to H'FFFFF (0 to 1048575) H'FFF00 to H'FFFFF (1048320 to 1048575) 16-Mbyte Mode H'000000 to H'FFFFFF (0 to 16777215) H'FFFF00 to H'FFFFFF (16776960 to 16777215)
MAR bits 23 to 20 are ignored in 1-Mbyte mode.
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Section 8 DMA Controller
8.6.8
Bus Cycle when Transfer Is Aborted
When a transfer is aborted by clearing the DTE bit or suspended by an NMI that clears the DTME bit, if this halts a channel for which the DMAC has a transfer request pending internally, a dead cycle may occur. This dead cycle does not update the halted channel's address register or counter value. Figure 8.27 shows an example in which an auto-requested transfer in cycle-steal mode on channel 0 is aborted by clearing the DTE bit in channel 0.
DMAC cycle Td Td
CPU cycle T1 T2 Td
DMAC cycle T1 T2 T1 T2 T1
CPU cycle T2 T3
CPU cycle T1 T2
Address bus
RD
HWR, LWR DTE bit is cleared
Figure 8.27 Bus Timing at Abort of DMA Transfer in Cycle-Steal Mode
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Section 8 DMA Controller
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Section 9 I/O Ports
Section 9 I/O Ports
9.1 Overview
The H8/3048B Group has 10 input/output ports (ports 1, 2, 3, 4, 5, 6, 8, 9, A, and B) and one input port (port 7). Table 9.1 summarizes the port functions. The pins in each port are multiplexed as shown in table 9.1. Each port has a data direction register (DDR) for selecting input or output, and a data register (DR) for storing output data. In addition to these registers, ports 2, 4, and 5 have an input pull-up MOS control register (PCR) for switching input pull-up MOS transistors on and off. Ports 1 to 6 and port 8 can drive one TTL load and a 90-pF capacitive load. Ports 9, A, and B can drive one TTL load and a 30-pF capacitive load. Ports 1 to 6 and 8 to B can drive a darlington pair. Ports 1, 2, 5, and B can drive LEDs (with 10-mA current sink). Pins P82 to P80, PA7 to PA0, and PB3 to PB0 have Schmitt-trigger input circuits. For block diagrams of the ports see appendix C, I/O Port Block Diagrams.
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Section 9 I/O Ports
Table 9.1
Port
Port Functions
Pins Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Mode 7
Description
Port 1 * 8-bit I/O port P17 to P10/ A7 to A0 * Can drive LEDs
Address output pins (A7 to A0)
Address output (A7 Generic to A0) and generic input/ output input DDR = 0: generic input DDR = 1: address output
Port 2 * 8-bit I/O port P27 to P20/ * Input pull-up A15 to A8 MOS * Can drive LEDs
Address output pins (A15 to A8)
Address output (A15 Generic to A8) and generic input/ input output DDR = 0: generic input DDR = 1: address output
Port 3 * 8-bit I/O port P37 to P30/ D15 to D8 Port 4 * 8-bit I/O port P47 to P40/ * Input pull-up D7 to D0 MOS Port 5 * 4-bit I/O port P53 to P50/ * Input pull-up A19 to A16 MOS * Can drive LEDs
Data input/output (D15 to D8)
Generic input/ output Generic input/ output
Data input/output (D7 to D0) and 8-bit generic input/output 8-bit bus mode: generic input/output 16-bit bus mode: data input/output Address output (A19 to A16)
Address output (A19 Generic to A16) and 4-bit input/ generic input output DDR = 0: generic input DDR = 1: address output
Port 6 * 7-bit I/O port P66/LWR, P65/HWR, P64/RD, P63/AS P62/BACK, P61/BREQ, P60/WAIT Port 7 * 8-bit I/O port P77/AN7/DA1, P76/AN6/DA0 P75 to P70/ AN5 to AN0
Bus control signal output (LWR, HWR, RD, AS)
Generic input/ output
Bus control signal input/output (BACK, BREQ, WAIT) and 3bit generic input/output Analog input (AN7, AN6) to A/D converter, analog output (DA1, DA0) from D/A converter, and generic input Analog input (AN5 to AN0) to A/D converter, and generic input
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Section 9 I/O Ports
Port Description Pins Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Mode 7 Generic input/ output IRQ3 to IRQ0 input and generic input/ output
Port 8 * 5-bit I/O port P84/CS0 * P82 to P80 have Schmitt inputs
DDR = 0: generic input DDR = 1 (after reset): CS0 output
P83/CS1/IRQ3, P82/CS2/IRQ2, P81/CS3/IRQ1
IRQ3 to IRQ1 input, CS1 to CS3 output, and generic input DDR = 0 (after reset): generic input DDR = 1: CS1 to CS3 output
P80/RFSH/IRQ0 IRQ0 input, RFSH output, and generic input/output
Port 9 * 6-bit I/O port P95/SCK1/IRQ5, Input and output (SCK1, SCK0, RxD1, RxD0, TxD1, TxD0) for serial P94/SCK0/IRQ4, communication interfaces 1 and 0 (SCI1/0), IRQ5 and IRQ4 input, and 6P93/RxD1, bit generic input/output P92/RxD0, P91/TxD1, P90/TxD0 Port A * 8-bit I/O port PA7/TP7/ TIOCB2/A20 * Schmitt inputs Output (TP7) from Address output (A20) programmable timing pattern controller (TPC), input or output (TIOCB2) for 16-bit integrated timer unit (ITU), and generic input/output TPC output (TP6 to TP4), ITU input and output (TIOCA2, TIOCB1, TIOCA1), CS4 to CS6 output, and generic input/ output TPC output (TP6 to TP4), ITU input and output (TIOCA2, TIOCB1, TIOCA1), address output (A23 to A21), CS4 to CS6 output, and generic input/output Address TPC TPC output output output (A20) (TP7), (TP7), ITU input ITU input or output or output (TIOCB2), (TIOCB2), and and generic generic input/ input/ output output TPC output (TP6 to TP4), ITU input and output (TIOCA2, TIOCB1, TIOCA1), CS4 to CS6 output, and generic input/ output TPC output (TP6 to TP4), ITU input and output (TIOCA2, TIOCB1, TIOCA1), address output (A23 to A21), CS4 to CS6 output, and generic input/out put TPC output (TP6 to TP4), ITU input and output (TIOCA2, TIOCB1, TIOCA1), and generic input/ output
PA6/TP6/ TIOCA2/A21/ CS4 PA5/TP5/ TIOCB1/A22/ CS5 PA4/TP4/ TIOCA1/A23/ CS6
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Section 9 I/O Ports
Port Description Pins Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Mode 7
Port A * 8-bit I/O port PA3/TP3/ TPC output (TP3 to TP0), output (TEND1, TEND0) from DMA controller TIOCB0/ (DMAC), ITU input and output (TCLKD, TCLKC, TCLKB, TCLKA, * Schmitt TIOCB0, TIOCA0), and generic input/output TCLKD, inputs PA2/TP2/ TIOCA0/ TCLKC, PA1/TP1/ TEND1/TCLKB, PA0/TP0/ TEND0/TCLKA Port B * 8-bit I/O port PB7/TP15/ TPC output (TP15), DMAC input (DREQ1), trigger input (ADTRG) to A/D DREQ1/ADTRG converter, and generic input/output * Can drive LEDs PB6/TP14/ TPC output (TP14), DMAC input (DREQ0), CS7 output, and TPC DREQ0,/CS7 generic input/output output * PB3 to PB0 (TP14), have DMAC Schmitt input inputs (DREQ0), and generic input/ output PB5/TP13/ TOCXB4, PB4/TP12/ TOCXA4, PB3/TP11/ TIOCB4, PB2/TP10/ TIOCA4, PB1/TP9/ TIOCB3, PB0/TP8/ TIOCA3 TPC output (TP13 to TP8), ITU input and output (TOCXB4, TOCXA4, TIOCB4, TIOCA4, TIOCB3, TIOCA3), and generic input/output
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Section 9 I/O Ports
9.2
9.2.1
Port 1
Overview
Port 1 is an 8-bit input/output port with the pin configuration shown in figure 9.1. The pin functions differ between the expanded modes with on-chip ROM disabled, expanded modes with on-chip ROM enabled, and single-chip mode. In modes 1 to 4 (expanded modes with on-chip ROM disabled), they are address bus output pins (A7 to A0). In modes 5 and 6 (expanded modes with on-chip ROM enabled), settings in the port 1 data direction register (P1DDR) can designate pins for address bus output (A7 to A0) or generic input. In mode 7 (single-chip mode), port 1 is a generic input/output port. When DRAM is connected to area 3, A7 to A0 output row and column addresses in read and write cycles. For details see section 7, Refresh Controller. Pins in port 1 can drive one TTL load and a 90-pF capacitive load. They can also drive a darlington transistor pair.
Port 1 pins P17 /A 7 P16 /A 6 P15 /A 5 Port 1 P14 /A 4 P13 /A 3 P12 /A 2 P11 /A 1 P10 /A 0 Modes 1 to 4 A 7 (output) A 6 (output) A 5 (output) A 4 (output) A 3 (output) A 2 (output) A 1 (output) A 0 (output) Modes 5 and 6 P17 (input)/A 7 (output) P16 (input)/A 6 (output) P15 (input)/A 5 (output) P14 (input)/A 4 (output) P13 (input)/A 3 (output) P12 (input)/A 2 (output) P11 (input)/A 1 (output) P10 (input)/A 0 (output) Mode 7 P17 (input/output) P16 (input/output) P15 (input/output) P14 (input/output) P13 (input/output) P12 (input/output) P11 (input/output) P10 (input/output)
Figure 9.1 Port 1 Pin Configuration
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Section 9 I/O Ports
9.2.2
Register Descriptions
Table 9.2 summarizes the registers of port 1. Table 9.2 Port 1 Registers
Initial Value Address* H'FFC0 H'FFC2 Note: * Name Port 1 data direction register Port 1 data register Lower 16 bits of the address. Abbreviation P1DDR P1DR R/W W R/W Modes 1 to 4 H'FF H'00 Modes 5 to 7 H'00 H'00
Port 1 Data Direction Register (P1DDR) P1DDR is an 8-bit write-only register that can select input or output for each pin in port 1.
Bit Modes Initial value 1 to 4 Read/Write Modes Initial value 5 to 7 Read/Write 7 1 0 W 6 1 0 W 5 1 0 W 4 1 0 W 3 1 0 W 2 1 0 W 1 1 0 W 0 1 0 W
P1 7 DDR P1 6 DDR P1 5 DDR P1 4 DDR P1 3 DDR P1 2 DDR P1 1 DDR P1 0 DDR
Port 1 data direction 7 to 0 These bits select input or output for port 1 pins
Modes 1 to 4 (Expanded Modes with On-Chip ROM Disabled): P1DDR values are fixed at 1 and cannot be modified. Port 1 functions as an address bus. Modes 5 and 6 (Expanded Modes with On-Chip ROM Enabled): A pin in port 1 becomes an address output pin if the corresponding P1DDR bit is set to 1, and a generic input pin if this bit is cleared to 0. Mode 7 (Single-Chip Mode): Port 1 functions as an input/output port. A pin in port 1 becomes an output pin if the corresponding P1DDR bit is set to 1, and an input pin if this bit is cleared to 0. In modes 5 to 7, P1DDR is a write-only register. Its value cannot be read. All bits return 1 when read.
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P1DDR is initialized to H'FF in modes 1 to 4 and H'00 in modes 5 to 7 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. If a P1DDR bit is set to 1, the corresponding pin maintains its output state in software standby mode. Port 1 Data Register (P1DR) P1DR is an 8-bit readable/writable register that stores output data for pins P17 to P10. While port 1 acts as an output port, the value of this register is output. When a bit in P1DDR is set to 1, if port 1 is read the value of the corresponding P1DR bit is returned. When a bit in P1DDR is cleared to 0, if port 1 is read the corresponding pin level is read.
Bit Initial value Read/Write 7 P17 0 R/W 6 P16 0 R/W 5 P15 0 R/W 4 P14 0 R/W 3 P13 0 R/W 2 P12 0 R/W 1 P11 0 R/W 0 P10 0 R/W
Port 1 data 7 to 0 These bits store data for port 1 pins
P1DR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting.
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Section 9 I/O Ports
9.3
9.3.1
Port 2
Overview
Port 2 is an 8-bit input/output port with the pin configuration shown in figure 9.2. The pin functions differ according to the operating mode. In modes 1 to 4 (expanded modes with on-chip ROM disabled), port 2 consists of address bus output pins (A15 to A8). In modes 5 and 6 (expanded modes with on-chip ROM enabled), settings in the port 2 data direction register (P2DDR) can designate pins for address bus output (A15 to A8) or generic input. In mode 7 (single-chip mode), port 2 is a generic input/output port. When DRAM is connected to area 3, A9 and A8 output row and column addresses in read and write cycles. For details see section 7, Refresh Controller. Port 2 has software-programmable built-in pull-up MOS. Pins in port 2 can drive one TTL load and a 90-pF capacitive load. They can also drive a darlington transistor pair.
Port 2 pins P27 /A 15 P26 /A 14 P25 /A 13 Port 2 P24 /A 12 P23 /A 11 P22 /A 10 P21 /A 9 P20 /A 8 Modes 1 to 4 A15 (output) A14 (output) A13 (output) A12 (output) A11 (output) A10 (output) A9 (output) A8 (output) Modes 5 and 6 P27 (input)/A15 (output) P26 (input)/A14 (output) P25 (input)/A13 (output) P24 (input)/A12 (output) P23 (input)/A11 (output) P22 (input)/A10 (output) P21 (input)/A9 (output) P20 (input)/A8 (output) Mode 7 P27 (input/output) P26 (input/output) P25 (input/output) P24 (input/output) P23 (input/output) P22 (input/output) P21 (input/output) P20 (input/output)
Figure 9.2 Port 2 Pin Configuration
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Section 9 I/O Ports
9.3.2
Register Descriptions
Table 9.3 summarizes the registers of port 2. Table 9.3 Port 2 Registers
Initial Value Address* H'FFC1 H'FFC3 H'FFD8 Note: * Name Port 2 data direction register Port 2 data register Port 2 input pull-up MOS control register Lower 16 bits of the address. Abbreviation P2DDR P2DR P2PCR R/W W R/W R/W Modes 1 to 4 H'FF H'00 H'00 Modes 5 to 7 H'00 H'00 H'00
Port 2 Data Direction Register (P2DDR) P2DDR is an 8-bit write-only register that can select input or output for each pin in port 2.
Bit Modes Initial value 1 to 4 Read/Write Modes Initial value 5 to 7 Read/Write 7 1 0 W 6 1 0 W 5 1 0 W 4 1 0 W 3 1 0 W 2 1 0 W 1 1 0 W 0 1 0 W
P2 7 DDR P2 6 DDR P2 5 DDR P2 4 DDR P2 3 DDR P2 2 DDR P2 1 DDR P2 0 DDR
Port 2 data direction 7 to 0 These bits select input or output for port 2 pins
Modes 1 to 4 (Expanded Modes with On-Chip ROM Disabled): P2DDR values are fixed at 1 and cannot be modified. Port 2 functions as an address bus. Modes 5 and 6 (Expanded Modes with On-Chip ROM Enabled): Following a reset, port 2 is an input port. A pin in port 2 becomes an address output pin if the corresponding P2DDR bit is set to 1, and a generic input port if this bit is cleared to 0. Mode 7 (Single-Chip Mode): Port 2 functions as an input/output port. A pin in port 2 becomes an output port if the corresponding P2DDR bit is set to 1, and an input port if this bit is cleared to 0. In modes 1 to 4, P2DDR always returns 1 when read. No value can be written to.
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In modes 5 to 7, P2DDR is a write-only register. Its value cannot be read. All bits return 1 when read. P2DDR is initialized to H'FF in modes 1 to 4 and H'00 in modes 5 to 7 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. If a P2DDR bit is set to 1, the corresponding pin maintains its output state in software standby mode. Port 2 Data Register (P2DR) P2DR is an 8-bit readable/writable register that stores output data for pins P27 to P20. While port 2 acts as an output port, the value of this register is output. When a bit in P2DDR is set to 1, if port 2 is read the value of the corresponding P2DR bit is returned. When a bit in P2DDR is cleared to 0, if port 2 is read the corresponding pin level is read.
Bit Initial value Read/Write 7 P2 7 0 R/W 6 P2 6 0 R/W 5 P2 5 0 R/W 4 P2 4 0 R/W 3 P2 3 0 R/W 2 P2 2 0 R/W 1 P2 1 0 R/W 0 P2 0 0 R/W
Port 2 data 7 to 0 These bits store data for port 2 pins
P2DR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Port 2 Input Pull-Up MOS Control Register (P2PCR) P2PCR is an 8-bit readable/writable register that controls the MOS input pull-up transistors in port 2.
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
P2 7 PCR P2 6 PCR P2 5 PCR P2 4 PCR P2 3 PCR P2 2 PCR P2 1 PCR P2 0 PCR
Port 2 input pull-up MOS control 7 to 0 These bits control input pull-up transistors built into port 2
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In modes 5 to 7, when a P2DDR bit is cleared to 0 (selecting generic input), if the corresponding bit from P27PCR to P20PCR is set to 1, the input pull-up MOS is turned on. P2PCR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Table 9.4 summarizes the states of the input pull-up transistors. Table 9.4
Mode 1 2 3 4 5 6 7 Legend: Off: The input pull-up MOS is always off. On/off: The input pull-up MOS is on if P2PCR = 1 and P2DDR = 0. Otherwise, it is off. Off Off On/off On/off
Input Pull-Up MOS States (Port 2)
Reset Off Hardware Standby Mode Off Software Standby Mode Off Other Modes Off
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Section 9 I/O Ports
9.4
9.4.1
Port 3
Overview
Port 3 is an 8-bit input/output port with the pin configuration shown in figure 9.3. Port 3 is a data bus in modes 1 to 6 (expanded modes) and a generic input/output port in mode 7 (single-chip mode). Pins in port 3 can drive one TTL load and a 90-pF capacitive load. They can also drive a darlington transistor pair.
Port 3 pins P37 /D15 P36 /D14 P35 /D13 Port 3 P34 /D12 P33 /D11 P32 /D10 P31 /D9 P30 /D8 Modes 1 to 6 D15 (input/output) D14 (input/output) D13 (input/output) D12 (input/output) D11 (input/output) D10 (input/output) D9 (input/output) D8 (input/output) Mode 7 P37 (input/output) P36 (input/output) P35 (input/output) P34 (input/output) P33 (input/output) P32 (input/output) P31 (input/output) P30 (input/output)
Figure 9.3 Port 3 Pin Configuration 9.4.2 Register Descriptions
Table 9.5 summarizes the registers of port 3. Table 9.5
Address* H'FFC4 H'FFC6 Note: *
Port 3 Registers
Name Port 3 data direction register Port 3 data register Lower 16 bits of the address. Abbreviation P3DDR P3DR R/W W R/W Initial Value H'00 H'00
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Port 3 Data Direction Register (P3DDR) P3DDR is an 8-bit write-only register that can select input or output for each pin in port 3.
Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W 3 0 W 2 0 W 1 0 W 0 0 W
P3 7 DDR P3 6 DDR P3 5 DDR P3 4 DDR P3 3 DDR P3 2 DDR P3 1 DDR P3 0 DDR
Port 3 data direction 7 to 0 These bits select input or output for port 3 pins
Modes 1 to 6 (Expanded Modes): Port 3 functions as a data bus. P3DDR is ignored. Mode 7 (Single-Chip Mode): Port 3 functions as an input/output port. A pin in port 3 becomes an output port if the corresponding P3DDR bit is set to 1, and an input port if this bit is cleared to 0. P3DDR is a write-only register. Its value cannot be read. All bits return 1 when read. P3DDR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. If a P3DDR bit is set to 1, the corresponding pin maintains its output state in software standby mode. Port 3 Data Register (P3DR) P3DR is an 8-bit readable/writable register that stores output data for pins P37 to P30. While port 3 acts as an output port, the value of this register is output. When a bit in P3DDR is set to 1, if port 3 is read the value of the corresponding P3DR bit is returned. When a bit in P3DDR is cleared to 0, if port 3 is read the corresponding pin level is read.
Bit Initial value Read/Write 7 P3 7 0 R/W 6 P3 6 0 R/W 5 P3 5 0 R/W 4 P3 4 0 R/W 3 P3 3 0 R/W 2 P3 2 0 R/W 1 P3 1 0 R/W 0 P3 0 0 R/W
Port 3 data 7 to 0 These bits store data for port 3 pins
P3DR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting.
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Section 9 I/O Ports
9.5
9.5.1
Port 4
Overview
Port 4 is an 8-bit input/output port with the pin configuration shown in figure 9.4. The pin functions differ according to the operating mode. In modes 1 to 6 (expanded modes), when the bus width control register (ABWCR) designates areas 0 to 7 all as 8-bit-access areas, the chip operates in 8-bit bus mode and port 4 is a generic input/output port. When at least one of areas 0 to 7 is designated as a 16-bit-access area, the chip operates in 16-bit bus mode and port 4 becomes part of the data bus. In mode 7 (single-chip mode), port 4 is a generic input/output port. Port 4 has software-programmable built-in pull-up MOS. Pins in port 4 can drive one TTL load and a 90-pF capacitive load. They can also drive a darlington transistor pair.
Port 4 pins P47 /D7 P46 /D6 P45 /D5 Port 4 P44 /D4 P43 /D3 P42 /D2 P41 /D1 P40 /D0 Modes 1 to 6 P47 (input/output)/D7 (input/output) P46 (input/output)/D6 (input/output) P45 (input/output)/D5 (input/output) P44 (input/output)/D4 (input/output) P43 (input/output)/D3 (input/output) P42 (input/output)/D2 (input/output) P41 (input/output)/D1 (input/output) P40 (input/output)/D0 (input/output) Mode 7 P47 (input/output) P46 (input/output) P45 (input/output) P44 (input/output) P43 (input/output) P42 (input/output) P41 (input/output) P40 (input/output)
Figure 9.4 Port 4 Pin Configuration
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Section 9 I/O Ports
9.5.2
Register Descriptions
Table 9.6 summarizes the registers of port 4. Table 9.6
Address* H'FFC5 H'FFC7 H'FFDA Note: *
Port 4 Registers
Name Port 4 data direction register Port 4 data register Port 4 input pull-up MOS control register Lower 16 bits of the address. Abbreviation P4DDR P4DR P4PCR R/W W R/W R/W Initial Value H'00 H'00 H'00
Port 4 Data Direction Register (P4DDR) P4DDR is an 8-bit write-only register that can select input or output for each pin in port 4.
Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W 3 0 W 2 0 W 1 0 W 0 0 W
P4 7 DDR P4 6 DDR P4 5 DDR P4 4 DDR P4 3 DDR P4 2 DDR P4 1 DDR P4 0 DDR
Port 4 data direction 7 to 0 These bits select input or output for port 4 pins
Modes 1 to 6 (Expanded Modes): When all areas are designated as 8-bit-access areas using the bus width control register (ABWCR) of the bus controller, selecting 8-bit bus mode, port 4 functions as a generic input/output port. A pin in port 4 becomes an output port if the corresponding P4DDR bit is set to 1, and an input port if this bit is cleared to 0. When at least one area is designated as a 16-bit-access area, selecting 16-bit bus mode, port 4 functions as part of the data bus regardless of the value in P4DDR. Mode 7 (Single-Chip Mode): Port 4 functions as an input/output port. A pin in port 4 becomes an output port if the corresponding P4DDR bit is set to 1, and an input port if this bit is cleared to 0. P4DDR is a write-only register. Its value cannot be read. All bits return 1 when read. P4DDR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting.
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ABWCR and P4DDR are not initialized in software standby mode. When port 4 functions as a generic input/output port, if a P4DDR bit is set to 1, the corresponding pin maintains its output state in software standby mode. Port 4 Data Register (P4DR) P4DR is an 8-bit readable/writable register that stores output data for pins P47 to P40. While port 4 acts as an output port, the value of this register is output. When a bit in P4DDR is set to 1, if port 4 is read the value of the corresponding P4DR bit is returned. When a bit in P4DDR is cleared to 0, if port 4 is read the corresponding pin level is read.
Bit Initial value Read/Write 7 P4 7 0 R/W 6 P4 6 0 R/W 5 P4 5 0 R/W 4 P4 4 0 R/W 3 P4 3 0 R/W 2 P4 2 0 R/W 1 P4 1 0 R/W 0 P4 0 0 R/W
Port 4 data 7 to 0 These bits store data for port 4 pins
P4DR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Port 4 Input Pull-Up MOS Control Register (P4PCR) P4PCR is an 8-bit readable/writable register that controls the MOS input pull-up transistors in port 4.
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
P4 7 PCR P4 6 PCR P4 5 PCR P4 4 PCR P4 3 PCR P4 2 PCR P4 1 PCR P4 0 PCR
Port 4 input pull-up MOS control 7 to 0 These bits control input pull-up MOS transistors built into port 4
In mode 7 (single-chip mode), and in 8-bit bus mode in modes 1 to 6 (expanded modes), when a P4DDR bit is cleared to 0 (selecting generic input), if the corresponding P4PCR bit is set to 1, the input pull-up MOS transistor is turned on.
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P4PCR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Table 9.7 summarizes the states of the input pull-ups MOS in the 8-bit and 16-bit bus modes. Table 9.7
Mode 1 to 6 7 8-bit bus mode 16-bit bus mode
Input Pull-Up MOS Transistor States (Port 4)
Reset Off Hardware Standby Mode Off Software Standby Mode On/off Off On/off Other Modes On/off Off On/off
Legend: Off: The input pull-up MOS transistor is always off. On/off: The input pull-up MOS transistor is on if P4PCR = 1 and P4DDR = 0. Otherwise, it is off.
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Section 9 I/O Ports
9.6
9.6.1
Port 5
Overview
Port 5 is a 4-bit input/output port with the pin configuration shown in figure 9.5. The pin functions differ depending on the operating mode. In modes 1 to 4 (expanded modes with on-chip ROM disabled), port 5 consists of address output pins (A19 to A16). In modes 5 and 6 (expanded modes with on-chip ROM enabled), settings in the port 5 data direction register (P5DDR) designate pins for address bus output (A19 to A16) or generic input. In mode 7 (single-chip mode), port 5 is a generic input/output port. Port 5 has software-programmable built-in pull-up MOS transistors. Pins in port 5 can drive one TTL load and a 90-pF capacitive load. They can also drive an LED or a darlington transistor pair.
Port 5 pins P53 /A 19 Port 5 P52 /A 18 P51 /A 17 P50 /A 16 Modes 1 to 4 A19 (output) A18 (output) A17 (output) A16 (output) Modes 5 and 6 P5 3 (input)/A19 (output) P5 2 (input)/A18 (output) P5 1 (input)/A17 (output) P5 0 (input)/A16 (output) Mode 7 P5 3 (input/output) P5 2 (input/output) P5 1 (input/output) P5 0 (input/output)
Figure 9.5 Port 5 Pin Configuration
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Section 9 I/O Ports
9.6.2
Register Descriptions
Table 9.8 summarizes the registers of port 5. Table 9.8 Port 5 Registers
Initial Value Address* H'FFC8 H'FFCA H'FFDB Note: * Name Port 5 data direction register Port 5 data register Port 5 input pull-up MOS control register Lower 16 bits of the address. Abbreviation P5DDR P5DR P5PCR R/W W R/W R/W Modes 1 to 4 H'FF H'F0 H'F0 Modes 5 to 7 H'F0 H'F0 H'F0
Port 5 Data Direction Register (P5DDR) P5DDR is an 8-bit write-only register that can select input or output for each pin in port 5. Bits 7 to 4 are reserved. They cannot be modified and are always read as 1.
Bit Modes Initial value 1 to 4 Read/Write Modes Initial value 5 to 7 Read/Write 7 1 1 6 1 1 Reserved bits 5 1 1 4 1 1 3 1 0 W 2 1 0 W 1 1 0 W 0 1 0 W
P5 3 DDR P5 2 DDR P5 1 DDR P5 0 DDR
Port 5 data direction 3 to 0 These bits select input or output for port 5 pins
Modes 1 to 4 (Expanded Modes with On-Chip ROM Disabled): P5DDR values are fixed at 1 and cannot be modified. Port 5 functions as an address bus. Modes 5 and 6 (Expanded Modes with On-Chip ROM Enabled): Following a reset, port 5 is an input port. A pin in port 5 becomes an address output pin if the corresponding P5DDR bit is set to 1, and an input port if this bit is cleared to 0.
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Section 9 I/O Ports
Mode 7 (Single-Chip Mode): Port 5 functions as an input/output port. A pin in port 5 becomes an output port if the corresponding P5DDR bit is set to 1, and an input port if this bit is cleared to 0. In modes 1 to 4, P5DDR always returns 1 when read. No value can be written to. In modes 5 to 7, P5DDR is a write-only register. Its value cannot be read. All bits return 1 when read. P5DDR is initialized to H'FF in modes 1 to 4 and H'F0 in modes 5 to 7 by a reset and in hardware standby mode. In software standby mode it retains its previous setting, so if a P5DDR bit is set to 1 while port 5 acts as an I/O port, the corresponding pin maintains its output state in software standby mode. Port 5 Data Register (P5DR) P5DR is an 8-bit readable/writable register that stores output data for pins P53 to P50. While port 5 acts as an output port, the value of this register is output. When a bit in P5DDR is set to 1, if port 5 is read the value of the corresponding P5DR bit is returned. When a bit in P5DDR is cleared to 0, if port 5 is read the corresponding pin level is read. Bits 7 to 4 are reserved. They cannot be modified and are always read as 1.
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 P5 3 0 R/W 2 P5 2 0 R/W 1 P5 1 0 R/W 0 P5 0 0 R/W
Reserved bits
Port 5 data 3 to 0 These bits store data for port 5 pins
P5DR is initialized to H'F0 by a reset and in hardware standby mode. In software standby mode it retains its previous setting.
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Port 5 Input Pull-Up MOS Control Register (P5PCR) P5PCR is an 8-bit readable/writable register that controls the MOS input pull-up MOS transistors in port 5. Bits 7 to 4 are reserved. They cannot be modified and are always read as 1.
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
P5 3 PCR P5 2 PCR P5 1 PCR P5 0 PCR
Reserved bits
Port 5 input pull-up MOS control 3 to 0 These bits control input pull-up MOS transistors built into port 5
In modes 5 to 7, when a P5DDR bit is cleared to 0 (selecting generic input), if the corresponding bit from P53PCR to P50PCR is set to 1, the input pull-up MOS transistor is turned on. P5PCR is initialized to H'F0 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Table 9.9 summarizes the states of the input pull-ups MOS in each mode. Table 9.9
Mode 1 2 3 4 5 6 7 Legend: Off: The input pull-up MOS transistor is always off. On/off: The input pull-up MOS transistor is on if P5PCR = 1 and P5DDR = 0. Otherwise, it is off. Off Off On/off On/off
Input Pull-Up MOS Transistor States (Port 5)
Reset Off Hardware Standby Mode Off Software Standby Mode Off Other Modes Off
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Section 9 I/O Ports
9.7
9.7.1
Port 6
Overview
Port 6 is a 7-bit input/output port that is also used for input and output of bus control signals (LWR, HWR, RD, AS, BACK, BREQ, and WAIT). When DRAM is connected to area 3, LWR, HWR, and RD also function as LW, UW, and CAS, or LCAS, UCAS, and WE, respectively. For details see section 7, Refresh Controller. Figure 9.6 shows the pin configuration of port 6. In modes 1 to 6 (expanded modes) the pin functions are LWR, HWR, RD, AS, P62/BACK, P61/BREQ, and P60/WAIT. See table 9.11 for the method of selecting the pin states. In mode 7 (single-chip mode) port 6 is a generic input/output port. Pins in port 6 can drive one TTL load and a 30-pF capacitive load. They can also drive a darlington transistor pair.
Port 6 pins P6 6 / LWR P6 5 / HWR P6 4 / RD Port 6 P6 3 / AS P6 2 / BACK P6 1 / BREQ P6 0 / WAIT
Modes 1 to 6 (expanded modes) LWR (output) HWR (output) RD AS (output) (output)
Mode 7 (single-chip mode) P6 6 (input/output) P6 5 (input/output) P6 4 (input/output) P6 3 (input/output) P6 2 (input/output) P6 1 (input/output) P6 0 (input/output)
P6 2 (input/output)/ BACK (output) P6 1 (input/output)/ BREQ (input) P6 0 (input/output)/ WAIT (input)
Figure 9.6 Port 6 Pin Configuration
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Section 9 I/O Ports
9.7.2
Register Descriptions
Table 9.10 summarizes the registers of port 6. Table 9.10 Port 6 Registers
Initial Value Address* H'FFC9 H'FFCB Note: * Name Port 6 data direction register Port 6 data register Lower 16 bits of the address. Abbreviation P6DDR P6DR R/W W R/W Modes 1 to 5 H'F8 H'80 Modes 6, 7 H'80 H'80
Port 6 Data Direction Register (P6DDR) P6DDR is an 8-bit write-only register that can select input or output for each pin in port 6. Bit 7 is reserved. It cannot be modified and is always read as 1.
Bit Initial value Read/Write 7 1 Reserved bit 6 0 W 5 0 W 4 0 W 3 0 W 2 0 W 1 0 W 0 0 W
P6 6 DDR P6 5 DDR P6 4 DDR P6 3 DDR P6 2 DDR P6 1 DDR P6 0 DDR
Port 6 data direction 6 to 0 These bits select input or output for port 6 pins
Modes 1 to 6 (Expanded Modes): Ports P66 to P63 function as bus control output pins (LWR, HWR, RD, AS), regardless of the settings of P66DDR to P63DDR. Ports P62 to P60 function as the bus control pins (BACK, BREQ, WAIT) or I/O ports. For selecting the pin function, see table 9.11. When ports P62 to P60 function as I/O ports and if P6DDR is set to 1, the corresponding pin of port 6 functions as an output port. If P6DDR is cleared to 0, the corresponding pin functions as an input port. Mode 7 (Single-Chip Mode): Port 6 is a generic input/output port. A pin in port 6 becomes an output port if the corresponding P6DDR bit is set to 1, and an input port if this bit is cleared to 0. P6DDR is a write-only register. Its value cannot be read. All bits return 1 when read. P6DDR is initialized to H'80 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. If a P6DDR bit is set to 1 while port 6 acts as an I/O port, the corresponding pin maintains its output state in software standby mode.
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Section 9 I/O Ports
Port 6 Data Register (P6DR) P6DR is an 8-bit readable/writable register that stores output data for pins P66 to P60. When this register is read, bits 6 to 0 each returns the logic level of the pin, when the corresponding bit of P6DDR is 0. When the corresponding bit of P6DDR is 1, bits 6 to 0 return the P6DR value.
Bit Initial value Read/Write 7 1 Reserved bit 6 P6 6 0 R/W 5 P6 5 0 R/W 4 P6 4 0 R/W 3 P6 3 0 R/W 2 P6 2 0 R/W 1 P6 1 0 R/W 0 P6 0 0 R/W
Port 6 data 6 to 0 These bits store data for port 6 pins
Bit 7 is reserved, cannot be modified, and always read as 1. P6DR is initialized to H'80 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Table 9.11 Port 6 Pin Functions in Modes 1 to 6
Pin P66/LWR Pin Functions and Selection Method Functions as follows regardless of P66DDR P66DDR Pin function P65/HWR 0 LWR output 1
Functions as follows regardless of P65DDR P65DDR Pin function 0 HWR output 1
P64/RD
Functions as follows regardless of P64DDR P64DDR Pin function 0 RD output 1
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Section 9 I/O Ports Pin P63/AS Pin Functions and Selection Method Functions as follows regardless of P63DDR P63DDR Pin function P62/BACK 0 AS output 1
Bit BRLE in BRCR and bit P62DDR select the pin function as follows BRLE P62DDR Pin function 0 P62 input 0 1 P62 output 1 -- BACK output
P61/BREQ
Bit BRLE in BRCR and bit P61DDR select the pin function as follows BRLE P61DDR Pin function 0 P61 input 0 1 P61 output 1 -- BREQ input
P60/WAIT
Bits WCE7 to WCE0 in WCER, bit WMS1 in WCR, and bit P60DDR select the pin function as follows WCER WMS1 P60DDR Pin function Note: * 0 P60 input Do not set bit P60DDR to 1. 0 1 P60 output All 1s 1 0* WAIT input Not all 1s -- 0*
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Section 9 I/O Ports
9.8
9.8.1
Port 7
Overview
Port 7 is an 8-bit input port that is also used for analog input to the A/D converter and analog output from the D/A converter. The pin functions are the same in all operating modes. Figure 9.7 shows the pin configuration of port 7. For the analog input pins of the A/D converter, see section 15, A/D Converter. For the analog input pins of the D/A converter, see section 16, D/A Converter.
Port 7 pins P77 (input)/AN 7 (input)/DA 1 (output) P76 (input)/AN 6 (input)/DA 0 (output) P75 (input)/AN 5 (input) Port 7 P74 (input)/AN 4 (input) P73 (input)/AN 3 (input) P72 (input)/AN 2 (input) P71 (input)/AN 1 (input) P70 (input)/AN 0 (input)
Figure 9.7 Port 7 Pin Configuration
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Section 9 I/O Ports
9.8.2
Register Description
Table 9.12 summarizes the port 7 register. Port 7 is an input-only port, so it has no data direction register. Table 9.12 Port 7 Data Register
Address* H'FFCE Note: * Name Port 7 data register Lower 16 bits of the address. Abbreviation P7DR R/W R Initial Value Undetermined
Port 7 Data Register (P7DR)
Bit Initial value Read/Write 7 P77 * R 6 P76 * R 5 P75 * R 4 P74 * R 3 P73 * R 2 P72 * R 1 P71 * R 0 P70 * R
Note: * Determined by pins P77 to P70.
When P7DR is read, the logic level of the pin is always read. No data can be written to.
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Section 9 I/O Ports
9.9
9.9.1
Port 8
Overview
Port 8 is a 5-bit input/output port that is also used for CS3 to CS0 output, RFSH output, and IRQ3 to IRQ0 input. Figure 9.8 shows the pin configuration of port 8. In modes 1 to 6 (expanded modes), port 8 can provide CS3 to CS0 output, RFSH output, and IRQ3 to IRQ0 input. See table 9.14 for the selection of pin functions in expanded modes. In mode 7 (single-chip mode), port 8 can provide IRQ3 to IRQ0 input. See table 9.15 for the selection of pin functions in single-chip mode. The IRQ3 to IRQ0 functions are selected by IER settings, regardless of whether the pin is used for input or output. For details see section 5, Interrupt Controller. Pins in port 8 can drive one TTL load and a 90-pF capacitive load. They can also drive a darlington transistor pair. Pins P82 to P80 have Schmitt-trigger inputs.
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Section 9 I/O Ports
Port 8 pins P84 / CS 0 P83 / CS 1 / IRQ 3 Port 8 P82 / CS 2 / IRQ 2 P81 / CS 3 / IRQ 1 P80 / RFSH /IRQ 0
Pin functions in modes 1 to 6 (expanded modes) P84 (input)/ CS 0 (output) P83 (input)/ CS 1 (output)/ IRQ 3 (input) P82 (input)/ CS 2 (output)/ IRQ 2 (input) P81 (input)/ CS 3 (output)/ IRQ 1 (input) P80 (input/output)/ RFSH (output)/ IRQ 0 (input)
Pin functions in mode 7 (single-chip mode) P84 /(input/output) P83 /(input/output)/ IRQ 3 (input) P82 /(input/output)/ IRQ 2 (input) P81 /(input/output)/ IRQ 1 (input) P80 /(input/output)/ IRQ 0 (input)
Figure 9.8 Port 8 Pin Configuration 9.9.2 Register Descriptions
Table 9.13 summarizes the registers of port 8. Table 9.13 Port 8 Registers
Initial Value Address* H'FFCD H'FFCF Note: * Name Port 8 data direction register Port 8 data register Lower 16 bits of the address. Abbreviation P8DDR P8DR R/W W R/W Modes 1 to 4 H'F0 H'E0 Modes 5 to 7 H'E0 H'E0
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Port 8 Data Direction Register (P8DDR) P8DDR is an 8-bit write-only register that can select input or output for each pin in port 8. Bits 7 to 5 are reserved. They cannot be modified and are always read as 1.
Bit Modes Initial value 1 to 4 Read/Write Modes Initial value 5 to 7 Read/Write 7 1 1 6 1 1 5 1 1 4 1 W 0 W 3 0 W 0 W 2 0 W 0 W 1 0 W 0 W 0 0 W 0 W
P8 4 DDR P8 3 DDR P8 2 DDR P8 1 DDR P8 0 DDR
Reserved bits
Port 8 data direction 4 to 0 These bits select input or output for port 8 pins
Modes 1 to 6 (Expanded Modes): When bits in P8DDR bit are set to 1, P84 to P81 become CS0 to CS3 output pins. When bits in P8DDR are cleared to 0, the corresponding pins become input ports. In modes 1 to 4 (expanded modes with on-chip ROM disabled), following a reset only CS0 is output. The other three pins are input ports. In modes 5 and 6 (expanded modes with on-chip ROM enabled), following a reset all four pins are input ports. When the refresh controller is enabled, P80 is used unconditionally for RFSH output. When the refresh controller is disabled, P80 becomes a generic input/output port according to the P8DDR setting. For details see table 9.15. Mode 7 (Single-Chip Mode): Port 8 is a generic input/output port. A pin in port 8 becomes an output port if the corresponding P8DDR bit is set to 1, and an input port if this bit is cleared to 0. P8DDR is a write-only register. Its value cannot be read. All bits return 1 when read. P8DDR is initialized to H'F0 in modes 1 to 4 and H'E0 in modes 5 to 7 by a reset and in hardware standby mode. In software standby mode it retains its previous setting, so if a P8DDR bit is set to 1 while port 8 acts as an I/O port, the corresponding pin maintains its output state in software standby mode.
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Section 9 I/O Ports
Port 8 Data Register (P8DR) P8DR is an 8-bit readable/writable register that stores output data for pins P84 to P80. While port 8 acts as an output port, the value of this register is output. When a bit in P8DDR is set to 1, if port 8 is read the value of the corresponding P8DR bit is returned. When a bit in P8DDR is cleared to 0, if port 8 is read the corresponding pin level is read. Bits 7 to 5 are reserved. They cannot be modified and always are read as 1.
Bit Initial value Read/Write 7 1 6 1 Reserved bits 5 1 4 P8 4 0 R/W 3 P8 3 0 R/W 2 P8 2 0 R/W 1 P8 1 0 R/W 0 P8 0 0 R/W
Port 8 data 4 to 0 These bits store data for port 8 pins
P8DR is initialized to H'E0 by a reset and in hardware standby mode. In software standby mode it retains its previous setting.
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Section 9 I/O Ports
Table 9.14 Port 8 Pin Functions in Modes 1 to 6
Pin P84/CS0 Pin Functions and Selection Method Bit P84DDR selects the pin function as follows P84DDR Pin function P83/CS1/IRQ3 0 P84 input 1 CS0 output
Bit P83DDR selects the pin function as follows P83DDR Pin function 0 P83 input IRQ3 input 1 CS1 output
P82/CS2/IRQ2
Bit P82DDR selects the pin function as follows P82DDR Pin function 0 P82 input IRQ2 input 1 CS2 output
P81/CS3/IRQ1
Bit P81DDR selects the pin function as follows P81DDR Pin function 0 P81 input IRQ1 input 1 CS3 output
P80/RFSH/IRQ0
Bit RFSHE in RFSHCR and bit P80DDR select the pin function as follows RFSHE P80DDR Pin function 0 P80 input 0 1 P80 output IRQ0 input 1 -- RFSH output
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Table 9.15 Port 8 Pin Functions in Mode 7
Pin P84 Pin Functions and Selection Method Bit P84DDR selects the pin function as follows P84DDR Pin function P83/IRQ3 0 P84 input 1 P84 output
Bit P83DDR selects the pin function as follows P83DDR Pin function 0 P83 input IRQ3 input 1 P83 output
P82/IRQ2
Bit P82DDR selects the pin function as follows P82DDR Pin function 0 P82 input IRQ2 input 1 P82 output
P81/IRQ1
Bit P81DDR selects the pin function as follows P81DDR Pin function 0 P81 input IRQ1 input 1 P81 output
P80/IRQ0
Bit P80DDR select the pin function as follows P80DDR Pin function 0 P80 input IRQ0 input 1 P80 output
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Section 9 I/O Ports
9.10
9.10.1
Port 9
Overview
Port 9 is a 6-bit input/output port that is also used for input and output (TxD0, TxD1, RxD0, RxD1, SCK0, SCK1) by serial communication interface channels 0 and 1 (SCI0 and SCI1), and for IRQ5 and IRQ4 input. See table 9.17 for the selection of pin functions. The IRQ5 and IRQ4 functions are selected by IER settings, regardless of whether the pin is used for input or output. For details see section 5, Interrupt Controller. Port 9 has the same set of pin functions in all operating modes. Figure 9.9 shows the pin configuration of port 9. Pins in port 9 can drive one TTL load and a 30-pF capacitive load. They can also drive a darlington transistor pair.
Port 9 pins P95 (input/output)/SCK 1 (input/output)/IRQ 5 (input) P94 (input/output)/SCK 0 (input/output)/IRQ 4 (input) Port 9 P93 (input/output)/RxD1 (input) P92 (input/output)/RxD0 (input) P91 (input/output)/TxD1 (output) P90 (input/output)/TxD0 (output)
Figure 9.9 Port 9 Pin Configuration
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Section 9 I/O Ports
9.10.2
Register Descriptions
Table 9.16 summarizes the registers of port 9. Table 9.16 Port 9 Registers
Address* H'FFD0 H'FFD2 Note: * Name Port 9 data direction register Port 9 data register Lower 16 bits of the address. Abbreviation P9DDR P9DR R/W W R/W Initial Value H'C0 H'C0
Port 9 Data Direction Register (P9DDR) P9DDR is an 8-bit write-only register that can select input or output for each pin in port 9. Bits 7 and 6 are reserved. They cannot be modified and are always read as 1.
Bit Initial value Read/Write 7 1 6 1 5 0 W 4 0 W 3 0 W 2 0 W 1 0 W 0 0 W
P9 5 DDR P9 4 DDR P9 3 DDR P9 2 DDR P9 1 DDR P9 0 DDR
Reserved bits
Port 9 data direction 5 to 0 These bits select input or output for port 9 pins
While port 9 acts as an I/O port, a pin in port 9 becomes an output port if the corresponding P9DDR bit is set to 1, and an input port if this bit is cleared to 0. For selecting the pin function, see table 9.17. P9DDR is a write-only register. Its value cannot be read. All bits return 1 when read. P9DDR is initialized to H'C0 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. If a P9DDR bit is set to 1 while port 9 acts as an I/O port, the corresponding pin maintains its output state in software standby mode.
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Section 9 I/O Ports
Port 9 Data Register (P9DR) P9DR is an 8-bit readable/writable register that stores output data for pins P95 to P90. While port 9 acts as an output port, the value of this register is output. When a bit in P9DDR is set to 1, if port 9 is read the value of the corresponding P9DR bit is returned. When a bit in P9DDR is cleared to 0, if port 9 is read the corresponding pin level is read.
Bit Initial value Read/Write 7 1 6 1 5 P9 5 0 R/W 4 P9 4 0 R/W 3 P9 3 0 R/W 2 P9 2 0 R/W 1 P9 1 0 R/W 0 P9 0 0 R/W
Reserved bits
Port 9 data 5 to 0 These bits store data for port 9 pins
Bits 7 and 6 are reserved. They cannot be modified and are always read as 1. P9DR is initialized to H'C0 by a reset and in hardware standby mode. In software standby mode it retains its previous setting.
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Table 9.17 Port 9 Pin Functions
Pin P95/SCK1/IRQ5 Pin Functions and Selection Method Bit C/A in SMR of SCI1, bits CKE0 and CKE1 in SCR of SCI1, and bit P95DDR select the pin function as follows CKE1 C/A CKE0 P95DDR Pin function 0 P95 input 0 1 P95 output 0 1 -- SCK1 output IRQ5 input P94/SCK0/IRQ4 Bit C/A in SMR of SCI0, bits CKE0 and CKE1 in SCR of SCI0, and bit P94DDR select the pin function as follows CKE1 C/A CKE0 P94DDR Pin function 0 P94 input 0 1 P94 output 0 1 -- SCK0 output IRQ4 input P93/RxD1 Bit RE in SCR of SCI1 and bit P93DDR select the pin function as follows RE P93DDR Pin function P92/RxD0 0 P93 input 0 1 P93 output 1 -- RxD1 input 0 1 -- -- SCK0 output 1 -- -- -- SCK0 input 0 1 -- -- SCK1 output 1 -- -- -- SCK1 input
Bit RE in SCR of SCI0, bit SMIF in SCMR, and bit P92DDR select the pin function as follows SMIF RE P92DDR Pin function 0 P92 input 0 1 P92 output 0 1 -- RxD0 input 1 -- -- RxD0 input
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Section 9 I/O Ports Pin P91/TxD1 Pin Functions and Selection Method Bit TE in SCR of SCI1 and bit P91DDR select the pin function as follows TE P91DDR Pin function P90/TxD0 0 P91 input 0 1 P91 output 1 -- TxD1 output
Bit TE in SCR of SCI0, bit SMIF in SCMR, and bit P90DDR select the pin function as follows SMIF TE P90DDR Pin function Note: * 0 P90 input 0 1 P90 output 0 1 -- TxD0 output 1 -- -- TxD0 output*
Functions as the TxD0 output pin, but there are two states: one in which the pin is driven, and another in which the pin is at highimpedance.
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Section 9 I/O Ports
9.11
9.11.1
Port A
Overview
Port A is an 8-bit input/output port that is also used for output (TP7 to TP0) from the programmable timing pattern controller (TPC), input and output (TIOCB2, TIOCA2, TIOCB1, TIOCA1, TIOCB0, TIOCA0, TCLKD, TCLKC, TCLKB, TCLKA) by the 16-bit integrated timer unit (ITU), output (TEND1, TEND0) from the DMA controller (DMAC), CS4 to CS6 output, and address output (A23 to A20). A reset or hardware standby leaves port A as an input port, except that in modes 3, 4, and 6, one pin is always used for A20 output. For selecting the pin function, see table 9.19. Usage of pins for TPC, ITU, and DMAC input and output is described in the sections on those modules. For output of address bits A23 to A21 in modes 3, 4, and 6, see section 6.2.5, Bus Release Control Register (BRCR). For output of CS4 to CS6 in modes 1 to 6, see section 6.3.2, Chip Select Signals. Pins not assigned to any of these functions are available for generic input/output. Figure 9.10 shows the pin configuration of port A. Pins in port A can drive one TTL load and a 30-pF capacitive load. They can also drive a darlington transistor pair. Port A has Schmitt-trigger inputs.
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Section 9 I/O Ports
Port A pins PA 7/TP7 /TIOCB2 /A 20 PA 6/TP6 /TIOCA2 /A21/CS4 PA 5/TP5 /TIOCB1 /A22/CS5 PA 4/TP4 /TIOCA1 /A23/CS6 Port A PA 3/TP3 /TIOCB 0 /TCLKD PA 2/TP2 /TIOCA 0 /TCLKC PA 1/TP1 /TEND1 /TCLKB PA 0/TP0 /TEND0 /TCLKA Pin functions in modes 1, 2, and 5 PA 7 (input/output)/TP7 (output)/TIOCB 2 (input/output) PA 6 (input/output)/TP6 (output)/TIOCA 2 (input/output)/CS4 (output) PA 5 (input/output)/TP5 (output)/TIOCB 1 (input/output)/CS5(output) PA 4 (input/output)/TP4 (output)/TIOCA 1 (input/output)/CS6(output) PA 3 (input/output)/TP3 (output)/TIOCB 0 (input/output)/TCLKD (input) PA 2 (input/output)/TP2 (output)/TIOCA 0 (input/output)/TCLKC (input) PA 1 (input/output)/TP1 (output)/TEND 1 (output)/TCLKB (input) PA 0 (input/output)/TP0 (output)/TEND 0 (output)/TCLKA (input) Pin functions in modes 3, 4, and 6 A20 (output) PA 6 (input/output)/TP6 (output)/TIOCA 2 (input/output)/A 21 (output)/CS4 (output) PA 5 (input/output)/TP5 (output)/TIOCB 1 (input/output)/A 22 (output)/CS5 (output) PA 4 (input/output)/TP4 (output)/TIOCA 1 (input/output)/A 23 (output)/CS6 (output) PA 3 (input/output)/TP3 (output)/TIOCB 0 (input/output)/TCLKD (input) PA 2 (input/output)/TP2 (output)/TIOCA 0 (input/output)/TCLKC (input) PA 1 (input/output)/TP1 (output)/TEND 1 (output)/TCLKB (input) PA 0 (input/output)/TP0 (output)/TEND 0 (output)/TCLKA (input) Pin functions in mode 7 PA7 (input/output)/TP7 (output)/TIOCB2 (input/output) PA6 (input/output)/TP6 (output)/TIOCA2 (input/output) PA5 (input/output)/TP5 (output)/TIOCB1 (input/output) PA4 (input/output)/TP4 (output)/TIOCA1 (input/output) PA3 (input/output)/TP3 (output)/TIOCB0 (input/output)/TCLKD (input) PA2 (input/output)/TP2 (output)/TIOCA0 (input/output)/TCLKC (input) PA1 (input/output)/TP1 (output)/TEND1 (output)/TCLKB (input) PA0 (input/output)/TP0 (output)/TEND0 (output)/TCLKA (input)
Figure 9.10 Port A Pin Configuration
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Section 9 I/O Ports
9.11.2
Register Descriptions
Table 9.18 summarizes the registers of port A. Table 9.18 Port A Registers
Initial Value Address* H'FFD1 H'FFD3 Note: * Name Port A data direction register Port A data register Lower 16 bits of the address. Abbreviation PADDR PADR R/W W R/W Modes 1, 2, 5, and 7 H'00 H'00 Modes 3, 4, and 6 H'80 H'00
Port A Data Direction Register (PADDR) PADDR is an 8-bit write-only register that can select input or output for each pin in port A. When pins are used for TPC output, the corresponding PADDR bits must also be set.
Bit Modes 3, 4, and 6 Modes 1, 2, 5, and 7 Initial value Initial value 7 1 0 6 0 W 0 W 5 0 W 0 W 4 0 W 0 W 3 0 W 0 W 2 0 W 0 W 1 0 W 0 W 0 0 W 0 W
PA7 DDR PA6 DDR PA5 DDR PA4 DDR PA3 DDR PA2 DDR PA1 DDR PA0 DDR Read/Write Read/Write W
Port A data direction 7 to 0 These bits select input or output for port A pins
While port A acts as an I/O port, a pin in port A becomes an output pin if the corresponding PADDR bit is set to 1, and an input pin if this bit is cleared to 0. In modes 3, 4, and 6, PA7DDR is fixed at 1 and PA7 functions as an address output pin. PADDR is a write-only register. Its value cannot be read. All bits return 1 when read. PADDR is initialized to H'00 by a reset and in hardware standby mode in modes 1, 2, 5, and 7. It is initialized to H'80 by a reset and in hardware standby mode in modes 3, 4, and 6. In software standby mode it retains its previous setting. If a PADDR bit is set to 1, the corresponding pin maintains its output state in software standby mode.
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Port A Data Register (PADR) PADR is an 8-bit readable/writable register that stores output data for pins PA7 to PA0. While port A acts as an output port, the value of this register is output. When a bit in PADDR is set to 1, if port A is read the value of the corresponding PADR bit is returned. When a bit in PADDR is cleared to 0, if port A is read the corresponding pin level is read.
Bit Initial value Read/Write 7 PA 7 0 R/W 6 PA 6 0 R/W 5 PA 5 0 R/W 4 PA 4 0 R/W 3 PA 3 0 R/W 2 PA 2 0 R/W 1 PA 1 0 R/W 0 PA 0 0 R/W
Port A data 7 to 0 These bits store data for port A pins
PADR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting.
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Section 9 I/O Ports
9.11.3
Pin Functions
Table 9.19 describes the selection of pin functions. Table 9.19 Port A Pin Functions
Pin Pin Functions and Selection Method
The mode setting, ITU channel 2 settings (bit PWM2 in TMDR and bits IOB2 to IOB0 in PA7/TP7/ TIOCB2/A20 TIOR2), bit NDER7 in NDERA, and bit PA7DDR in PADDR select the pin function as follows Mode ITU channel 2 settings PA7DDR NDER7 Pin function Note: * (1) in table below -- -- TIOCB2 output 0 -- PA7 input 1, 2, 5, 7 (2) in table below 1 0 PA7 output TIOCB2 input* 1 1 TP7 output 3, 4, 6 -- -- -- A20 output
TIOCB2 input when IOB2 = 1 and PWM2 = 0.
ITU channel 2 settings IOB2 IOB1 IOB0
(2) 0 0 0 0 1
(1)
(2) 1 1 -- -- --
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Section 9 I/O Ports Pin PA6/TP6/ TIOCA2/ A21/CS4 Pin Functions and Selection Method The mode setting, bit A21E in BRCR, bit CS4E in CSCR, ITU channel 2 settings (bit PWM2 in TMDR and bits IOA2 to IOA0 in TIOR2), bit NDER6 in NDERA, and bit PA6DDR in PADDR select the pin function as follows
Mode CS4E A21E ITU channel 2 settings PA6DDR NDER6 Pin function (1) in table below -- -- 0 -- 1 0 PA6 put 1 1 TP6 output -- -- 1, 2, 5 0 -- (2) in table below 1 -- -- (1) in table below -- -- 0 -- 1 0 PA6 put 1 1 TP6 output -- -- A21 output -- -- 1 (2) in table below 3, 4, 6 0 0 -- 1 -- -- (1) in table below -- -- 0 -- 1 0 PA6 put 1 1 TP6 output 7 -- -- (2) in table below
TIOCA2 PA6
CS4 TIOCA2 PA6 output
CS4 TIOCA2 PA6 output
output input out-
output input out-
output input out-
TIOCA2 input* Note: * TIOCA2 input when IOA2 = 1. ITU channel 2 settings PWM2 IOA2 IOA1 IOA0 0 0 0 0 1 0 (2) (1)
TIOCA2 input*
TIOCA2 input*
(2)
(1)
1 1 1 -- -- -- -- -- --
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Section 9 I/O Ports Pin
PA5/TP5/ TIOCB1/
Pin Functions and Selection Method The mode setting, bit A22E in BRCR, bit CS5E in CSCR, ITU channel 1 settings (bit PWM1 in TMDR and bits IOB2 to IOB0 in TIOR1), bit NDER5 in NDERA, and bit PA5DDR in PADDR select the pin function as follows
Mode CS5E A22E ITU channel 1 settings PA5DDR NDER5 Pin function (1) in table below -- -- 0 -- 1 0 PA5 put 1 1 TP5 output -- -- 1, 2, 5 0 -- (2) in table below 1 -- -- (1) in table below -- -- 0 -- 1 0 PA5 put 1 1 TP5 output -- -- A22 output -- -- 1 (2) in table below 3, 4, 6 0 0 -- 1 -- -- (1) in table below -- -- 0 -- 1 0 PA5 put 1 1 TP5 output 7 -- -- (2) in table below
A22/CS5
TIOCB1 PA5
CS5 TIOCB1 PA5 output
CS5 TIOCB1 PA5 output
output input out-
output input out-
output input out-
TIOCB1 input* Note: * TIOCB1 input when IOB2 = 1 and PWM1 = 0. ITU channel 1 settings IOB2 IOB1 IOB0 0 0 0 0 1 (2)
TIOCB1 input*
TIOCB1 input*
(1)
(2)
1 1 -- -- --
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Section 9 I/O Ports Pin PA4/TP4/ TIOCA1/ A23/CS6 Pin Functions and Selection Method The mode setting, bit A23E in BRCR, bit CS6E in CSCR, ITU channel 1 settings (bit PWM1 in TMDR and bits IOA2 to IOA0 in TIOR1), bit NDER4 in NDERA, and bit PA4DDR in PADDR select the pin function as follows
Mode CS6E A23E ITU channel 2 settings (1) in table below -- -- 0 -- 1 0 PA4 put 1 1 TP4 output -- -- 1, 2, 5 0 -- (2) in table below 1 -- -- (1) in table below -- -- 0 -- 1 0 PA4 put 1 1 TP4 output -- -- A23 output -- -- 1 (2) in table below 3, 4, 6 0 0 -- 1 -- -- (1) in table below -- -- 0 -- 1 0 PA4 put 1 1 TP4 output 7 -- -- (2) in table below
PA4DDR NDER4
Pin function
TIOCA1 PA4
CS6 TIOCA1 PA4 output
CS6 TIOCA1 PA4 output
output input out-
output input out-
output input out-
TIOCA1 input* Note: * TIOCA1 input when IOA2 = 1. ITU channel 1 settings PWM1 IOA2 IOA1 IOA0 0 0 0 0 1 0 (2) (1)
TIOCA1 input*
TIOCA1 input*
(2)
(1)
1 1 1 -- -- -- -- -- --
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Section 9 I/O Ports Pin PA3/TP3/ TIOCB0/ TCLKD Pin Functions and Selection Method ITU channel 0 settings (bit PWM0 in TMDR and bits IOB2 to IOB0 in TIOR0), bits TPSC2 to TPSC0 in TCR4 to TCR0, bit NDER3 in NDERA, and bit PA3DDR in PADDR select the pin function as follows ITU channel 0 settings PA3DDR NDER3 Pin function (1) in table below -- -- TIOCB0 output 0 -- PA3 input (2) in table below 1 0 PA3 output
1 TIOCB0 input* 2 TCLKD input*
1 1 TP3 output
Notes: 1. TIOCB0 input when IOB2 = 1 and PWM0 = 0. 2. TCLKD input when TPSC2 = TPSC1 = TPSC0 = 1 in any of TCR4 to TCR0. ITU channel 0 settings IOB2 IOB1 IOB0 0 0 (2) 0 0 1 1 -- (1) (2) 1 -- --
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Section 9 I/O Ports Pin PA2/TP2/ TIOCA0/ TCLKC Pin Functions and Selection Method ITU channel 0 settings (bit PWM0 in TMDR and bits IOA2 to IOA0 in TIOR0), bits TPSC2 to TPSC0 in TCR4 to TCR0, bit NDER2 in NDERA, and bit PA2DDR in PADDR select the pin function as follows ITU channel 0 settings PA2DDR NDER2 Pin function (1) in table below -- -- TIOCA0 output 0 -- PA2 input (2) in table below 1 0 PA2 output
1 TIOCA0 input* 2 TCLKC input*
1 1 TP2 output
Notes: 1. TIOCA0 input when IOA2 = 1. 2. TCLKC input when TPSC2 = TPSC1 = 1 and TPSC0 = 0 in any of TCR4 to TCR0. ITU channel 0 settings PWM0 IOA2 IOA1 IOA0 0 0 0 0 1 1 -- (2) (1) 0 1 -- -- (2) (1) 1 -- -- --
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Section 9 I/O Ports Pin PA1/TP1/ TCLKB/ TEND1 Pin Functions and Selection Method DMAC channel 1 settings (bits DTS2A to DTS0A and DTS2B to DTS0B in DTCR1A and DTCR1B), bit NDER1 in NDERA, and bit PA1DDR in PADDR select the pin function as follows DMAC channel 1 settings PA1DDR NDER1 Pin function Note: * (1) in table below -- -- TEND1 output 0 -- PA1 input (2) in table below 1 0 PA1 output TCLKB input* 1 1 TP1 output
TCLKB input when MDF = 1 in TMDR, or when TPSC2 = 1, TPSC1 = 0, and TPSC0 = 1 in any of TCR4 to TCR0. (2) Not both 1 -- 0 -- 1 0 1 1 0 0 -- 0 1 -- (1) (2) (1) (2) Both 1 1 0 -- 1 1 0 1 1 1 (1)
DMAC channel 1 settings DTS2A, DTS1A DTS0A DTS2B DTS1B
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Section 9 I/O Ports Pin PA0/TP0/ TCLKA/ TEND0 Pin Functions and Selection Method DMAC channel 0 settings (bits DTS2A to DTS0A and DTS2B to DTS0B in DTCR0A and DTCR0B), bit NDER0 in NDERA, and bit PA0DDR in PADDR select the pin function as follows DMAC channel 0 settings PA0DDR NDER0 Pin function Note: * (1) in table below -- -- TEND0 output 0 -- PA0 input (2) in table below 1 0 PA0 output TCLKA input* 1 1 TP0 output
TCLKA input when MDF = 1 in TMDR, or when TPSC2 = 1 and TPSC1 = 0 in any of TCR4 to TCR0. (2) Not both 1 -- 0 -- 1 0 1 1 0 0 -- 0 1 -- (1) (2) (1) (2) Both 1 1 0 -- 1 1 0 1 1 1 (1)
DMAC channel 0 settings DTS2A, DTS1A DTS0A DTS2B DTS1B
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Section 9 I/O Ports
9.12
9.12.1
Port B
Overview
Port B is an 8-bit input/output port that is also used for output (TP15 to TP8) from the programmable timing pattern controller (TPC), input/output (TIOCB4, TIOCB3, TIOCA4, TIOCA3) and output (TOCXB4, TOCXA4) by the 16-bit integrated timer unit (ITU), input (DREQ1, DREQ0) to the DMA controller (DMAC), ADTRG input to the A/D converter, and CS7 output. A reset or hardware standby leaves port B as an input port. For selecting the pin function, see table 9.21. Usage of pins for TPC, ITU, DMAC, and A/D converter input and output is described in the sections on those modules. For output of CS7 in modes 1 to 6, see section 6.3.2, Chip Select Signals. Pins not assigned to any of these functions are available for generic input/output. Figure 9.11 shows the pin configuration of port B. Pins in port B can drive one TTL load and a 30-pF capacitive load. They can also drive an LED or darlington transistor pair. Pins PB3 to PB0 have Schmitt-trigger inputs.
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Section 9 I/O Ports
Port B pins PB7/TP15/DREQ1/ADTRG PB6/TP14/DREQ0/CS7 PB5/TP13/TOCXB4 PB4/TP12/TOCXA4 Port B PB3/TP11/TIOCB4 PB2/TP10/TIOCA4 PB1/TP9/TIOCB3 PB0/TP8/TIOCA3 Pin functions in modes 1 to 6 PB7 (input/output)/TP15 (output)/DREQ1 (input)/ADTRG (input) PB6 (input/output)/TP14 (output)/DREQ0 (input)/CS7 (output) PB5 (input/output)/TP13 (output)/TOCXB4 (output) PB4 (input/output)/TP12 (output)/TOCXA4 (output) PB3 (input/output)/TP11 (output)/TIOCB4 (input/output) PB2 (input/output)/TP10 (output)/TIOCA4 (input/output) PB1 (input/output)/TP9 (output)/TIOCB3 (input/output) PB0 (input/output)/TP8 (output)/TIOCA3 (input/output) Pin functions in mode 7 PB7 (input/output)/TP15 (output)/DREQ1 (input)/ADTRG (input) PB6 (input/output)/TP14 (output)/DREQ0 (input) PB5 (input/output)/TP13 (output)/TOCXB4 (output) PB4 (input/output)/TP12 (output)/TOCXA4 (output) PB3 (input/output)/TP11 (output)/TIOCB4 (input/output) PB2 (input/output)/TP10 (output)/TIOCA4 (input/output) PB1 (input/output)/TP9 (output)/TIOCB3 (input/output) PB0 (input/output)/TP8 (output)/TIOCA3 (input/output)
Figure 9.11 Port B Pin Configuration
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Section 9 I/O Ports
9.12.2
Register Descriptions
Table 9.20 summarizes the registers of port B. Table 9.20 Port B Registers
Address* H'FFD4 H'FFD6 Note: * Name Port B data direction register Port B data register Lower 16 bits of the address. Abbreviation PBDDR PBDR R/W W R/W Initial Value H'00 H'00
Port B Data Direction Register (PBDDR) PBDDR is an 8-bit write-only register that can select input or output for each pin in port B. When pins are used for TPC output, the corresponding PBDDR bits must also be set.
Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W 3 0 W 2 0 W 1 0 W 0 0 W
PB7 DDR PB6 DDR PB5 DDR PB4 DDR PB3 DDR PB2 DDR PB1 DDR PB0 DDR
Port B data direction 7 to 0 These bits select input or output for port B pins
While port B acts as an I/O port, a pin in port B becomes an output pin if the corresponding PBDDR bit is set to 1, and an input pin if this bit is cleared to 0. PBDDR is a write-only register. Its value cannot be read. All bits return 1 when read. PBDDR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. If a PBDDR bit is set to 1 while port B acts as an I/O port, the corresponding pin maintains its output state in software standby mode.
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Section 9 I/O Ports
Port B Data Register (PBDR) PBDR is an 8-bit readable/writable register that stores output data for pins PB7 to PB0. While port B acts as an output port, the value of this register is output. When a bit in PBDDR is set to 1, if port B is read the value of the corresponding PBDR bit is returned. When a bit in PBDDR is cleared to 0, if port B is read the corresponding pin level is read.
Bit Initial value Read/Write 7 PB 7 0 R/W 6 PB 6 0 R/W 5 PB 5 0 R/W 4 PB 4 0 R/W 3 PB 3 0 R/W 2 PB 2 0 R/W 1 PB 1 0 R/W 0 PB 0 0 R/W
Port B data 7 to 0 These bits store data for port B pins
PBDR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting.
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Section 9 I/O Ports
9.12.3
Pin Functions
Table 9.21 describes the selection of pin functions. Table 9.21 Port B Pin Functions
Pin PB7/TP15/ DREQ1/ ADTRG Pin Functions and Selection Method DMAC channel 1 settings (bits DTS2A to DTS0A and DTS2B to DTS0B in DTCR1A and DTCR1B), bit TRGE in ADCR, bit NDER15 in NDERB, and bit PB7DDR in PBDDR select the pin function as follows PB7DDR NDER15 Pin function 0 -- PB7 input 1 0 PB7 output
1 DREQ1 input* 2 ADTRG input*
1 1 TP15 output
Notes: 1. DREQ1 input under DMAC channel 1 settings (1) in the table below. 2. ADTRG input when TRGE = 1. DMAC channel 1 settings DTS2A, DTS1A DTS0A DTS2B DTS1B 0 -- (2) Not both 1 -- 1 0 1 1 0 0 -- 0 1 -- (1) (2) (1) (2) Both 1 1 0 -- 1 1 0 1 1 1 (1)
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Section 9 I/O Ports Pin PB6/TP14/ DREQ0/ CS7 Pin Functions and Selection Method Bit CS7E in CSCR, DMAC channel 0 settings (bits DTS2A to DTS0A and DTS2B to DTS0B in DTCR0A and DTCR0B), bit NDER14 in NDERB, and bit PB6DDR in PBDDR select the pin function as follows PB6DDR CS7E NDER14 Pin function Note: * 0 0 -- PB6 input 1 0 0 PB6 output DREQ0 input* DMAC channel 0 settings DTS2A, DTS1A DTS0A DTS2B DTS1B PB5/TP13/ TOCXB4 0 -- 1 0 1 TP14 output -- 1 -- -- CS7 output
DREQ0 input under DMAC channel 0 settings (1) in the table below. (2) Not both 1 -- 1 0 1 1 0 0 -- 0 1 -- (1) (2) (1) (2) Both 1 1 0 -- 1 1 0 1 1 1 (1)
ITU channel 4 settings (bit CMD1 in TFCR and bit EXB4 in TOER), bit NDER13 in NDERB, and bit PB5DDR in PBDDR select the pin function as follows EXB4, CMD1 PB5DDR NDER13 Pin function 0 -- PB5 input Not both 1 1 0 PB5 output 1 1 TP13 output Both 1 -- -- TOCXB4 output
PB4/TP12/ TOCXA4
ITU channel 4 settings (bit CMD1 in TFCR and bit EXA4 in TOER), bit NDER12 in NDERB, and bit PB4DDR in PBDDR select the pin function as follows EXA4, CMD1 PB4DDR NDER12 Pin function 0 -- PB4 input Not both 1 1 0 PB4 output 1 1 TP12 output Both 1 -- -- TOCXA4 output
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Section 9 I/O Ports Pin PB3/TP11/ TIOCB4 Pin Functions and Selection Method ITU channel 4 settings (bit PWM4 in TMDR, bit CMD1 in TFCR, bit EB4 in TOER, and bits IOB2 to IOB0 in TIOR4), bit NDER11 in NDERB, and bit PB3DDR in PBDDR select the pin function as follows ITU channel 4 settings PB3DDR NDER11 Pin function Note: * (1) in table below -- -- TIOCB4 output 0 -- PB3 input (2) in table below 1 0 PB3 output TIOCB4 input* TIOCB4 input when CMD1 = PWM4 = 0 and IOB2 = 1. (2) 0 -- -- -- -- 0 0 0 0 0 1 0 0 1 -- 1 -- -- (2) (1) 1 1 -- -- -- (2) (1) ITU channel 4 settings EB4 CMD1 IOB2 IOB1 IOB0 1 1 TP11 output
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Section 9 I/O Ports Pin PB2/TP10/ TIOCA4 Pin Functions and Selection Method ITU channel 4 settings (bit CMD1 in TFCR, bit EA4 in TOER, bit PWM4 in TMDR, and bits IOA2 to IOA0 in TIOR4), bit NDER10 in NDERB, and bit PB2DDR in PBDDR select the pin function as follows ITU channel 4 settings PB2DDR NDER10 Pin function Note: * (1) in table below -- -- TIOCA4 output 0 -- PB2 input (2) in table below 1 0 PB2 output TIOCA4 input* TIOCA4 input when CMD1 = PWM4 = 0 and IOA2 = 1. (2) 0 -- -- -- -- -- 0 0 0 0 0 1 0 0 1 -- 1 -- -- 0 1 -- -- -- (2) (1) 1 1 -- -- -- -- (2) (1) ITU channel 4 settings EA4 CMD1 PWM4 IOA2 IOA1 IOA0 1 1 TP10 output
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Section 9 I/O Ports Pin PB1/TP9/ TIOCB3 Pin Functions and Selection Method ITU channel 3 settings (bit PWM3 in TMDR, bit CMD1 in TFCR, bit EB3 in TOER, and bits IOB2 to IOB0 in TIOR3), bit NDER9 in NDERB, and bit PB1DDR in PBDDR select the pin function as follows ITU channel 3 settings PB1DDR NDER9 Pin function Note: * (1) in table below -- -- TIOCB3 output 0 -- PB1 input (2) in table below 1 0 PB1 output TIOCB3 input* TIOCB3 input when CMD1 = PWM3 = 0 and IOB2 = 1. (2) 0 -- -- -- -- 0 0 0 0 0 1 0 0 1 -- 1 -- -- (2) (1) 1 1 -- -- -- (2) (1) ITU channel 3 settings EB3 CMD1 IOB2 IOB1 IOB0 1 1 TP9 output
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Section 9 I/O Ports Pin PB0/TP8/ TIOCA3 Pin Functions and Selection Method ITU channel 3 settings (bit CMD1 in TFCR, bit EA3 in TOER, bit PWM3 in TMDR, and bits IOA2 to IOA0 in TIOR3), bit NDER8 in NDERB, and bit PB0DDR in PBDDR select the pin function as follows ITU channel 3 settings PB0DDR NDER8 Pin function Note: * (1) in table below -- -- TIOCA3 output 0 -- PB0 input (2) in table below 1 0 PB0 output TIOCA3 input* TIOCA3 input when CMD1 = PWM3 = 0 and IOA2 = 1. (2) 0 -- -- -- -- -- 0 0 0 0 0 1 0 0 1 -- 1 -- -- 0 1 -- -- -- (2) (1) 1 1 -- -- -- -- (2) (1) ITU channel 3 settings EA3 CMD1 PWM3 IOA2 IOA1 IOA0 1 1 TP8 output
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Section 10 16-Bit Integrated Timer Unit (ITU)
Section 10 16-Bit Integrated Timer Unit (ITU)
10.1 Overview
The H8/3048B Group has a built-in 16-bit integrated timer unit (ITU) with five 16-bit timer channels. When the ITU is not used, it can be independently halted to conserve power. For details see section 20.6, Module Standby Function. 10.1.1 Features
ITU features are listed below. * Capability to process up to 12 pulse outputs or 10 pulse inputs * Ten general registers (GRs, two per channel) with independently-assignable output compare or input capture functions * Selection of eight counter clock sources for each channel: Internal clocks: , /2, /4, /8 External clocks: TCLKA, TCLKB, TCLKC, TCLKD * Five operating modes selectable in all channels: Waveform output by compare match Selection of 0 output, 1 output, or toggle output (only 0 or 1 output in channel 2) Input capture function Rising edge, falling edge, or both edges (selectable) Counter clearing function Counters can be cleared by compare match or input capture Synchronization Two or more timer counters (TCNTs) can be preset simultaneously, or cleared simultaneously by compare match or input capture. Counter synchronization enables synchronous register input and output. PWM mode PWM output can be provided with an arbitrary duty cycle. With synchronization, up to five-phase PWM output is possible * Phase counting mode selectable in channel 2 Two-phase encoder output can be counted automatically.
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Section 10 16-Bit Integrated Timer Unit (ITU)
* Three additional modes selectable in channels 3 and 4 Reset-synchronized PWM mode If channels 3 and 4 are combined, three-phase PWM output is possible with three pairs of complementary waveforms. Complementary PWM mode If channels 3 and 4 are combined, three-phase PWM output is possible with three pairs of non-overlapping complementary waveforms. Buffering Input capture registers can be double-buffered. Output compare registers can be updated automatically. * High-speed access via internal 16-bit bus The 16-bit timer counters, general registers, and buffer registers can be accessed at high speed via a 16-bit bus. * Fifteen interrupt sources Each channel has two compare match/input capture interrupts and an overflow interrupt. All interrupts can be requested independently. * Activation of DMA controller (DMAC) Four of the compare match/input capture interrupts from channels 0 to 3 can start the DMAC. * Output triggering of programmable timing pattern controller (TPC) Compare match/input capture signals from channels 0 to 3 can be used as TPC output triggers.
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Section 10 16-Bit Integrated Timer Unit (ITU)
Table 10.1 summarizes the ITU functions. Table 10.1 ITU Functions
Item Clock sources General registers (output compare/input capture registers) Buffer registers Input/output pins Output pins Counter clearing function Channel 0 Channel 1 Channel 2 Channel 3 Channel 4 Internal clocks: , /2, /4, /8 External clocks: TCLKA, TCLKB, TCLKC, TCLKD, selectable independently GRA0, GRB0 GRA1, GRB1 GRA2, GRB2 GRA3, GRB3 GRA4, GRB4
-- TIOCA0, TIOCB0 -- GRA0/GRB0 compare match or input capture
O O O O O O
-- TIOCA1, TIOCB1 -- GRA1/GRB1 compare match or input capture
O O O O O O
-- TIOCA2, TIOCB2 -- GRA2/GRB2 compare match or input capture
O O
BRA3, BRB3 TIOCA3, TIOCB3 -- GRA3/GRB3 compare match or input capture
O O O O O O O O
BRA4, BRB4 TIOCA4, TIOCB4 TOCXA4, TOCXB4 GRA4/GRB4 compare match or input capture
O O O O O O O O
Compare match 0 output 1 Toggle Input capture function Synchronization PWM mode Reset-synchronized PWM mode Complementary PWM mode Phase counting mode Buffering DMAC activation
--
O O O
-- -- -- --
-- -- -- --
-- --
O
--
O
--
O
--
GRA0 compare GRA1 compare GRA2 compare GRA3 compare -- match or input match or input match or input match or input capture capture capture capture Three sources * tch/input capture A0 * Compare match/input capture B0 * Overflow Three sources * Compare match/input capture A1 * Compare match/input capture B1 * Overflow Three sources * Compare match/input capture A2 * Compare match/input capture B2 * Overflow Three sources * Compare match/input capture A3 * Compare match/input capture B3 * Overflow Three sources * Compare match/input capture A4 * Compare match/input capture B4 * Overflow
Interrupt sources
Legend: O: Available --: Not available
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.1.2
Block Diagrams
ITU Block Diagram (Overall) Figure 10.1 is a block diagram of the ITU.
TCLKA to TCLKD , /2, /4, /8 TOCXA4, TOCXB4 TIOCA0 to TIOCA4 TIOCB0 to TIOCB4
Clock selector Control logic
IMIA0 to IMIA4 IMIB0 to IMIB4 OVI0 to OVI4
TOER
16-bit timer channel 4
16-bit timer channel 3
16-bit timer channel 2
16-bit timer channel 1
16-bit timer channel 0
TOCR TSTR TSNC TMDR TFCR
Module data bus Legend: TOER: Timer output master enable register (8 bits) TOCR: Timer output control register (8 bits) TSTR: Timer start register (8 bits) TSNC: Timer synchro register (8 bits) TMDR: Timer mode register (8 bits) TFCR: Timer function control register (8 bits)
Figure 10.1 ITU Block Diagram (Overall)
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Internal data bus
Bus interface
Section 10 16-Bit Integrated Timer Unit (ITU)
Block Diagram of Channels 0 and 1 ITU channels 0 and 1 are functionally identical. Both have the structure shown in figure 10.2.
TCLKA to TCLKD , /2, /4, /8
Clock selector Control logic Comparator
TIOCA0 TIOCB0 IMIA0 IMIB0 OVI0
TCNT
TIOR
TIER
GRA
GRB
TCR
Module data bus Legend: TCNT: GRA, GRB: TCR: TIOR: TIER: TSR:
Timer counter (16 bits) General registers A and B (input capture/output compare registers) (16 bits x 2) Timer control register (8 bits) Timer I/O control register (8 bits) Timer interrupt enable register (8 bits) Timer status register (8 bits)
Figure 10.2 Block Diagram of Channels 0 and 1 (for Channel 0)
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TSR
Section 10 16-Bit Integrated Timer Unit (ITU)
Block Diagram of Channel 2 Figure 10.3 is a block diagram of channel 2. This is the channel that provides only 0 output and 1 output.
TCLKA to TCLKD , /2, /4, /8
Clock selector Control logic Comparator
TIOCA2 TIOCB2 IMIA2 IMIB2 OVI2
TCNT2
TIOR2
TIER2
GRA2
GRB2
TCR2
Module data bus Legend: Timer counter 2 (16 bits) TCNT2: GRA2, GRB2: General registers A2 and B2 (input capture/output compare registers) (16 bits x 2) Timer control register 2 (8 bits) TCR2: Timer I/O control register 2 (8 bits) TIOR2: Timer interrupt enable register 2 (8 bits) TIER2: Timer status register 2 (8 bits) TSR2:
Figure 10.3 Block Diagram of Channel 2
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TSR2
Section 10 16-Bit Integrated Timer Unit (ITU)
Block Diagrams of Channels 3 and 4 Figure 10.4 is a block diagram of channel 3. Figure 10.5 is a block diagram of channel 4.
TIOCA3 TIOCB3 Control logic Comparator IMIA3 IMIB3 OVI3
TCLKA to TCLKD , /2, /4, /8
Clock selector
TCNT3
TIOR3
TIER3
GRA3
GRB3
BRA3
BRB3
TCR3
Module data bus Legend: Timer counter 3 (16 bits) TCNT3: GRA3, GRB3: General registers A3 and B3 (input capture/output compare registers) (16 bits x 2) BRA3, BRB3: Buffer registers A3 and B3 (input capture/output compare buffer registers) (16 bits x 2) Timer control register 3 (8 bits) TCR3: TIOR3: Timer I/O control register 3 (8 bits) TIER3: Timer interrupt enable register 3 (8 bits) TSR3: Timer status register 3 (8 bits)
Figure 10.4 Block Diagram of Channel 3
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TSR3
Section 10 16-Bit Integrated Timer Unit (ITU)
TCLKA to TCLKD , /2, /4, /8
Clock selector Control logic Comparator
TOCXA4 TOCXB4 TIOCA4 TIOCB4 IMIA4 IMIB4 OVI4
TCNT4
TIOR4
TIER4
GRA4
GRB4
BRA4
BRB4
TCR4
Module data bus Legend: Timer counter 4 (16 bits) TCNT4: GRA4, GRB4: General registers A4 and B4 (input capture/output compare registers) (16 bits x 2) BRA4, BRB4: Buffer registers A4 and B4 (input capture/output compare buffer registers) (16 bits x 2) Timer control register 4 (8 bits) TCR4: TIOR4: Timer I/O control register 4 (8 bits) TIER4: Timer interrupt enable register 4 (8 bits) TSR4: Timer status register 4 (8 bits)
Figure 10.5 Block Diagram of Channel 4
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TSR4
Section 10 16-Bit Integrated Timer Unit (ITU)
10.1.3
Input/Output Pins
Table 10.2 summarizes the ITU pins. Table 10.2 ITU Pins
Channel Common Name Clock input A Clock input B Clock input C Clock input D 0 Input capture/output compare A0 Input capture/output compare B0 1 Input capture/output compare A1 Input capture/output compare B1 2 Input capture/output compare A2 Input capture/output compare B2 3 Input capture/output compare A3 Input capture/output compare B3 4 Input capture/output compare A4 Input capture/output compare B4 Output compare XA4 Output compare XB4 Abbreviation TCLKA TCLKB TCLKC TCLKD TIOCA0 TIOCB0 TIOCA1 TIOCB1 TIOCA2 TIOCB2 TIOCA3 Input/ Output Input Input Input Input Input/ output Input/ output Input/ output Input/ output Input/ output Input/ output Input/ output Input/ output Input/ output Input/ output Output Output Function External clock A input pin (phase-A input pin in phase counting mode) External clock B input pin (phase-B input pin in phase counting mode) External clock C input pin External clock D input pin GRA0 output compare or input capture pin PWM output pin in PWM mode GRB0 output compare or input capture pin GRA1 output compare or input capture pin PWM output pin in PWM mode GRB1 output compare or input capture pin GRA2 output compare or input capture pin PWM output pin in PWM mode GRB2 output compare or input capture pin GRA3 output compare or input capture pin PWM output pin in PWM mode, complementary PWM mode, or reset-synchronized PWM mode GRB3 output compare or input capture pin PWM output pin in complementary PWM mode or reset-synchronized PWM mode GRA4 output compare or input capture pin PWM output pin in PWM mode, complementary PWM mode, or reset-synchronized PWM mode GRB4 output compare or input capture pin PWM output pin in complementary PWM mode or reset-synchronized PWM mode PWM output pin in complementary PWM mode or reset-synchronized PWM mode PWM output pin in complementary PWM mode or reset-synchronized PWM mode
TIOCB3
TIOCA4
TIOCB4
TOCXA4 TOCXB4
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.1.4
Register Configuration
Table 10.3 summarizes the ITU registers. Table 10.3 ITU Registers
Channel Common Address* H'FF60 H'FF61 H'FF62 H'FF63 H'FF90 H'FF91 0 H'FF64 H'FF65 H'FF66 H'FF67 H'FF68 H'FF69 H'FF6A H'FF6B H'FF6C H'FF6D 1 H'FF6E H'FF6F H'FF70 H'FF71 H'FF72 H'FF73 H'FF74 H'FF75 H'FF76 H'FF77
1
Name Timer start register Timer synchro register Timer mode register Timer function control register Timer output master enable register Timer output control register Timer control register 0 Timer I/O control register 0 Timer interrupt enable register 0 Timer status register 0 Timer counter 0 (high) Timer counter 0 (low) General register A0 (high) General register A0 (low) General register B0 (high) General register B0 (low) Timer control register 1 Timer I/O control register 1 Timer interrupt enable register 1 Timer status register 1 Timer counter 1 (high) Timer counter 1 (low) General register A1 (high) General register A1 (low) General register B1 (high) General register B1 (low)
Abbreviation TSTR TSNC TMDR TFCR TOER TOCR TCR0 TIOR0 TIER0 TSR0 TCNT0H TCNT0L GRA0H GRA0L GRB0H GRB0L TCR1 TIOR1 TIER1 TSR1 TCNT1H TCNT1L GRA1H GRA1L GRB1H GRB1L
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
2 R/(W)*
Initial Value H'E0 H'E0 H'80 H'C0 H'FF H'FF H'80 H'88 H'F8 H'F8 H'00 H'00 H'FF H'FF H'FF H'FF H'80 H'88 H'F8 H'F8 H'00 H'00 H'FF H'FF H'FF H'FF
R/W R/W R/W R/W R/W R/W R/W R/W R/W
2 R/(W)*
R/W R/W R/W R/W R/W R/W
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Section 10 16-Bit Integrated Timer Unit (ITU) Abbreviation TCR2 TIOR2 TIER2 TSR2 TCNT2H TCNT2L GRA2H GRA2L GRB2H GRB2L TCR3 TIOR3 TIER3 TSR3 TCNT3H TCNT3L GRA3H GRA3L GRB3H GRB3L BRA3H BRA3L BRB3H BRB3L Initial Value H'80 H'88 H'F8 H'F8 H'00 H'00 H'FF H'FF H'FF H'FF H'80 H'88 H'F8 H'F8 H'00 H'00 H'FF H'FF H'FF H'FF H'FF H'FF H'FF H'FF
Channel 2
Address* H'FF78 H'FF79 H'FF7A H'FF7B H'FF7C H'FF7D H'FF7E H'FF7F H'FF80 H'FF81
1
Name Timer control register 2 Timer I/O control register 2 Timer interrupt enable register 2 Timer status register 2 Timer counter 2 (high) Timer counter 2 (low) General register A2 (high) General register A2 (low) General register B2 (high) General register B2 (low) Timer control register 3 Timer I/O control register 3 Timer interrupt enable register 3 Timer status register 3 Timer counter 3 (high) Timer counter 3 (low) General register A3 (high) General register A3 (low) General register B3 (high) General register B3 (low) Buffer register A3 (high) Buffer register A3 (low) Buffer register B3 (high) Buffer register B3 (low)
R/W R/W R/W R/W
2 R/(W)*
R/W R/W R/W R/W R/W R/W R/W R/W R/W
2 R/(W)*
3
H'FF82 H'FF83 H'FF84 H'FF85 H'FF86 H'FF87 H'FF88 H'FF89 H'FF8A H'FF8B H'FF8C H'FF8D H'FF8E H'FF8F
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
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Section 10 16-Bit Integrated Timer Unit (ITU) Abbreviation TCR4 TIOR4 TIER4 TSR4 TCNT4H TCNT4L GRA4H GRA4L GRB4H GRB4L BRA4H BRA4L BRB4H BRB4L Initial Value H'80 H'88 H'F8 H'F8 H'00 H'00 H'FF H'FF H'FF H'FF H'FF H'FF H'FF H'FF
Channel 4
Address* H'FF92 H'FF93 H'FF94 H'FF95 H'FF96 H'FF97 H'FF98 H'FF99 H'FF9A H'FF9B H'FF9C H'FF9D H'FF9E H'FF9F
1
Name Timer control register 4 Timer I/O control register 4 Timer interrupt enable register 4 Timer status register 4 Timer counter 4 (high) Timer counter 4 (low) General register A4 (high) General register A4 (low) General register B4 (high) General register B4 (low) Buffer register A4 (high) Buffer register A4 (low) Buffer register B4 (high) Buffer register B4 (low)
R/W R/W R/W R/W
2 R/(W)*
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Notes: 1. Lower 16 bits of the address. 2. Only 0 can be written, to clear flags.
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.2
10.2.1
Register Descriptions
Timer Start Register (TSTR)
TSTR is an 8-bit readable/writable register that starts and stops the timer counter (TCNT) in channels 0 to 4.
Bit Initial value Read/Write 7 1 6 1 Reserved bits 5 1 4 STR4 0 R/W 3 STR3 0 R/W 2 STR2 0 R/W 1 STR1 0 R/W 0 STR0 0 R/W
Counter start 4 to 0 These bits start and stop TCNT4 to TCNT0
TSTR is initialized to H'E0 by a reset and in standby mode. Bits 7 to 5--Reserved: Read-only bits, always read as 1. Bit 4--Counter Start 4 (STR4): Starts and stops timer counter 4 (TCNT4).
Bit 4: STR4 0 1 Description TCNT4 is halted TCNT4 is counting (Initial value)
Bit 3--Counter Start 3 (STR3): Starts and stops timer counter 3 (TCNT3).
Bit 3: STR3 0 1 Description TCNT3 is halted TCNT3 is counting (Initial value)
Bit 2--Counter Start 2 (STR2): Starts and stops timer counter 2 (TCNT2).
Bit 2: STR2 0 1 Description TCNT2 is halted TCNT2 is counting (Initial value)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Bit 1--Counter Start 1 (STR1): Starts and stops timer counter 1 (TCNT1).
Bit 1: STR1 0 1 Description TCNT1 is halted TCNT1 is counting (Initial value)
Bit 0--Counter Start 0 (STR0): Starts and stops timer counter 0 (TCNT0).
Bit 0: STR0 0 1 Description TCNT0 is halted TCNT0 is counting (Initial value)
10.2.2
Timer Synchro Register (TSNC)
TSNC is an 8-bit readable/writable register that selects whether channels 0 to 4 operate independently or synchronously. Channels are synchronized by setting the corresponding bits to 1.
Bit Initial value Read/Write 7 1 6 1 Reserved bits 5 1 4 SYNC4 0 R/W 3 SYNC3 0 R/W 2 SYNC2 0 R/W 1 SYNC1 0 R/W 0 SYNC0 0 R/W
Timer sync 4 to 0 These bits synchronize channels 4 to 0
TSNC is initialized to H'E0 by a reset and in standby mode. Bits 7 to 5--Reserved: Read-only bits, always read as 1. Bit 4--Timer Sync 4 (SYNC4): Selects whether channel 4 operates independently or synchronously.
Bit 4: SYNC4 0 1 Description Channel 4's timer counter (TCNT4) operates independently TCNT4 is preset and cleared independently of other channels Channel 4 operates synchronously TCNT4 can be synchronously preset and cleared (Initial value)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Bit 3--Timer Sync 3 (SYNC3): Selects whether channel 3 operates independently or synchronously.
Bit 3: SYNC3 0 1 Description Channel 3's timer counter (TCNT3) operates independently TCNT3 is preset and cleared independently of other channels Channel 3 operates synchronously TCNT3 can be synchronously preset and cleared (Initial value)
Bit 2--Timer Sync 2 (SYNC2): Selects whether channel 2 operates independently or synchronously.
Bit 2: SYNC2 0 1 Description Channel 2's timer counter (TCNT2) operates independently TCNT2 is preset and cleared independently of other channels Channel 2 operates synchronously TCNT2 can be synchronously preset and cleared (Initial value)
Bit 1--Timer Sync 1 (SYNC1): Selects whether channel 1 operates independently or synchronously.
Bit 1: SYNC1 0 1 Description Channel 1's timer counter (TCNT1) operates independently TCNT1 is preset and cleared independently of other channels Channel 1 operates synchronously TCNT1 can be synchronously preset and cleared (Initial value)
Bit 0--Timer Sync 0 (SYNC0): Selects whether channel 0 operates independently or synchronously.
Bit 0: Bit 0 0 1 Description Channel 0's timer counter (TCNT0) operates independently TCNT0 is preset and cleared independently of other channels Channel 0 operates synchronously TCNT0 can be synchronously preset and cleared (Initial value)
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.2.3
Timer Mode Register (TMDR)
TMDR is an 8-bit readable/writable register that selects PWM mode for channels 0 to 4. It also selects phase counting mode and the overflow flag (OVF) setting conditions for channel 2.
Bit Initial value Read/Write 7 1 6 MDF 0 R/W 5 FDIR 0 R/W 4 PWM4 0 R/W 3 PWM3 0 R/W 2 PWM2 0 R/W 1 PWM1 0 R/W 0 PWM0 0 R/W
PWM mode 4 to 0 These bits select PWM mode for channels 4 to 0 Flag direction Selects the setting condition for the overflow flag (OVF) in timer status register 2 (TSR2) Phase counting mode flag Selects phase counting mode for channel 2 Reserved bit
TMDR is initialized to H'80 by a reset and in standby mode. Bit 7--Reserved: Read-only bit, always read as 1. Bit 6--Phase Counting Mode Flag (MDF): Selects whether channel 2 operates normally or in phase counting mode.
Bit 6: MDF 0 1 Description Channel 2 operates normally Channel 2 operates in phase counting mode (Initial value)
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Section 10 16-Bit Integrated Timer Unit (ITU)
When MDF is set to 1 to select phase counting mode, TCNT2 operates as an up/down-counter and pins TCLKA and TCLKB become counter clock input pins. TCNT2 counts both rising and falling edges of TCLKA and TCLKB, and counts up or down as follows.
Counting Direction TCLKA pin TCLKB pin Down-Counting Low High High Low Up-Counting High Low Low High
In phase counting mode channel 2 operates as above regardless of the external clock edges selected by bits CKEG1 and CKEG0 and the clock source selected by bits TPSC2 to TPSC0 in TCR2. Phase counting mode takes precedence over these settings. The counter clearing condition selected by the CCLR1 and CCLR0 bits in TCR2 and the compare match/input capture settings and interrupt functions of TIOR2, TIER2, and TSR2 remain effective in phase counting mode. Bit 5--Flag Direction (FDIR): Designates the setting condition for the OVF flag in TSR2. The FDIR designation is valid in all modes in channel 2.
Bit 5: FDIR 0 1 Description OVF is set to 1 in TSR2 when TCNT2 overflows or underflows OVF is set to 1 in TSR2 when TCNT2 overflows (Initial value)
Bit 4--PWM Mode 4 (PWM4): Selects whether channel 4 operates normally or in PWM mode.
Bit 4: PWM4 0 1 Description Channel 4 operates normally Channel 4 operates in PWM mode (Initial value)
When bit PWM4 is set to 1 to select PWM mode, pin TIOCA4 becomes a PWM output pin. The output goes to 1 at compare match with GRA4, and to 0 at compare match with GRB4. If complementary PWM mode or reset-synchronized PWM mode is selected by bits CMD1 and CMD0 in TFCR, the CMD1 and CMD0 setting takes precedence and the PWM4 setting is ignored.
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Section 10 16-Bit Integrated Timer Unit (ITU)
Bit 3--PWM Mode 3 (PWM3): Selects whether channel 3 operates normally or in PWM mode.
Bit 3: PWM3 0 1 Description Channel 3 operates normally Channel 3 operates in PWM mode (Initial value)
When bit PWM3 is set to 1 to select PWM mode, pin TIOCA3 becomes a PWM output pin. The output goes to 1 at compare match with GRA3, and to 0 at compare match with GRB3. If complementary PWM mode or reset-synchronized PWM mode is selected by bits CMD1 and CMD0 in TFCR, the CMD1 and CMD0 setting takes precedence and the PWM3 setting is ignored. Bit 2--PWM Mode 2 (PWM2): Selects whether channel 2 operates normally or in PWM mode.
Bit 2: PWM2 0 1 Description Channel 2 operates normally Channel 2 operates in PWM mode (Initial value)
When bit PWM2 is set to 1 to select PWM mode, pin TIOCA2 becomes a PWM output pin. The output goes to 1 at compare match with GRA2, and to 0 at compare match with GRB2. Bit 1--PWM Mode 1 (PWM1): Selects whether channel 1 operates normally or in PWM mode.
Bit 1: PWM1 0 1 Description Channel 1 operates normally Channel 1 operates in PWM mode (Initial value)
When bit PWM1 is set to 1 to select PWM mode, pin TIOCA1 becomes a PWM output pin. The output goes to 1 at compare match with GRA1, and to 0 at compare match with GRB1. Bit 0--PWM Mode 0 (PWM0): Selects whether channel 0 operates normally or in PWM mode.
Bit 0: PWM0 0 1 Description Channel 0 operates normally Channel 0 operates in PWM mode (Initial value)
When bit PWM0 is set to 1 to select PWM mode, pin TIOCA0 becomes a PWM output pin. The output goes to 1 at compare match with GRA0, and to 0 at compare match with GRB0.
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.2.4
Timer Function Control Register (TFCR)
TFCR is an 8-bit readable/writable register that selects complementary PWM mode, resetsynchronized PWM mode, and buffering for channels 3 and 4.
Bit Initial value Read/Write 7 1 6 1 5 CMD1 0 R/W 4 CMD0 0 R/W 3 BFB4 0 R/W 2 BFA4 0 R/W 1 BFB3 0 R/W 0 BFA3 0 R/W
Reserved bits Combination mode 1/0 These bits select complementary PWM mode or reset-synchronized PWM mode for channels 3 and 4 Buffer mode B4 and A4 These bits select buffering of general registers (GRB4 and GRA4) by buffer registers (BRB4 and BRA4) in channel 4 Buffer mode B3 and A3 These bits select buffering of general registers (GRB3 and GRA3) by buffer registers (BRB3 and BRA3) in channel 3
TFCR is initialized to H'C0 by a reset and in standby mode. Bits 7 and 6--Reserved: Read-only bits, always read as 1. Bits 5 and 4--Combination Mode 1 and 0 (CMD1, CMD0): These bits select whether channels 3 and 4 operate in normal mode, complementary PWM mode, or reset-synchronized PWM mode.
Bit 5: CMD1 0 1 Bit 4: CMD0 0 1 0 1 Channels 3 and 4 operate together in complementary PWM mode Channels 3 and 4 operate together in reset-synchronized PWM mode Description Channels 3 and 4 operate normally (Initial value)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Before selecting reset-synchronized PWM mode or complementary PWM mode, halt the timer counter or counters that will be used in these modes. When these bits select complementary PWM mode or reset-synchronized PWM mode, they take precedence over the setting of the PWM mode bits (PWM4 and PWM3) in TMDR. Settings of complementary PWM mode or reset-synchronized PWM mode and settings of timer sync bits SYNC4 and SYNC3 in TSNC are valid simultaneously, however, when complementary PWM mode is selected, channels 3 and 4 must not be synchronized (do not set bits SYNC3 and SYNC4 both to 1 in TSNC). Bit 3--Buffer Mode B4 (BFB4): Selects whether GRB4 operates normally in channel 4, or whether GRB4 is buffered by BRB4.
Bit 3: BFB4 0 1 Description GRB4 operates normally GRB4 is buffered by BRB4 (Initial value)
Bit 2--Buffer Mode A4 (BFA4): Selects whether GRA4 operates normally in channel 4, or whether GRA4 is buffered by BRA4.
Bit 2: BFA4 0 1 Description GRA4 operates normally GRA4 is buffered by BRA4 (Initial value)
Bit 1--Buffer Mode B3 (BFB3): Selects whether GRB3 operates normally in channel 3, or whether GRB3 is buffered by BRB3.
Bit 1: BFB3 0 1 Description GRB3 operates normally GRB3 is buffered by BRB3 (Initial value)
Bit 0--Buffer Mode A3 (BFA3): Selects whether GRA3 operates normally in channel 3, or whether GRA3 is buffered by BRA3.
Bit 0: BFA3 0 1 Description GRA3 operates normally GRA3 is buffered by BRA3 (Initial value)
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.2.5
Timer Output Master Enable Register (TOER)
TOER is an 8-bit readable/writable register that enables or disables output settings for channels 3 and 4.
Bit Initial value Read/Write 7 1 6 1 5 EXB4 1 R/W 4 EXA4 1 R/W 3 EB3 1 R/W 2 EB4 1 R/W 1 EA4 1 R/W 0 EA3 1 R/W
Reserved bits Master enable TOCXA4, TOCXB4 These bits enable or disable output settings for pins TOCXA4 and TOCXB4 Master enable TIOCA3, TIOCB3 , TIOCA4, TIOCB4 These bits enable or disable output settings for pins TIOCA3, TIOCB3 , TIOCA4, and TIOCB4
TOER is initialized to H'FF by a reset and in standby mode. Bits 7 and 6--Reserved: Read-only bits, always read as 1. Bit 5--Master Enable TOCXB4 (EXB4): Enables or disables ITU output at pin TOCXB4.
Bit 5: EXB4 0 Description TOCXB4 output is disabled regardless of TFCR settings (TOCXB4 operates as a generic input/output pin). If XTGD = 0, EXB4 is cleared to 0 when input capture A occurs in channel 1. 1 TOCXB4 is enabled for output according to TFCR settings (Initial value)
Bit 4--Master Enable TOCXA4 (EXA4): Enables or disables ITU output at pin TOCXA4.
Bit 4: EXA4 0 Description TOCXA4 output is disabled regardless of TFCR settings (TOCXA4 operates as a generic input/output pin). If XTGD = 0, EXA4 is cleared to 0 when input capture A occurs in channel 1. 1 TOCXA4 is enabled for output according to TFCR settings (Initial value)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Bit 3--Master Enable TIOCB3 (EB3): Enables or disables ITU output at pin TIOCB3.
Bit 3: EB3 0 Description TIOCB3 output is disabled regardless of TIOR3 and TFCR settings (TIOCB3 operates as a generic input/output pin). If XTGD = 0, EB3 is cleared to 0 when input capture A occurs in channel 1. 1 TIOCB3 is enabled for output according to TIOR3 and TFCR settings (Initial value)
Bit 2--Master Enable TIOCB4 (EB4): Enables or disables ITU output at pin TIOCB4.
Bit 2: EB4 0 Description TIOCB4 output is disabled regardless of TIOR4 and TFCR settings (TIOCB4 operates as a generic input/output pin). If XTGD = 0, EB4 is cleared to 0 when input capture A occurs in channel 1. 1 TIOCB4 is enabled for output according to TIOR4 and TFCR settings (Initial value)
Bit 1--Master Enable TIOCA4 (EA4): Enables or disables ITU output at pin TIOCA4.
Bit 1: EA4 0 Description TIOCA4 output is disabled regardless of TIOR4, TMDR, and TFCR settings (TIOCA4 operates as a generic input/output pin). If XTGD = 0, EA4 is cleared to 0 when input capture A occurs in channel 1. 1 TIOCA4 is enabled for output according to TIOR4, TMDR, and TFCR settings (Initial value)
Bit 0--Master Enable TIOCA3 (EA3): Enables or disables ITU output at pin TIOCA3.
Bit 0: EA3 0 Description TIOCA3 output is disabled regardless of TIOR3, TMDR, and TFCR settings (TIOCA3 operates as a generic input/output pin). If XTGD = 0, EA3 is cleared to 0 when input capture A occurs in channel 1. 1 TIOCA3 is enabled for output according to TIOR3, TMDR, and TFCR settings (Initial value)
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.2.6
Timer Output Control Register (TOCR)
TOCR is an 8-bit readable/writable register that selects externally triggered disabling of output in complementary PWM mode and reset-synchronized PWM mode, and inverts the output levels.
Bit Initial value Read/Write 7 1 6 1 Reserved bits 5 1 4 XTGD 1 R/W 3 1 2 1 1 OLS4 1 R/W 0 OLS3 1 R/W
Output level select 3, 4 These bits select output levels in complementary PWM mode and resetsynchronized PWM mode Reserved bits
External trigger disable Selects externally triggered disabling of output in complementary PWM mode and reset-synchronized PWM mode
The settings of the XTGD, OLS4, and OLS3 bits are valid only in complementary PWM mode and reset-synchronized PWM mode. These settings do not affect other modes. TOCR is initialized to H'FF by a reset and in standby mode. Bits 7 to 5--Reserved: Read-only bits, always read as 1. Bit 4--External Trigger Disable (XTGD): Selects externally triggered disabling of ITU output in complementary PWM mode and reset-synchronized PWM mode.
Bit 4: XTGD 0 Description Input capture A in channel 1 is used as an external trigger signal in complementary PWM mode and reset-synchronized PWM mode. When an external trigger occurs, bits 5 to 0 in TOER are cleared to 0, disabling ITU output. 1 External triggering is disabled (Initial value)
Bits 3 and 2--Reserved: Read-only bits, always read as 1.
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Section 10 16-Bit Integrated Timer Unit (ITU)
Bit 1--Output Level Select 4 (OLS4): Selects output levels in complementary PWM mode and reset-synchronized PWM mode.
Bit 1: OLS4 0 1 Description TIOCA3, TIOCA4, and TIOCB4 outputs are inverted TIOCA3, TIOCA4, and TIOCB4 outputs are not inverted (Initial value)
Bit 0--Output Level Select 3 (OLS3): Selects output levels in complementary PWM mode and reset-synchronized PWM mode.
Bit 0: OLS3 0 1 Description TIOCB3, TOCXA4, and TOCXB4 outputs are inverted TIOCB3, TOCXA4, and TOCXB4 outputs are not inverted (Initial value)
10.2.7
Timer Counters (TCNT)
TCNT is a 16-bit counter. The ITU has five TCNTs, one for each channel.
Channel 0 1 2 3 4 Abbreviation TCNT0 TCNT1 TCNT2 TCNT3 TCNT4 Phase counting mode: up/down-counter Other modes: up-counter Complementary PWM mode: up/down-counter Other modes: up-counter Function Up-counter
Bit Initial value Read/Write
15 0
14 0
13 0
12 0
11 0
10 0
9 0
8 0
7 0
6 0
5 0
4 0
3 0
2 0
1 0
0 0
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Each TCNT is a 16-bit readable/writable register that counts pulse inputs from a clock source. The clock source is selected by bits TPSC2 to TPSC0 in TCR. TCNT0 and TCNT1 are up-counters. TCNT2 is an up/down-counter in phase counting mode and an up-counter in other modes. TCNT3 and TCNT4 are up/down-counters in complementary PWM mode and up-counters in other modes.
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Section 10 16-Bit Integrated Timer Unit (ITU)
TCNT can be cleared to H'0000 by compare match with GRA or GRB or by input capture to GRA or GRB (counter clearing function) in the same channel. When TCNT overflows (changes from H'FFFF to H'0000), the OVF flag is set to 1 in TSR of the corresponding channel. When TCNT underflows (changes from H'0000 to H'FFFF), the OVF flag is set to 1 in TSR of the corresponding channel. The TCNTs are linked to the CPU by an internal 16-bit bus and can be written or read by either word access or byte access. Each TCNT is initialized to H'0000 by a reset and in standby mode. 10.2.8 General Registers A, B (GRA, GRB)
The general registers are 16-bit registers. The ITU has 10 general registers, two in each channel.
Channel 0 1 2 3 4 Abbreviation GRA0, GRB0 GRA1, GRB1 GRA2, GRB2 GRA3, GRB3 GRA4, GRB4 Output compare/input capture register; can be buffered by buffer registers BRA and BRB Function Output compare/input capture register
Bit Initial value Read/Write
15 1
14 1
13 1
12 1
11 1
10 1
9 1
8 1
7 1
6 1
5 1
4 1
3 1
2 1
1 1
0 1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
A general register is a 16-bit readable/writable register that can function as either an output compare register or an input capture register. The function is selected by settings in TIOR. When a general register is used as an output compare register, its value is constantly compared with the TCNT value. When the two values match (compare match), the IMFA or IMFB flag is set to 1 in TSR. Compare match output can be selected in TIOR. When a general register is used as an input capture register, rising edges, falling edges, or both edges of an external input capture signal are detected and the current TCNT value is stored in the
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Section 10 16-Bit Integrated Timer Unit (ITU)
general register. The corresponding IMFA or IMFB flag in TSR is set to 1 at the same time. The valid edge or edges of the input capture signal are selected in TIOR. TIOR settings are ignored in PWM mode, complementary PWM mode, and reset-synchronized PWM mode. General registers are linked to the CPU by an internal 16-bit bus and can be written or read by either word access or byte access. General registers are initialized to the output compare function (with no output signal) by a reset and in standby mode. The initial value is H'FFFF. 10.2.9 Buffer Registers A, B (BRA, BRB)
The buffer registers are 16-bit registers. The ITU has four buffer registers, two each in channels 3 and 4.
Channel 3 4 Abbreviation BRA3, BRB3 BRA4, BRB4 Function Used for buffering * When the corresponding GRA or GRB functions as an output compare register, BRA or BRB can function as an output compare buffer register: the BRA or BRB value is automatically transferred to GRA or GRB at compare match When the corresponding GRA or GRB functions as an input capture register, BRA or BRB can function as an input capture buffer register: the GRA or GRB value is automatically transferred to BRA or BRB at input capture
*
Bit Initial value Read/Write
15 1
14 1
13 1
12 1
11 1
10 1
9 1
8 1
7 1
6 1
5 1
4 1
3 1
2 1
1 1
0 1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
A buffer register is a 16-bit readable/writable register that is used when buffering is selected. Buffering can be selected independently by bits BFB4, BFA4, BFB3, and BFA3 in TFCR. The buffer register and general register operate as a pair. When the general register functions as an output compare register, the buffer register functions as an output compare buffer register. When
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Section 10 16-Bit Integrated Timer Unit (ITU)
the general register functions as an input capture register, the buffer register functions as an input capture buffer register. The buffer registers are linked to the CPU by an internal 16-bit bus and can be written or read by either word or byte access. Buffer registers are initialized to H'FFFF by a reset and in standby mode. 10.2.10 Timer Control Registers (TCR) TCR is an 8-bit register. The ITU has five TCRs, one in each channel.
Channel 0 1 2 3 4 Abbreviation TCR0 TCR1 TCR2 TCR3 TCR4 Function TCR controls the timer counter. The TCRs in all channels are functionally identical. When phase counting mode is selected in channel 2, the settings of bits CKEG1 and CKEG0 and TPSC2 to TPSC0 in TCR2 are ignored.
Bit Initial value Read/Write
7 1
6 CCLR1 0 R/W
5 CCLR0 0 R/W
4 0 R/W
3 0 R/W
2 TPSC2 0 R/W
1 TPSC1 0 R/W
0 TPSC0 0 R/W
CKEG1 CKEG0
Timer prescaler 2 to 0 These bits select the counter clock Clock edge 1, 0 These bits select external clock edges Counter clear 1, 0 These bits select the counter clear source Reserved bit
Each TCR is an 8-bit readable/writable register that selects the timer counter clock source, selects the edge or edges of external clock sources, and selects how the counter is cleared. TCR is initialized to H'80 by a reset and in standby mode. Bit 7--Reserved: Read-only bit, always read as 1.
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Section 10 16-Bit Integrated Timer Unit (ITU)
Bits 6 and 5--Counter Clear 1 and 0 (CCLR1, CCLR0): These bits select how TCNT is cleared.
Bit 6: CCLR1 0 Bit 5: CCLR0 0 1 1 0 1 Description TCNT is not cleared (Initial value)
TCNT is cleared by GRA compare match or input 1 capture* TCNT is cleared by GRB compare match or input 1 capture* Synchronous clear: TCNT is cleared in synchronization 2 with other synchronized timers*
Notes: 1. TCNT is cleared by compare match when the general register functions as an output compare register, and by input capture when the general register functions as an input capture register. 2. Selected in TSNC.
Bits 4 and 3--Clock Edge 1 and 0 (CKEG1, CKEG0): These bits select external clock input edges when an external clock source is used.
Bit 4: CKEG1 0 1 Bit 3: CKEG0 0 1 -- Description Count rising edges Count falling edges Count both edges (Initial value)
When channel 2 is set to phase counting mode, bits CKEG1 and CKEG0 in TCR2 are ignored. Phase counting takes precedence.
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Section 10 16-Bit Integrated Timer Unit (ITU)
Bits 2 to 0--Timer Prescaler 2 to 0 (TPSC2 to TPSC0): These bits select the counter clock source.
Bit 2: TPSC2 0 Bit 1: TPSC1 0 1 1 0 1 Bit 0: TPSC0 0 1 0 1 0 1 0 1 Description Internal clock: Internal clock: /2 Internal clock: /4 Internal clock: /8 External clock A: TCLKA input External clock B: TCLKB input External clock C: TCLKC input External clock D: TCLKD input (Initial value)
When bit TPSC2 is cleared to 0 an internal clock source is selected, and the timer counts only falling edges. When bit TPSC2 is set to 1 an external clock source is selected, and the timer counts the edge or edges selected by bits CKEG1 and CKEG0. When channel 2 is set to phase counting mode (MDF = 1 in TMDR), the settings of bits TPSC2 to TPSC0 in TCR2 are ignored. Phase counting takes precedence.
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.2.11 Timer I/O Control Register (TIOR) TIOR is an 8-bit register. The ITU has five TIORs, one in each channel.
Channel 0 1 2 3 4 Abbreviation TIOR0 TIOR1 TIOR2 TIOR3 TIOR4 Function TIOR controls the general registers. Some functions differ in PWM mode. TIOR3 and TIOR4 settings are ignored when complementary PWM mode or reset-synchronized PWM mode is selected in channels 3 and 4.
Bit Initial value Read/Write
7 1
6 IOB2 0 R/W
5 IOB1 0 R/W
4 IOB0 0 R/W
3 1
2 IOA2 0 R/W
1 IOA1 0 R/W
0 IOA0 0 R/W
I/O control A2 to A0 These bits select GRA functions Reserved bit I/O control B2 to B0 These bits select GRB functions Reserved bit
Each TIOR is an 8-bit readable/writable register that selects the output compare or input capture function for GRA and GRB, and specifies the functions of the TIOCA and TIOCB pins. If the output compare function is selected, TIOR also selects the type of output. If input capture is selected, TIOR also selects the edge or edges of the input capture signal. TIOR is initialized to H'88 by a reset and in standby mode. Bit 7--Reserved: Read-only bit, always read as 1.
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Section 10 16-Bit Integrated Timer Unit (ITU)
Bits 6 to 4--I/O Control B2 to B0 (IOB2 to IOB0): These bits select the GRB function.
Bit 6: IOB2 0 Bit 5: IOB1 0 1 Bit 4: IOB0 0 1 0 1 1 0 1 0 1 0 1 Notes: 1. After a reset, the output is 0 until the first compare match. 2. Channel 2 output cannot be toggled by compare match. This setting selects 1 output instead. GRB is an input capture register Description GRB is an output compare register No output at compare match (Initial value) 1 0 output at GRB compare match* 1 output at GRB compare match*
1
Output toggles at GRB compare match 12 (1 output in channel 2)* * GRB captures rising edge of input GRB captures falling edge of input GRB captures both edges of input
Bit 3--Reserved: Read-only bit, always read as 1. Bits 2 to 0--I/O Control A2 to A0 (IOA2 to IOA0): These bits select the GRA function.
Bit 2: IOA2 0 Bit 1: IOA1 0 1 Bit 0: IOA0 0 1 0 1 1 0 1 0 1 0 1 Notes: 1. After a reset, the output is 0 until the first compare match. 2. Channel 2 output cannot be toggled by compare match. This setting selects 1 output instead. GRA is an input capture register Description GRA is an output compare register No output at compare match (Initial value) 1 0 output at GRA compare match* 1 output at GRA compare match*
1
Output toggles at GRA compare match 12 (1 output in channel 2)* * GRA captures rising edge of input GRA captures falling edge of input GRA captures both edges of input
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.2.12 Timer Status Register (TSR) TSR is an 8-bit register. The ITU has five TSRs, one in each channel.
Channel 0 1 2 3 4 Abbreviation TSR0 TSR1 TSR2 TSR3 TSR4 Function Indicates input capture, compare match, and overflow status
Bit Initial value Read/Write
7 1
6 1
5 1 Reserved bits
4 1
3 1
2 OVF 0 R/(W)*
1 IMFB 0 R/(W)*
0 IMFA 0 R/(W)*
Overflow flag Status flag indicating overflow or underflow Input capture/compare match flag B Status flag indicating GRB compare match or input capture Input capture/compare match flag A Status flag indicating GRA compare match or input capture Note: * Only 0 can be written, to clear the flag.
Each TSR is an 8-bit readable/writable register containing flags that indicate TCNT overflow or underflow and GRA or GRB compare match or input capture. These flags are interrupt sources and generate CPU interrupts if enabled by corresponding bits in TIER. TSR is initialized to H'F8 by a reset and in standby mode. Bits 7 to 3--Reserved: Read-only bits, always read as 1.
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Section 10 16-Bit Integrated Timer Unit (ITU)
Bit 2--Overflow Flag (OVF): This status flag indicates TCNT overflow or underflow.
Bit 2: OVF 0 1 Description [Clearing condition] Read OVF when OVF = 1, then write 0 in OVF [Setting condition] TCNT overflowed from H'FFFF to H'0000, or underflowed from H'0000 to H'FFFF* Note: * TCNT underflow occurs when TCNT operates as an up/down-counter. Underflow occurs only under the following conditions: (1) Channel 2 operates in phase counting mode (MDF = 1 in TMDR) (2) Channels 3 and 4 operate in complementary PWM mode (CMD1 = 1 and CMD0 = 0 in TFCR) (Initial value)
Bit 1--Input Capture/Compare Match Flag B (IMFB): This status flag indicates GRB compare match or input capture events.
Bit 1: IMFB 0 1 Description [Clearing condition] Read IMFB when IMFB = 1, then write 0 in IMFB [Setting conditions] TCNT = GRB when GRB functions as an output compare register. TCNT value is transferred to GRB by an input capture signal, when GRB functions as an input capture register. (Initial value)
Bit 0--Input Capture/Compare Match Flag A (IMFA): This status flag indicates GRA compare match or input capture events.
Bit 0: IMFA 0 Description [Clearing conditions] Read IMFA when IMFA = 1, then write 0 in IMFA. DMAC activated by IMIA interrupt (channels 0 to 3 only). 1 [Setting conditions] TCNT = GRA when GRA functions as an output compare register. TCNT value is transferred to GRA by an input capture signal, when GRA functions as an input capture register. (Initial value)
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.2.13 Timer Interrupt Enable Register (TIER) TIER is an 8-bit register. The ITU has five TIERs, one in each channel.
Channel 0 1 2 3 4 Abbreviation TIER0 TIER1 TIER2 TIER3 TIER4 Function Enables or disables interrupt requests.
Bit Initial value Read/Write
7 1
6 1
5 1 Reserved bits
4 1
3 1
2 OVIE 0 R/W
1 IMIEB 0 R/W
0 IMIEA 0 R/W
Overflow interrupt enable Enables or disables OVF interrupts Input capture/compare match interrupt enable B Enables or disables IMFB interrupts Input capture/compare match interrupt enable A Enables or disables IMFA interrupts
Each TIER is an 8-bit readable/writable register that enables and disables overflow interrupt requests and general register compare match and input capture interrupt requests. TIER is initialized to H'F8 by a reset and in standby mode. Bits 7 to 3--Reserved: Read-only bits, always read as 1.
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Section 10 16-Bit Integrated Timer Unit (ITU)
Bit 2--Overflow Interrupt Enable (OVIE): Enables or disables the interrupt requested by the OVF flag in TSR when OVF is set to 1.
Bit 2: OVIE 0 1 Description OVI interrupt requested by OVF is disabled OVI interrupt requested by OVF is enabled (Initial value)
Bit 1--Input Capture/Compare Match Interrupt Enable B (IMIEB): Enables or disables the interrupt requested by the IMFB flag in TSR when IMFB is set to 1.
Bit 1: IMIEB 0 1 Description IMIB interrupt requested by IMFB is disabled IMIB interrupt requested by IMFB is enabled (Initial value)
Bit 0--Input Capture/Compare Match Interrupt Enable A (IMIEA): Enables or disables the interrupt requested by the IMFA flag in TSR when IMFA is set to 1.
Bit 0: IMIEA 0 1 Description IMIA interrupt requested by IMFA is disabled IMIA interrupt requested by IMFA is enabled (Initial value)
10.3
10.3.1
CPU Interface
16-Bit Accessible Registers
The timer counters (TCNTs), general registers A and B (GRAs and GRBs), and buffer registers A and B (BRAs and BRBs) are 16-bit registers, and are linked to the CPU by an internal 16-bit data bus. These registers can be written or read a word at a time, or a byte at a time. Figures 10.6 and 10.7 show examples of word access to a timer counter (TCNT). Figures 10.8 to 10.11 show examples of byte access to TCNTH and TCNTL.
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Section 10 16-Bit Integrated Timer Unit (ITU)
On-chip data bus H CPU L Bus interface H L Module data bus
TCNTH
TCNTL
Figure 10.6 Access to Timer Counter (CPU Writes to TCNT, Word)
On-chip data bus H CPU L Bus interface H L Module data bus
TCNTH
TCNTL
Figure 10.7 Access to Timer Counter (CPU Reads TCNT, Word)
On-chip data bus H CPU L Bus interface H L Module data bus
TCNTH
TCNTL
Figure 10.8 Access to Timer Counter (CPU Writes to TCNT, Upper Byte)
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Section 10 16-Bit Integrated Timer Unit (ITU)
On-chip data bus H CPU L Bus interface H L Module data bus
TCNTH
TCNTL
Figure 10.9 Access to Timer Counter (CPU Writes to TCNT, Lower Byte)
On-chip data bus H CPU L Bus interface H L Module data bus
TCNTH
TCNTL
Figure 10.10 Access to Timer Counter (CPU Reads TCNT, Upper Byte)
On-chip data bus H CPU L Bus interface H L Module data bus
TCNTH
TCNTL
Figure 10.11 Access to Timer Counter (CPU Reads TCNT, Lower Byte)
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.3.2
8-Bit Accessible Registers
The registers other than the timer counters, general registers, and buffer registers are 8-bit registers. These registers are linked to the CPU by an internal 8-bit data bus. Figures 10.12 and 10.13 show examples of byte read and write access to a TCR. If a word-size data transfer instruction is executed, two byte transfers are performed.
On-chip data bus H CPU L Bus interface H L Module data bus
TCR
Figure 10.12 Access to Timer Counter (CPU Writes to TCR)
On-chip data bus H CPU L Bus interface H L Module data bus
TCR
Figure 10.13 Access to Timer Counter (CPU Reads TCR)
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.4
10.4.1
Operation
Overview
A summary of operations in the various modes is given below. Normal Operation Each channel has a timer counter and general registers. The timer counter counts up, and can operate as a free-running counter, periodic counter, or external event counter. General registers A and B can be used for input capture or output compare. Synchronous Operation The timer counters in designated channels are preset synchronously. Data written to the timer counter in any one of these channels is simultaneously written to the timer counters in the other channels as well. The timer counters can also be cleared synchronously if so designated by the CCLR1 and CCLR0 bits in the TCRs. PWM Mode A PWM waveform is output from the TIOCA pin. The output goes to 1 at compare match A and to 0 at compare match B. The duty cycle can be varied from 0% to 100% depending on the settings of GRA and GRB. When a channel is set to PWM mode, its GRA and GRB automatically become output compare registers. Reset-Synchronized PWM Mode Channels 3 and 4 are paired for three-phase PWM output with complementary waveforms. (The three phases are related by having a common transition point.) When reset-synchronized PWM mode is selected GRA3, GRB3, GRA4, and GRB4 automatically function as output compare registers, TIOCA3, TIOCB3, TIOCA4, TOCXA4, TIOCB4, and TOCXB4 function as PWM output pins, and TCNT3 operates as an up-counter. TCNT4 operates independently, and is not compared with GRA4 or GRB4.
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Section 10 16-Bit Integrated Timer Unit (ITU)
Complementary PWM Mode Channels 3 and 4 are paired for three-phase PWM output with non-overlapping complementary waveforms. When complementary PWM mode is selected GRA3, GRB3, GRA4, and GRB4 automatically function as output compare registers, and TIOCA3, TIOCB3, TIOCA4, TOCXA4, TIOCB4, and TOCXB4 function as PWM output pins. TCNT3 and TCNT4 operate as up/downcounters. Phase Counting Mode The phase relationship between two clock signals input at TCLKA and TCLKB is detected and TCNT2 counts up or down accordingly. When phase counting mode is selected TCLKA and TCLKB become clock input pins and TCNT2 operates as an up/down-counter. Buffering * If the general register is an output compare register When compare match occurs the buffer register value is transferred to the general register. * If the general register is an input capture register When input capture occurs the TCNT value is transferred to the general register, and the previous general register value is transferred to the buffer register. * Complementary PWM mode The buffer register value is transferred to the general register when TCNT3 and TCNT4 change counting direction. * Reset-synchronized PWM mode The buffer register value is transferred to the general register at GRA3 compare match.
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.4.2
Basic Functions
Counter Operation When one of bits STR0 to STR4 is set to 1 in the timer start register (TSTR), the timer counter (TCNT) in the corresponding channel starts counting. The counting can be free-running or periodic. Sample setup procedure for counter: Figure 10.14 shows a sample procedure for setting up a counter.
Counter setup
Select counter clock
1
Type of counting? Yes
No
Free-running counting Periodic counting
Select counter clear source
2
Select output compare register function
3
Set period
4
Start counter Periodic counter
5
Start counter Free-running counter
5
Figure 10.14 Counter Setup Procedure (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
1. Set bits TPSC2 to TPSC0 in TCR to select the counter clock source. If an external clock source is selected, set bits CKEG1 and CKEG0 in TCR to select the desired edge(s) of the external clock signal. 2. For periodic counting, set CCLR1 and CCLR0 in TCR to have TCNT cleared at GRA compare match or GRB compare match. 3. Set TIOR to select the output compare function of GRA or GRB, whichever was selected in step 2. 4. Write the count period in GRA or GRB, whichever was selected in step 2. 5. Set the STR bit to 1 in TSTR to start the timer counter. Free-running and periodic counter operation: A reset leaves the counters (TCNTs) in ITU channels 0 to 4 all set as free-running counters. A free-running counter starts counting up when the corresponding bit in TSTR is set to 1. When the count overflows from H'FFFF to H'0000, the OVF flag is set to 1 in TSR. If the corresponding OVIE bit is set to 1 in TIER, a CPU interrupt is requested. After the overflow, the counter continues counting up from H'0000. Figure 10.15 illustrates free-running counting.
TCNT value H'FFFF
H'0000 STR0 to STR4 bit OVF
Time
Figure 10.15 Free-Running Counter Operation When a channel is set to have its counter cleared by compare match, in that channel TCNT operates as a periodic counter. Select the output compare function of GRA or GRB, set bit CCLR1 or CCLR0 in TCR to have the counter cleared by compare match, and set the count period in GRA or GRB. After these settings, the counter starts counting up as a periodic counter when the corresponding bit is set to 1 in TSTR. When the count matches GRA or GRB, the IMFA or IMFB flag is set to 1 in TSR and the counter is cleared to H'0000. If the corresponding IMIEA or IMIEB bit is set to 1 in TIER, a CPU interrupt is requested at this time. After the compare match, TCNT continues counting up from H'0000. Figure 10.16 illustrates periodic counting.
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Section 10 16-Bit Integrated Timer Unit (ITU)
TCNT value GR
Counter cleared by general register compare match
H'0000 STR bit IMF
Time
Figure 10.16 Periodic Counter Operation TCNT count timing: * Internal clock source Bits TPSC2 to TPSC0 in TCR select the system clock () or one of three internal clock sources obtained by prescaling the system clock (/2, /4, /8). Figure 10.17 shows the timing.
Internal clock TCNT input TCNT N-1 N N+1
Figure 10.17 Count Timing for Internal Clock Sources * External clock source Bits TPSC2 to TPSC0 in TCR select an external clock input pin (TCLKA to TCLKD), and its valid edge or edges are selected by bits CKEG1 and CKEG0. The rising edge, falling edge, or both edges can be selected. The pulse width of the external clock signal must be at least 1.5 system clocks when a single edge is selected, and at least 2.5 system clocks when both edges are selected. Shorter pulses will not be counted correctly. Figure 10.18 shows the timing when both edges are detected.
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Section 10 16-Bit Integrated Timer Unit (ITU)
External clock input TCNT input TCNT N-1 N N+1
Figure 10.18 Count Timing for External Clock Sources (when Both Edges Are Detected) Waveform Output by Compare Match In ITU channels 0, 1, 3, and 4, compare match A or B can cause the output at the TIOCA or TIOCB pin to go to 0, go to 1, or toggle. In channel 2 the output can only go to 0 or go to 1. Sample setup procedure for waveform output by compare match: Figure 10.19 shows a sample procedure for setting up waveform output by compare match.
Output setup
Select waveform output mode
1
1. Select the compare match output mode (0, 1, or toggle) in TIOR. When a waveform output mode is selected, the pin switches from its generic input/ output function to the output compare function (TIOCA or TIOCB). An output compare pin outputs 0 until the first compare match occurs.
Set output timing
2
2. Set a value in GRA or GRB to designate the compare match timing.
Start counter
3
3. Set the STR bit to 1 in TSTR to start the timer counter.
Waveform output
Figure 10.19 Setup Procedure for Waveform Output by Compare Match (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Examples of waveform output: Figure 10.20 shows examples of 0 and 1 output. TCNT operates as a free-running counter, 0 output is selected for compare match A, and 1 output is selected for compare match B. When the pin is already at the selected output level, the pin level does not change.
TCNT value H'FFFF GRB GRA H'0000 TIOCB Time No change No change 1 output
TIOCA
No change
No change
0 output
Figure 10.20 0 and 1 Output (Examples) Figure 10.21 shows examples of toggle output. TCNT operates as a periodic counter, cleared by compare match B. Toggle output is selected for both compare match A and B.
TCNT value GRB
Counter cleared by compare match with GRB
GRA
H'0000 TIOCB
Time Toggle output Toggle output
TIOCA
Figure 10.21 Toggle Output (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Output compare timing: The compare match signal is generated in the last state in which TCNT and the general register match (when TCNT changes from the matching value to the next value). When the compare match signal is generated, the output value selected in TIOR is output at the output compare pin (TIOCA or TIOCB). When TCNT matches a general register, the compare match signal is not generated until the next counter clock pulse. Figure 10.22 shows the output compare timing.
TCNT input clock TCNT N N+1
GR Compare match signal TIOCA, TIOCB
N
Figure 10.22 Output Compare Timing Input Capture Function The TCNT value can be captured into a general register when a transition occurs at an input capture/output compare pin (TIOCA or TIOCB). Capture can take place on the rising edge, falling edge, or both edges. The input capture function can be used to measure pulse width or period. Sample setup procedure for input capture: Figure 10.23 shows a sample procedure for setting up input capture.
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Section 10 16-Bit Integrated Timer Unit (ITU)
Input selection
Select input-capture input
1
1. Set TIOR to select the input capture function of a general register and the rising edge, falling edge, or both edges of the input capture signal. Clear the port data direction bit to 0 before making these TIOR settings.
Start counter
2
2. Set the STR bit to 1 in TSTR to start the timer counter.
Input capture
Figure 10.23 Setup Procedure for Input Capture (Example) Examples of input capture: Figure 10.24 illustrates input capture when the falling edge of TIOCB and both edges of TIOCA are selected as capture edges. TCNT is cleared by input capture into GRB.
TCNT value H'0180 H'0160 H'0005 H'0000 TIOCB
Counter cleared by TIOCB input (falling edge)
Time
TIOCA
GRA
H'0005
H'0160
GRB
H'0180
Figure 10.24 Input Capture (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Input capture signal timing: Input capture on the rising edge, falling edge, or both edges can be selected by settings in TIOR. Figure 10.25 shows the timing when the rising edge is selected. The pulse width of the input capture signal must be at least 1.5 system clocks for single-edge capture, and 2.5 system clocks for capture of both edges.
Input-capture input
Internal input capture signal
TCNT
N
GRA, GRB
N
Figure 10.25 Input Capture Signal Timing
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.4.3
Synchronization
The synchronization function enables two or more timer counters to be synchronized by writing the same data to them simultaneously (synchronous preset). With appropriate TCR settings, two or more timer counters can also be cleared simultaneously (synchronous clear). Synchronization enables additional general registers to be associated with a single time base. Synchronization can be selected for all channels (0 to 4). Sample Setup Procedure for Synchronization Figure 10.26 shows a sample procedure for setting up synchronization.
Setup for synchronization Select synchronization 1
Synchronous preset
Synchronous clear
Write to TCNT
2
Clearing synchronized to this channel? Yes Select counter clear source
No
3
Select counter clear source
4
Start counter
5
Start counter
5
Synchronous preset
Counter clear
Synchronous clear
1. Set the SYNC bits to 1 in TSNC for the channels to be synchronized. 2. When a value is written in TCNT in one of the synchronized channels, the same value is simultaneously written in TCNT in the other channels (synchronized preset). 3. Set the CCLR1 or CCLR0 bit in TCR to have the counter cleared by compare match or input capture. 4. Set the CCLR1 and CCLR0 bits in TCR to have the counter cleared synchronously. 5. Set the STR bits in TSTR to 1 to start the synchronized counters.
Figure 10.26 Setup Procedure for Synchronization (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Example of Synchronization Figure 10.27 shows an example of synchronization. Channels 0, 1, and 2 are synchronized, and are set to operate in PWM mode. Channel 0 is set for counter clearing by compare match with GRB0. Channels 1 and 2 are set for synchronous counter clearing. The timer counters in channels 0, 1, and 2 are synchronously preset, and are synchronously cleared by compare match with GRB0. A three-phase PWM waveform is output from pins TIOCA0, TIOCA1, and TIOCA2. For further information on PWM mode, see section 10.4.4, PWM Mode.
Value of TCNT0 to TCNT2
Cleared by compare match with GRB0
GRB0 GRB1 GRA0 GRB2 GRA1 GRA2 H'0000 TIOCA0 Time
TIOCA1
TIOCA2
Figure 10.27 Synchronization (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.4.4
PWM Mode
In PWM mode GRA and GRB are paired and a PWM waveform is output from the TIOCA pin. GRA specifies the time at which the PWM output changes to 1. GRB specifies the time at which the PWM output changes to 0. If either GRA or GRB is selected as the counter clear source, a PWM waveform with a duty cycle from 0% to 100% is output at the TIOCA pin. PWM mode can be selected in all channels (0 to 4). Table 10.4 summarizes the PWM output pins and corresponding registers. If the same value is set in GRA and GRB, the output does not change when compare match occurs. Table 10.4
Channel 0 1 2 3 4
PWM Output Pins and Registers
Output Pin TIOCA0 TIOCA1 TIOCA2 TIOCA3 TIOCA4 1 Output GRA0 GRA1 GRA2 GRA3 GRA4 0 Output GRB0 GRB1 GRB2 GRB3 GRB4
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Section 10 16-Bit Integrated Timer Unit (ITU)
Sample Setup Procedure for PWM Mode Figure 10.28 shows a sample procedure for setting up PWM mode.
PWM mode
Select counter clock
1
Select counter clear source
2
Set GRA
3
Set GRB
4
Select PWM mode
5
Start counter
6
PWM mode
1. Set bits TPSC2 to TPSC0 in TCR to select the counter clock source. If an external clock source is selected, set bits CKEG1 and CKEG0 in TCR to select the desired edge(s) of the external clock signal. 2. Set bits CCLR1 and CCLR0 in TCR to select the counter clear source. 3. Set the time at which the PWM waveform should go to 1 in GRA. 4. Set the time at which the PWM waveform should go to 0 in GRB. 5. Set the PWM bit in TMDR to select PWM mode. When PWM mode is selected, regardless of the TIOR contents, GRA and GRB become output compare registers specifying the times at which the PWM output goes to 1 and 0. The TIOCA pin automatically becomes the PWM output pin. The TIOCB pin conforms to the settings of bits IOB1 and IOB0 in TIOR. If TIOCB output is not desired, clear both IOB1 and IOB0 to 0. 6. Set the STR bit to 1 in TSTR to start the timer counter.
Figure 10.28 Setup Procedure for PWM Mode (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Examples of PWM Mode Figure 10.29 shows examples of operation in PWM mode. In PWM mode TIOCA becomes an output pin. The output goes to 1 at compare match with GRA, and to 0 at compare match with GRB. In the examples shown, TCNT is cleared by compare match with GRA or GRB. Synchronized operation and free-running counting are also possible.
TCNT value Counter cleared by compare match with GRA GRA
GRB
H'0000
Time
TIOCA a. Counter cleared by GRA
TCNT value Counter cleared by compare match with GRB GRB
GRA
H'0000
Time
TIOCA b. Counter cleared by GRB
Figure 10.29 PWM Mode (Example 1)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Figure 10.30 shows examples of the output of PWM waveforms with duty cycles of 0% and 100%. If the counter is cleared by compare match with GRB, and GRA is set to a higher value than GRB, the duty cycle is 0%. If the counter is cleared by compare match with GRA, and GRB is set to a higher value than GRA, the duty cycle is 100%.
TCNT value GRB
Counter cleared by compare match with GRB
GRA
H'0000
Time
TIOCA
Write to GRA a. 0% duty cycle TCNT value GRA
Write to GRA
Counter cleared by compare match with GRA
GRB
H'0000
Time
TIOCA
Write to GRB
Write to GRB
b. 100% duty cycle
Figure 10.30 PWM Mode (Example 2)
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.4.5
Reset-Synchronized PWM Mode
In reset-synchronized PWM mode channels 3 and 4 are combined to produce three pairs of complementary PWM waveforms, all having one waveform transition point in common. When reset-synchronized PWM mode is selected TIOCA3, TIOCB3, TIOCA4, TOCXA4, TIOCB4, and TOCXB4 automatically become PWM output pins, and TCNT3 functions as an up-counter. Table 10.5 lists the PWM output pins. Table 10.6 summarizes the register settings. Table 10.5
Channel 3 4
Output Pins in Reset-Synchronized PWM Mode
Output Pin TIOCA3 TIOCB3 TIOCA4 TOCXA4 TIOCB4 TOCXB4 Description PWM output 1 PWM output 1' (complementary waveform to PWM output 1) PWM output 2 PWM output 2' (complementary waveform to PWM output 2) PWM output 3 PWM output 3' (complementary waveform to PWM output 3)
Table 10.6
Register TCNT3 TCNT4 GRA3 GRB3 GRA4 GRB4
Register Settings in Reset-Synchronized PWM Mode
Setting Initially set to H'0000 Not used (operates independently) Specifies the count period of TCNT3 Specifies a transition point of PWM waveforms output from TIOCA3 and TIOCB3 Specifies a transition point of PWM waveforms output from TIOCA4 and TOCXA4 Specifies a transition point of PWM waveforms output from TIOCB4 and TOCXB4
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Section 10 16-Bit Integrated Timer Unit (ITU)
Sample Setup Procedure for Reset-Synchronized PWM Mode Figure 10.31 shows a sample procedure for setting up reset-synchronized PWM mode.
Reset-synchronized PWM mode
Stop counter
1
Select counter clock
2
Select counter clear source
3
Select reset-synchronized PWM mode
4
Set TCNT
5
Set general registers
6
Start counter
7
Reset-synchronized PWM mode
1. Clear the STR3 bit in TSTR to 0 to halt TCNT3. Reset-synchronized PWM mode must be set up while TCNT3 is halted. 2. Set bits TPSC2 to TPSC0 in TCR to select the counter clock source for channel 3. If an external clock source is selected, select the external clock edge(s) with bits CKEG1 and CKEG0 in TCR. 3. Set bits CCLR1 and CCLR0 in TCR3 to select GRA3 compare match as the counter clear source. 4. Set bits CMD1 and CMD0 in TFCR to select reset-synchronized PWM mode. TIOCA3, TIOCB3, TIOCA4, TIOCB4, TOCXA4, and TOCXB4 automatically become PWM output pins. 5. Preset TCNT3 to H'0000. TCNT4 need not be preset. 6. GRA3 is the waveform period register. Set the waveform period value in GRA3. Set transition times of the PWM output waveforms in GRB3, GRA4, and GRB4. Set times within the compare match range of TCNT3. X GRA3 (X: setting value) 7. Set the STR3 bit in TSTR to 1 to start TCNT3.
Figure 10.31 Setup Procedure for Reset-Synchronized PWM Mode (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Example of Reset-Synchronized PWM Mode Figure 10.32 shows an example of operation in reset-synchronized PWM mode. TCNT3 operates as an up-counter in this mode. TCNT4 operates independently, detached from GRA4 and GRB4. When TCNT3 matches GRA3, TCNT3 is cleared and resumes counting from H'0000. The PWM outputs toggle at compare match of TCNT3 with GRB3, GRA4, and GRB4 respectively, and all toggle when the counter is cleared.
TCNT3 value Counter cleared at compare match with GRA3 GRA3 GRB3 GRA4 GRB4 H'0000 Time
TIOCA3
TIOCB3
TIOCA4
TOCXA4
TIOCB4
TOCXB4
Figure 10.32 Operation in Reset-Synchronized PWM Mode (Example) (when OLS3 = OLS4 = 1) For the settings and operation when reset-synchronized PWM mode and buffer mode are both selected, see section 10.4.8, Buffering.
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.4.6
Complementary PWM Mode
In complementary PWM mode channels 3 and 4 are combined to output three pairs of complementary, non-overlapping PWM waveforms. When complementary PWM mode is selected TIOCA3, TIOCB3, TIOCA4, TOCXA4, TIOCB4, and TOCXB4 automatically become PWM output pins, and TCNT3 and TCNT4 function as up/downcounters. Table 10.7 lists the PWM output pins. Table 10.8 summarizes the register settings. Table 10.7
Channel 3
Output Pins in Complementary PWM Mode
Output Pin TIOCA3 TIOCB3 Description PWM output 1 PWM output 1' (non-overlapping complementary waveform to PWM output 1) PWM output 2 PWM output 2' (non-overlapping complementary waveform to PWM output 2) PWM output 3 PWM output 3' (non-overlapping complementary waveform to PWM output 3)
4
TIOCA4 TOCXA4 TIOCB4 TOCXB4
Table 10.8
Register TCNT3 TCNT4 GRA3 GRB3 GRA4 GRB4
Register Settings in Complementary PWM Mode
Setting Initially specifies the non-overlap margin (difference to TCNT4) Initially set to H'0000 Specifies the upper limit value of TCNT3 minus 1 Specifies a transition point of PWM waveforms output from TIOCA3 and TIOCB3 Specifies a transition point of PWM waveforms output from TIOCA4 and TOCXA4 Specifies a transition point of PWM waveforms output from TIOCB4 and TOCXB4
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Section 10 16-Bit Integrated Timer Unit (ITU)
Setup Procedure for Complementary PWM Mode Figure 10.33 shows a sample procedure for setting up complementary PWM mode.
Complementary PWM mode
Stop counting
1
1. Clear bits STR3 and STR4 to 0 in TSTR to halt the timer counters. Complementary PWM mode must be set up while TCNT3 and TCNT4 are halted. 2. Set bits TPSC2 to TPSC0 in TCR to select the same counter clock source for channels 3 and 4. If an external clock source is selected, select the external clock edge(s) with bits CKEG1 and CKEG0 in TCR. Do not select any counter clear source with bits CCLR1 and CCLR0 in TCR. 3. Set bits CMD1 and CMD0 in TFCR to select complementary PWM mode. TIOCA3, TIOCB3, TIOCA4, TIOCB4, TOCXA4, and TOCXB4 automatically become PWM output pins. 4. Clear TCNT4 to H'0000. Set the non-overlap margin in TCNT3. Do not set TCNT3 and TCNT4 to the same value. 5. GRA3 is the waveform period register. Set the upper limit value of TCNT3 minus 1 in GRA3. Set transition times of the PWM output waveforms in GRB3, GRA4, and GRB4. Set times within the compare match range of TCNT3 and TCNT4. T X (X: initial setting of GRB3, GRA4, or GRB4. T: initial setting of TCNT3) 6. Set bits STR3 and STR4 in TSTR to 1 to start TCNT3 and TCNT4.
Select counter clock
2
Select complementary PWM mode
3
Set TCNTs
4
Set general registers
5
Start counters
6
Complementary PWM mode
Note: After exiting complementary PWM mode, to resume operating in complementary PWM mode, follow the entire setup procedure from step 1 again.
Figure 10.33 Setup Procedure for Complementary PWM Mode (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Clearing Procedure for Complementary PWM Mode Figure 10.34 shows the steps to clear complementary PWM mode.
Complementary PWM mode
1. Clear the CMD1 bit of TFCR to 0 to set channels 3 and 4 to normal operating mode. 1 2. After setting channels 3 and 4 to normal operating mode, wait at least one counter clock period, then clear bits STR3 and STR4 of TSTR to 0 to stop counter operation of TCNT3 and TCNT4.
Clear complementary PWM mode
Stop counter operation
2
Normal operating mode
Figure 10.34 Clearing Procedure for Complementary PWM Mode
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Section 10 16-Bit Integrated Timer Unit (ITU)
Examples of Complementary PWM Mode Figure 10.35 shows an example of operation in complementary PWM mode. TCNT3 and TCNT4 operate as up/down-counters, counting down from compare match between TCNT3 and GRA3 and counting up from the point at which TCNT4 underflows. During each up-and-down counting cycle, PWM waveforms are generated by compare match with general registers GRB3, GRA4, and GRB4. Since TCNT3 is initially set to a higher value than TCNT4, compare match events occur in the sequence TCNT3, TCNT4, TCNT4, TCNT3.
TCNT3 and TCNT4 values GRA3 TCNT3 GRB3 GRA4 GRB4 H'0000 Up-counting starts when TCNT4 underflows TCNT4
Down-counting starts at compare match between TCNT3 and GRA3
Time
TIOCA3
TIOCB3
TIOCA4
TOCXA4
TIOCB4
TOCXB4
Figure 10.35 Operation in Complementary PWM Mode (Example 1, OLS3 = OLS4 = 1)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Figure 10.36 shows examples of waveforms with 0% and 100% duty cycles (in one phase) in complementary PWM mode. In this example the outputs change at compare match with GRB3, so waveforms with duty cycles of 0% or 100% can be output by setting GRB3 to a value larger than GRA3. The duty cycle can be changed easily during operation by use of the buffer registers. For further information see section 10.4.8, Buffering.
TCNT3 and TCNT4 values GRA3
GRB3
H'0000 TIOCA3 TIOCB3 0% duty cycle a. 0% duty cycle TCNT3 and TCNT4 values GRA3
Time
GRB3
H'0000 TIOCA3 TIOCB3 100% duty cycle b. 100% duty cycle
Time
Figure 10.36 Operation in Complementary PWM Mode (Example 2, OLS3 = OLS4 = 1)
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Section 10 16-Bit Integrated Timer Unit (ITU)
In complementary PWM mode, TCNT3 and TCNT4 overshoot and undershoot at the transitions between up-counting and down-counting. The setting conditions for the IMFA bit in channel 3 and the OVF bit in channel 4 differ from the usual conditions. In buffered operation the buffer transfer conditions also differ. Timing diagrams are shown in figures 10.37 and 10.38.
TCNT3
N-1
N
N+1
N
N-1
GRA3
N
IMFA Set to 1 Buffer transfer signal (BR to GR)
Flag not set
GR Buffer transfer No buffer transfer
Figure 10.37 Overshoot Timing
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Section 10 16-Bit Integrated Timer Unit (ITU)
Underflow TCNT4 H'0001 H'0000 H'FFFF
Overflow H'0000
OVF Set to 1 Buffer transfer signal (BR to GR)
Flag not set
GR Buffer transfer No buffer transfer
Figure 10.38 Undershoot Timing In channel 3, IMFA is set to 1 only during up-counting. In channel 4, OVF is set to 1 only when an underflow occurs. When buffering is selected, buffer register contents are transferred to the general register at compare match A3 during up-counting, and when TCNT4 underflows. General Register Settings in Complementary PWM Mode When setting up general registers for complementary PWM mode or changing their settings during operation, note the following points. * Initial settings Do not set values from H'0000 to T - 1 (where T is the initial value of TCNT3). After the counters start and the first compare match A3 event has occurred, however, settings in this range also become possible. * Changing settings Use the buffer registers. Correct waveform output may not be obtained if a general register is written to directly. * Cautions on changes of general register settings Figure 10.39 shows six correct examples and one incorrect example.
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Section 10 16-Bit Integrated Timer Unit (ITU)
GRA3 GR
H'0000 BR
Not allowed
GR
Figure 10.39 Changing a General Register Setting by Buffer Transfer (Example 1) Buffer transfer at transition from up-counting to down-counting If the general register value is in the range from GRA3 - T + 1 to GRA3, do not transfer a buffer register value outside this range. Conversely, if the general register value is outside this range, do not transfer a value within this range. See figure 10.40.
GRA3 + 1 GRA3
Illegal changes
GRA3 - T + 1 GRA3 - T
TCNT3
TCNT4
Figure 10.40 Changing a General Register Setting by Buffer Transfer (Caution 1) Buffer transfer at transition from down-counting to up-counting If the general register value is in the range from H'0000 to T - 1, do not transfer a buffer register value outside this range. Conversely, when a general register value is outside this range, do not transfer a value within this range. See figure 10.41.
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TCNT3 TCNT4 T T-1 Illegal changes H'0000 H'FFFF
Figure 10.41 Changing a General Register Setting by Buffer Transfer (Caution 2) General register settings outside the counting range (H'0000 to GRA3) Waveforms with a duty cycle of 0% or 100% can be output by setting a general register to a value outside the counting range. When a buffer register is set to a value outside the counting range, then later restored to a value within the counting range, the counting direction (up or down) must be the same both times. See figure 10.42.
GRA3 GR H'0000 0% duty cycle Output pin Output pin 100% duty cycle
BR
GR Write during down-counting Write during up-counting
Figure 10.42 Changing a General Register Setting by Buffer Transfer (Example 2) Settings can be made in this way by detecting GRA3 compare match or TCNT4 underflow before writing to the buffer register. They can also be made by using GRA3 compare match to activate the DMAC.
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.4.7
Phase Counting Mode
In phase counting mode the phase difference between two external clock inputs (at the TCLKA and TCLKB pins) is detected, and TCNT2 counts up or down accordingly. In phase counting mode, the TCLKA and TCLKB pins automatically function as external clock input pins and TCNT2 becomes an up/down-counter, regardless of the settings of bits TPSC2 to TPSC0, CKEG1, and CKEG0 in TCR2. Settings of bits CCLR1, CCLR0 in TCR2, and settings in TIOR2, TIER2, TSR2, GRA2, and GRB2 are valid. The input capture and output compare functions can be used, and interrupts can be generated. Phase counting is available only in channel 2. Sample Setup Procedure for Phase Counting Mode Figure 10.43 shows a sample procedure for setting up phase counting mode.
Phase counting mode
Select phase counting mode
1
Select flag setting condition
2
1. Set the MDF bit in TMDR to 1 to select phase counting mode. 2. Select the flag setting condition with the FDIR bit in TMDR. 3. Set the STR2 bit to 1 in TSTR to start the timer counter.
Start counter
3
Phase counting mode
Figure 10.43 Setup Procedure for Phase Counting Mode (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Example of Phase Counting Mode Figure 10.44 shows an example of operations in phase counting mode. Table 10.9 lists the upcounting and down-counting conditions for TCNT2. In phase counting mode both the rising and falling edges of TCLKA and TCLKB are counted. The phase difference between TCLKA and TCLKB must be at least 1.5 states, the phase overlap must also be at least 1.5 states, and the pulse width must be at least 2.5 states. See figure 10.45.
TCNT2 value Counting up Counting down
Time TCLKB TCLKA
Figure 10.44 Operation in Phase Counting Mode (Example) Table 10.9 Up/Down Counting Conditions
Counting Direction TCLKB TCLKA Up-Counting Low High High Low Down-Counting High Low Low High
Phase difference
Phase difference
Pulse width
Pulse width
TCLKA
TCLKB Phase difference and overlap: at least 1.5 states Pulse width: at least 2.5 states
Overlap
Overlap
Figure 10.45 Phase Difference, Overlap, and Pulse Width in Phase Counting Mode
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.4.8
Buffering
Buffering operates differently depending on whether a general register is an output compare register or an input capture register, with further differences in reset-synchronized PWM mode and complementary PWM mode. Buffering is available only in channels 3 and 4. Buffering operations under the conditions mentioned above are described next. * General register used for output compare The buffer register value is transferred to the general register at compare match. See figure 10.46.
Compare match signal
BR
GR
Comparator
TCNT
Figure 10.46 Compare Match Buffering * General register used for input capture The TCNT value is transferred to the general register at input capture. The previous general register value is transferred to the buffer register. See figure 10.47.
Input capture signal
BR
GR
TCNT
Figure 10.47 Input Capture Buffering * Complementary PWM mode The buffer register value is transferred to the general register when TCNT3 and TCNT4 change counting direction. This occurs at the following two times: When TCNT3 compare matches GRA3 When TCNT4 underflows * Reset-synchronized PWM mode The buffer register value is transferred to the general register at compare match A3.
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Section 10 16-Bit Integrated Timer Unit (ITU)
Sample Buffering Setup Procedure Figure 10.48 shows a sample buffering setup procedure.
Buffering
Select general register functions
1
Set buffer bits
2
1. Set TIOR to select the output compare or input capture function of the general registers. 2. Set bits BFA3, BFA4, BFB3, and BFB4 in TFCR to select buffering of the required general registers. 3. Set the STR bits to 1 in TSTR to start the timer counters.
Start counters
3
Buffered operation
Figure 10.48 Buffering Setup Procedure (Example) Examples of Buffering Figure 10.49 shows an example in which GRA is set to function as an output compare register buffered by BRA, TCNT is set to operate as a periodic counter cleared by GRB compare match, and TIOCA and TIOCB are set to toggle at compare match A and B. Because of the buffer setting, when TIOCA toggles at compare match A, the BRA value is simultaneously transferred to GRA. This operation is repeated each time compare match A occurs. Figure 10.50 shows the transfer timing.
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Section 10 16-Bit Integrated Timer Unit (ITU)
TCNT value GRB H'0250 H'0200 H'0100 H'0000 BRA GRA TIOCB TIOCA H'0200 H'0250
Counter cleared by compare match B
Time H'0100 H'0200 H'0100 H'0200 H'0200 Toggle output Toggle output
Compare match A
Figure 10.49 Register Buffering (Example 1: Buffering of Output Compare Register)
TCNT Compare match signal Buffer transfer signal BR GR n N N n n+1
Figure 10.50 Compare Match and Buffer Transfer Timing (Example) Figure 10.51 shows an example in which GRA is set to function as an input capture register buffered by BRA, and TCNT is cleared by input capture B. The falling edge is selected as the input capture edge at TIOCB. Both edges are selected as input capture edges at TIOCA. Because
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Section 10 16-Bit Integrated Timer Unit (ITU)
of the buffer setting, when the TCNT value is captured into GRA at input capture A, the previous GRA value is simultaneously transferred to BRA. Figure 10.52 shows the transfer timing.
TCNT value H'0180 H'0160
Counter cleared by input capture B
H'0005 H'0000 TIOCB
Time
TIOCA
GRA
H'0005
H'0160
BRA
H'0005
H'0160
GRB
H'0180
Input capture A
Figure 10.51 Register Buffering (Example 2: Buffering of Input Capture Register)
TIOC pin Input capture signal TCNT GR BR M m n n M n+1 N n M N n N+1
Figure 10.52 Input Capture and Buffer Transfer Timing (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Figure 10.53 shows an example in which GRB3 is buffered by BRB3 in complementary PWM mode. Buffering is used to set GRB3 to a higher value than GRA3, generating a PWM waveform with 0% duty cycle. The BRB3 value is transferred to GRB3 when TCNT3 matches GRA3, and when TCNT4 underflows.
TCNT3 and TCNT4 values H'1FFF GRA3 TCNT3 TCNT4 GRB3
H'0999
H'0000
Time
BRB3 GRB3
H'0999 H'0999 H'0999
H'1FFF H'1FFF H'1FFF
H'0999 H'0999
TIOCA3
TIOCB3
Figure 10.53 Register Buffering (Example 3: Buffering in Complementary PWM Mode)
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.4.9
ITU Output Timing
The ITU outputs from channels 3 and 4 can be disabled by bit settings in TOER or by an external trigger, or inverted by bit settings in TOCR. Timing of Enabling and Disabling of ITU Output by TOER In this example an ITU output is disabled by clearing a master enable bit to 0 in TOER. An arbitrary value can be output by appropriate settings of the data register (DR) and data direction register (DDR) of the corresponding input/output port. Figure 10.54 illustrates the timing of the enabling and disabling of ITU output by TOER.
T1 T2 T3
Address bus
TOER address
TOER
ITU output pin
Timer output
I/O port
ITU output
Generic input/output
Figure 10.54 Timing of Disabling of ITU Output by Writing to TOER (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Timing of Disabling of ITU Output by External Trigger If the XTGD bit is cleared to 0 in TOCR in reset-synchronized PWM mode or complementary PWM mode, when an input capture A signal occurs in channel 1, the master enable bits are cleared to 0 in TOER, disabling ITU output. Figure 10.55 shows the timing.
TIOCA1 pin Input capture signal TOER ITU output pins N ITU output ITU output N: Arbitrary setting (H'C1 to H'FF) H'C0 I/O port Generic input/output N ITU output ITU output H'C0 I/O port Generic input/output
Figure 10.55 Timing of Disabling of ITU Output by External Trigger (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Timing of Output Inversion by TOCR The output levels in reset-synchronized PWM mode and complementary PWM mode can be inverted by inverting the output level select bits (OLS4 and OLS3) in TOCR. Figure 10.56 shows the timing.
T1 T2 T3
Address bus
TOCR address
TOCR
ITU output pin Inverted
Figure 10.56 Timing of Inverting of ITU Output Level by Writing to TOCR (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.5
Interrupts
The ITU has two types of interrupts: input capture/compare match interrupts, and overflow interrupts. 10.5.1 Setting of Status Flags
Timing of Setting of IMFA and IMFB at Compare Match IMFA and IMFB are set to 1 by a compare match signal generated when TCNT matches a general register (GR). The compare match signal is generated in the last state in which the values match (when TCNT is updated from the matching count to the next count). Therefore, when TCNT matches a general register, the compare match signal is not generated until the next timer clock input. Figure 10.57 shows the timing of the setting of IMFA and IMFB.
TCNT input clock
TCNT
N
N+1
GR
N
Compare match signal
IMF
IMI
Figure 10.57 Timing of Setting of IMFA and IMFB by Compare Match
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Section 10 16-Bit Integrated Timer Unit (ITU)
Timing of Setting of IMFA and IMFB by Input Capture IMFA and IMFB are set to 1 by an input capture signal. The TCNT contents are simultaneously transferred to the corresponding general register. Figure 10.58 shows the timing.
Input capture signal
IMF
TCNT
N
GR
N
IMI
Figure 10.58 Timing of Setting of IMFA and IMFB by Input Capture
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Section 10 16-Bit Integrated Timer Unit (ITU)
Timing of Setting of Overflow Flag (OVF) OVF is set to 1 when TCNT overflows from H'FFFF to H'0000 or underflows from H'0000 to H'FFFF. Figure 10.59 shows the timing.
TCNT
H'FFFF
H'0000
Overflow signal
OVF
OVI
Figure 10.59 Timing of Setting of OVF
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.5.2
Timing of Clearing of Status Flags
If the CPU reads a status flag while it is set to 1, then writes 0 in the status flag, the status flag is cleared. Figure 10.60 shows the timing.
TSR write cycle T1 T2 T3
Address
TSR address
IMF, OVF
Figure 10.60 Timing of Clearing of Status Flags 10.5.3 Interrupt Sources and DMA Controller Activation
Each ITU channel can generate a compare match/input capture A interrupt, a compare match/input capture B interrupt, and an overflow interrupt. In total there are 15 interrupt sources, all independently vectored. An interrupt is requested when the interrupt request flag and interrupt enable bit are both set to 1. The priority order of the channels can be modified in interrupt priority registers A and B (IPRA and IPRB). For details see section 5, Interrupt Controller. Compare match/input capture A interrupts in channels 0 to 3 can activate the DMA controller (DMAC). When the DMAC is activated a CPU interrupt is not requested. Table 10.10 lists the interrupt sources.
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Section 10 16-Bit Integrated Timer Unit (ITU)
Table 10.10 ITU Interrupt Sources
Channel 0 Interrupt Source IMIA0 IMIB0 OVI0 1 IMIA1 IMIB1 OVI1 2 IMIA2 IMIB2 OVI2 3 IMIA3 IMIB3 OVI3 4 IMIA4 IMIB4 OVI4 Note: * Description Compare match/input capture A0 Compare match/input capture B0 Overflow 0 Compare match/input capture A1 Compare match/input capture B1 Overflow 1 Compare match/input capture A2 Compare match/input capture B2 Overflow 2 Compare match/input capture A3 Compare match/input capture B3 Overflow 3 Compare match/input capture A4 Compare match/input capture B4 Overflow 4 DMAC Activatable Yes No No Yes No No Yes No No Yes No No No No No Low Priority* High
The priority immediately after a reset is indicated. Inter-channel priorities can be changed by settings in IPRA and IPRB.
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.6
Usage Notes
This section describes contention and other matters requiring special attention during ITU operations. Contention between TCNT Write and Clear If a counter clear signal occurs in the T3 state of a TCNT write cycle, clearing of the counter takes priority and the write is not performed. See figure 10.61.
TCNT write cycle T1 T2 T3
Address bus
TCNT address
Internal write signal
Counter clear signal
TCNT
N
H'0000
Figure 10.61 Contention between TCNT Write and Clear
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Section 10 16-Bit Integrated Timer Unit (ITU)
Contention between TCNT Word Write and Increment If an increment pulse occurs in the T3 state of a TCNT word write cycle, writing takes priority and TCNT is not incremented. See figure 10.62.
TCNT word write cycle T1 T2 T3
Address bus
TCNT address
Internal write signal
TCNT input clock
TCNT
N
M TCNT write data
Figure 10.62 Contention between TCNT Word Write and Increment
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Section 10 16-Bit Integrated Timer Unit (ITU)
Contention between TCNT Byte Write and Increment If an increment pulse occurs in the T2 or T3 state of a TCNT byte write cycle, writing takes priority and TCNT is not incremented. The TCNT byte that was not written retains its previous value. See figure 10.63, which shows an increment pulse occurring in the T2 state of a byte write to TCNTH.
TCNTH byte write cycle T1 T2 T3
Address bus
TCNTH address
Internal write signal
TCNT input clock
TCNTH
N TCNT write data
M
TCNTL
X
X+1
X
Figure 10.63 Contention between TCNT Byte Write and Increment
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Section 10 16-Bit Integrated Timer Unit (ITU)
Contention between General Register Write and Compare Match If a compare match occurs in the T3 state of a general register write cycle, writing takes priority and the compare match signal is inhibited. See figure 10.64.
General register write cycle T1 T2 T3
Address bus
GR address
Internal write signal
TCNT
N
N+1
GR
N
M General register write data
Compare match signal
Inhibited
Figure 10.64 Contention between General Register Write and Compare Match
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Section 10 16-Bit Integrated Timer Unit (ITU)
Contention between TCNT Write and Overflow or Underflow If an overflow occurs in the T3 state of a TCNT write cycle, writing takes priority and the counter is not incremented. OVF is set to 1. The same holds for underflow. See figure 10.65.
TCNT write cycle T1 T2 T3
Address bus
TCNT address
Internal write signal
TCNT input clock
Overflow signal
TCNT
H'FFFF TCNT write data
M
OVF
Figure 10.65 Contention between TCNT Write and Overflow
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Section 10 16-Bit Integrated Timer Unit (ITU)
Contention between General Register Read and Input Capture If an input capture signal occurs during the T3 state of a general register read cycle, the value before input capture is read. See figure 10.66.
General register read cycle T1 T2 T3
Address bus
GR address
Internal read signal
Input capture signal
GR
X
M
Internal data bus
X
Figure 10.66 Contention between General Register Read and Input Capture
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Section 10 16-Bit Integrated Timer Unit (ITU)
Contention between Counter Clearing by Input Capture and Counter Increment If an input capture signal and counter increment signal occur simultaneously, the counter is cleared according to the input capture signal. The counter is not incremented by the increment signal. The value before the counter is cleared is transferred to the general register. See figure 10.67.
Input capture signal
Counter clear signal
TCNT input clock
TCNT
N
H'0000
GR
N
Figure 10.67 Contention between Counter Clearing by Input Capture and Counter Increment
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Section 10 16-Bit Integrated Timer Unit (ITU)
Contention between General Register Write and Input Capture If an input capture signal occurs in the T3 state of a general register write cycle, input capture takes priority and the write to the general register is not performed. See figure 10.68.
General register write cycle T1 T2 T3
Address bus
GR address
Internal write signal
Input capture signal
TCNT
M
GR
M
Figure 10.68 Contention between General Register Write and Input Capture Note on Waveform Period Setting When a counter is cleared by compare match, the counter is cleared in the last state at which the TCNT value matches the general register value, at the time when this value would normally be updated to the next count. The actual counter frequency is therefore given by the following formula:
f= (N + 1)
(f: counter frequency. : system clock frequency. N: value set in general register.) Rev. 3.00 Sep 27, 2006 page 407 of 872 REJ09B0325-0300
Section 10 16-Bit Integrated Timer Unit (ITU)
Contention between Buffer Register Write and Input Capture If a buffer register is used for input capture buffering and an input capture signal occurs in the T3 state of a write cycle, input capture takes priority and the write to the buffer register is not performed. See figure 10.69.
Buffer register write cycle T1 T2 T3
Address bus
BR address
Internal write signal
Input capture signal
GR
N
X TCNT value
BR
M
N
Figure 10.69 Contention between Buffer Register Write and Input Capture
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Section 10 16-Bit Integrated Timer Unit (ITU)
Note on Synchronous Preset When channels are synchronized, if a TCNT value is modified by byte write access, all 16 bits of all synchronized counters assume the same value as the counter that was addressed. Example: When channels 2 and 3 are synchronized
* Byte write to channel 2 or byte write to channel 3 Write A to upper byte of channel 2
TCNT2 TCNT3
W Y
X Z
TCNT2 TCNT3
A A
X X
Upper byte Lower byte
Write A to lower byte of channel 3 TCNT2 TCNT3
Upper byte Lower byte Y Y A A
Upper byte Lower byte * Word write to channel 2 or word write to channel 3 TCNT2 TCNT3 W Y X Z Write AB word to channel 2 or 3 TCNT2 TCNT3 A A B B
Upper byte Lower byte
Upper byte Lower byte
Note on Setup of Reset-Synchronized PWM Mode and Complementary PWM Mode When setting bits CMD1 and CMD0 in TFCR, take the following precautions: * Write to bits CMD1 and CMD0 only when TCNT3 and TCNT4 are stopped. * Do not switch directly between reset-synchronized PWM mode and complementary PWM mode. First switch to normal mode (by clearing bit CMD1 to 0), then select reset-synchronized PWM mode or complementary PWM mode.
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Register Settings TMDR TFCR TOCR TOER TIOR0 TCR0
TSNC
Operating Mode MDF FDIR PWM Master Enable IOA IOB * IOA2 = 0 Other bits unrestricted IOB2 = 0 Other bits unrestricted IOA2 = 1 Other bits unrestricted IOB2 = 1 Other bits unrestricted CCLR1 = 0 CCLR0 = 1 CCLR1 = 1 CCLR0 = 0 CCLR1 = 1 CCLR0 = 1 Clear Select Clock Select
Synchronization PWM0 = 1 PWM0 = 0
ResetOutput CompleSynchro- BufferXTGD Level mentary nized ing Select PWM PWM
Synchronous preset
SYNC0 = 1
PWM mode
ITU Operating Modes
Output compare A
Output compare B


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PWM0 = 0 PWM0 = 0
Input capture A
Section 10 16-Bit Integrated Timer Unit (ITU)
Table 10.11 (a) ITU Operating Modes (Channel 0)
Input capture B
Counter By compare clearing match/input capture A
By compare match/input capture B
Synchronous clear
SYNC0 = 1
Legend:
: Setting available (valid). : Setting does not affect this mode.
Note: * The input capture function cannot be used in PWM mode. If compare match A and compare match B occur simultaneously, the compare match signal is inhibited.
Register Settings TMDR TFCR TOCR TOER TIOR1 TCR1
TSNC
Operating Mode MDF IOA2 = 0 Other bits unrestricted IOB2 = 0 Other bits unrestricted IOA2 = 1 Other bits unrestricted IOB2 = 1 Other bits unrestricted CCLR1 = 0 CCLR0 = 1 CCLR1 = 1 CCLR0 = 0 CCLR1 = 1 CCLR0 = 1 *1 PWM1 = 1 PWM1 = 0 FDIR PWM Master Enable IOA IOB Clear Select
Synchronization
ResetOutput CompleSynchro- BufferXTGD Level mentary nized ing Select PWM PWM
Clock Select
Synchronous preset
SYNC1 = 1
PWM mode
Output compare A
Output compare B

Input capture A
PWM1 = 0 *2
Input capture B
PWM1 = 0
Table 10.11 (b) ITU Operating Modes (Channel 1)
Counter By compare clearing match/input capture A

By compare match/input capture B
Synchronous clear
SYNC1 = 1
Legend:
: Setting available (valid). : Setting does not affect this mode.
Section 10 16-Bit Integrated Timer Unit (ITU)
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Notes: 1. The input capture function cannot be used in PWM mode. If compare match A and compare match B occur simultaneously, the compare match signal is inhibited. 2. Valid only when channels 3 and 4 are operating in complementary PWM mode or reset-synchronized PWM mode.
Register Settings TMDR TFCR TOCR TOER TIOR2 TCR2
TSNC
Operating Mode MDF FDIR PWM Master Enable IOA IOB -- IOA2 = 0 Other bits unrestricted IOB2 = 0 Other bits unrestricted IOA2 = 1 Other bits unrestricted IOB2 = 1 Other bits unrestricted CCLR1 = 0 CCLR0 = 1 CCLR1 = 1 CCLR0 = 0 CCLR1 = 1 CCLR0 = 1 * Clear Select
Synchronization PWM2 = 1 PWM2 = 0
ResetOutput CompleSynchro- BufferXTGD Level mentary nized ing Select PWM PWM
Clock Select
Synchronous preset
SYNC2 = 1
PWM mode
Output compare A
Output compare B


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PWM2 = 0 PWM2 = 0 MDF = 1
Section 10 16-Bit Integrated Timer Unit (ITU)
Input capture A
Table 10.11 (c) ITU Operating Modes (Channel 2)
Input capture B
Counter By compare clearing match/input capture A
By compare match/input capture B
Synchronous clear
SYNC2 = 1
Phase counting mode
Legend:
: Setting available (valid). : Setting does not affect this mode.
Note: * The input capture function cannot be used in PWM mode. If compare match A and compare match B occur simultaneously, the compare match signal is inhibited.
Register Settings TMDR PWM *3 PWM3 = 1 CMD1 = 0 PWM3 = 0 CMD1 = 0 CMD1 = 0 IOA2 = 0 Other bits unrestricted IOB2 = 0 Other bits unrestricted EA3 ignored IOA2 = 1 Other bits Other bits unrestricted unrestricted IOA2 = 1 Other bits unrestricted CCLR1 = 0 CCLR0 = 1 *1 CCLR1 = 1 CCLR0 = 0 *1 CCLR1 = 1 CCLR0 = 1 *6 *6 BFA3 = 1 Other bits unrestricted BFA3 = 1 Other bits unrestricted *1 CCLR1 = 0 CCLR0 = 0 CCLR1 = 0 CCLR0 = 1 *5 CMD1 = 0 *2 *1 Complementary PWM Buffering IOA IOB Output XTGD Level Select Master Enable Clear Select ResetSynchronized PWM Clock Select TFCR TOCR TOER TIOR3 TCR3
TSNC
Operating Mode
Synchro- MDF FDIR nization
Synchronous preset
SYNC3 = 1
PWM mode
Output compare A
Output compare B CMD1 = 0 CMD1 = 0

Input capture A PWM3 = 0 CMD1 = 0 CMD1 = 0

Input capture B PWM3 = 0 CMD1 = 0 CMD1 = 0

Counter By compare clearing match/input capture A Illegal setting: CMD1 = 1 CMD0 = 0 CMD1 = 0 CMD1 = 0
*4
EB3 ignored Other bits unrestricted *1
Table 10.11 (d) ITU Operating Modes (Channel 3)
By compare match/input capture B Illegal setting: CMD1 = 1 CMD0 = 0 CMD1 = 1 CMD0 = 0 CMD1 = 1 CMD0 = 1 CMD1 = 1 CMD0 = 1 CMD1 = 1 CMD0 = 0
Synchronous clear
SYNC3 = 1
Complementary PWM mode
*3
Reset-synchronized PWM mode
Buffering (BRA)
Buffering (BRB)
*1
Legend:
: Setting available (valid). : Setting does not affect this mode.
Section 10 16-Bit Integrated Timer Unit (ITU)
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Notes: 1. 2. 3. 4. 5. 6.
Master enable bit settings are valid only during waveform output. The input capture function cannot be used in PWM mode. If compare match A and compare match B occur simultaneously, the compare match signal is inhibited. Do not set both channels 3 and 4 for synchronous operation when complementary PWM mode is selected. The counter cannot be cleared by input capture A when reset-synchronized PWM mode is selected. In complementary PWM mode, select the same clock source for channels 3 and 4. Use the input capture A function in channel 1.
Register Settings TMDR PWM *3 PWM4 = 1 CMD1 = 0 CMD1 = 0 CMD1 = 0 IOA2 = 0 Other bits unrestricted IOB2 = 0 Other bits unrestricted EA4 ignored IOA2 = 1 Other bits Other bits unrestricted unrestricted IOA2 = 1 Other bits unrestricted CCLR1 = 0 CCLR0 = 1 *1 CCLR1 = 1 CCLR0 = 0 *1 CCLR1 = 1 CCLR0 = 1 BFA4 = 1 Other bits unrestricted BFA4 = 1 Other bits unrestricted *1 CCLR1 = 0 CCLR0 = 0 *6 *5 *6 PWM4 = 0 CMD1 = 0 -- *2 *1 Complementary PWM Buffering IOA IOB Output XTGD Level Select Master Enable Clear Select Clock Select ResetSynchronized PWM TFCR TOCR TOER TIOR4 TCR4
TSNC
Operating Mode
Synchro- MDF FDIR nization
Synchronous preset
SYNC4 = 1
PWM mode
Output compare A
Output compare B CMD1 = 0 CMD1 = 0

Input capture A PWM4 = 0 CMD1 = 0 CMD1 = 0

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PWM4 = 0 CMD1 = 0 CMD1 = 0 Illegal setting: CMD1 = 1 CMD0 = 0 Illegal setting: CMD1 = 1 CMD0 = 0 Illegal setting: CMD1 = 1 CMD0 = 0 CMD1 = 1 CMD0 = 0 CMD1 = 1 CMD0 = 1 CMD1 = 1 CMD0 = 1 CMD1 = 1 CMD0 = 0 *4 *4 *4 EB4 ignored Other bits unrestricted *1 *1
Section 10 16-Bit Integrated Timer Unit (ITU)
Input capture B
Counter By compare clearing match/input capture A
Table 10.11 (e) ITU Operating Modes (Channel 4)
By compare match/input capture B
Synchronous clear
SYNC4 = 1
Complementary PWM mode
*3
Reset-synchronized PWM mode
Buffering (BRA)
Buffering (BRB)
Legend:
: Setting available (valid). : Setting does not affect this mode.
Notes: 1. 2. 3. 4. 5. 6.
Master enable bit settings are valid only during waveform output. The input capture function cannot be used in PWM mode. If compare match A and compare match B occur simultaneously, the compare match signal is inhibited. Do not set both channels 3 and 4 for synchronous operation when complementary PWM mode is selected. When reset-synchronized PWM mode is selected, TCNT4 operates independently and the counter clearing function is available. Waveform output is not affected. In complementary PWM mode, select the same clock source for channels 3 and 4. TCR4 settings are valid in reset-synchronized PWM mode, but TCNT4 operates independently, without affecting waveform output.
Section 11 Programmable Timing Pattern Controller
Section 11 Programmable Timing Pattern Controller
11.1 Overview
The H8/3048B Group has a built-in programmable timing pattern controller (TPC) that provides pulse outputs by using the 16-bit integrated timer unit (ITU) as a time base. The TPC pulse outputs are divided into 4-bit groups (group 3 to group 0) that can operate simultaneously and independently. 11.1.1 Features
TPC features are listed below. * 16-bit output data Maximum 16-bit data can be output. TPC output can be enabled on a bit-by-bit basis. * Four output groups Output trigger signals can be selected in 4-bit groups to provide up to four different 4-bit outputs. * Selectable output trigger signals Output trigger signals can be selected for each group from the compare-match signals of four ITU channels. * Non-overlap mode A non-overlap margin can be provided between pulse outputs. * Can operate together with the DMA controller (DMAC) The compare-match signals selected as trigger signals can activate the DMAC for sequential output of data without CPU intervention.
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Section 11 Programmable Timing Pattern Controller
11.1.2
Block Diagram
Figure 11.1 shows a block diagram of the TPC.
ITU compare match signals
PADDR Control logic NDERA TPMR
PBDDR NDERB TPCR
TP15 TP14 TP13 TP12 TP11 TP10 TP 9 TP 8 TP 7 TP 6 TP 5 TP 4 TP 3 TP 2 TP 1 TP 0 Legend: TPMR: TPCR: NDERB: NDERA: PBDDR: PADDR: NDRB: NDRA: PBDR: PADR:
Pulse output pins, group 3 PBDR Pulse output pins, group 2 NDRB
Internal data bus
Pulse output pins, group 1 PADR Pulse output pins, group 0 NDRA
TPC output mode register TPC output control register Next data enable register B Next data enable register A Port B data direction register Port A data direction register Next data register B Next data register A Port B data register Port A data register
Figure 11.1 TPC Block Diagram
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Section 11 Programmable Timing Pattern Controller
11.1.3
TPC Pins
Table 11.1 summarizes the TPC output pins. Table 11.1 TPC Pins
Name TPC output 0 TPC output 1 TPC output 2 TPC output 3 TPC output 4 TPC output 5 TPC output 6 TPC output 7 TPC output 8 TPC output 9 TPC output 10 TPC output 11 TPC output 12 TPC output 13 TPC output 14 TPC output 15 Symbol TP0 TP1 TP2 TP3 TP4 TP5 TP6 TP7 TP8 TP9 TP10 TP11 TP12 TP13 TP14 TP15 I/O Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Group 3 pulse output Group 2 pulse output Group 1 pulse output Function Group 0 pulse output
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Section 11 Programmable Timing Pattern Controller
11.1.4
Registers
Table 11.2 summarizes the TPC registers. Table 11.2 TPC Registers
Address* H'FFD1 H'FFD3 H'FFD4 H'FFD6 H'FFA0 H'FFA1 H'FFA2 H'FFA3 H'FFA5/ 3 H'FFA7* H'FFA4 3 H'FFA6*
1
Name Port A data direction register Port A data register Port B data direction register Port B data register TPC output mode register TPC output control register Next data enable register B Next data enable register A Next data register A Next data register B
Abbreviation PADDR PADR PBDDR PBDR TPMR TPCR NDERB NDERA NDRA NDRB
R/W W
2 R/(W)*
Initial Value H'00 H'00 H'00
2
W R/(W)* R/W R/W R/W R/W R/W R/W
H'00 H'F0 H'FF H'00 H'00 H'00 H'00
Notes: 1. Lower 16 bits of the address. 2. Bits used for TPC output cannot be written. 3. The NDRA address is H'FFA5 when the same output trigger is selected for TPC output groups 0 and 1 by settings in TPCR. When the output triggers are different, the NDRA address is H'FFA7 for group 0 and H'FFA5 for group 1. Similarly, the address of NDRB is H'FFA4 when the same output trigger is selected for TPC output groups 2 and 3 by settings in TPCR. When the output triggers are different, the NDRB address is H'FFA6 for group 2 and H'FFA4 for group 3.
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Section 11 Programmable Timing Pattern Controller
11.2
11.2.1
Register Descriptions
Port A Data Direction Register (PADDR)
PADDR is an 8-bit write-only register that selects input or output for each pin in port A.
Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W 3 0 W 2 0 W 1 0 W 0 0 W
PA7 DDR PA6 DDR PA5 DDR PA4 DDR PA3 DDR PA2 DDR PA1 DDR PA0 DDR
Port A data direction 7 to 0 These bits select input or output for port A pins
Port A is multiplexed with pins TP7 to TP0. Bits corresponding to pins used for TPC output must be set to 1. For further information about PADDR, see section 9.11, Port A. 11.2.2 Port A Data Register (PADR)
PADR is an 8-bit readable/writable register that stores TPC output data for groups 0 and 1, when these TPC output groups are used.
Bit Initial value Read/Write 7 PA 7 0 R/(W)* 6 PA 6 0 R/(W)* 5 PA 5 0 R/(W)* 4 PA 4 0 R/(W)* 3 PA 3 0 R/(W)* 2 PA 2 0 R/(W)* 1 PA 1 0 R/(W)* 0 PA 0 0 R/(W)*
Port A data 7 to 0 These bits store output data for TPC output groups 0 and 1 Note: * Bits selected for TPC output by NDERA settings become read-only bits.
For further information about PADR, see section 9.11, Port A.
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Section 11 Programmable Timing Pattern Controller
11.2.3
Port B Data Direction Register (PBDDR)
PBDDR is an 8-bit write-only register that selects input or output for each pin in port B.
Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W 3 0 W 2 0 W 1 0 W 0 0 W
PB7 DDR PB6 DDR PB5 DDR PB4 DDR PB3 DDR PB2 DDR PB1 DDR PB0 DDR
Port B data direction 7 to 0 These bits select input or output for port B pins
Port B is multiplexed with pins TP15 to TP8. Bits corresponding to pins used for TPC output must be set to 1. For further information about PBDDR, see section 9.12, Port B. 11.2.4 Port B Data Register (PBDR)
PBDR is an 8-bit readable/writable register that stores TPC output data for groups 2 and 3, when these TPC output groups are used.
Bit Initial value Read/Write 7 PB 7 0 R/(W)* 6 PB 6 0 R/(W)* 5 PB 5 0 R/(W)* 4 PB 4 0 R/(W)* 3 PB 3 0 R/(W)* 2 PB 2 0 R/(W)* 1 PB 1 0 R/(W)* 0 PB 0 0 R/(W)*
Port B data 7 to 0 These bits store output data for TPC output groups 2 and 3 Note: * Bits selected for TPC output by NDERB settings become read-only bits.
For further information about PBDR, see section 9.12, Port B.
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Section 11 Programmable Timing Pattern Controller
11.2.5
Next Data Register A (NDRA)
NDRA is an 8-bit readable/writable register that stores the next output data for TPC output groups 1 and 0 (pins TP7 to TP0). During TPC output, when an ITU compare match event specified in TPCR occurs, NDRA contents are transferred to the corresponding bits in PADR. The address of NDRA differs depending on whether TPC output groups 0 and 1 have the same output trigger or different output triggers. NDRA is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Same Trigger for TPC Output Groups 0 and 1 If TPC output groups 0 and 1 are triggered by the same compare match event, the NDRA address is H'FFA5. The upper 4 bits belong to group 1 and the lower 4 bits to group 0. Address H'FFA7 consists entirely of reserved bits that cannot be modified and are always read as 1. Address H'FFA5
Bit Initial value Read/Write 7 NDR7 0 R/W 6 NDR6 0 R/W 5 NDR5 0 R/W 4 NDR4 0 R/W 3 NDR3 0 R/W 2 NDR2 0 R/W 1 NDR1 0 R/W 0 NDR0 0 R/W
Next data 7 to 4 These bits store the next output data for TPC output group 1
Next data 3 to 0 These bits store the next output data for TPC output group 0
Address H'FFA7
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 1 2 1 1 1 0 1
Reserved bits
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Section 11 Programmable Timing Pattern Controller
Different Triggers for TPC Output Groups 0 and 1 If TPC output groups 0 and 1 are triggered by different compare match events, the address of the upper 4 bits of NDRA (group 1) is H'FFA5 and the address of the lower 4 bits (group 0) is H'FFA7. Bits 3 to 0 of address H'FFA5 and bits 7 to 4 of address H'FFA7 are reserved bits that cannot be modified and are always read as 1. Address H'FFA5
Bit Initial value Read/Write 7 NDR7 0 R/W 6 NDR6 0 R/W 5 NDR5 0 R/W 4 NDR4 0 R/W 3 1 2 1 1 1 0 1
Next data 7 to 4 These bits store the next output data for TPC output group 1
Reserved bits
Address H'FFA7
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 NDR3 0 R/W 2 NDR2 0 R/W 1 NDR1 0 R/W 0 NDR0 0 R/W
Reserved bits
Next data 3 to 0 These bits store the next output data for TPC output group 0
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Section 11 Programmable Timing Pattern Controller
11.2.6
Next Data Register B (NDRB)
NDRB is an 8-bit readable/writable register that stores the next output data for TPC output groups 3 and 2 (pins TP15 to TP8). During TPC output, when an ITU compare match event specified in TPCR occurs, NDRB contents are transferred to the corresponding bits in PBDR. The address of NDRB differs depending on whether TPC output groups 2 and 3 have the same output trigger or different output triggers. NDRB is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Same Trigger for TPC Output Groups 2 and 3 If TPC output groups 2 and 3 are triggered by the same compare match event, the NDRB address is H'FFA4. The upper 4 bits belong to group 3 and the lower 4 bits to group 2. Address H'FFA6 consists entirely of reserved bits that cannot be modified and are always read as 1. Address H'FFA4
Bit Initial value Read/Write 7 NDR15 0 R/W 6 NDR14 0 R/W 5 NDR13 0 R/W 4 NDR12 0 R/W 3 NDR11 0 R/W 2 NDR10 0 R/W 1 NDR9 0 R/W 0 NDR8 0 R/W
Next data 15 to 12 These bits store the next output data for TPC output group 3
Next data 11 to 8 These bits store the next output data for TPC output group 2
Address H'FFA6
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 1 2 1 1 1 0 1
Reserved bits
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Section 11 Programmable Timing Pattern Controller
Different Triggers for TPC Output Groups 2 and 3 If TPC output groups 2 and 3 are triggered by different compare match events, the address of the upper 4 bits of NDRB (group 3) is H'FFA4 and the address of the lower 4 bits (group 2) is H'FFA6. Bits 3 to 0 of address H'FFA4 and bits 7 to 4 of address H'FFA6 are reserved bits that cannot be modified and are always read as 1. Address H'FFA4
Bit Initial value Read/Write 7 NDR15 0 R/W 6 NDR14 0 R/W 5 NDR13 0 R/W 4 NDR12 0 R/W 3 1 2 1 1 1 0 1
Next data 15 to 12 These bits store the next output data for TPC output group 3
Reserved bits
Address H'FFA6
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 NDR11 0 R/W 2 NDR10 0 R/W 1 NDR9 0 R/W 0 NDR8 0 R/W
Reserved bits
Next data 11 to 8 These bits store the next output data for TPC output group 2
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Section 11 Programmable Timing Pattern Controller
11.2.7
Next Data Enable Register A (NDERA)
NDERA is an 8-bit readable/writable register that enables or disables TPC output groups 1 and 0 (TP7 to TP0) on a bit-by-bit basis.
Bit Initial value Read/Write 7 NDER7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 NDER2 0 R/W 1 0 R/W 0 0 R/W
NDER6 NDER5
NDER4 NDER3
NDER1 NDER0
Next data enable 7 to 0 These bits enable or disable TPC output groups 1 and 0
If a bit is enabled for TPC output by NDERA, then when the ITU compare match event selected in the TPC output control register (TPCR) occurs, the NDRA value is automatically transferred to the corresponding PADR bit, updating the output value. If TPC output is disabled, the bit value is not transferred from NDRA to PADR and the output value does not change. NDERA is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 0--Next Data Enable 7 to 0 (NDER7 to NDER0): These bits enable or disable TPC output groups 1 and 0 (TP7 to TP0) on a bit-by-bit basis.
Bits 7 to 0: NDER7 to NDER0 0 1 Description TPC outputs TP7 to TP0 are disabled (NDR7 to NDR0 are not transferred to PA7 to PA0) TPC outputs TP7 to TP0 are enabled (NDR7 to NDR0 are transferred to PA7 to PA0) (Initial value)
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Section 11 Programmable Timing Pattern Controller
11.2.8
Next Data Enable Register B (NDERB)
NDERB is an 8-bit readable/writable register that enables or disables TPC output groups 3 and 2 (TP15 to TP8) on a bit-by-bit basis.
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
NDER15 NDER14 NDER13 NDER12 NDER11 NDER10 NDER9 NDER8
Next data enable 15 to 8 These bits enable or disable TPC output groups 3 and 2
If a bit is enabled for TPC output by NDERB, then when the ITU compare match event selected in the TPC output control register (TPCR) occurs, the NDRB value is automatically transferred to the corresponding PBDR bit, updating the output value. If TPC output is disabled, the bit value is not transferred from NDRB to PBDR and the output value does not change. NDERB is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 0--Next Data Enable 15 to 8 (NDER15 to NDER8): These bits enable or disable TPC output groups 3 and 2 (TP15 to TP8) on a bit-by-bit basis.
Bits 7 to 0: NDER15 to NDER8 0 1 Description TPC outputs TP15 to TP8 are disabled (NDR15 to NDR8 are not transferred to PB7 to PB0) TPC outputs TP15 to TP8 are enabled (NDR15 to NDR8 are transferred to PB7 to PB0) (Initial value)
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Section 11 Programmable Timing Pattern Controller
11.2.9
TPC Output Control Register (TPCR)
TPCR is an 8-bit readable/writable register that selects output trigger signals for TPC outputs on a group-by-group basis.
Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W
G3CMS1 G3CMS0 G2CMS1 G2CMS0 G1CMS1 G1CMS0 G0CMS1 G0CMS0
Group 3 compare match select 1 and 0 These bits select the compare match Group 2 compare event that triggers TPC output group 3 match select 1 and 0 These bits select (TP15 to TP12) the compare match Group 1 compare event that triggers TPC output group 2 match select 1 and 0 These bits select (TP11 to TP 8 ) the compare match Group 0 compare event that triggers TPC output group 1 match select 1 and 0 These bits select (TP7 to TP4 ) the compare match event that triggers TPC output group 0 (TP3 to TP 0 )
TPCR is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 and 6--Group 3 Compare Match Select 1 and 0 (G3CMS1, G3CMS0): These bits select the compare match event that triggers TPC output group 3 (TP15 to TP12).
Bit 7: G3CMS1 0 Bit 6: G3CMS0 0 1 1 0 1 Description TPC output group 3 (TP15 to TP12) is triggered by compare match in ITU channel 0 TPC output group 3 (TP15 to TP12) is triggered by compare match in ITU channel 1 TPC output group 3 (TP15 to TP12) is triggered by compare match in ITU channel 2 TPC output group 3 (TP15 to TP12) is triggered by compare match in ITU channel 3 (Initial value)
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Section 11 Programmable Timing Pattern Controller
Bits 5 and 4--Group 2 Compare Match Select 1 and 0 (G2CMS1, G2CMS0): These bits select the compare match event that triggers TPC output group 2 (TP11 to TP8).
Bit 5: G2CMS1 0 Bit 4: G2CMS0 0 1 1 0 1 Description TPC output group 2 (TP11 to TP8) is triggered by compare match in ITU channel 0 TPC output group 2 (TP11 to TP8) is triggered by compare match in ITU channel 1 TPC output group 2 (TP11 to TP8) is triggered by compare match in ITU channel 2 TPC output group 2 (TP11 to TP8) is triggered by compare match in ITU channel 3 (Initial value)
Bits 3 and 2--Group 1 Compare Match Select 1 and 0 (G1CMS1, G1CMS0): These bits select the compare match event that triggers TPC output group 1 (TP7 to TP4).
Bit 3: G1CMS1 0 Bit 2: G1CMS0 0 1 1 0 1 Description TPC output group 1 (TP7 to TP4) is triggered by compare match in ITU channel 0 TPC output group 1 (TP7 to TP4) is triggered by compare match in ITU channel 1 TPC output group 1 (TP7 to TP4) is triggered by compare match in ITU channel 2 TPC output group 1 (TP7 to TP4) is triggered by compare match in ITU channel 3 (Initial value)
Bits 1 and 0--Group 0 Compare Match Select 1 and 0 (G0CMS1, G0CMS0): These bits select the compare match event that triggers TPC output group 0 (TP3 to TP0).
Bit 1: G0CMS1 0 Bit 0: G0CMS0 0 1 1 0 1 Description TPC output group 0 (TP3 to TP0) is triggered by compare match in ITU channel 0 TPC output group 0 (TP3 to TP0) is triggered by compare match in ITU channel 1 TPC output group 0 (TP3 to TP0) is triggered by compare match in ITU channel 2 TPC output group 0 (TP3 to TP0) is triggered by compare match in ITU channel 3 (Initial value)
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Section 11 Programmable Timing Pattern Controller
11.2.10 TPC Output Mode Register (TPMR) TPMR is an 8-bit readable/writable register that selects normal or non-overlapping TPC output for each group.
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
G3NOV G2NOV
G1NOV G0NOV
Reserved bits Group 3 non-overlap Selects non-overlapping TPC output for group 3 (TP15 to TP12 ) Group 2 non-overlap Selects non-overlapping TPC output for group 2 (TP11 to TP8 ) Group 1 non-overlap Selects non-overlapping TPC output for group 1 (TP7 to TP4 ) Group 0 non-overlap Selects non-overlapping TPC output for group 0 (TP3 to TP0 )
The output trigger period of a non-overlapping TPC output waveform is set in general register B (GRB) in the ITU channel selected for output triggering. The non-overlap margin is set in general register A (GRA). The output values change at compare match A and B. For details see section 11.3.4, Non-Overlapping TPC Output. TPMR is initialized to H'F0 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 4--Reserved: Read-only bits, always read as 1.
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Section 11 Programmable Timing Pattern Controller
Bit 3--Group 3 Non-Overlap (G3NOV): Selects normal or non-overlapping TPC output for group 3 (TP15 to TP12).
Bit 3: G3NOV 0 1 Description Normal TPC output in group 3 (output values change at compare match A in the selected ITU channel) (Initial value) Non-overlapping TPC output in group 3 (independent 1 and 0 output at compare match A and B in the selected ITU channel)
Bit 2--Group 2 Non-Overlap (G2NOV): Selects normal or non-overlapping TPC output for group 2 (TP11 to TP8).
Bit 2: G2NOV 0 1 Description Normal TPC output in group 2 (output values change at compare match A in the selected ITU channel) (Initial value) Non-overlapping TPC output in group 2 (independent 1 and 0 output at compare match A and B in the selected ITU channel)
Bit 1--Group 1 Non-Overlap (G1NOV): Selects normal or non-overlapping TPC output for group 1 (TP7 to TP4).
Bit 1: G1NOV 0 1 Description Normal TPC output in group 1 (output values change at compare match A in the selected ITU channel) (Initial value) Non-overlapping TPC output in group 1 (independent 1 and 0 output at compare match A and B in the selected ITU channel)
Bit 0--Group 0 Non-Overlap (G0NOV): Selects normal or non-overlapping TPC output for group 0 (TP3 to TP0).
Bit 0: G0NOV 0 1 Description Normal TPC output in group 0 (output values change at compare match A in the selected ITU channel) (Initial value) Non-overlapping TPC output in group 0 (independent 1 and 0 output at compare match A and B in the selected ITU channel)
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Section 11 Programmable Timing Pattern Controller
11.3
11.3.1
Operation
Overview
When corresponding bits in PADDR or PBDDR and NDERA or NDERB are set to 1, TPC output is enabled. The TPC output initially consists of the corresponding PADR or PBDR contents. When a compare-match event selected in TPCR occurs, the corresponding NDRA or NDRB bit contents are transferred to PADR or PBDR to update the output values. Figure 11.2 illustrates the TPC output operation. Table 11.3 summarizes the TPC operating conditions.
DDR Q
NDER Q Output trigger signal
C Q TPC output pin DR D Q NDR D Internal data bus
Figure 11.2 TPC Output Operation Table 11.3 TPC Operating Conditions
NDER 0 1 DDR 0 1 0 1 Pin Function Generic input port Generic output port Generic input port (but the DR bit is a read-only bit, and when compare match occurs, the NDR bit value is transferred to the DR bit) TPC pulse output
Sequential output of up to 16-bit patterns is possible by writing new output data to NDRA and NDRB before the next compare match. For information on non-overlapping operation, see section 11.3.4, Non-Overlapping TPC Output.
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Section 11 Programmable Timing Pattern Controller
11.3.2
Output Timing
If TPC output is enabled, NDRA/NDRB contents are transferred to PADR/PBDR and output when the selected compare match event occurs. Figure 11.3 shows the timing of these operations for the case of normal output in groups 2 and 3, triggered by compare match A.
TCNT
N
N+1
GRA Compare match A signal
N
NDRB
n
PBDR TP8 to TP15
m m
n n
Figure 11.3 Timing of Transfer of Next Data Register Contents and Output (Example)
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Section 11 Programmable Timing Pattern Controller
11.3.3
Normal TPC Output
Sample Setup Procedure for Normal TPC Output Figure 11.4 shows a sample procedure for setting up normal TPC output.
Normal TPC output
Select GR functions Set GRA value ITU setup Select counting operation Select interrupt request
1 2 3 4
Set initial output data Select port output Port and TPC setup Enable TPC output Select TPC output trigger Set next TPC output data
5 6 7 8 9
ITU setup
Start counter
10
Set TIOR to make GRA an output compare register (with output inhibited). 2. Set the TPC output trigger period. 3. Select the counter clock source with bits TPSC2 to TPSC0 in TCR. Select the counter clear source with bits CCLR1 and CCLR0. 4. Enable the IMFA interrupt in TIER. The DMAC can also be set up to transfer data to the next data register. 5. Set the initial output values in the DR bits of the input/output port pins to be used for TPC output. 6. Set the DDR bits of the input/output port pins to be used for TPC output to 1. 7. Set the NDER bits of the pins to be used for TPC output to 1. 8. Select the ITU compare match event to be used as the TPC output trigger in TPCR. 9. Set the next TPC output values in the NDR bits. 10. Set the STR bit to 1 in TSTR to start the timer counter. 11. At each IMFA interrupt, set the next output values in the NDR bits.
1.
Compare match? Yes Set next TPC output data
No
11
Figure 11.4 Setup Procedure for Normal TPC Output (Example)
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Section 11 Programmable Timing Pattern Controller
Example of Normal TPC Output (Example of Five-Phase Pulse Output) Figure 11.5 shows an example in which the TPC is used for cyclic five-phase pulse output.
TCNT value TCNT GRA Compare match
H'0000 NDRB 80 C0 40 60 20 30 10 18 08 88 80 C0 40
Time
PBDR
00
80
C0
40
60
20
30
10
18
08
88
80
C0
TP15
TP14 TP13 TP12
TP11
*
*
*
*
The ITU channel to be used as the output trigger channel is set up so that GRA is an output compare register and the counter will be cleared by compare match A. The trigger period is set in GRA. The IMIEA bit is set to 1 in TIER to enable the compare match A interrupt. H'F8 is written in PBDDR and NDERB, and bits G3CMS1, G3CMS0, G2CMS1, and G2CMS0 are set in TPCR to select compare match in the ITU channel set up in step 1 as the output trigger. Output data H'80 is written in NDRB. The timer counter in this ITU channel is started. When compare match A occurs, the NDRB contents are transferred to PBDR and output. The compare match/input capture A (IMFA) interrupt service routine writes the next output data (H'C0) in NDRB. Five-phase overlapping pulse output (one or two phases active at a time) can be obtained by writing H'40, H'60, H'20, H'30, H'10, H'18, H'08, H'88... at successive IMFA interrupts. If the DMAC is set for activation by this interrupt, pulse output can be obtained without loading the CPU.
Figure 11.5 Normal TPC Output Example (Five-Phase Pulse Output)
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Section 11 Programmable Timing Pattern Controller
11.3.4
Non-Overlapping TPC Output
Sample Setup Procedure for Non-Overlapping TPC Output Figure 11.6 shows a sample procedure for setting up non-overlapping TPC output.
Non-overlapping TPC output Select GR functions Set GR values ITU setup Select counting operation Select interrupt requests 3 4 1 2 1. Set TIOR to make GRA and GRB output compare registers (with output inhibited). 2. Set the TPC output trigger period in GRB and the non-overlap margin in GRA. 3. Select the counter clock source with bits TPSC2 to TPSC0 in TCR. Select the counter clear source with bits CCLR1 and CCLR0. 4. Enable the IMFA interrupt in TIER. The DMAC can also be set up to transfer data to the next data register. 5. Set the initial output values in the DR bits of the input/output port pins to be used for TPC output. 6. Set the DDR bits of the input/output port pins to be used for TPC output to 1. 7. Set the NDER bits of the pins to be used for TPC output to 1. 8. In TPCR, select the ITU compare match event to be used as the TPC output trigger. 9. In TPMR, select the groups that will operate in non-overlap mode. 10. Set the next TPC output values in the NDR bits. 11. Set the STR bit to 1 in TSTR to start the timer counter. 12. At each IMFA interrupt, write the next output value in the NDR bits.
Set initial output data Set up TPC output Enable TPC transfer Port and TPC setup Select TPC transfer trigger Select non-overlapping groups Set next TPC output data
5 6 7 8 9 10
ITU setup
Start counter
11
Compare match A? Yes Set next TPC output data
No
12
Figure 11.6 Setup Procedure for Non-Overlapping TPC Output (Example)
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Section 11 Programmable Timing Pattern Controller
Example of Non-Overlapping TPC Output (Example of Four-Phase Complementary Non-Overlapping Output) Figure 11.7 shows an example of the use of TPC output for four-phase complementary nonoverlapping pulse output.
TCNT value GRB GRA H'0000 NDRB 95 65 59 56 95 65 Time TCNT
PBDR
00
95
05
65
41
59
50
56
14
95
05
65
Non-overlap margin TP15
TP14 TP13 TP12
TP11 TP10 TP9 TP8
* The output trigger ITU channel is set up so that GRA and GRB are output compare registers and the counter will be cleared by compare match B. The TPC output trigger period is set in GRB. The nonoverlap margin is set in GRA. The IMIEA bit is set to 1 in TIER to enable IMFA interrupts. * H'FF is written in PBDDR and NDERB, and bits G3CMS1, G3CMS0, G2CMS1, and G2CMS0 are set in TPCR to select compare match in the ITU channel set up in step 1 as the output trigger. Bits G3NOV and G2NOV are set to 1 in TPMR to select non-overlapping output. Output data H'95 is written in NDRB. * The timer counter in this ITU channel is started. When compare match B occurs, outputs change from 1 to 0. When compare match A occurs, outputs change from 0 to 1 (the change from 0 to 1 is delayed by the value of GRA). The IMFA interrupt service routine writes the next output data (H'65) in NDRB. * Four-phase complementary non-overlapping pulse output can be obtained by writing H'59, H'56, H'95... at successive IMFA interrupts. If the DMAC is set for activation by this interrupt, pulse output can be obtained without loading the CPU.
Figure 11.7 Non-Overlapping TPC Output Example (Four-Phase Complementary Non-Overlapping Pulse Output)
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Section 11 Programmable Timing Pattern Controller
11.3.5
TPC Output Triggering by Input Capture
TPC output can be triggered by ITU input capture as well as by compare match. If GRA and GRB functions as an input capture register in the ITU channel selected in TPCR, TPC output will be triggered by the input capture signal. Figure 11.8 shows the timing.
TIOC pin Input capture signal NDR N
DR
M
N
Figure 11.8 TPC Output Triggering by Input Capture (Example)
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Section 11 Programmable Timing Pattern Controller
11.4
11.4.1
Usage Notes
Operation of TPC Output Pins
TP0 to TP15 are multiplexed with ITU, DMAC, address bus, and other pin functions. When ITU, DMAC, or address output is enabled, the corresponding pins cannot be used for TPC output. The data transfer from NDR bits to DR bits takes place, however, regardless of the usage of the pin. Pin functions should be changed only under conditions in which the output trigger event will not occur. 11.4.2 Note on Non-Overlapping Output
During non-overlapping operation, the transfer of NDR bit values to DR bits takes place as follows. 1. NDR bits are always transferred to DR bits at compare match A. 2. At compare match B, NDR bits are transferred only if their value is 0. Bits are not transferred if their value is 1. Figure 11.9 illustrates the non-overlapping TPC output operation.
DDR Q
NDER Q Compare match A Compare match B
C Q TPC output pin DR D Q NDR D Internal data bus
Figure 11.9 Non-Overlapping TPC Output
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Section 11 Programmable Timing Pattern Controller
Therefore, 0 data can be transferred ahead of 1 data by making compare match B occur before compare match A. NDR contents should not be altered during the interval from compare match B to compare match A (the non-overlap margin). This can be accomplished by having the IMFA interrupt service routine write the next data in NDR, or by having the IMFA interrupt activate the DMAC. The next data must be written before the next compare match B occurs. Figure 11.10 shows the timing relationships.
Compare match A Compare match B NDR write NDR write
NDR
DR 0 output 0/1 output Write to NDR in this interval Do not write to NDR in this interval Do not write to NDR in this interval 0 output 0/1 output Write to NDR in this interval
Figure 11.10 Non-Overlapping Operation and NDR Write Timing
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Section 11 Programmable Timing Pattern Controller
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Section 12 Watchdog Timer
Section 12 Watchdog Timer
12.1 Overview
The H8/3048B Group has an on-chip watchdog timer (WDT). The WDT has two selectable functions: it can operate as a watchdog timer to supervise system operation, or it can operate as an interval timer. As a watchdog timer, it generates a reset signal for the chip if a system crash allows the timer counter (TCNT) to overflow before being rewritten. In interval timer operation, an interval timer interrupt is requested at each TCNT overflow. 12.1.1 Features
WDT features are listed below. * Selection of eight counter clock sources /2, /32, /64, /128, /256, /512, /2048, or /4096 * Interval timer option * Timer counter overflow generates a reset signal or interrupt. The reset signal is generated in watchdog timer operation. An interval timer interrupt is generated in interval timer operation. * The entire chip can be reset internally by a reset signal output from the watchdog timer. The reset signal generated by timer counter overflow during watchdog timer operation resets the entire chip internally. In an H8/3048F-ONE (single power supply with flash memory), the RESO pin acts as the FWE pin; no external reset signal can be output.
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Section 12 Watchdog Timer
12.1.2
Block Diagram
Figure 12.1 shows a block diagram of the WDT.
Overflow TCNT Interrupt signal (interval timer) Interrupt control TCSR Read/ write control
Internal data bus
RSTCSR
Internal clock sources /2 /32 /64 Clock Clock selector /128 /256 /512 /2048 /4096 RESO*
Reset (internal, external)
Reset control
Legend: TCNT: Timer counter TCSR: Timer control/status register RSTCSR: Reset control/status register Note: * Open-drain output pin
Figure 12.1 WDT Block Diagram 12.1.3 Pin Configuration
1
Output pins used by the WDT* are shown in table 12.11. Table 12.1 WDT Pins
Pin Name Reset output Abbreviation RESO I/O
2 Output*
Function External output of watchdog timer reset signal
Notes: 1. Not provided in on-chip flash memory versions. 2. Open-drain output pin
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Section 12 Watchdog Timer
12.1.4
Register Configuration
Table 12.2 summarizes the WDT registers. Table 12.2 WDT Registers
Address* Write*
2 1
Read H'FFA8 H'FFA9 H'FFAB
Name Timer control/status register Timer counter Reset control/status register
Abbreviation TCSR TCNT RSTCSR
R/W
3 R/(W)*
Initial Value H'18 H'00
3
H'FFA8 H'FFAA
R/W R/(W)*
H'3F
Notes: 1. Lower 16 bits of the address. 2. Write word data starting at this address. 3. Only 0 can be written in bit 7, to clear the flag.
12.2
12.2.1
Register Descriptions
Timer Counter (TCNT)
TCNT is an 8-bit readable and writable* up-counter.
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
When the TME bit is set to 1 in TCSR, TCNT starts counting pulses generated from an internal clock source selected by bits CKS2 to CKS0 in TCSR. When the count overflows (changes from H'FF to H'00), the OVF bit is set to 1 in TCSR. TCNT is initialized to H'00 by a reset and when the TME bit is cleared to 0. Note: * TCNT is write-protected by a password. For details see section 12.2.4, Notes on Register Rewriting.
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Section 12 Watchdog Timer
12.2.2
Timer Control/Status Register (TCSR)
TCSR is an 8-bit readable and writable* register. Its functions include selecting the timer mode and clock source. Note: * TCSR differs from other registers in being more difficult to write. For details see section 12.2.4, Notes on Register Rewriting.
Bit Initial value Read/Write 7 OVF 0 R/(W)* 6 WT/IT 0 R/W 5 TME 0 R/W 4 1 3 1 2 CKS2 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W
Clock select These bits select the TCNT clock source Reserved bits Timer enable Selects whether TCNT runs or halts Timer mode select Selects the mode Overflow flag Status flag indicating overflow Note: * Only 0 can be written, to clear the flag.
Bits 7 to 5 are initialized to 0 by a reset and in standby mode. Bits 2 to 0 are initialized to 0 by a reset. In software standby mode bits 2 to 0 are not initialized, but retain their previous values. Bit 7--Overflow Flag (OVF): This status flag indicates that the timer counter has overflowed from H'FF to H'00.
Bit 7: OVF 0 1 Description [Clearing condition] Cleared by reading OVF when OVF = 1, then writing 0 in OVF [Setting condition] Set when TCNT changes from H'FF to H'00 (Initial value)
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Section 12 Watchdog Timer
Bit 6--Timer Mode Select (WT/IT Selects whether to use the WDT as a watchdog timer or IT): IT interval timer. If used as an interval timer, the WDT generates an interval timer interrupt request when TCNT overflows. If used as a watchdog timer, the WDT generates a reset signal when TCNT overflows.
Bit 6: WT/IT IT 0 1 Description Interval timer: requests interval timer interrupts Watchdog timer: generates a reset signal (Initial value)
Bit 5--Timer Enable (TME): Selects whether TCNT runs or is halted. When WT/IT = 1, clear the SYSCR software standby bit (SSBY) to 0, then set the TME to 1. When SSBY is set to 1, clear TME to 0.
Bit 5: TME 0 1 Description TCNT is initialized to H'00 and halted TCNT is counting and CPU interrupt requests are enabled (Initial value)
Bits 4 and 3--Reserved: Read-only bits, always read as 1. Bits 2 to 0--Clock Select 2 to 0 (CKS2 to CKS0): These bits select one of eight internal clock sources, obtained by prescaling the system clock (), for input to TCNT.
Bit 2: CKS2 0 Bit 1: CKS1 0 1 1 0 1 Bit 0: CKS0 0 1 0 1 0 1 0 1 Description /2 /32 /64 /128 /256 /512 /2048 /4096 (Initial value)
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Section 12 Watchdog Timer
12.2.3
Reset Control/Status Register (RSTCSR)
RSTCSR is an 8-bit readable and writable register that indicates when a reset signal has been generated by watchdog timer overflow, and controls external output of the reset signal.
Bit Initial value Read/Write 7 WRST 0 R/(W)* 6 RSTOE 0 R/W 5 1 4 1 3 1 2 1 1 1 0 1
Reserved bits Reset output enable Enables or disables external output of the reset signal Watchdog timer reset Indicates that a reset signal has been generated Notes: The method for writing to RSTCSR is different from that for general registers to prevent inadvertent overwriting. For details see section 12.2.4, Notes on Register Rewriting. * Only 0 can be written in bit 7, to clear the flag.
Bits 7 and 6 are initialized by input of a reset signal at the RES pin. They are not initialized by reset signals generated by watchdog timer overflow. Bit 7--Watchdog Timer Reset (WRST): During watchdog timer operation, this bit indicates that TCNT has overflowed and generated a reset signal. This reset signal resets the entire chip internally. If bit RSTOE is set to 1, this reset signal is also output (low) at the RESO pin to initialize external system devices. Note that there is no RESO pin in the versions with on-chip flash memory.
Bit 7 WRST 0 Description [Clearing conditions] * * 1 Reset signal at RES pin. Read WRST when WRST = 1, then write 0 in WRST. (Initial value)
[Setting condition] Set when TCNT overflow generates a reset signal during watchdog timer operation
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Section 12 Watchdog Timer
Bit 6--Reset Output Enable (RSTOE): Enables or disables external output at the RESO pin of the reset signal generated if TCNT overflows during watchdog timer operation. Note that there is no RESO pin in the versions with on-chip flash memory.
Bit 6 RSTOE 0 1 Description Reset signal is not output externally Reset signal is output externally (Initial value)
Bits 5 to 0--Reserved: These bits cannot be modified and are always read as 1. 12.2.4 Notes on Register Rewriting
The watchdog timer's TCNT, TCSR, and RSTCSR registers differ from other registers in being more difficult to write. The procedures for writing and reading these registers are given below. Writing to TCNT and TCSR These registers must be written by a word transfer instruction. They cannot be written by byte instructions. Figure 12.2 shows the format of data written to TCNT and TCSR. TCNT and TCSR both have the same write address. The write data must be contained in the lower byte of the written word. The upper byte must contain H'5A (password for TCNT) or H'A5 (password for TCSR). This transfers the write data from the lower byte to TCNT or TCSR.
15 H'FFA8 * H'5A 87 Write data 0
TCNT write Address
TCSR write Address H'FFA8 *
15 H'A5
87 Write data
0
Note: * Lower 16 bits of the address.
Figure 12.2 Format of Data Written to TCNT and TCSR
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Section 12 Watchdog Timer
Writing to RSTCSR RSTCSR must be written by a word transfer instruction. It cannot be written by byte transfer instructions. Figure 12.3 shows the format of data written to RSTCSR. To write 0 in the WRST bit, the write data must have H'A5 in the upper byte and H'00 in the lower byte. The H'00 in the lower byte clears the WRST bit in RSTCSR to 0. To write to the RSTOE bit, the upper byte must contain H'5A and the lower byte must contain the write data. Writing this word transfers a write data value into the RSTOE bit.
15 H'A5 87 H'00 0
Writing 0 in WRST bit Address H'FFAA*
Writing to RSTOE bit Address H'FFAA*
15 H'5A
87 Write data
0
Note: * Lower 16 bits of the address.
Figure 12.3 Format of Data Written to RSTCSR Reading TCNT, TCSR, and RSTCSR These registers are read like other registers. Byte access instructions can be used. The read addresses are H'FFA8 for TCSR, H'FFA9 for TCNT, and H'FFAB for RSTCSR, as listed in table 12.3. Table 12.3 Read Addresses of TCNT, TCSR, and RSTCSR
Address* H'FFA8 H'FFA9 H'FFAB Note: * Register TCSR TCNT RSTCSR Lower 16 bits of the address.
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Section 12 Watchdog Timer
12.3
Operation
Operations when the WDT is used as a watchdog timer and as an interval timer are described below. 12.3.1 Watchdog Timer Operation
Figure 12.4 illustrates watchdog timer operation. To use the WDT as a watchdog timer, set the WT/IT and TME bits to 1 in TCSR. Software must prevent TCNT overflow by rewriting the TCNT value (normally by writing H'00) before overflow occurs. If TCNT fails to be rewritten and overflows due to a system crash etc., the chip is internally reset for a duration of 518 states. The watchdog reset signal can be externally output from the RESO pin to reset external system devices. The reset signal is output externally for 132 states. External output can be enabled or disabled by the RSTOE bit in RSTCSR. Note that there is no RESO pin in the versions with onchip flash memory. A watchdog reset has the same vector as a reset generated by input at the RES pin. Software can distinguish a RES reset from a watchdog reset by checking the WRST bit in RSTCSR. If a RES reset and a watchdog reset occur simultaneously, the RES reset takes priority.
WDT overflow
H'FF TCNT count value H'00
TME set to 1
OVF = 1 Start Internal reset signal H'00 written in TCNT Reset H'00 written in TCNT
518 states RESO
132 states
Figure 12.4 Watchdog Timer Operation
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Section 12 Watchdog Timer
12.3.2
Interval Timer Operation
Figure 12.5 illustrates interval timer operation. To use the WDT as an interval timer, clear bit WT/IT to 0 and set bit TME to 1 in TCSR. An interval timer interrupt request is generated at each TCNT overflow. This function can be used to generate interval timer interrupts at regular intervals.
H'FF
TCNT count value Time t H'00 WT/ IT = 0 TME = 1
Interval timer interrupt
Interval timer interrupt
Interval timer interrupt
Interval timer interrupt
Figure 12.5 Interval Timer Operation 12.3.3 Timing of Setting of Overflow Flag (OVF)
Figure 12.6 shows the timing of setting of the OVF flag in TCSR. The OVF flag is set to 1 when TCNT overflows. At the same time, a reset signal is generated in watchdog timer operation, or an interval timer interrupt is generated in interval timer operation.
TCNT
H'FF
H'00
Overflow signal
OVF
Figure 12.6 Timing of Setting of OVF
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Section 12 Watchdog Timer
12.3.4
Timing of Setting of Watchdog Timer Reset Bit (WRST)
The WRST bit in RSTCSR is valid when bits WT/IT and TME are both set to 1 in TCSR. Figure 12.7 shows the timing of setting of WRST and the internal reset timing. The WRST bit is set to 1 when TCNT overflows and OVF is set to 1. At the same time an internal reset signal is generated for the entire chip. This internal reset signal clears OVF to 0, but the WRST bit remains set to 1. The reset routine must therefore clear the WRST bit.
TCNT
H'FF
H'00
Overflow signal
OVF
WDT internal reset
WRST
Figure 12.7 Timing of Setting of WRST Bit and Internal Reset
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Section 12 Watchdog Timer
12.4
Interrupts
During interval timer operation, an overflow generates an interval timer interrupt (WOVI). The interval timer interrupt is requested whenever the OVF bit is set to 1 in TCSR.
12.5
Usage Notes
Contention between TCNT Write and Increment If a timer counter clock pulse is generated during the T3 state of a write cycle to TCNT, the write takes priority and the timer count is not incremented. See figure 12.8.
Write cycle: CPU writes to TCNT T1 T2 T3
TCNT
Internal write signal
TCNT input clock
TCNT
N
M Counter write data
Figure 12.8 Contention between TCNT Write and Increment Changing CKS2 to CKS0 Values Halt TCNT by clearing the TME bit to 0 in TCSR before changing the values of bits CKS2 to CKS0.
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Section 12 Watchdog Timer
12.6
Notes
This chip incorporates an WDT. The timer counter value of the on-chip WDT is not rewritten, even if a system crash occurs. If an overflow occurs, a reset signal is generated and the chip is reset. However, if the following three events occur due to a CPU overrun, for example, the above operations cannot be guaranteed since the WDT and the CPU are incorporated in the same chip. * When the internal I/O registers related to the on-chip WDT are rewritten. * When software standby mode is incorrectly entered. * When the break mode is incorrectly entered. In addition, as stated in the NMI above, if an abnormal level is input into the power supply pins or the system control pins, correct operations cannot be guaranteed. Except the above cases, the on-chip WDT functions as a device that supports recovery from a system crash. Accordingly, when a fail-safe function is required in your system, an additional circuit may be required as necessary.
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Section 12 Watchdog Timer
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Section 13 Serial Communication Interface
Section 13 Serial Communication Interface
13.1 Overview
The H8/3048B Group has a serial communication interface (SCI) with two independent channels. The two channels are functionally identical. The SCI can communicate in asynchronous or synchronous mode. It also has a multiprocessor communication function for serial communication among two or more processors. When the SCI is not used, it can be halted to conserve power. Each SCI channel can be halted independently. For details see section 20.6, Module Standby Function. Channel 0 (SCI0) also has a smart card interface function conforming to the ISO/IEC7816-3 (Identification Card) standard. This function supports serial communication with a smart card. For details, see section 14, Smart Card Interface. 13.1.1 Features
SCI features are listed below. * Selection of asynchronous or synchronous mode for serial communication Asynchronous mode Serial data communication is synchronized one character at a time. The SCI can communicate with a universal asynchronous receiver/transmitter (UART), asynchronous communication interface adapter (ACIA), or other chip that employs standard asynchronous serial communication. It can also communicate with two or more other processors using the multiprocessor communication function. There are twelve selectable serial data communication formats. * Data length: 7 or 8 bits * Stop bit length: 1 or 2 bits * Parity bit: even, odd, or none * Multiprocessor bit: 1 or 0 * Receive error detection: parity, overrun, and framing errors * Break detection: by reading the RxD level directly when a framing error occurs
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Section 13 Serial Communication Interface
Synchronous mode Serial data communication is synchronized with a clock signal. The SCI can communicate with other chips having a synchronous communication function. There is one serial data communication format. * Data length: 8 bits * Receive error detection: overrun errors * Full duplex communication The transmitting and receiving sections are independent, so the SCI can transmit and receive simultaneously. The transmitting and receiving sections are both double-buffered, so serial data can be transmitted and received continuously. * Built-in baud rate generator with selectable bit rates * Selectable transmit/receive clock sources: internal clock from baud rate generator, or external clock from the SCK pin. * Four types of interrupts Transmit-data-empty, transmit-end, receive-data-full, and receive-error interrupts are requested independently. The transmit-data-empty and receive-data-full interrupts from SCI0 can activate the DMA controller (DMAC) to transfer data.
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Section 13 Serial Communication Interface
13.1.2
Block Diagram
Figure 13.1 shows a block diagram of the SCI.
Bus interface
BRR Baud rate generator Clock External clock TEI TXI RXI ERI
Internal data bus
Module data bus
RDR RxD RSR
TDR TSR
SSR SCR SMR Transmit/ receive control
TxD
/4 /16 /64
Parity generate Parity check
SCK
Legend: RSR: Receive shift register RDR: Receive data register TSR: Transmit shift register TDR: Transmit data register SMR: Serial mode register SCR: Serial control register SSR: Serial status register BRR: Bit rate register
Figure 13.1 SCI Block Diagram
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Section 13 Serial Communication Interface
13.1.3
Input/Output Pins
The SCI has serial pins for each channel as listed in table 13.1. Table 13.1 SCI Pins
Channel 0 Name Serial clock pin Receive data pin Transmit data pin 1 Serial clock pin Receive data pin Transmit data pin Abbreviation SCK0 RxD0 TxD0 SCK1 RxD1 TxD1 I/O Input/output Input Output Input/output Input Output Function SCI0 clock input/output SCI0 receive data input SCI0 transmit data output SCI1 clock input/output SCI1 receive data input SCI1 transmit data output
13.1.4
Register Configuration
The SCI has internal registers as listed in table 13.2. These registers select asynchronous or synchronous mode, specify the data format and bit rate, and control the transmitter and receiver sections. Table 13.2 Registers
Channel 0 Address* H'FFB0 H'FFB1 H'FFB2 H'FFB3 H'FFB4 H'FFB5 1 H'FFB8 H'FFB9 H'FFBA H'FFBB H'FFBC H'FFBD
1
Name Serial mode register Bit rate register Serial control register Transmit data register Serial status register Receive data register Serial mode register Bit rate register Serial control register Transmit data register Serial status register Receive data register
Abbreviation SMR BRR SCR TDR SSR RDR SMR BRR SCR TDR SSR RDR
R/W R/W R/W R/W R/W
2 R/(W)*
Initial Value H'00 H'FF H'00 H'FF H'84 H'00 H'00 H'FF H'00 H'FF H'84 H'00
R R/W R/W R/W R/W
2 R/(W)*
R
Notes: 1. Lower 16 bits of the address. 2. Only 0 can be written, to clear flags.
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Section 13 Serial Communication Interface
13.2
13.2.1
Register Descriptions
Receive Shift Register (RSR)
RSR is the register that receives serial data.
Bit 7 6 5 4 3 2 1 0
Read/Write


The SCI loads serial data input at the RxD pin into RSR in the order received, LSB (bit 0) first, thereby converting the data to parallel data. When 1 byte has been received, it is automatically transferred to RDR. The CPU cannot read or write RSR directly. 13.2.2 Receive Data Register (RDR)
RDR is the register that stores received serial data.
Bit Initial value Read/Write 7 0 R 6 0 R 5 0 R 4 0 R 3 0 R 2 0 R 1 0 R 0 0 R
When the SCI finishes receiving 1 byte of serial data, it transfers the received data from RSR into RDR for storage. RSR is then ready to receive the next data. This double buffering allows data to be received continuously. RDR is a read-only register. Its contents cannot be modified by the CPU. RDR is initialized to H'00 by a reset and in standby mode.
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Section 13 Serial Communication Interface
13.2.3
Transmit Shift Register (TSR)
TSR is the register that transmits serial data.
Bit 7 6 5 4 3 2 1 0
Read/Write


The SCI loads transmit data from TDR into TSR, then transmits the data serially from the TxD pin, LSB (bit 0) first. After transmitting one data byte, the SCI automatically loads the next transmit data from TDR into TSR and starts transmitting it. If the TDRE flag is set to 1 in SSR, however, the SCI does not load the TDR contents into TSR. The CPU cannot read or write TSR directly. 13.2.4 Transmit Data Register (TDR)
TDR is an 8-bit register that stores data for serial transmission.
Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W
When the SCI detects that TSR is empty, it moves transmit data written in TDR from TDR into TSR and starts serial transmission. Continuous serial transmission is possible by writing the next transmit data in TDR during serial transmission from TSR. The CPU can always read and write TDR. TDR is initialized to H'FF by a reset and in standby mode.
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Section 13 Serial Communication Interface
13.2.5
Serial Mode Register (SMR)
SMR is an 8-bit register that specifies the SCI serial communication format and selects the clock source for the baud rate generator.
Bit Initial value Read/Write 7 C/A 0 R/W 6 CHR 0 R/W 5 PE 0 R/W 4 O/E 0 R/W 3 STOP 0 R/W 2 MP 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W
Clock select 1/0 These bits select the baud rate generator's clock source Multiprocessor mode Selects the multiprocessor function Stop bit length Selects the stop bit length Parity mode Selects even or odd parity Parity enable Selects whether a parity bit is added Character length Selects character length in asynchronous mode Communication mode Selects asynchronous or synchronous mode
The CPU can always read and write SMR. SMR is initialized to H'00 by a reset and in standby mode. Bit 7--Communication Mode (C/A): Selects whether the SCI operates in asynchronous or A synchronous mode.
Bit 7: C/A A 0 1 Description Asynchronous mode Synchronous mode (Initial value)
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Section 13 Serial Communication Interface
Bit 6--Character Length (CHR): Selects 7-bit or 8-bit data length in asynchronous mode. In synchronous mode the data length is 8 bits regardless of the CHR setting.
Bit 6: CHR 0 1 Note: * Description 8-bit data 7-bit data* When 7-bit data is selected, the MSB (bit 7) in TDR is not transmitted. (Initial value)
Bit 5--Parity Enable (PE): In asynchronous mode, this bit enables or disables the addition of a parity bit to transmit data, and the checking of the parity bit in receive data. In synchronous mode the parity bit is neither added nor checked, regardless of the PE setting.
Bit 5: PE 0 1 Note: * Description Parity bit not added or checked Parity bit added and checked* (Initial value)
When PE is set to 1, an even or odd parity bit is added to transmit data according to the even or odd parity mode selected by the O/E bit, and the parity bit in receive data is checked to see that it matches the even or odd mode selected by the O/E bit.
Bit 4--Parity Mode (O/E): Selects even or odd parity. The O/E bit setting is valid in E asynchronous mode when the PE bit is set to 1 to enable the adding and checking of a parity bit. The O/E setting is ignored in synchronous mode, or when parity adding and checking is disabled in asynchronous mode.
Bit 4: O/E E 0 1 Description Even parity* 2 Odd parity*
1
(Initial value)
Notes: 1. When even parity is selected, the parity bit added to transmit data makes an even number of 1s in the transmitted character and parity bit combined. Receive data must have an even number of 1s in the received character and parity bit combined. 2. When odd parity is selected, the parity bit added to transmit data makes an odd number of 1s in the transmitted character and parity bit combined. Receive data must have an odd number of 1s in the received character and parity bit combined.
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Section 13 Serial Communication Interface
Bit 3--Stop Bit Length (STOP): Selects one or two stop bits in asynchronous mode. This setting is used only in asynchronous mode. In synchronous mode no stop bit is added, so the STOP bit setting is ignored.
Bit 3: STOP 0 1 Description One stop bit* 2 Two stop bits*
1
(Initial value)
Notes: 1. One stop bit (with value 1) is added at the end of each transmitted character. 2. Two stop bits (with value 1) are added at the end of each transmitted character.
In receiving, only the first stop bit is checked, regardless of the STOP bit setting. If the second stop bit is 1 it is treated as a stop bit. If the second stop bit is 0 it is treated as the start bit of the next incoming character. Bit 2--Multiprocessor Mode (MP): Selects a multiprocessor format. When a multiprocessor format is selected, parity settings made by the PE and O/E bits are ignored. The MP bit setting is valid only in asynchronous mode. It is ignored in synchronous mode. For further information on the multiprocessor communication function, see section 13.3.3, Multiprocessor Communication.
Bit 2: MP 0 1 Description Multiprocessor function disabled Multiprocessor format selected (Initial value)
Bits 1 and 0--Clock Select 1 and 0 (CKS1, CKS0): These bits select the clock source of the onchip baud rate generator. Four clock sources are available: , /4, /16, and /64. For the relationship between the clock source, bit rate register setting, and baud rate, see section 13.2.8, Bit Rate Register (BRR).
Bit 1: CKS1 0 1 Bit 0: CKS0 0 1 0 1 Description /4 /16 /64 (Initial value)
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Section 13 Serial Communication Interface
13.2.6
Serial Control Register (SCR)
SCR enables the SCI transmitter and receiver, enables or disables serial clock output in asynchronous mode, enables or disables interrupts, and selects the transmit/receive clock source.
Bit Initial value Read/Write 7 TIE 0 R/W 6 RIE 0 R/W 5 TE 0 R/W 4 RE 0 R/W 3 MPIE 0 R/W 2 TEIE 0 R/W 1 CKE1 0 R/W 0 CKE0 0 R/W
Clock enable 1/0 These bits select the SCI clock source Transmit-end interrupt enable Enables or disables transmitend interrupts (TEI) Multiprocessor interrupt enable Enables or disables multiprocessor interrupts Receive enable Enables or disables the receiver Transmit enable Enables or disables the transmitter Receive interrupt enable Enables or disables receive-data-full interrupts (RXI) and receive-error interrupts (ERI) Transmit interrupt enable Enables or disables transmit-data-empty interrupts (TXI)
The CPU can always read and write SCR. SCR is initialized to H'00 by a reset and in standby mode.
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Section 13 Serial Communication Interface
Bit 7--Transmit Interrupt Enable (TIE): Enables or disables the transmit-data-empty interrupt (TXI) requested when the TDRE flag in SSR is set to 1 due to transfer of serial transmit data from TDR to TSR.
Bit 7: TIE 0 1 Note: * Description Transmit-data-empty interrupt request (TXI) is disabled* Transmit-data-empty interrupt request (TXI) is enabled TXI interrupt requests can be cleared by reading the value 1 from the TDRE flag, then clearing it to 0; or by clearing the TIE bit to 0. (Initial value)
Bit 6--Receive Interrupt Enable (RIE): Enables or disables the receive-data-full interrupt (RXI) requested when the RDRF flag is set to 1 in SSR due to transfer of serial receive data from RSR to RDR; also enables or disables the receive-error interrupt (ERI).
Bit 6: RIE 0 1 Note: * Description Receive-data-full (RXI) and receive-error (ERI) interrupt requests are disabled* (Initial value) Receive-data-full (RXI) and receive-error (ERI) interrupt requests are enabled RXI and ERI interrupt requests can be cleared by reading the value 1 from the RDRF, FER, PER, or ORER flag, then clearing it to 0; or by clearing the RIE bit to 0.
Bit 5--Transmit Enable (TE): Enables or disables the start of SCI serial transmitting operations.
Bit 5: TE 0 1 Description Transmitting disabled* 2 Transmitting enabled*
1
(Initial value)
Notes: 1. The TDRE bit is locked at 1 in SSR. 2. In the enabled state, serial transmitting starts when the TDRE bit in SSR is cleared to 0 after writing of transmit data into TDR. Select the transmit format in SMR before setting the TE bit to 1.
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Section 13 Serial Communication Interface
Bit 4--Receive Enable (RE): Enables or disables the start of SCI serial receiving operations.
Bit 4: RE 0 1 Description Receiving disabled* 2 Receiving enabled*
1
(Initial value)
Notes: 1. Clearing the RE bit to 0 does not affect the RDRF, FER, PER, and ORER flags. These flags retain their previous values. 2. In the enabled state, serial receiving starts when a start bit is detected in asynchronous mode, or serial clock input is detected in synchronous mode. Select the receive format in SMR before setting the RE bit to 1.
Bit 3--Multiprocessor Interrupt Enable (MPIE): Enables or disables multiprocessor interrupts. The MPIE setting is valid only in asynchronous mode, and only if the MP bit is set to 1 in SMR. The MPIE setting is ignored in synchronous mode or when the MP bit is cleared to 0.
Bit 3: MPIE 0 Description Multiprocessor interrupts are disabled (normal receive operation) (Initial value) [Clearing conditions] * * 1 The MPIE bit is cleared to 0. MPB = 1 in received data.
Multiprocessor interrupts are enabled* Receive-data-full interrupts (RXI), receive-error interrupts (ERI), and setting of the RDRF, FER, and ORER status flags in SSR are disabled until data with the multiprocessor bit set to 1 is received.
Note:
*
The SCI does not transfer receive data from RSR to RDR, does not detect receive errors, and does not set the RDRF, FER, and ORER flags in SSR. When it receives data in which MPB = 1, the SCI sets the MPB bit to 1 in SSR, automatically clears the MPIE bit to 0, enables RXI and ERI interrupts (if the RIE bit is set to 1 in SCR), and allows the FER and ORER flags to be set.
Bit 2--Transmit-End Interrupt Enable (TEIE): Enables or disables the transmit-end interrupt (TEI) requested if TDR does not contain new transmit data when the MSB is transmitted.
Bit 2: TEIE 0 1 Note: * Description Transmit-end interrupt requests (TEI) are disabled* Transmit-end interrupt requests (TEI) are enabled* (Initial value)
TEI interrupt requests can be cleared by reading the value 1 from the TDRE flag in SSR, then clearing the TDRE flag to 0, thereby also clearing the TEND flag to 0; or by clearing the TEIE bit to 0.
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Section 13 Serial Communication Interface
Bits 1 and 0--Clock Enable 1 and 0 (CKE1, CKE0): These bits select the SCI clock source and enable or disable clock output from the SCK pin. Depending on the settings of CKE1 and CKE0, the SCK pin can be used for generic input/output, serial clock output, or serial clock input. The CKE0 setting is valid only in asynchronous mode, and only when the SCI is internally clocked (CKE1 = 0). The CKE0 setting is ignored in synchronous mode, or when an external clock source is selected (CKE1 = 1). Select the SCI operating mode in SMR before setting the CKE1 and CKE0 bits. For further details on selection of the SCI clock source, see table 13.9 in section 13.3, Operation.
Bit 1: CKE1 0 Bit 0: CKE0 0 Description Asynchronous mode Synchronous mode 1 1 0 1 Asynchronous mode Synchronous mode Asynchronous mode Synchronous mode Asynchronous mode Synchronous mode Internal clock, SCK pin available for generic 1 input/output* Internal clock, SCK pin used for serial clock output* 2 Internal clock, SCK pin used for clock output* Internal clock, SCK pin used for serial clock output 3 External clock, SCK pin used for clock input* External clock, SCK pin used for serial clock input 3 External clock, SCK pin used for clock input* External clock, SCK pin used for serial clock input
1
Notes: 1. Initial value 2. The output clock frequency is the same as the bit rate. 3. The input clock frequency is 16 times the bit rate.
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Section 13 Serial Communication Interface
13.2.7
Serial Status Register (SSR)
SSR is an 8-bit register containing multiprocessor bit values, and status flags that indicate SCI operating status.
Bit Initial value Read/Write 7 TDRE 1 R/(W)* 6 RDRF 0 R/(W)* 5 ORER 0 R/(W)* 4 FER 0 R/(W)* 3 PER 0 R/(W)* 2 TEND 1 R 1 MPB 0 R 0 MPBT 0 R/W Multiprocessor bit transfer Value of multiprocessor bit to be transmitted Multiprocessor bit Stores the received multiprocessor bit value Transmit end Status flag indicating end of transmission Parity error Status flag indicating detection of a receive parity error Framing error Status flag indicating detection of a receive framing error Overrun error Status flag indicating detection of a receive overrun error Receive data register full Status flag indicating that data has been received and stored in RDR Transmit data register empty Status flag indicating that transmit data has been transferred from TDR into TSR and new data can be written in TDR Note: * Only 0 can be written, to clear the flag.
The CPU can always read and write SSR, but cannot write 1 in the TDRE, RDRF, ORER, PER, and FER flags. These flags can be cleared to 0 only if they have first been read while set to 1. The TEND and MPB flags are read-only bits that cannot be written. SSR is initialized to H'84 by a reset and in standby mode.
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Section 13 Serial Communication Interface
Bit 7--Transmit Data Register Empty (TDRE): Indicates that the SCI has loaded transmit data from TDR into TSR and the next serial transmit data can be written in TDR.
Bit 7: TDRE 0 Description TDR contains valid transmit data [Clearing conditions] * * 1 Software reads TDRE while it is set to 1, then writes 0. The DMAC writes data in TDR. (Initial value)
TDR does not contain valid transmit data [Setting conditions] * * * The chip is reset or enters standby mode. The TE bit in SCR is cleared to 0.
TDR contents are loaded into TSR, so new data can be written in TDR.
Bit 6--Receive Data Register Full (RDRF): Indicates that RDR contains new receive data.
Bit 6: RDRF 0 Description RDR does not contain new receive data [Clearing conditions] * * * 1 The chip is reset or enters standby mode. Software reads RDRF while it is set to 1, then writes 0. The DMAC reads data from RDR. (Initial value)
RDR contains new receive data [Setting condition] When serial data is received normally and transferred from RSR to RDR.
Note: The RDR contents and RDRF flag are not affected by detection of receive errors or by clearing of the RE bit to 0 in SCR. They retain their previous values. If the RDRF flag is still set to 1 when reception of the next data ends, an overrun error occurs and receive data is lost.
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Section 13 Serial Communication Interface
Bit 5--Overrun Error (ORER): Indicates that data reception ended abnormally due to an overrun error.
Bit 5: ORER 0 Description Receiving is in progress or has ended normally [Clearing conditions] * * 1 The chip is reset or enters standby mode. Software reads ORER while it is set to 1, then writes 0. 2 A receive overrun error occurred* [Setting condition] Reception of the next serial data ends when RDRF = 1. Notes: 1. Clearing the RE bit to 0 in SCR does not affect the ORER flag, which retains its previous value. 2. RDR continues to hold the receive data before the overrun error, so subsequent receive data is lost. Serial receiving cannot continue while the ORER flag is set to 1. In synchronous mode, serial transmitting is also disabled. (Initial value)*
1
Bit 4--Framing Error (FER): Indicates that data reception ended abnormally due to a framing error in asynchronous mode.
Bit 4: FER 0 Description Receiving is in progress or has ended normally [Clearing conditions] * * 1 The chip is reset or enters standby mode. Software reads FER while it is set to 1, then writes 0.
2
(Initial value)*
1
A receive framing error occurred* [Setting condition]
The stop bit at the end of receive data is checked and found to be 0. Notes: 1. Clearing the RE bit to 0 in SCR does not affect the FER flag, which retains its previous value. 2. When the stop bit length is 2 bits, only the first bit is checked. The second stop bit is not checked. When a framing error occurs the SCI transfers the receive data into RDR but does not set the RDRF flag. Serial receiving cannot continue while the FER flag is set to 1. In synchronous mode, serial transmitting is also disabled.
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Section 13 Serial Communication Interface
Bit 3--Parity Error (PER): Indicates that data reception ended abnormally due to a parity error in asynchronous mode.
Bit 3: PER 0 Description Receiving is in progress or has ended normally* [Clearing conditions] * * 1 The chip is reset or enters standby mode. Software reads PER while it is set to 1, then writes 0. 2 A receive parity error occurred* [Setting condition] The number of 1s in receive data, including the parity bit, does not match the even or odd parity setting of O/E in SMR. Notes: 1. Clearing the RE bit to 0 in SCR does not affect the PER flag, which retains its previous value. 2. When a parity error occurs the SCI transfers the receive data into RDR but does not set the RDRF flag. Serial receiving cannot continue while the PER flag is set to 1. In synchronous mode, serial transmitting is also disabled.
1
(Initial value)
Bit 2--Transmit End (TEND): Indicates that when the last bit of a serial character was transmitted TDR did not contain new transmit data, so transmission has ended. The TEND flag is a read-only bit and cannot be written.
Bit 2: TEND 0 Description Transmission is in progress [Clearing conditions] * * 1 Software reads TDRE while it is set to 1, then writes 0 in the TDRE flag. The DMAC writes data in TDR. (Initial value)
End of transmission [Setting conditions] * * * The chip is reset or enters standby mode. The TE bit is cleared to 0 in SCR.
TDRE is 1 when the last bit of a serial character is transmitted.
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Section 13 Serial Communication Interface
Bit 1--Multiprocessor Bit (MPB): Stores the value of the multiprocessor bit in receive data when a multiprocessor format is used in asynchronous mode. MPB is a read-only bit and cannot be written.
Bit 1: MPB 0 1 Note: * Description Multiprocessor bit value in receive data is 0* Multiprocessor bit value in receive data is 1 If the RE bit is cleared to 0 when a multiprocessor format is selected, MPB retains its previous value. (Initial value)
Bit 0--Multiprocessor Bit Transfer (MPBT): Stores the value of the multiprocessor bit added to transmit data when a multiprocessor format is selected for transmitting in asynchronous mode. The MPBT setting is ignored in synchronous mode, when a multiprocessor format is not selected, or when the SCI is not transmitting.
Bit 0: MPBT 0 1 Description Multiprocessor bit value in transmit data is 0 Multiprocessor bit value in transmit data is 1 (Initial value)
13.2.8
Bit Rate Register (BRR)
BRR is an 8-bit register that, together with the CKS1 and CKS0 bits in SMR that select the baud rate generator clock source, determines the serial communication bit rate.
Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W
The CPU can always read and write BRR. BRR is initialized to H'FF by a reset and in standby mode. The two SCI channels have independent baud rate generator control, so different values can be set in the two channels. Table 13.3 shows examples of BRR settings in asynchronous mode. Table 13.4 shows examples of BRR settings in synchronous mode.
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Section 13 Serial Communication Interface
Table 13.3 Examples of Bit Rates and BRR Settings in Asynchronous Mode
(MHz) 2 Bit Rate (bits/s) 110 150 300 600 1200 2400 4800 9600 19200 31250 38400 n 1 1 0 0 0 0 0 0 0 0 0 N 141 103 207 103 51 25 12 6 2 1 1 Error (%) 0.03 0.16 0.16 0.16 0.16 0.16 0.16 -6.99 8.51 0.00 -18.62 n 1 1 0 0 0 0 0 0 0 0 0 2.097152 N 148 108 217 108 54 26 13 6 2 1 1 Error (%) -0.04 0.21 0.21 0.21 -0.70 1.14 -2.48 -2.48 13.78 4.86 -14.67 n 1 1 0 0 0 0 0 0 0 0 0 2.4576 N 174 127 255 127 63 31 15 7 3 1 1 Error (%) -0.26 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 22.88 0.00 n 1 1 1 0 0 0 0 0 0 0 0 N 212 155 77 155 77 38 19 9 4 2 1 3 Error (%) 0.03 0.16 0.16 0.16 0.16 0.16 -2.34 -2.34 -2.34 0.00 22.07
(MHz) 3.6864 Bit Rate (bits/s) 110 150 300 600 1200 2400 4800 9600 19200 31250 38400 n 2 1 1 0 0 0 0 0 0 0 0 N 64 191 95 191 95 47 23 11 5 3 2 Error (%) 0.70 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 -7.84 0.00 n 2 1 1 0 0 0 0 0 0 0 0 N 70 207 103 207 103 51 25 12 6 3 2 4 Error (%) 0.03 0.16 0.16 0.16 0.16 0.16 0.16 0.16 -6.99 0.00 8.51 n 2 1 1 0 0 0 0 0 0 0 0 4.9152 N 86 255 127 255 127 63 31 15 7 4 3 Error (%) 0.31 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 -1.70 0.00 n 2 2 1 1 0 0 0 0 0 0 0 N 88 64 129 64 129 64 32 15 7 4 3 5 Error (%) -0.25 0.16 0.16 0.16 0.16 0.16 -1.36 1.73 1.73 0.00 1.73
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Section 13 Serial Communication Interface (MHz) 6 Bit Rate (bits/s) 110 150 300 600 1200 2400 4800 9600 19200 31250 38400 n 2 2 1 1 0 0 0 0 0 0 0 N 106 77 155 77 155 77 38 19 9 5 4 Error (%) -0.44 0.16 0.16 0.16 0.16 0.16 0.16 -2.34 -2.34 0.00 -2.34 n 2 2 1 1 0 0 0 0 0 0 0 N 108 79 159 79 159 79 39 19 9 5 4 6.144 Error (%) 0.08 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 2.40 0.00 n 2 2 1 1 0 0 0 0 0 0 0 (MHz) 9.8304 Bit Rate (bits/s) 110 150 300 600 1200 2400 4800 9600 19200 31250 38400 n 2 2 1 1 0 0 0 0 0 0 0 N 174 127 255 127 255 127 63 31 15 9 7 Error (%) -0.26 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 -1.70 0.00 n 2 2 2 1 1 0 0 0 0 0 0 N 177 129 64 129 64 129 64 32 15 9 7 10 Error (%) -0.25 0.16 0.16 0.16 0.16 0.16 0.16 -1.36 1.73 0.00 1.73 n 2 2 2 1 1 0 0 0 0 0 0 N 212 155 77 155 77 155 77 38 19 11 9 12 Error (%) 0.03 0.16 0.16 0.16 0.16 0.16 0.16 0.16 -2.34 0.00 -2.34 n 2 2 2 1 1 0 0 0 0 0 0 12.288 N 217 159 79 159 79 159 79 39 19 11 9 Error (%) 0.08 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 2.40 0.00 7.3728 N 130 95 191 95 191 95 47 23 11 6 5 Error (%) -0.07 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 5.33 0.00 n 2 2 1 1 0 0 0 0 0 0 0 N 141 103 207 103 207 103 51 25 12 7 6 8 Error (%) 0.03 0.16 0.16 0.16 0.16 0.16 0.16 0.16 0.16 0.00 -6.99
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Section 13 Serial Communication Interface (MHz) 13 Bit Rate (bits/s) 110 150 300 600 1200 2400 4800 9600 19200 31250 38400 n 2 2 2 1 1 0 0 0 0 0 0 N 230 168 84 168 84 168 84 41 20 12 10 Error (%) -0.08 0.16 -0.43 0.16 -0.43 0.16 -0.43 0.76 0.76 0.00 -3.82 n 2 2 2 1 1 0 0 0 0 0 0 N 248 181 90 181 90 181 90 45 22 13 10 14 Error (%) -0.17 0.16 0.16 0.16 0.16 0.16 0.16 -0.93 -0.93 0.00 3.57 n 3 2 2 1 1 0 0 0 0 0 0 14.7456 N 64 191 95 191 95 191 95 47 23 14 11 Error (%) 0.70 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 -1.70 0.00 n 3 2 2 1 1 0 0 0 0 0 0 N 70 207 103 207 103 207 103 51 25 15 12 16 Error (%) 0.03 0.16 0.16 0.16 0.16 0.16 0.16 0.16 0.16 0.00 0.16
(MHz) 18 Bit Rate (bits/s) 110 150 300 600 1200 2400 4800 9600 19200 31250 38400 n 3 2 2 1 1 0 0 0 0 0 0 N 79 233 116 233 116 233 116 58 28 17 14 Error (%) -0.12 0.16 0.16 0.16 0.16 0.16 0.16 -0.69 1.02 0.00 -2.34 n 3 3 2 2 1 1 0 0 0 0 0 N 88 64 129 64 129 64 129 64 32 19 15 20 Error (%) -0.25 0.16 0.16 0.16 0.16 0.16 0.16 0.16 -1.36 0.00 1.73 n 3 3 2 2 1 1 0 0 0 0 0 N 110 80 162 80 162 80 162 80 40 24 19 25 Error (%) -0.02 0.47 -0.15 0.47 -0.15 0.47 -0.15 0.47 -0.76 0.00 1.73
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Section 13 Serial Communication Interface
Table 13.4 Examples of Bit Rates and BRR Settings in Synchronous Mode
(MHz) Bit Rate (bits/s) n 110 250 500 1k 2.5 k 5k 10 k 25 k 50 k 100 k 250 k 500 k 1M 2M 2.5 M 4M Legend: Blank: No setting available --: Setting possible, but error occurs *: Continuous transmit/receive not possible Note: Settings with an error of 1% or less are recommended. 3 2 1 1 0 0 0 0 0 0 0 0 2 N 70 124 249 124 199 99 49 19 9 4 1 0* n 4 N n 8 N n 10 N n 13 N n 16 N n 18 N n 20 N n 25 N
---- 2 2 1 1 0 0 0 0 0 0 0 0 249 124 249 99 199 99 39 19 9 3 1 0*
---- 3 2 2 1 1 0 0 0 0 0 0 0 0 124 249 124 199 99 199 79 39 19 7 3 1 0*
---- ---- ---- ---- 1 1 0 0 0 0 0 0 249 124 249 99 49 24 9 4
---- 3 3 2 2 1 1 0 0 0 202 101 202 80 162 80 129 64 12
---- 3 3 2 2 1 1 0 0 0 0 0 0 0 249 124 249 99 199 99 159 79 39 15 7 3 1
---- ---- 3 3 2 1 1 0 0 0 0 0 0 140 69 112 224 112 179 89 44 17 8 4
---- ---- 3 3 2 1 1 0 0 0 0 0 0 155 77 124 249 124 199 99 49 19 9 4
---- ---- ---- 3 2 2 1 0 0 0 0 97 155 77 155 249 124 62 24
---- ---- ---- ---- ----
---- ---- ---- ---- ----
---- ---- 0 0*
---- ---- ----
---- ---- ----
----
---- 0 0*
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Section 13 Serial Communication Interface The BRR setting is calculated as follows: Asynchronous mode:
N= 64 x 22n-1 x B x 106 - 1
Synchronous mode:
N= 8x 22n-1 xB x 106 - 1
B: N: : n:
Bit rate (bits/s) BRR setting for baud rate generator (0 N 255) System clock frequency (MHz) Baud rate generator clock source (n = 0, 1, 2, 3) (For the clock sources and values of n, see the following table.) SMR Settings
n 0 1 2 3
Clock Source /4 /16 /64
CKS1 0 0 1 1
CKS0 0 1 0 1
The bit rate error in asynchronous mode is calculated as follows.
x 106 (N + 1) x B x 64 x 22n-1 - 1 x 100
Error (%) =
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Section 13 Serial Communication Interface
Table 13.5 indicates the maximum bit rates in asynchronous mode for various system clock frequencies. Tables 13.6 and 13.7 indicate the maximum bit rates with external clock input. Table 13.5 Maximum Bit Rates for Various Frequencies (Asynchronous Mode)
Settings (MHz) 2 2.097152 2.4576 3 3.6864 4 4.9152 5 6 6.144 7.3728 8 9.8304 10 12 12.288 14 14.7456 16 17.2032 18 20 25 Maximum Bit Rate (bits/s) 62500 65536 76800 93750 115200 125000 153600 156250 187500 192000 230400 250000 307200 312500 375000 384000 437500 460800 500000 537600 562500 625000 781250 n 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 N 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
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Section 13 Serial Communication Interface
Table 13.6 Maximum Bit Rates with External Clock Input (Asynchronous Mode)
(MHz) 2 2.097152 2.4576 3 3.6864 4 4.9152 5 6 6.144 7.3728 8 9.8304 10 12 12.288 14 14.7456 16 17.2032 18 20 25 External Input Clock (MHz) 0.5000 0.5243 0.6144 0.7500 0.9216 1.0000 1.2288 1.2500 1.5000 1.5360 1.8432 2.0000 2.4576 2.5000 3.0000 3.0720 3.5000 3.6864 4.0000 4.3008 4.5000 5.0000 6.2500 Maximum Bit Rate (bits/s) 31250 32768 38400 46875 57600 62500 76800 78125 93750 96000 115200 125000 153600 156250 187500 192000 218750 230400 250000 268800 281250 312500 390625
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Section 13 Serial Communication Interface
Table 13.7 Maximum Bit Rates with External Clock Input (Synchronous Mode)
(MHz) 2 4 6 8 10 12 14 16 18 20 25 External Input Clock (MHz) 0.3333 0.6667 1.0000 1.3333 1.6667 2.0000 2.3333 2.6667 3.0000 3.3333 4.1667 Maximum Bit Rate (bits/s) 333333.3 666666.7 1000000.0 1333333.3 1666666.7 2000000.0 2333333.3 2666666.7 3000000.0 3333333.3 4166666.7
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Section 13 Serial Communication Interface
13.3
13.3.1
Operation
Overview
The SCI has an asynchronous mode in which characters are synchronized individually, and a synchronous mode in which communication is synchronized with clock pulses. Serial communication is possible in either mode. Asynchronous or synchronous mode and the communication format are selected in SMR, as shown in table 13.8. The SCI clock source is selected by the C/A bit in SMR and the CKE1 and CKE0 bits in SCR, as shown in table 13.9. Asynchronous Mode: * Data length is selectable: 7 or 8 bits. * Parity and multiprocessor bits are selectable. So is the stop bit length (1 or 2 bits). These selections determine the communication format and character length. * In receiving, it is possible to detect framing errors, parity errors, overrun errors, and the break state. * An internal or external clock can be selected as the SCI clock source. When an internal clock is selected, the SCI operates using the on-chip baud rate generator, and can output a serial clock signal with a frequency matching the bit rate. When an external clock is selected, the external clock input must have a frequency 16 times the bit rate. (The on-chip baud rate generator is not used.) Synchronous Mode: * The communication format has a fixed 8-bit data length. * In receiving, it is possible to detect overrun errors. * An internal or external clock can be selected as the SCI clock source. When an internal clock is selected, the SCI operates using the on-chip baud rate generator, and outputs a serial clock signal to external devices. When an external clock is selected, the SCI operates on the input serial clock. The on-chip baud rate generator is not used.
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Section 13 Serial Communication Interface
Table 13.8 SMR Settings and Serial Communication Formats
SMR Settings Bit 7: Bit 6: Bit 2: Bit 5: Bit 3: C/A CHR MP PE STOP Mode A 0 0 0 0 1 1 0 1 0 1 1 -- -- -- 1 -- 0 1 0 1 0 1 0 1 0 1 0 1 -- Synchronous mode 8-bit data Absent Asynchronous mode (multiprocessor format) 8-bit data 7-bit data Present Absent Present 7-bit data Absent Asynchronous mode SCI Communication Format Data Length 8-bit data Multiprocessor Parity Bit Bit Absent Absent Present Stop Bit Length 1 bit 2 bits 1 bit 2 bits 1 bit 2 bits 1 bit 2 bits 1 bit 2 bits 1 bit 2 bits None
Table 13.9 SMR and SCR Settings and SCI Clock Source Selection
SMR Bit 7: C/A A 0 SCR Settings Bit 1: CKE1 0 Bit 0: CKE0 0 1 1 1 0 1 0 1 0 1 0 1 Synchronous mode Internal External Mode Asynchronous mode Clock Source Internal SCI Transmit/Receive Clock SCK Pin Function SCI does not use the SCK pin Outputs a clock with frequency matching the bit rate External Inputs a clock with frequency 16 times the bit rate Outputs the serial clock Inputs the serial clock
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Section 13 Serial Communication Interface
13.3.2
Operation in Asynchronous Mode
In asynchronous mode each transmitted or received character begins with a start bit and ends with a stop bit. Serial communication is synchronized one character at a time. The transmitting and receiving sections of the SCI are independent, so full duplex communication is possible. The transmitter and receiver are both double buffered, so data can be written and read while transmitting and receiving are in progress, enabling continuous transmitting and receiving. Figure 13.2 shows the general format of asynchronous serial communication. In asynchronous serial communication the communication line is normally held in the mark (high) state. The SCI monitors the line and starts serial communication when the line goes to the space (low) state, indicating a start bit. One serial character consists of a start bit (low), data (LSB first), parity bit (high or low), and stop bit (high), in that order. When receiving in asynchronous mode, the SCI synchronizes at the falling edge of the start bit. The SCI samples each data bit on the eighth pulse of a clock with a frequency 16 times the bit rate. Receive data is latched at the center of each bit.
Idle (mark) state 1 0/1 Parity bit 1 Stop bit 1
1 Serial data 0 Start bit 1 bit
(LSB) D0 D1 D2 D3 D4 D5 D6
(MSB) D7
Transmit or receive data 7 bits or 8 bits One unit of data (character or frame)
1 bit or 1 bit or no bit 2 bits
Figure 13.2 Data Format in Asynchronous Communication (Example: 8-Bit Data with Parity and 2 Stop Bits)
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Section 13 Serial Communication Interface
Communication Formats Table 13.10 shows the 12 communication formats that can be selected in asynchronous mode. The format is selected by settings in SMR. Table 13.10 Serial Communication Formats (Asynchronous Mode)
SMR Settings
CHR 0 PE 0 MP 0 STOP 0 1 S 2
Serial Communication Format and Frame Length
3 4 5 6 7 8 9 10 STOP 11 12
8-bit data 8-bit data 8-bit data 8-bit data 7-bit data 7-bit data 7-bit data 7-bit data 8-bit data 8-bit data 7-bit data 7-bit data
STOP
0
0
0
1
S
STOP STOP
0
1
0
0
S
P
STOP
0
1
0
1
S
P
STOP STOP
1
0
0
0
S
1
0
0
1
S
STOP STOP
1
1
0
0
S
P
STOP
1
1
0
1
S
P
STOP STOP
0
--
1
0
S
MPB STOP
0
--
1
1
S
MPB STOP STOP
1
--
1
0
S
MPB STOP
1
--
1
1
S
MPB STOP STOP
Legend: S: Start bit STOP: Stop bit P: Parity bit MPB: Multiprocessor bit
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Section 13 Serial Communication Interface
Clock An internal clock generated by the on-chip baud rate generator or an external clock input from the SCK pin can be selected as the SCI transmit/receive clock. The clock source is selected by the C/A bit in SMR and bits CKE1 and CKE0 in SCR. See table 13.9. When an external clock is input at the SCK pin, it must have a frequency equal to 16 times the desired bit rate. When the SCI operates on an internal clock, it can output a clock signal at the SCK pin. The frequency of this output clock is equal to the bit rate. The phase is aligned as in figure 13.3 so that the rising edge of the clock occurs at the center of each transmit data bit.
0
D0
D1
D2
D3
D4
D5
D6
D7
0/1
1
1
1 frame
Figure 13.3 Phase Relationship between Output Clock and Serial Data (Asynchronous Mode) Transmitting and Receiving Data SCI Initialization (Asynchronous Mode): Before transmitting or receiving, clear the TE and RE bits to 0 in SCR, then initialize the SCI as follows. When changing the communication mode or format, always clear the TE and RE bits to 0 before following the procedure given below. Clearing TE to 0 sets the TDRE flag to 1 and initializes TSR. Clearing RE to 0, however, does not initialize the RDRF, PER, FER, and ORER flags and RDR, which retain their previous contents. When an external clock is used, the clock should not be stopped during initialization or subsequent operation. SCI operation becomes unreliable if the clock is stopped. Figure 13.4 is a sample flowchart for initializing the SCI.
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Section 13 Serial Communication Interface
Start of initialization
Clear TE and RE bits to 0 in SCR
Set CKE1 and CKE0 bits in SCR (leaving TE and RE bits cleared to 0)
1
1. Select the clock source in SCR. Clear the RIE, TIE, TEIE, MPIE, TE, and RE bits to 0. If clock output is selected in asynchronous mode, clock output starts immediately after the setting is made in SCR. 2. Select the communication format in SMR. 3. Write the value corresponding to the bit rate in BRR. This step is not necessary when an external clock is used. 4. Wait for at least the interval required to transmit or receive 1 bit, then set the TE or RE bit to 1 in SCR. Set the RIE, TIE, TEIE, and MPIE bits as necessary. Setting the TE or RE bit enables the SCI to use the TxD or RxD pin.
Select communication format in SMR
2
Set value in BRR Wait
3
1 bit interval elapsed? Yes Set TE or RE bit to 1 in SCR Set RIE, TIE, TEIE, and MPIE bits as necessary
No
4
Transmitting or receiving
Figure 13.4 Sample Flowchart for SCI Initialization
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Section 13 Serial Communication Interface
Transmitting Serial Data (Asynchronous Mode): Figure 13.5 shows a sample flowchart for transmitting serial data and indicates the procedure to follow.
1 1. SCI initialization: the transmit data output function of the TxD pin is selected automatically. 2. SCI status check and transmit data write: read SSR, check that the TDRE flag is 1, then write transmit data in TDR and clear the TDRE flag to 0. 3. To continue transmitting serial data: after checking that the TDRE flag is 1, indicating that data can be written, write data in TDR, then clear the TDRE flag to 0. When the DMAC is activated by a transmitdata-empty interrupt request (TXI) to write data in TDR, the TDRE flag is checked and cleared automatically. 4. To output a break signal at the end of serial transmission: set the DDR bit to 1 and clear the DR bit to 0 (DDR and DR are I/O port registers), then clear the TE bit to 0 in SCR.
Initialize Start transmitting
Read TDRE flag in SSR No TDRE = 1? Yes Write transmit data in TDR and clear TDRE flag to 0 in SSR
2
All data transmitted? Yes Read TEND flag in SSR
No
3
TEND = 1? Yes Output break signal? Yes Clear DR bit to 0, set DDR bit to 1 Clear TE bit to 0 in SCR
No
No
4
End
Figure 13.5 Sample Flowchart for Transmitting Serial Data
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Section 13 Serial Communication Interface
In transmitting serial data, the SCI operates as follows. 1. The SCI monitors the TDRE flag in SSR. When the TDRE flag is cleared to 0 the SCI recognizes that TDR contains new data, and loads this data from TDR into TSR. 2. After loading the data from TDR into TSR, the SCI sets the TDRE flag to 1 and starts transmitting. If the TIE bit is set to 1 in SCR, the SCI requests a transmit-data-empty interrupt (TXI) at this time. Serial transmit data is transmitted in the following order from the TxD pin: a. Start bit: One 0 bit is output. b. Transmit data: 7 or 8 bits are output, LSB first. c. Parity bit or multiprocessor bit: One parity bit (even or odd parity) or one multiprocessor bit is output. Formats in which neither a parity bit nor a multiprocessor bit is output can also be selected. d. Stop bit: One or two 1 bits (stop bits) are output. e. Mark state: Output of 1 bits continues until the start bit of the next transmit data. 3. The SCI checks the TDRE flag when it outputs the stop bit. If the TDRE flag is 0, the SCI loads new data from TDR into TSR, outputs the stop bit, then begins serial transmission of the next frame. If the TDRE flag is 1, the SCI sets the TEND flag to 1 in SSR, outputs the stop bit, then continues output of 1 bits in the mark state. If the TEIE bit is set to 1 in SCR, a transmitend interrupt (TEI) is requested at this time. Figure 13.6 shows an example of SCI transmit operation in asynchronous mode.
Start bit
0
1
Data D0 D1 D7
Parity Stop Start bit bit bit 0/1
1 0
Data D0 D1 D7
Parity Stop bit bit 0/1
1
1
Idle (mark) state
TDRE TEND
TXI interrupt request
TXI interrupt handler writes data in TDR and clears TDRE flag to 0 1 frame
TXI interrupt request
TEI interrupt request
Figure 13.6 Example of SCI Transmit Operation in Asynchronous Mode (8-Bit Data with Parity and 1 Stop Bit)
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Section 13 Serial Communication Interface
Receiving Serial Data (Asynchronous Mode): Figure 13.7 shows a sample flowchart for receiving serial data and indicates the procedure to follow.
Initialize
1
Start receiving
Read ORER, PER, and FER flags in SSR
2
PER FER ORER = 1? No
Yes 3 Error handling (continued on next page)
Read RDRF flag in SSR
4
No RDRF = 1? Yes Read receive data from RDR, and clear RDRF flag to 0 in SSR
1. SCI initialization: the receive data function of the RxD pin is selected automatically. 2, 3. Receive error handling and break detection: if a receive error occurs, read the ORER, PER, and FER flags in SSR to identify the error. After executing the necessary error handling, clear the ORER, PER, and FER flags all to 0. Receiving cannot resume if any of the ORER, PER, and FER flags remains set to 1. When a framing error occurs, the RxD pin can be read to detect the break state. 4. SCI status check and receive data read: read SSR, check that RDRF is set to 1, then read receive data from RDR and clear the RDRF flag to 0. Notification that the RDRF flag has changed from 0 to 1 can also be given by the RXI interrupt. 5. To continue receiving serial data: check the RDRF flag, read RDR, and clear the RDRF flag to 0 before the stop bit of the current frame is received. If the DMAC is activated by an RXI interrupt to read the RDR value, the RDRF flag is cleared automatically.
No
Finished receiving? Yes Clear RE bit to 0 in SCR End
5
Figure 13.7 Sample Flowchart for Receiving Serial Data (1)
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Section 13 Serial Communication Interface
3 Error handling
No
ORER = 1? Yes Overrun error handling
No
FER = 1? Yes Break? No Framing error handling Clear RE bit to 0 in SCR Yes
No
PER = 1? Yes Parity error handling
Clear ORER, PER, and FER flags to 0 in SSR
End
Figure 13.7 Sample Flowchart for Receiving Serial Data (2)
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Section 13 Serial Communication Interface
In receiving, the SCI operates as follows. 1. The SCI monitors the receive data line. When it detects a start bit, the SCI synchronizes internally and starts receiving. 2. Receive data is stored in RSR in order from LSB to MSB. 3. The parity bit and stop bit are received. After receiving, the SCI makes the following checks: a. Parity check: The number of 1s in the receive data must match the even or odd parity setting of the O/E bit in SMR. b. Stop bit check: The stop bit value must be 1. If there are two stop bits, only the first stop bit is checked. c. Status check: The RDRF flag must be 0 so that receive data can be transferred from RSR into RDR. If these checks all pass, the RDRF flag is set to 1 and the received data is stored in RDR. If one of the checks fails (receive error)*, the SCI operates as indicated in table 13.11. Note: * When a receive error occurs, further receiving is disabled. In receiving, the RDRF flag is not set to 1. Be sure to clear the error flags to 0. 4. When the RDRF flag is set to 1, if the RIE bit is set to 1 in SCR, a receive-data-full interrupt (RXI) is requested. If the ORER, PER, or FER flag is set to 1 and the RIE bit in SCR is also set to 1, a receive-error interrupt (ERI) is requested. Table 13.11 Receive Error Conditions
Receive Error Overrun error Abbreviation ORER Condition Receiving of next data ends while RDRF flag is still set to 1 in SSR Stop bit is 0 Parity of receive data differs from even/odd parity setting in SMR Data Transfer Receive data not transferred from RSR to RDR Receive data transferred from RSR to RDR Receive data transferred from RSR to RDR
Framing error Parity error
FER PER
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Section 13 Serial Communication Interface
Figure 13.8 shows an example of SCI receive operation in asynchronous mode.
Start bit
0
1
Data D0 D1 D7
Parity Stop Start bit bit bit 0/1
1 0
Data D0 D1 D7
Parity Stop bit bit 0/1
1
1
Idle (mark) state
RDRF
FER RXI request 1 frame RXI interrupt handler reads data in RDR and clears RDRF flag to 0
Framing error, ERI request
Figure 13.8 Example of SCI Receive Operation (8-Bit Data with Parity and One Stop Bit) 13.3.3 Multiprocessor Communication
The multiprocessor communication function enables several processors to share a single serial communication line. The processors communicate in asynchronous mode using a format with an additional multiprocessor bit (multiprocessor format). In multiprocessor communication, each receiving processor is addressed by an ID. A serial communication cycle consists of an ID-sending cycle that identifies the receiving processor, and a data-sending cycle. The multiprocessor bit distinguishes ID-sending cycles from data-sending cycles. The transmitting processor starts by sending the ID of the receiving processor with which it wants to communicate as data with the multiprocessor bit set to 1. Next the transmitting processor sends transmit data with the multiprocessor bit cleared to 0. Receiving processors skip incoming data until they receive data with the multiprocessor bit set to 1. When they receive data with the multiprocessor bit set to 1, receiving processors compare the data with their IDs. The receiving processor with a matching ID continues to receive further incoming data. Processors with IDs not matching the received data skip further incoming data until they again receive data with the multiprocessor bit set to 1. Multiple processors can send and receive data in this way. Figure 13.9 shows an example of communication among different processors using a multiprocessor format.
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Section 13 Serial Communication Interface
Communication Formats Four formats are available. Parity-bit settings are ignored when a multiprocessor format is selected. For details see table 13.10. Clock See the description of asynchronous mode.
Transmitting processor
Serial communication line
Receiving processor A (ID = 01)
Receiving processor B
Receiving processor C
Receiving processor D
(ID = 02)
(ID = 03)
(ID = 04)
Serial data
H'01 (MPB = 1)
ID-sending cycle: receiving processor address
H'AA (MPB = 0)
Data-sending cycle: data sent to receiving processor specified by ID
Legend: MPB: Multiprocessor bit
Figure 13.9 Example of Communication among Processors Using Multiprocessor Format (Sending Data H'AA to Receiving Processor A)
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Section 13 Serial Communication Interface
Transmitting and Receiving Data Transmitting Multiprocessor Serial Data: Figure 13.10 shows a sample flowchart for transmitting multiprocessor serial data and indicates the procedure to follow.
Initialize Start transmitting
1
Read TDRE flag in SSR TDRE = 1? Yes Write transmit data in TDR and set MPBT bit in SSR Clear TDRE flag to 0 No No
2
All data transmitted? Yes Read TEND flag in SSR
3
1. SCI initialization: the transmit data output function of the TxD pin is selected automatically. 2. SCI status check and transmit data write: read SSR, check that the TDRE flag is 1, then write transmit data in TDR. Also set the MPBT flag to 0 or 1 in SSR. Finally, clear the TDRE flag to 0. 3. To continue transmitting serial data: after checking that the TDRE flag is 1, indicating that data can be written, write data in TDR, then clear the TDRE flag to 0. When the DMAC is activated by a transmit-data-empty interrupt request (TXI) to write data in TDR, the TDRE flag is checked and cleared automatically. 4. To output a break signal at the end of serial transmission: set the DDR bit to 1 and clear the DR bit to 0 (DDR and DR are I/O port registers), then clear the TE bit to 0 in SCR.
TEND = 1? Yes Output break signal? Yes Clear DR bit to 0, set DDR bit to 1 Clear TE bit to 0 in SCR
No
No
4
End
Figure 13.10 Sample Flowchart for Transmitting Multiprocessor Serial Data
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Section 13 Serial Communication Interface
In transmitting serial data, the SCI operates as follows. 1. The SCI monitors the TDRE flag in SSR. When the TDRE flag is cleared to 0 the SCI recognizes that TDR contains new data, and loads this data from TDR into TSR. 2. After loading the data from TDR into TSR, the SCI sets the TDRE flag to 1 and starts transmitting. If the TIE bit in SCR is set to 1, the SCI requests a transmit-data-empty interrupt (TXI) at this time. Serial transmit data is transmitted in the following order from the TxD pin: a. Start bit: One 0 bit is output. b. Transmit data: 7 or 8 bits are output, LSB first. c. Multiprocessor bit: One multiprocessor bit (MPBT value) is output. d. Stop bit: One or two 1 bits (stop bits) are output. e. Mark state: Output of 1 bits continues until the start bit of the next transmit data. 3. The SCI checks the TDRE flag when it outputs the stop bit. If the TDRE flag is 0, the SCI loads data from TDR into TSR, outputs the stop bit, then begins serial transmission of the next frame. If the TDRE flag is 1, the SCI sets the TEND flag in SSR to 1, outputs the stop bit, then continues output of 1 bits in the mark state. If the TEIE bit is set to 1 in SCR, a transmit-end interrupt (TEI) is requested at this time. Figure 13.11 shows an example of SCI transmit operation using a multiprocessor format.
Multiprocessor bit
1
Multiprocessor bit Data D0 D1 D7 0/1 Stop bit
1 1
Start bit
0
Data D0 D1 D7 0/1
Stop Start bit bit
1 0
Idle (mark) state
TDRE TEND
TXI request
TXI interrupt handler writes data in TDR and clears TDRE flag to 0 1 frame
TXI request
TEI request
Figure 13.11 Example of SCI Transmit Operation (8-Bit Data with Multiprocessor Bit and One Stop Bit)
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Section 13 Serial Communication Interface
Receiving Multiprocessor Serial Data: Figure 13.12 shows a sample flowchart for receiving multiprocessor serial data and indicates the procedure to follow.
Initialize Start receiving 1 1. SCI initialization: the receive data function of the RxD pin is selected automatically. 2. ID receive cycle: set the MPIE bit to 1 in SCR. 3. SCI status check and ID check: read SSR, check that the RDRF flag is set to 1, then read data from RDR and compare with the processor's own ID. If the ID does not match, set the MPIE bit to 1 again and clear the RDRF flag to 0. If the ID matches, clear the RDRF flag to 0. 4. SCI status check and data receiving: read SSR, check that the RDRF flag is set to 1, then read data from RDR. 5. Receive error handling and break detection: if a receive error occurs, read the ORER and FER flags in SSR to identify the error. After executing the necessary error handling, clear the ORER and FER flags both to 0. Receiving cannot resume while either the ORER or FER flag remains set to 1. When a framing error occurs, the RxD pin can be read to detect the break state.
Set MPIE bit to 1 in SCR
2
Read ORER and FER flags in SSR Yes
FER ORER = 1 No Read RDRF flag in SSR No RDRF = 1? Yes Read receive data from RDR No Own ID? Yes Read ORER and FER flags in SSR
3
FER ORER = 1 No Read RDRF flag in SSR
Yes
4 No
RDRF = 1? Yes Read receive data from RDR No
Finished receiving? Yes Clear RE bit to 0 in SCR End
5 Error handling (continued on next page)
Figure 13.12 Sample Flowchart for Receiving Multiprocessor Serial Data (1)
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Section 13 Serial Communication Interface
5 Error handling
No
ORER = 1? Yes Overrun error handling
No
FER = 1? Yes Break? No Framing error handling Clear RE bit to 0 in SCR Yes
Clear ORER, PER, and FER flags to 0 in SSR
End
Figure 13.12 Sample Flowchart for Receiving Multiprocessor Serial Data (2) Figure 13.13 shows an example of SCI receive operation using a multiprocessor format.
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Section 13 Serial Communication Interface
1
Start bit
0
Data (ID1)
MPB D7
1
Stop Start Data (data1) bit bit
1 0
MPB D7
0
Stop bit
1
1
D0
D1
D0
D1
Idle (mark) state
MPIE
RDRF
RDR value
ID1 RXI request (multiprocessor interrupt) RXI handler reads RDR data and clears RDRF flag to 0 Not own ID, so MPIE bit is set to 1 again No RXI request, RDR not updated
MPB detection MPIE= 0
a. Own ID does not match data
1
Start bit
0
Data (ID2)
MPB D7
1
Stop Start Data (data2) bit bit
1 0
MPB D7
0
Stop bit
1
1
D0
D1
D0
D1
Idle (mark) state
MPIE
RDRF
RDR value
ID2 RXI request (multiprocessor interrupt)
Data 2
MPB detection MPIE= 0
RXI interrupt handler Own ID, so receiving MPIE bit is set reads RDR data and continues, with data to 1 again clears RDRF flag to 0 received by RXI interrupt handler
b. Own ID matches data
Figure 13.13 Example of SCI Receive Operation (8-Bit Data with Multiprocessor Bit and One Stop Bit)
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Section 13 Serial Communication Interface
13.3.4
Synchronous Operation
In synchronous mode, the SCI transmits and receives data in synchronization with clock pulses. This mode is suitable for high-speed serial communication. The SCI transmitter and receiver share the same clock but are otherwise independent, so full duplex communication is possible. The transmitter and receiver are also double buffered, so continuous transmitting or receiving is possible by reading or writing data while transmitting or receiving is in progress. Figure 13.14 shows the general format in synchronous serial communication.
One unit (character or frame) of serial data * Serial clock LSB Serial data Don't care Note: * High except in continuous transmitting or receiving Bit 0 Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 MSB Bit 7 Don't care *
Figure 13.14 Data Format in Synchronous Communication In synchronous serial communication, each data bit is placed on the communication line from one falling edge of the serial clock to the next. Data is guaranteed valid at the rise of the serial clock. In each character, the serial data bits are transmitted in order from LSB (first) to MSB (last). After output of the MSB, the communication line remains in the state of the MSB. In synchronous mode the SCI receives data by synchronizing with the rise of the serial clock. Communication Format The data length is fixed at 8 bits. No parity bit or multiprocessor bit can be added.
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Section 13 Serial Communication Interface
Clock An internal clock generated by the on-chip baud rate generator or an external clock input from the SCK pin can be selected by setting the C/A bit in SMR and the CKE1 and CKE0 bits in SCR. See table 13.9. When the SCI operates on an internal clock, it outputs the clock signal at the SCK pin. Eight clock pulses are output per transmitted or received character. When the SCI operates on an internal clock, the serial clock outputs the clock signal at the SCK pin. Eight clock pulses are output per transmitted or received character. When the SCI is not transmitting or receiving, the clock signal remains in the high state. However, when receiving only, overrun error may occur or the serial clock continues output until the RE bit clears at 0. When transmitting or receiving in single characters, select the external clock. Transmitting and Receiving Data SCI Initialization (Synchronous Mode): Before transmitting or receiving, clear the TE and RE bits to 0 in SCR, then initialize the SCI as follows. When changing the communication mode or format, always clear the TE and RE bits to 0 before following the procedure given below. Clearing the TE bit to 0 sets the TDRE flag to 1 and initializes TSR. Clearing the RE bit to 0, however, does not initialize the RDRF, PER, FER, and ORE flags and RDR, which retain their previous contents. Figure 13.15 is a sample flowchart for initializing the SCI.
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Section 13 Serial Communication Interface
Start of initialization
Clear TE and RE bits to 0 in SCR
Set RIE, TIE, TEIE, MPIE, CKE1, and CKE0 bits in SCR (leaving TE and RE bits cleared to 0)
1
1. Select the clock source in SCR. Clear the RIE, TIE, TEIE, MPIE, TE, and RE bits to 0. 2. Select the communication format in SMR. 3. Write the value corresponding to the bit rate in BRR. This step is not necessary when an external clock is used. 4. Wait for at least the interval required to transmit or receive one bit, then set the TE or RE bit to 1 in SCR. Also set the RIE, TIE, TEIE, and MPIE bits as necessary. Setting the TE or RE bit enables the SCI to use the TxD or RxD pin.
2 Select communication format in SMR 3 Set value in BRR Wait 1 bit interval elapsed? Yes Set TE or RE to 1 in SCR Set RIE, TIE, TEIE, and MPIE bits as necessary No
4
Start transmitting or receiving
Note: In simultaneous transmitting and receiving, the TE and RE bits should be cleared to 0 or set to 1 simultaneously.
Figure 13.15 Sample Flowchart for SCI Initialization
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Section 13 Serial Communication Interface
Transmitting Serial Data (Synchronous Mode): Figure 13.16 shows a sample flowchart for transmitting serial data and indicates the procedure to follow.
1. SCI initialization: the transmit data output function of the TxD pin is selected automatically. 2. SCI status check and transmit data write: read SSR, check that the TDRE flag is 1, then write transmit data in TDR and clear the TDRE flag to 0. 3. To continue transmitting serial data: after checking that the TDRE flag is 1, indicating that data can be written, write data in TDR, then clear the TDRE flag to 0. When the DMAC is activated by a transmitdata-empty interrupt request (TXI) to write data in TDR, the TDRE flag is checked and cleared automatically.
Initialize
1
Start transmitting
Read TDRE flag in SSR
2
No TDRE = 1? Yes Write transmit data in TDR and clear TDRE flag to 0 in SSR
All data transmitted? Yes
No
3
Read TEND flag in SSR No
TEND = 1? Yes Clear TE bit to 0 in SCR
End
Figure 13.16 Sample Flowchart for Serial Transmitting
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Section 13 Serial Communication Interface
In transmitting serial data, the SCI operates as follows. 1. The SCI monitors the TDRE flag in SSR. When the TDRE flag is cleared to 0 the SCI recognizes that TDR contains new data, and loads this data from TDR into TSR. 2. After loading the data from TDR into TSR, the SCI sets the TDRE flag to 1 and starts transmitting. If the TIE bit is set to 1 in SCR, the SCI requests a transmit-data-empty interrupt (TXI) at this time. If clock output is selected, the SCI outputs eight serial clock pulses. If an external clock source is selected, the SCI outputs data in synchronization with the input clock. Data is output from the TxD pin in order from LSB (bit 0) to MSB (bit 7). 3. The SCI checks the TDRE flag when it outputs the MSB (bit 7). If the TDRE flag is 0, the SCI loads data from TDR into TSR and begins serial transmission of the next frame. If the TDRE flag is 1, the SCI sets the TEND flag to 1 in SSR, and after transmitting the MSB, holds the TxD pin in the MSB state. If the TEIE bit in SCR is set to 1, a transmit-end interrupt (TEI) is requested at this time. 4. After the end of serial transmission, the SCK pin is held in a constant state. Figure 13.17 shows an example of SCI transmit operation.
Transmit direction
Serial clock
Serial data TDRE TEND TXI request
Bit 0
Bit 1
Bit 7
Bit 0
Bit 1
Bit 6
Bit 7
TXI interrupt handler writes data in TDR and clears TDRE flag to 0 1 frame
TXI request
TEI request
Figure 13.17 Example of SCI Transmit Operation
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Section 13 Serial Communication Interface
Receiving Serial Data: Figure 13.18 shows a sample flowchart for receiving serial data and indicates the procedure to follow. When switching from asynchronous mode to synchronous mode, make sure that the ORER, PER, and FER flags are cleared to 0. If the FER or PER flag is set to 1 the RDRF flag will not be set and both transmitting and receiving will be disabled.
SCI initialization: the receive data function of the RxD pin is selected automatically. 2, 3. Receive error handling: if a receive error Start receiving occurs, read the ORER flag in SSR, then after executing the necessary error handling, clear the ORER flag to 0. Neither transmitting nor receiving can resume while the ORER flag Read ORER flag in SSR 2 remains set to 1. 4. SCI status check and receive data read: read SSR, check that the RDRF flag is set to 1, Yes ORER = 1? then read receive data from RDR and clear 3 the RDRF flag to 0. Notification that the RDRF Error handling No flag has changed from 0 to 1 can also be given by the RXI interrupt. continued on next page 5. To continue receiving serial data: check the 4 Read RDRF flag in SSR RDRF flag, read RDR, and clear the RDRF flag to 0 before the MSB (bit 7) of the current frame is received. If the DMAC is activated No by a receive-data-full interrupt request (RXI) RDRF = 1? to read RDR, the RDRF flag is cleared automatically. Yes Read receive data from RDR, and clear RDRF flag to 0 in SSR 5
Initialize
1
1.
No
Finished receiving? Yes Clear RE bit to 0 in SCR
End
Figure 13.18 Sample Flowchart for Serial Receiving (1)
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Section 13 Serial Communication Interface
3 Error handling
Overrun error handling
Clear ORER flag to 0 in SSR
End
Figure 13.18 Sample Flowchart for Serial Receiving (2) In receiving, the SCI operates as follows. 1. The SCI synchronizes with serial clock input or output and initializes internally. 2. Receive data is stored in RSR in order from LSB to MSB. After receiving the data, the SCI checks that the RDRF flag is 0 so that receive data can be transferred from RSR to RDR. If this check passes, the RDRF flag is set to 1 and the received data is stored in RDR. If the check does not pass (receive error), the SCI operates as indicated in table 13.11. 3. After setting the RDRF flag to 1, if the RIE bit is set to 1 in SCR, the SCI requests a receivedata-full interrupt (RXI). If the ORER flag is set to 1 and the RIE bit in SCR is also set to 1, the SCI requests a receive-error interrupt (ERI). Figure 13.19 shows an example of SCI receive operation.
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Section 13 Serial Communication Interface
Receive direction Serial clock
Serial data RDRF
Bit 7
Bit 0
Bit 7
Bit 0
Bit 1
Bit 6
Bit 7
ORER RXI request RXI interrupt handler reads data in RDR and clears RDRF flag to 0 1 frame RXI request Overrun error, ERI request
Figure 13.19 Example of SCI Receive Operation Transmitting and Receiving Serial Data Simultaneously (Synchronous Mode): Figure 13.20 shows a sample flowchart for transmitting and receiving serial data simultaneously and indicates the procedure to follow.
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Section 13 Serial Communication Interface
Initialize Start transmitting and receiving
1
Read TDRE flag in SSR No TDRE = 1? Yes Write transmit data in TDR and clear TDRE flag to 0 in SSR
2
Read ORER flag in SSR Yes 3 No Read RDRF flag in SSR No RDRF = 1? Yes Read receive data from RDR and clear RDRF flag to 0 in SSR Error handling 4
ORER = 1?
No
End of transmitting and receiving? Yes Clear TE and RE bits to 0 in SCR
5
1. SCI initialization: the transmit data output function of the TxD pin and receive data input function of the RxD pin are selected, enabling simultaneous transmitting and receiving. 2. SCI status check and transmit data write: read SSR, check that the TDRE flag is 1, then write transmit data in TDR and clear the TDRE flag to 0. Notification that the TDRE flag has changed from 0 to 1 can also be given by the TXI interrupt. 3. Receive error handling: if a receive error occurs, read the ORER flag in SSR, then after executing the necessary error handling, clear the ORER flag to 0. Neither transmitting nor receiving can resume while the ORER flag remains set to 1. 4. SCI status check and receive data read: read SSR, check that the RDRF flag is 1, then read receive data from RDR and clear the RDRF flag to 0. Notification that the RDRF flag has changed from 0 to 1 can also be given by the RXI interrupt. 5. To continue transmitting and receiving serial data: check the RDRF flag, read RDR, and clear the RDRF flag to 0 before the MSB (bit 7) of the current frame is received. Also check that the TDRE flag is set to 1, indicating that data can be written, write data in TDR, then clear the TDRE flag to 0 before the MSB (bit 7) of the current frame is transmitted. When the DMAC is activated by a transmit-data-empty interrupt request (TXI) to write data in TDR, the TDRE flag is checked and cleared automatically. When the DMAC is activated by a receivedata-full interrupt request (RXI) to read RDR, the RDRF flag is cleared automatically.
End Note: When switching from transmitting or receiving to simultaneous transmitting and receiving, clear both the TE bit and the RE bit to 0, then set both bits to 1.
Figure 13.20 Sample Flowchart for Serial Transmitting
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Section 13 Serial Communication Interface
13.4
SCI Interrupts
The SCI has four interrupt request sources: TEI (transmit-end interrupt), ERI (receive-error interrupt), RXI (receive-data-full interrupt), and TXI (transmit-data-empty interrupt). Table 13.12 lists the interrupt sources and indicates their priority. These interrupts can be enabled and disabled by the TIE, TEIE, and RIE bits in SCR. Each interrupt request is sent separately to the interrupt controller. The TXI interrupt is requested when the TDRE flag is set to 1 in SSR. The TEI interrupt is requested when the TEND flag is set to 1 in SSR. The TXI interrupt request can activate the DMAC to transfer data. Data transfer by the DMAC automatically clears the TDRE flag to 0. The TEI interrupt request cannot activate the DMAC. The RXI interrupt is requested when the RDRF flag is set to 1 in SSR. The ERI interrupt is requested when the ORER, PER, or FER flag is set to 1 in SSR. The RXI interrupt request can activate the DMAC to transfer data. Data transfer by the DMAC automatically clears the RDRF flag to 0. The ERI interrupt request cannot activate the DMAC. The DMAC can be activated by interrupts from SCI channel 0. Table 13.12 SCI Interrupt Sources
Interrupt ERI RXI TXI TEI Description Receive error (ORER, FER, or PER) Receive data register full (RDRF) Transmit data register empty (TDRE) Transmit end (TEND) Low Priority High
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Section 13 Serial Communication Interface
13.5
Usage Notes
Note the following points when using the SCI. TDR Write and TDRE Flag The TDRE flag in SSR is a status flag indicating the loading of transmit data from TDR into TSR. The SCI sets the TDRE flag to 1 when it transfers data from TDR to TSR. Data can be written into TDR regardless of the state of the TDRE flag. If new data is written in TDR when the TDRE flag is 0, the old data stored in TDR will be lost because this data has not yet been transferred to TSR. Before writing transmit data in TDR, be sure to check that the TDRE flag is set to 1. Simultaneous Multiple Receive Errors Table 13.13 indicates the state of SSR status flags when multiple receive errors occur simultaneously. When an overrun error occurs the RSR contents are not transferred to RDR, so receive data is lost. Table 13.13 SSR Status Flags and Transfer of Receive Data
SSR Status Flags RDRF 1 0 0 1 1 0 1 ORER 1 0 0 1 1 0 1 FER 0 1 0 1 0 1 1 PER 0 0 1 0 1 1 1 Receive Data Transfer RSR RDR x O O x x O x
Receive Errors Overrun error Framing error Parity error Overrun error + framing error Overrun error + parity error Framing error + parity error Overrun error + framing error + parity error
Legend: O: Receive data is transferred from RSR to RDR. x: Receive data is not transferred from RSR to RDR.
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Section 13 Serial Communication Interface
Break Detection and Processing Break signals can be detected by reading the RxD pin directly when a framing error (FER) is detected. In the break state the input from the RxD pin consists of all 0s, so the FER flag is set and the parity error flag (PER) may also be set. In the break state the SCI receiver continues to operate, so if the FER flag is cleared to 0 it will be set to 1 again. Sending a Break Signal When the TE bit is cleared to 0 the TxD pin becomes an I/O port, the level and direction (input or output) of which are determined by DR and DDR bits. This feature can be used to send a break signal. After the serial transmitter is initialized, the DR value substitutes for the mark state until the TE bit is set to 1 (the TxD pin function is not selected until the TE bit is set to 1). The DDR and DR bits should therefore both be set to 1 beforehand. To send a break signal during serial transmission, clear the DR bit to 0, then clear the TE bit to 0. When the TE bit is cleared to 0 the transmitter is initialized, regardless of its current state, so the TxD pin becomes an output port outputting the value 0. Receive Error Flags and Transmitter Operation (Synchronous Mode Only) When a receive error flag (ORER, PER, or FER) is set to 1 the SCI will not start transmitting, even if the TDRE flag is cleared to 0. Be sure to clear the receive error flags to 0 when starting to transmit. Note that clearing the RE bit to 0 does not clear the receive error flags to 0. Receive Data Sampling Timing in Asynchronous Mode and Receive Margin In asynchronous mode the SCI operates on a base clock with 16 times the bit rate frequency. In receiving, the SCI synchronizes internally with the fall of the start bit, which it samples on the base clock. Receive data is latched at the rising edge of the eighth base clock pulse. See figure 13.21.
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Section 13 Serial Communication Interface
16 clocks 8 clocks 0 Internal base clock 7 15 0 7 15 0
Receive data (RxD)
Start bit
D0
D1
Synchronization sampling timing
Data sampling timing
Figure 13.21 Receive Data Sampling Timing in Asynchronous Mode The receive margin in asynchronous mode can therefore be expressed as in equation (1).
M = (0.5 - 1 2N ) - (L - 0.5) F - D - 0.5 N (1 + F) x 100% ................... (1)
M: N: D: L: F:
Receive margin (%) Ratio of clock frequency to bit rate (N = 16) Clock duty cycle (D = 0 to 1.0) Frame length (L = 9 to 12) Absolute deviation of clock frequency
From equation (1), if F = 0 and D = 0.5 the receive margin is 46.875%, as given by equation (2).
D = 0.5, F = 0 M = {0.5 - 1/(2 x 16)} x 100% = 46.875% ............................................................................................. (2)
This is a theoretical value. A reasonable margin to allow in system designs is 20% to 30%. Restrictions on Usage of DMAC To have the DMAC read RDR, be sure to select the SCI receive-data-full interrupt (RXI) as the activation source with bits DTS2 to DTS0 in DTCR.
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Section 13 Serial Communication Interface
Restrictions on Usage of the Serial Clock When transmitting data using an external clock as the serial clock, an interval of at least 5 states is necessary between clearing the TDRE bit in SSR and the start (falling edge) of the first transmit clock pulse corresponding to each frame (see figure 13.22). This condition is also needed for continuous transmission. If it is not fulfilled, operational error will occur.
SCK t* TDRE t*
TXD
X0
X1
X2
X3
X4
X5
X6
X7
Y0
Y1
Y2
Y3
Continuous transmission
Note: * Ensure that t 5 states.
Figure 13.22 Serial Clock Transmission (Example)
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Section 13 Serial Communication Interface
Switching SCK Pin to Port Output Pin in Synchronous Mode When the SCK pin is used as the serial clock output in synchronous mode, and is then switched to its output port function at the end of transmission, a low level may be output for one half-cycle. Half-cycle low-level output occurs when SCK is switched to its port function with the following settings when DDR = 1, DR = 1, C/A = 1, CKE1 = 0, CKE0 = 0, and TE = 1. 1. End of serial data transmission 2. TE bit = 0 3. C/A bit = 0 ... switchover to port output 4. Occurrence of low-level output (see figure 13.23)
Half-cycle low-level output SCK/port 1. End of transmission Data TE C/A CKE1 CKE0 Bit 6 Bit 7 2. TE = 0 4. Low-level output
3. C/A = 0
Figure 13.23 Operation when Switching from SCK Pin to Port Pin
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Section 13 Serial Communication Interface
Sample Procedure for Preventing Low-Level Output As this sample procedure temporarily places the SCK pin in the input state, the SCK/port pin should be pulled up beforehand with an external circuit. With DDR = 1, DR = 1, C/A = 1, CKE1 = 0, CKE0 = 0, and TE = 1, make the following settings in the order shown. 1. End of serial data transmission 2. TE bit = 0 3. CKE1 bit = 1 4. C/A bit = 0 ... switchover to port output 5. CKE1 bit = 0
High-level output SCK/port 1. End of transmission Data TE C/A 3. CKE1 = 1 CKE1 CKE0 5. CKE1 = 0 Bit 6 Bit 7 2. TE = 0
4. C/A = 0
Figure 13.24 Operation when Switching from SCK Pin Function to Port Pin Function (Example of Preventing Low-Level Output)
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Section 14 Smart Card Interface
Section 14 Smart Card Interface
14.1 Overview
As an extension of its serial communication interface functions, SCI0 supports a smart card (IC card) interface conforming to the ISO/IEC7816-3 (Identification Card) standard. Switchover between normal serial communication and the smart card interface is controlled by a register setting. 14.1.1 Features
Features of the smart-card interface supported by the H8/3048B Group are listed below. * Asynchronous communication Data length: 8 bits Parity bits generated and checked Error signal output in receive mode (parity error) Error signal detect and automatic data retransmit in transmit mode Supports both direct convention and inverse convention * Built-in baud rate generator with selectable bit rates * Three types of interrupts Transmit-data-empty, receive-data-full, and receive-error interrupts are requested independently. The transmit-data-empty and receive-data-full interrupts can activate the DMA controller (DMAC) to transfer data.
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Section 14 Smart Card Interface
14.1.2
Block Diagram
Figure 14.1 shows a block diagram of the smart card interface.
Bus interface
Module data bus
Internal data bus
RDR
TDR
RxD0
RSR
TSR
SCMR SSR SCR SMR Transmit/receive control
BRR /4 Baud rate generator Clock /16 /64
TxD0
Parity generate Parity check
SCK0 TXI RXI ERI Legend: SCMR: Smart card mode register RSR: Receive shift register RDR: Receive data register Transmit shift register TSR: TDR: Transmit data register SMR: Serial mode register SCR: Serial control register SSR: Serial status register BRR: Bit rate register
Figure 14.1 Smart Card Interface Block Diagram
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Section 14 Smart Card Interface
14.1.3
Input/Output Pins
Table 14.1 lists the smart card interface pins. Table 14.1 Smart Card Interface Pins
Name Serial clock pin Receive data pin Transmit data pin Abbreviation SCK0 RxD0 TxD0 I/O Output Input Output Function Clock output Receive data input Transmit data output
14.1.4
Register Configuration
The smart card interface has the internal registers listed in table 14.2. BRR, TDR, and RDR have their normal serial communication interface functions, as described in section 13, Serial Communication Interface. Table 14.2 Registers
Address* H'FFB0 H'FFB1 H'FFB2 H'FFB3 H'FFB4 H'FFB5 H'FFB6
1
Name Serial mode register Bit rate register Serial control register Transmit data register Serial status register Receive data register Smart card mode register
Abbreviation SMR BRR SCR TDR SSR RDR SCMR
R/W R/W R/W R/W R/W
2 R/(W)*
Initial Value H'00 H'FF H'00 H'FF F'84 H'00 H'F2
R R/W
Notes: 1. Lower 16 bits of the address. 2. Only 0 can be written, to clear flags.
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Section 14 Smart Card Interface
14.2
Register Descriptions
This section describes the new or modified registers and bit functions in the smart card interface. 14.2.1 Smart Card Mode Register (SCMR)
SCMR is an 8-bit readable/writable register that selects smart card interface functions.
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 SDIR 0 R/W 2 SINV 0 R/W 1 1 0 SMIF 0 R/W
Reserved bits Smart card interface mode select Enables or disables the smart card interface function Smart card data invert Inverts data logic levels Smart card data transfer direction Selects the serial/parallel conversion format
Reserved bits
SCMR is initialized to H'F2 by a reset and in standby mode. Bits 7 to 4--Reserved: Read-only bits, always read as 1. Bit 3--Smart Card Data Transfer Direction (SDIR): Selects the serial/parallel conversion format.
Bit 3: SDIR 0 1 Description TDR contents are transmitted LSB-first Received data is stored LSB-first in RDR TDR contents are transmitted MSB-first Received data is stored MSB-first in RDR (Initial value)
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Section 14 Smart Card Interface
Bit 2--Smart Card Data Inverter (SINV): Inverts data logic levels. This function is used in combination with bit 3 to communicate with inverse-convention cards. SINV does not affect the logic level of the parity bit. For parity settings, see section 14.3.4, Register Settings.
Bit 2: SINV 0 1 Description Unmodified TDR contents are transmitted Received data is stored unmodified in RDR Inverted TDR contents are transmitted Received data is inverted before storage in RDR (Initial value)
Bit 1--Reserved: Read-only bit, always read as 1. Bit 0--Smart Card Interface Mode Select (SMIF): Enables the smart card interface function.
Bit 0: SMIF 0 1 Description Smart card interface function is disabled Smart card interface function is enabled (Initial value)
14.2.2
Serial Status Register (SSR)
The function of SSR bit 4 is modified in the smart card interface. This change also causes a modification to the setting conditions for bit 2 (TEND).
Bit Initial value Read/Write 7 TDRE 1 R/(W)* 6 RDRF 0 R/(W)* 5 ORER 0 R/(W)* 4 ERS 0 R/(W)* 3 PER 0 R/(W)* 2 TEND 1 R 1 MPB 0 R 0 MPBT 0 R/W
Transmit end Status flag indicating end of transmission Error signal status (ERS) Status flag indicating that an error signal has been received Note: * Only 0 can be written, to clear the flag.
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Section 14 Smart Card Interface
Bits 7 to 5: These bits operate as in normal serial communication. For details see section 13, Serial Communication Interface. Bit 4--Error Signal Status (ERS): In smart card interface mode, this flag indicates the status of the error signal sent from the receiving device to the transmitting device. The smart card interface does not detect framing errors.
Bit 4: ERS 0 Description Indicates normal data transmission, with no error signal returned (Initial value) [Clearing conditions] The chip is reset or enters standby mode. Software reads ERS while it is set to 1, then writes 0. 1 Indicates that the receiving device sent an error signal reporting a parity error [Setting condition] A low error signal was sampled. Note: Clearing the TE bit to 0 in SCR does not affect the ERS flag, which retains its previous value.
Bits 3 to 0: These bits operate as in normal serial communication. For details see section 13, Serial Communication Interface. The setting conditions for transmit end (TEND, bit 2), however, are modified as follows.
Bit 2: TEND 0 Description Transmission is in progress [Clearing conditions] Software reads TDRE while it is set to 1, then writes 0 in the TDRE flag. The DMAC writes data in TDR. 1 End of transmission [Setting conditions] The chip is reset or enters standby mode. The TE bit and FER/ERS bit are both cleared to 0 in SCR. TDRE is 1 and FER/ERS is 0 at a time 2.5 etu after the last bit of a 1-byte serial character is transmitted (normal transmission) Note: An etu (elementary time unit) is the time needed to transmit one bit. (Initial value)
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Section 14 Smart Card Interface
14.2.3
Serial Mode Register (SMR)
Bit 7 of SMR has a different function in smart card interface mode. The related serial control register (SCR) changes from bit 1 to bit 0. However, this function does not exist in the flash memory version.
Bit Initial value Read/Write 7 GM 0 R/W 6 CHR 0 R/W 5 PE 0 R/W 4 O/E 0 R/W 3 STOP 0 R/W 2 MP 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W
Bit 7--GSM Mode (GM): Set at 0 when using the regular smart card interface. In GSM mode, set to 1. When transmission is complete, initially the TEND flag set timing appears followed by clock output restriction mode. Clock output restriction mode comprises serial control register bit 1 and bit 0.
Bit 7: GM 0 Description Using the regular smart card interface mode * * 1 * * The TEND flag is set 12.5 etu after the beginning of the start bit Clock output on/off control only The TEND flag is set 11.0 etu after the beginning of the start bit Clock output on/off and fixed-high/fixed-low control (set by SCR) (Initial value)
Using the GSM mode smart card interface mode
Bits 6 to 0--Operate in the same way as for the normal SCI. For details, see section 13.2.5, Serial Mode Register (SMR).
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Section 14 Smart Card Interface
14.2.4
Serial Control Register (SCR)
Bits 1 and 0 have different functions in smart card interface mode. However, this function does not exist in the flash memory version.
Bit Initial value Read/Write 7 TIE 0 R/W 6 RIE 0 R/W 5 TE 0 R/W 4 RE 0 R/W 3 MPIE 0 R/W 2 TEIE 0 R/W 1 CKE1 0 R/W 0 CKE0 0 R/W
Bits 7 to 2--Operate in the same way as for the normal SCI. For details, see section 13.2.6, Serial Control Register (SCR). Bits 1 and 0--Clock Enable (CKE1, CKE0): Setting enable or disable for the SCI clock selection and clock output from the SCK pin. In smart card interface mode, it is possible to switch between enabling and disabling of the normal clock output, and specify a fixed high level or fixed low level for the clock output.
SMR Bit 7: GM 0 0 1 1 1 1 Bit 1: CKE1 0 0 0 0 1 1 SCR Bit 0: CKE0 0 1 0 1 0 1 Description The internal clock/SCK0 pin functions as an I/O port The internal clock/SCK0 pin is fixed at low-level output The internal clock/SCK0 pin functions as the clock output The internal clock/SCK0 pin is fixed at high-level output The internal clock/SCK0 pin functions as the clock output (Initial value)
The internal clock/SCK0 pin functions as the clock output
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Section 14 Smart Card Interface
14.3
14.3.1
Operation
Overview
The main features of the smart-card interface are as follows. * One frame consists of eight data bits and a parity bit. * In transmitting, a guard time of at least two elementary time units (2 etu) is provided between the end of the parity bit and the start of the next frame. (An elementary time unit is the time required to transmit one bit.) * In receiving, if a parity error is detected, a low error signal is output for 1 etu, beginning 10.5 etu after the start bit. * In transmitting, if an error signal is received, after at least 2 etu, the same data is automatically transmitted again. * Only asynchronous communication is supported. There is no synchronous communication function. 14.3.2 Pin Connections
Figure 14.2 shows a pin connection diagram for the smart card interface. In communication with a smart card, data is transmitted and received over the same signal line. The TxD0 and RxD0 pins should both be connected to this line. The data transmission line should be pulled up to VCC through a resistor. If the smart card uses the clock generated by the smart card interface, connect the SCK0 output pin to the card's CLK input. If the card uses its own internal clock, this connection is unnecessary. The reset signal should be output from one of the H8/3048B Group's generic ports. In addition to these pin connections, power and ground connections will normally also be necessary.
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Section 14 Smart Card Interface
VCC
TxD0 RxD0 SCK0 Clock line Px (port) H8/3048B Group Reset line Data line
I/O
CLK RST Smart card
Card-processing device
Figure 14.2 Smart Card Interface Connection Diagram Note: A loop-back test can be performed by setting both RE and TE to 1 without connecting a smart card. 14.3.3 Data Format
Figure 14.3 shows the data format of the smart card interface. In receive mode, parity is checked once per frame. If a parity error is detected, an error signal is returned to the transmitting device to request retransmission. In transmit mode, the error signal is sampled and the same data is retransmitted if the error signal is low.
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Section 14 Smart Card Interface
No parity error Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
Output from transmitting device
Parity error Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp DE
Output from transmitting device Output from receiving device Start bit Data bits Parity bit Error signal
Legend: Ds: D0 to D7: Dp: DE:
Figure 14.3 Smart Card Interface Data Format The operating sequence is as follows. 1. When not in use, the data line is in the high-impedance state, and is pulled up to the high level through a resistor. 2. To start transmitting a frame of data, the transmitting device transmits a low start bit (Ds), followed by eight data bits (D0 to D7) and a parity bit (Dp). 3. Next, in the smart card interface, the transmitting device returns the data line to the highimpedance state. The data line is pulled up to the high level through a resistor. 4. The receiving device performs a parity check. If there is no parity error, the receiving device waits to receive the next data. If a parity error is present, the receiving device outputs a low error signal (DE) to request retransmission of the data. After outputting the error signal for a designated interval, the receiving device returns the signal line to the high-impedance state. The signal line is pulled back up to the high level through the pull-up resistor. 5. If the transmitting device does not receive an error signal, it proceeds to transmit the next data. If it receives an error signal, it returns to step 2 and transmits the same data again.
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Section 14 Smart Card Interface
14.3.4
Register Settings
Table 14.3 shows a bit map of the registers used in the smart card interface. Bits indicated as 0 or 1 should always be set to the indicated value. The settings of the other bits will be described in this section. Table 14.3 Register Settings in Smart Card Interface
Register SMR BRR SCR TDR SSR RDR SCMR Address* H'FFB0 H'FFB1 H'FFB2 H'FFB3 H'FFB4 H'FFB5 H'FFB6
1
Bit 7 GM BRR7 TIE TDR7 TDRE RDR7 --
Bit 6 0 BRR6 RIE TDR6 RDRF RDR6 --
Bit 5 1 BRR5 TE TDR5 ORER RDR5 --
Bit 4 O/E BRR4 RE TDR4 ERS RDR4 --
Bit 3 1 BRR3 0 TDR3 PER RDR3 SDIR
Bit 2 0 BRR2 0 TDR2 TEND RDR2 SINV
Bit 1 CKS1
Bit 0 CKS0
BRR1 BRR0 2 CKE1* CKE0 TDR1 0 RDR1 -- TDR0 0 RDR0 SMIF
Legend: --: Unused bit. Notes: 1. Lower 16 bits of the address. 2. When the GM of the SMR is set at 0, be sure the CKE1 bit is 0.
Serial Mode Register (SMR) Settings: In regular smart card interface mode, set the GM bit at 0. In regular smart card mode, clear the GM bit to 0. In GSM mode, set the GM bit to 1. Clear the O/E bit to 0 if the smart card uses the direct convention. Set the O/E bit to 1 if the smart card uses the inverse convention. Bits CKS1 and CKS0 select the clock source of the built-in baud rate generator. See section 14.3.5, Clock. Bit Rate Register (BRR) Settings: This register sets the bit rate. Equations for calculating the setting are given in section 14.3.5, Clock. Serial Control Register (SCR): The TIE, RIE, TE, and RE bits have their normal serial communication functions. For details, see section 13, Serial Communication Interface. The CKE1 and CKE0 bits select clock output. When the GM bit of the SMR is cleared to 0, to disable clock output, clear this bit to 00. To enable clock output, set this bit to 01. When the GM bit of the SMR is set to 1, clock output is enabled. Clock output is fixed at high or low. Smart Card Mode Register (SCMR): If the smart card follows the direct convention, clear the SDIR and SINV bits to 0. If the smart card follows the indirect convention, set the SDIR and SINV bits to 1. To use the smart card interface, set the SMIF bit to 1.
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Section 14 Smart Card Interface
The register settings and examples of starting character waveforms are shown below for two smart cards, one following the direct convention and one the inverse convention. * Direct convention (SDIR = SINV = O/E = 0)
(Z) A Z Z A Z Z Z A A Z (Z) State
Ds
D0
D1
D2
D3
D4
D5
D6
D7
Dp
In the direct convention, state Z corresponds to logic level 1, and state A to logic level 0. Characters are transmitted and received LSB-first. In the example above the first character data is H'3B. The parity bit is 1, following the even parity rule designated for smart cards. * Inverse convention (SDIR = SINV = O/E = 1)
(Z) A Z Z A A A A A A Z (Z) State
Ds
D7
D6
D5
D4
D3
D2
D1
D0
Dp
In the inverse convention, state A corresponds to the logic level 1, and state Z to the logic level 0. Characters are transmitted and received MSB-first. In the example above the first character data is H'3F. Following the even parity rule designated for smart cards, the parity bit logic level is 0, corresponding to state Z. In the H8/3048B Group, the SINV bit inverts only the data bits D7 to D0. The parity bit is not inverted, so the O/E bit in SMR must be set to odd parity mode. This applies in both transmitting and receiving.
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Section 14 Smart Card Interface
14.3.5
Clock
As its serial communication clock, the smart card interface can use only the internal clock generated by the on-chip baud rate generator. The bit rate can be selected by setting the bit rate register (BRR) and bits CKS1 and CKS0 in the serial mode register (SMR). The bit rate can be calculated from the equation given below. Table 14.5 lists some examples of bit rate settings. If bit CKE0 is set to 1, a clock signal with a frequency equal to 372 times the bit rate is output from the SCK0 pin.
B= 1488 x 22n-1 x (N + 1) x 106
where, N: B: : n:
BRR setting (0 N 255) Bit rate (bits/s) System clock frequency (MHz)* See table 14.4
Table 14.4 n-Values of CKS1 and CKS0 Settings
n 0 1 2 3 CKS1 0 0 1 1 CKS0 0 1 0 1
Note: * If the gear function is used to divide the system clock frequency, use the divided frequency to calculate the bit rate. The equation above applies directly to 1/1 frequency division. Table 14.5 Bit Rates (bits/s) for Different BRR Settings (when n = 0)
(MHz) N 0 1 2 7.1424 9600.0 4800.0 3200.0 10.00 10.7136 13.00 14.2848 16.00 18.00 20.00 25.00 13440.9 14400.0 17473.1 19200.0 21505.4 24193.5 26881.7 33602.2 6720.4 4480.3 7200.0 4800.0 8736.6 5824.4 9600.0 6400.0 10752.7 12096.8 13440.9 16801.1 7168.5 8064.5 8960.6 11200.7
Note: Bit rates are rounded off to one decimal place.
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Section 14 Smart Card Interface
The following equation calculates the bit rate register (BRR) setting from the system clock frequency and bit rate. N is an integer from 0 to 255, specifying the value with the smaller error.
N= 1488 x 22n-1 x B x 106 - 1
Table 14.6 BRR Settings for Typical Bit Rate (bits/s) (when n = 0)
(MHz) 7.1424 Bit/s 9600 N Error 0 0.00 10.00 N Error 1 30.00 10.7136 N Error 1 25.00 13.00 N Error 1 8.99 14.2848 N Error 1 0.00 16.00 N Error 1 12.01 18.00 N Error 2 15.99 20.00 N Error 2 6.66 25.00 N Error 3 12.49
Table 14.7 Maximum Bit Rates for Various Frequencies (Smart Card Interface)
(MHz) 7.1424 10.00 10.7136 13.00 14.2848 16.00 18.00 20.00 25.00 Maximum Bit Rate (bits/s) 9600 13441 14400 17473 19200 21505 24194 26882 33602 N 0 0 0 0 0 0 0 0 0 n 0 0 0 0 0 0 0 0 0
The bit rate error is calculated from the following equation.
Error (%) = 1488 x 22n-1 x B x (N + 1) x 106 - 1 x 100
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Section 14 Smart Card Interface
14.3.6
Transmitting and Receiving Data
Initialization Before transmitting or receiving data, initialize the smart card interface by the procedure below. Initialization is also necessary when switching from transmit mode to receive mode or from receive mode to transmit mode. 1. Clear the TE and RE bits to 0 in the serial control register (SCR). 2. Clear the ERS, PER, and ORER error flags to 0 in the serial status register (SSR). 3. Set the parity mode bit (O/E) and baud rate generator clock source select bits (CKS1 and CKS0) as required in the serial mode register (SMR). At the same time, clear the C/A, CHR, and MP bits to 0, and set the STOP and PE bits to 1. 4. Set the SMIF, SDIR, and SINV bits as required in the smart card mode register (SCMR). When the SMIF bit is set to 1, the TxD0 and RxD0 pins switch from their I/O port functions to their serial communication interface functions, and are placed in the high-impedance state. 5. Set a value corresponding to the desired bit rate in the bit rate register (BRR). 6. Set clock enable bit 0 (CKE0) as required in the serial control register (SCR). Write 0 in the TIE, RIE, TE, RE, MPIE, TEIE, and CKE1 bits. If bit CKE0 is set to 1, a serial clock will be output from the SCK0 pin. 7. Wait for at least the interval required to transmit or receive one bit, then set the TIE, RIE, TE, and RE bits as necessary in SCR. Do not set TE and RE both to 1, except when performing a loop-back test.
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Section 14 Smart Card Interface
Transmitting Serial Data The transmitting procedure in smart card mode is different from the normal SCI procedure, because of the need to sample the error signal and retransmit. Figure 14.4 shows a flowchart for transmitting, and figure 14.5 shows the relation between a transmit operation and the internal registers. 1. Initialize the smart card interface by the procedure given above in Initialization. 2. Check that the ERS error flag is cleared to 0 in SSR. 3. Check that the TEND flag is set to 1 in SSR. Repeat steps 2 and 3 until this check passes. 4. Write transmit data in TDR and clear the TDRE flag to 0. The data will be transmitted and the TEND flag will be cleared to 0. 5. To continue transmitting data, return to step 2. 6. To terminate transmission, clear the TE bit to 0. This procedure may include interrupt handling and DMA transfer. If the TIE bit is set to 1 to enable interrupt requests, when transmission is completed and the TEND flag is set to 1, a transmit-data-empty interrupt (TXI) is requested. If the RIE bit is set to 1 to enable interrupt requests, when a transmit error occurs and the ERS flag is set to 1, a transmit/receive-error interrupt (ERI) is requested. The timing of TEND flag setting depends on the GM bit in SMR. The timing is shown in figure 14.6. If the TXI interrupt activates the DMAC, the number of bytes designated in the DMAC can be transmitted automatically, including automatic retransmit. For details, see Interrupt Operations and Data Transfer by DMAC in this section.
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Section 14 Smart Card Interface
Start Initialize Start transmitting
No
FER/ERS = 0 ?
Yes
Error handling
No
TEND = 1 ?
Yes
Write data in TDR and clear TDRE flag to 0 in SSR
No
All data transmitted ?
Yes
FER/ERS = 0 ?
Yes
No
Error handling
No
TEND = 1 ?
Yes
Clear TE bit to 0 End
Figure 14.4 Transmit Flowchart (Example)
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Section 14 Smart Card Interface
TDR (1) Data write (2) Transfer from TDR to TSR (3) Serial data output Data 1 Data 1 Data 1
TSR (shift register)
Data 1
; Data remains in TDR Data 1 I/O signal line output
In case of normal transmission: TEND flag is set In case of transmit error: ERS flag is set Steps (2) and (3) above are repeated until the TEND flag is set Note: When the ERS flag is set, it should be cleared until transfer of the last bit (D7 in LSB-first transmission, D0 in MSB-first transmission) of the next transfer data to be transmitted has been completed.
Figure 14.5 Relation Between Transmit Operation and Internal Registers
I/O data
Ds
Da
Db
Dc
Dd
De
Df
Dg
Dh
Dp
DE
Guard time TXI (TEND interrupt) 12.5 etu When GM = 0
11.0 etu When GM = 1
Figure 14.6 TEND Flag Occurrence Timing
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Section 14 Smart Card Interface
Receiving Serial Data The receiving procedure in smart card mode is the same as the normal SCI procedure. Figure 14.7 shows a flowchart for receiving. 1. Initialize the smart card interface by the procedure given in Initialization at the beginning of this section. 2. Check that the ORER and PER error flags are cleared to 0 in SSR. If either flag is set, carry out the necessary error handling, then clear both the ORER and PER flags to 0. 3. Check that the RDRF flag is set to 1. Repeat steps 2 and 3 until this check passes. 4. Read receive data from RDR. 5. To continue receiving data, clear the RDRF flag to 0 and return to step 2. 6. To terminate receiving, clear the RE bit to 0.
Start Initialize Start receiving
ORER = 0 and PER = 0 ?
Yes
No
Error handling
No
RDRF = 1 ?
Yes
Read RDR and clear RDRF flag to 0 in SSR
No
All data received ?
Yes
Clear RE bit to 0
Figure 14.7 Receive Flowchart (Example)
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Section 14 Smart Card Interface
This procedure may include interrupt handling and DMA transfer. If the RIE bit is set to 1 to enable interrupt requests, when receiving is completed and the RDRF flag is set to 1, a receive-data-full interrupt (RXI) is requested. If a receive error occurs, either the ORER or PER flag is set to 1 and a transmit/receive-error interrupt (ERI) is requested. If the RXI interrupt activates the DMAC, the number of bytes designated in the DMAC will be transferred, skipping receive data in which an error occurred. For details, see Interrupt Operations and Data Transfer by DMAC below. When a parity error occurs and PER is set to 1, the receive data is transferred to RDR, so the erroneous data can be read. Switching Modes To switch from receive mode to transmit mode, check that receiving operations have completed, then initialize the smart card interface, clearing RE to 0 and setting TE to 1. Completion of receive operations is indicated by the RDRF, PER, or ORER flag. To switch from transmit mode to receive mode, check that transmitting operations have completed, then initialize the smart card interface, clearing TE to 0 and setting RE to 1. Completion of transmit operations can be verified from the TEND flag. Fixing Clock Output When the GM bit of the SMR is set to 1, clock output is fixed by CKE1 and CKE0 of SCR. In this case, the clock pulse can be set at minimum value. Figure 14.8 shows clock output fixed timing: CKE0 is restricted with GM = 1 and CKE1 = 1.
Specified pulse width CKE1 value Specified pulse width
SCK
SCR write (CKE0 = 0)
SCR write (CKE0 = 1)
Figure 14.8 Clock Output Fixed Timing
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Section 14 Smart Card Interface
Interrupt Operations The smart card interface has three interrupt sources: transmit-data-empty (TXI), transmit/receiveerror (ERI), and receive-data-full (RXI). The transmit-end interrupt request (TEI) is not available in smart card mode. A TXI interrupt is requested when the TEND flag is set to 1 in SSR. An RXI interrupt is requested when the RDRF flag is set to 1 in SSR. An ERI interrupt is requested when the ORER, PER, or ERS flag is set to 1 in SSR. These relationships are shown in table 14.8. Table 14.8 Smart Card Mode Operating States and Interrupt Sources
Operating State Transmit mode Receive mode Normal operation Error Normal operation Error Flag TEND ERS RDRF PER, ORER Mask Bit TIE RIE RIE RIE Interrupt Source TXI ERI RXI ERI DMAC Activation Available Not available Available Not available
Data Transfer by DMAC The DMAC can be used to transmit and receive in smart card mode, as in normal SCI operations. In transmit mode, when the TEND flag is set to 1 in SSR, the TDRE flag is set simultaneously, generating a TXI interrupt. If TXI is designated in advance as a DMAC activation source, the DMAC will be activated by the TXI request and will transfer the next transmit data. This data transfer by the DMAC automatically clears the TDRE and TEND flags to 0. When an error occurs, the SCI automatically retransmits the same data, keeping TEND cleared to 0 so that the DMAC is not activated. The SCI and DMAC will therefore automatically transmit the designated number of bytes, including retransmission when an error occurs. When an error occurs the ERS flag is not cleared automatically, so the RIE bit should be set to 1 to enable the error to generate an ERI request, and the ERI interrupt handler should clear ERS. When using the DMAC to transmit or receive, first set up and enable the DMAC, then make SCI settings. DMAC settings are described in section 8, DMA Controller. In receive operations, when the RDRF flag is set to 1 in SSR, an RXI interrupt is requested. If RXI is designated in advance as a DMAC activation source, the DMAC will be activated by the RXI request and will transfer the received data. This data transfer by the DMAC automatically clears the RDRF flag to 0. When an error occurs, the RDRF flag is not set and an error flag is set instead. The DMAC is not activated. The ERI interrupt request is directed to the CPU. The ERI interrupt handler should clear the error flags.
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Section 14 Smart Card Interface
Examples of Operation in GSM Mode When switching between smart card interface mode and software standby mode, use the following procedures to maintain the clock duty cycle. * Switching from smart card interface mode to software standby mode 1. Set the P94 data register (DR) and data direction register (DDR) to the values for the fixed output state in software standby mode. 2. Write 0 to the TE and RE bits in the serial control register (SCR) to stop transmit/receive operations. At the same time, set the CKE1 bit to the value for the fixed output state in software standby mode. 3. Write 0 to the CKE0 bit in SCR to stop the clock. 4. Wait for one serial clock cycle. During this period, the duty cycle is preserved and clock output is fixed at the specified level. 5. Write H'00 to the serial mode register (SMR) and smart card mode register (SCMR). 6. Make the transition to the software standby state. * Returning from software standby mode to smart card interface mode 1. Clear the software standby state. 2. Set the CKE1 bit in SCR to the value for the fixed output state at the start of software standby (the current P94 pin state). 3. Set smart card interface mode and output the clock. Clock signal generation is started with the normal duty cycle.
Software standby mode
Normal operation
Normal operation
(1)(2)(3)
(4) (5)(6)
(1) (2)(3)
Figure 14.9 Procedure for Stopping and Restarting the Clock
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Section 14 Smart Card Interface
Use the following procedure to secure the clock duty cycle after powering on. 1. The initial state is port input and high impedance. Use pull-up or pull-down resistors to fix the potential. 2. Fix at the output specified by the CKE1 bit in SCR. 3. Set SMR and SCMR, and switch to smart card interface mode operation. 4. Set the CKE0 bit in SCR to 1 to start clock output.
14.4
Usage Notes
When using the SCI as a smart card interface, note the following points. Receive Data Sampling Timing in Smart Card Mode and Receive Margin In smart card mode the SCI operates on a base clock with 372 times the bit rate frequency. In receiving, the SCI synchronizes internally with the fall of the start bit, which it samples on the base clock. Receive data is latched at the rising edge of the 186th base clock pulse. See figure 14.10.
372 clocks 186 clocks 0 185 371 0 185 371 0
Internal base clock
Receive data (RxD)
Start bit
D0
D1
Synchronization sampling timing
Data sampling timing
Figure 14.10 Receive Data Sampling Timing in Smart Card Mode
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Section 14 Smart Card Interface
The receive margin can therefore be expressed as follows. Receive margin in smart card mode:
M= 0.5 - 1 2N - (L - 0.5) F - D - 0.5 N (1 + F) x 100%
M: Receive margin (%) N: Ratio of clock frequency to bit rate (N = 372) D: Clock duty cycle (D = 0 to 1.0) L: Frame length (L = 10) F: Absolute deviation of clock frequency
From this equation, if F = 0 and D = 0.5 the receive margin is as follows.
D = 0.5, F = 0 M = {0.5 - 1/(2 x 372)} x 100% = 49.866%
Retransmission Retransmission is described below for the separate cases of transmit mode and receive mode. * Retransmission when SCI is in Receive Mode (see figure 14.11) (1) The SCI checks the received parity bit. If it detects an error, it automatically sets the PER flag to 1. If the RIE bit in SCR is set to the enable state, an ERI interrupt is requested. The PER flag should be cleared to 0 in SSR before the next parity bit sampling timing. (2) The RDRF bit in SSR is not set to 1 for the error frame. (3) If an error is not detected when the parity bit is checked, the PER flag is not set in SSR. (4) If an error is not detected when the parity bit is checked, receiving operations are assumed to have ended normally, and the RDRF bit is automatically set to 1 in SSR. If the RIE bit in SCR is set to the enable state, an RXI interrupt is requested. If RXI is enabled as a DMA transfer activation source, the RDR contents can be read automatically. When the DMAC reads the RDR data, it automatically clears RDRF to 0. (5) When a normal frame is received, at the error signal transmit timing, the data pin is held in the high-impedance state.
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Section 14 Smart Card Interface
Frame n
Retransmitted frame (DE)
Frame n + 1
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
DE
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
Ds D0 D1 D2 D3 D4
RDRF (2) PER (1) (3) (4)
Figure 14.11 Retransmission in SCI Receive Mode * Retransmission when SCI is in Transmit Mode (see figure 14.12) (6) After transmitting one frame, if the receiving device returns an error signal, the SCI sets the ERS flag to 1 in SSR. If the RIE bit in SCR is set to the enable state, an ERI interrupt is requested. The ERS flag should be cleared to 0 in SSR before the next parity bit sampling timing. (7) The TEND bit in SSR is not set for the frame in which the error signal was received, indicating an error. (8) If no error signal is returned from the receiving device, the ERS flag is not set in SSR. (9) If no error signal is returned from the receiving device, transmission of the frame, including retransmission, is assumed to be complete, and the TEND bit is set to 1 in SSR. If the TIE bit in SCR is set to the enable state, a TXI interrupt is requested. If TXI is enabled as a DMA transfer activation source, the next data can be written in TDR automatically. When the DMAC writes data in TDR, it automatically clears the TDRE bit to 0.
Frame n Retransmitted frame (DE) Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp DE Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp Ds D0 D1 D2 D3 D4
Frame n + 1
TDRE Transfer from TDR to TSR TEND (7) ERS (6) (8) (9) Transfer from TDR to TSR Transfer from TDR to TSR
Figure 14.12 Retransmission in SCI Transmit Mode
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Section 15 A/D Converter
Section 15 A/D Converter
15.1 Overview
The H8/3048B Group includes a 10-bit successive-approximations A/D converter with a selection of up to eight analog input channels. When the A/D converter is not used, it can be halted independently to conserve power. For details see section 20.6, Module Standby Function. 15.1.1 Features
A/D converter features are listed below. * 10-bit resolution * Eight input channels * Selectable analog conversion voltage range The analog voltage conversion range can be programmed by input of an analog reference voltage at the VREF pin. * High-speed conversion Conversion time: Minimum 5.36 s per channel (with 25-MHz system clock) * Two conversion modes Single mode: A/D conversion of one channel Scan mode: continuous conversion on one to four channels * Four 16-bit data registers A/D conversion results are transferred for storage into data registers corresponding to the channels. * Sample-and-hold function * A/D conversion can be externally triggered * A/D interrupt requested at end of conversion At the end of A/D conversion, an A/D end interrupt (ADI) can be requested.
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Section 15 A/D Converter
15.1.2
Block Diagram
Figure 15.1 shows a block diagram of the A/D converter.
Module data bus
Bus interface ADDRC ADDRD ADDRA ADDRB ADCSR
Internal data bus
AVCC V REF AV SS 10-bit D/A
Successiveapproximations register
AN 0 AN 1 AN 2 AN 3 AN 4 AN 5 AN 6 AN 7 Analog multiplexer
+ - Comparator Control circuit Sample-andhold circuit /16 /8
ADCR
ADI ADTRG Legend: ADCR: ADCSR: ADDRA: ADDRB: ADDRC: ADDRD:
A/D control register A/D control/status register A/D data register A A/D data register B A/D data register C A/D data register D
Figure 15.1 A/D Converter Block Diagram
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Section 15 A/D Converter
15.1.3
Input Pins
Table 15.1 summarizes the A/D converter's input pins. The eight analog input pins are divided into two groups: group 0 (AN0 to AN3), and group 1 (AN4 to AN7). AVCC and AVSS are the power supply for the analog circuits in the A/D converter. VREF is the A/D conversion reference voltage. Table 15.1 A/D Converter Pins
Pin Name Analog power supply pin Analog ground pin Reference voltage pin Analog input pin 0 Analog input pin 1 Analog input pin 2 Analog input pin 3 Analog input pin 4 Analog input pin 5 Analog input pin 6 Analog input pin 7 A/D external trigger input pin Abbreviation AVCC AVSS VREF AN0 AN1 AN2 AN3 AN4 AN5 AN6 AN7 ADTRG I/O Input Input Input Input Input Input Input Input Input Input Input Input External trigger input for starting A/D conversion Group 1 analog inputs Function Analog power supply Analog ground and reference voltage Analog reference voltage Group 0 analog inputs
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Section 15 A/D Converter
15.1.4
Register Configuration
Table 15.2 summarizes the A/D converter's registers. Table 15.2 A/D Converter Registers
Address* H'FFE0 H'FFE1 H'FFE2 H'FFE3 H'FFE4 H'FFE5 H'FFE6 H'FFE7 H'FFE8 H'FFE9
1
Name A/D data register A (high) A/D data register A (low) A/D data register B (high) A/D data register B (low) A/D data register C (high) A/D data register C (low) A/D data register D (high) A/D data register D (low) A/D control/status register A/D control register
Abbreviation ADDRAH ADDRAL ADDRBH ADDRBL ADDRCH ADDRCL ADDRDH ADDRDL ADCSR ADCR
R/W R R R R R R R R R/(W)* R/W
2
Initial Value H'00 H'00 H'00 H'00 H'00 H'00 H'00 H'00 H'00
3 H'7E*
Notes: 1. Lower 16 bits of the address 2. Only 0 can be written in bit 7, to clear the flag. 3. Initial value is H'7F in mask ROM versions, PROM versions, and dual power supply flash memory versions.
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Section 15 A/D Converter
15.2
15.2.1
Bit ADDRn
Register Descriptions
A/D Data Registers A to D (ADDRA to ADDRD)
15 0 R 14 0 R 13 0 R 12 0 R 11 0 R 10 0 R 9 0 R 8 0 R 7 0 R 6 0 R 5 0 R 4 0 R 3 0 R 2 0 R 1 0 R 0 0 R
AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0
Initial value Read/Write (n = A to D)
A/D conversion data 10-bit data giving an A/D conversion result
Reserved bits
The four A/D data registers (ADDRA to ADDRD) are 16-bit read-only registers that store the results of A/D conversion. An A/D conversion produces 10-bit data, which is transferred for storage into the A/D data register corresponding to the selected channel. The upper 8 bits of the result are stored in the upper byte of the A/D data register. The lower 2 bits are stored in the lower byte. Bits 5 to 0 of an A/D data register are reserved bits that are always read as 0. Table 15.3 indicates the pairings of analog input channels and A/D data registers. The CPU can always read and write the A/D data registers. The upper byte can be read directly, but the lower byte is read through a temporary register (TEMP). For details see section 15.3, CPU Interface. The A/D data registers are initialized to H'0000 by a reset and in standby mode. Table 15.3 Analog Input Channels and A/D Data Registers
Analog Input Channel Group 0 AN0 AN1 AN2 AN3 Group 1 AN4 AN5 AN6 AN7 A/D Data Register ADDRA ADDRB ADDRC ADDRD
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Section 15 A/D Converter
15.2.2
Bit
A/D Control/Status Register (ADCSR)
7 ADF 0 R/(W)* 6 ADIE 0 R/W 5 ADST 0 R/W 4 SCAN 0 R/W 3 CKS 0 R/W 2 CH2 0 R/W 1 CH1 0 R/W 0 CH0 0 R/W
Initial value Read/Write
Channel select 2 to 0 These bits select analog input channels Clock select Selects the A/D conversion time Scan mode Selects single mode or scan mode A/D start Starts or stops A/D conversion A/D interrupt enable Enables and disables A/D end interrupts A/D end flag Indicates end of A/D conversion Note: * Only 0 can be written, to clear the flag.
ADCSR is an 8-bit readable/writable register that selects the mode and controls the A/D converter. ADCSR is initialized to H'00 by a reset and in standby mode. Bit 7--A/D End Flag (ADF): Indicates the end of A/D conversion.
Bit 7: ADF 0 1 Description [Clearing condition] Cleared by reading ADF while ADF = 1, then writing 0 in ADF [Setting conditions] Single mode: A/D conversion ends Scan mode: A/D conversion ends in all selected channels (Initial value)
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Section 15 A/D Converter
Bit 6--A/D Interrupt Enable (ADIE): Enables or disables the interrupt (ADI) requested at the end of A/D conversion.
Bit 6: ADIE 0 1 Description A/D end interrupt request (ADI) is disabled A/D end interrupt request (ADI) is enabled (Initial value)
Bit 5--A/D Start (ADST): Starts or stops A/D conversion. The ADST bit remains set to 1 during A/D conversion. It can also be set to 1 by external trigger input at the ADTRG pin.
Bit 5: ADST 0 1 Description A/D conversion is stopped (Initial value)
Single mode: A/D conversion starts; ADST is automatically cleared to 0 when conversion ends. Scan mode: A/D conversion starts and continues, cycling among the selected channels, until ADST is cleared to 0 by software, by a reset, or by a transition to standby mode.
Bit 4--Scan Mode (SCAN): Selects single mode or scan mode. For further information on operation in these modes, see section 15.4, Operation. Clear the ADST bit to 0 before switching the conversion mode.
Bit 4: SCAN 0 1 Description Single mode Scan mode (Initial value)
Bit 3--Clock Select (CKS): Selects the A/D conversion time. Clear the ADST bit to 0 before switching the conversion time.
Bit 3: CKS 0 1 Description Conversion time = 266 states (maximum) Conversion time = 134 states (maximum) (Initial value)
Bits 2 to 0--Channel Select 2 to 0 (CH2 to CH0): These bits and the SCAN bit select the analog input channels. Clear the ADST bit to 0 before changing the channel selection.
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Section 15 A/D Converter Group Selection CH2 0
Channel Selection CH1 0 1 CH0 0 1 0 1 0 1 1 0 1 Single Mode AN0 (Initial value) AN1 AN2 AN3 AN4 AN5 AN6 AN7
Description Scan Mode AN0 AN0, AN1 AN0 to AN2 AN0 to AN3 AN4 AN4, AN5 AN4 to AN6 AN4 to AN7
1
0
15.2.3
Bit
A/D Control Register (ADCR)
7 TRGE 0 R/W 6 1 5 1 4 1 3 1 2 1 1 1 0 0
Initial value Read/Write
Reserved bits Trigger enable Enables or disables external triggering of A/D conversion Reserved bit Must not be set to 1
ADCR is an 8-bit readable/writable register that enables or disables external triggering of A/D conversion. ADCR is initialized to H'7E by a reset and in standby mode. Bit 7--Trigger Enable (TRGE): Enables or disables external triggering of A/D conversion.
Bit 7: TRGE 0 1 Description A/D conversion cannot be externally triggered (Initial value)
A/D conversion starts at the falling edge of the external trigger signal (ADTRG)
Bits 6 to 1--Reserved: Read-only bits, always read as 1. Bit 0--Reserved: Do not set to 1.
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Section 15 A/D Converter
15.3
CPU Interface
ADDRA to ADDRD are 16-bit registers, but they are connected to the CPU by an 8-bit data bus. Therefore, although the upper byte can be be accessed directly by the CPU, the lower byte is read through an 8-bit temporary register (TEMP). An A/D data register is read as follows. When the upper byte is read, the upper-byte value is transferred directly to the CPU and the lower-byte value is transferred into TEMP. Next, when the lower byte is read, the TEMP contents are transferred to the CPU. When reading an A/D data register, always read the upper byte before the lower byte. It is possible to read only the upper byte, but if only the lower byte is read, incorrect data may be obtained. Figure 15.2 shows the data flow for access to an A/D data register.
Upper-byte read
CPU (H'AA)
Module data bus Bus interface
TEMP (H'40)
ADDRnH (H'AA)
ADDRnL (H'40) (n = A to D)
Lower-byte read
CPU (H'40)
Module data bus Bus interface
TEMP (H'40)
ADDRnH (H'AA)
ADDRnL (H'40) (n = A to D)
Figure 15.2 A/D Data Register Access Operation (Reading H'AA40)
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Section 15 A/D Converter
15.4
Operation
The A/D converter operates by successive approximations with 10-bit resolution. It has two operating modes: single mode and scan mode. 15.4.1 Single Mode (SCAN = 0)
Single mode should be selected when only one A/D conversion on one channel is required. A/D conversion starts when the ADST bit is set to 1 by software, or by external trigger input. The ADST bit remains set to 1 during A/D conversion and is automatically cleared to 0 when conversion ends. When conversion ends the ADF bit is set to 1. If the ADIE bit is also set to 1, an ADI interrupt is requested at this time. To clear the ADF flag to 0, first read ADCSR, then write 0 in ADF. When the mode or analog input channel must be switched during analog conversion, to prevent incorrect operation, first clear the ADST bit to 0 in ADCSR to halt A/D conversion. After making the necessary changes, set the ADST bit to 1 to start A/D conversion again. The ADST bit can be set at the same time as the mode or channel is changed. Typical operations when channel 1 (AN1) is selected in single mode are described next. Figure 15.3 shows a timing diagram for this example. 1. Single mode is selected (SCAN = 0), input channel AN1 is selected (CH2 = CH1 = 0, CH0 = 1), the A/D interrupt is enabled (ADIE = 1), and A/D conversion is started (ADST = 1). 2. When A/D conversion is completed, the result is transferred into ADDRB. At the same time the ADF flag is set to 1, the ADST bit is cleared to 0, and the A/D converter becomes idle. 3. Since ADF = 1 and ADIE = 1, an ADI interrupt is requested. 4. The A/D interrupt handling routine starts. 5. The routine reads ADCSR, then writes 0 in the ADF flag. 6. The routine reads and processes the conversion result (ADDRB). 7. Execution of the A/D interrupt handling routine ends. After that, if the ADST bit is set to 1, A/D conversion starts again and steps 2 to 7 are repeated.
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Set *
ADIE A/D conversion starts Clear * Clear * Set * Set *
ADST
ADF Idle
State of channel 0 (AN 0) Idle
A/D conversion (1)
State of channel 1 (AN 1) Idle Idle
A/D conversion (2)
Idle
State of channel 2 (AN 2) Idle
State of channel 3 (AN 3)
ADDRA Read conversion result A/D conversion result (1) Read conversion result A/D conversion result (2)
ADDRB
ADDRC
ADDRD
Figure 15.3 Example of A/D Converter Operation (Single Mode, Channel 1 Selected)
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Section 15 A/D Converter
Note: * Vertical arrows ( ) indicate instructions executed by software.
Section 15 A/D Converter
15.4.2
Scan Mode (SCAN = 1)
Scan mode is useful for monitoring analog inputs in a group of one or more channels. When the ADST bit is set to 1 by software or external trigger input, A/D conversion starts on the first channel in the group (AN0 when CH2 = 0, AN4 when CH2 = 1). When two or more channels are selected, after conversion of the first channel ends, conversion of the second channel (AN1 or AN5) starts immediately. A/D conversion continues cyclically on the selected channels until the ADST bit is cleared to 0. The conversion results are transferred for storage into the A/D data registers corresponding to the channels. When the mode or analog input channel selection must be changed during analog conversion, to prevent incorrect operation, first clear the ADST bit to 0 in ADCSR to halt A/D conversion. After making the necessary changes, set the ADST bit to 1. A/D conversion will start again from the first channel in the group. The ADST bit can be set at the same time as the mode or channel selection is changed. Typical operations when three channels in group 0 (AN0 to AN2) are selected in scan mode are described next. Figure 15.4 shows a timing diagram for this example. 1. Scan mode is selected (SCAN = 1), scan group 0 is selected (CH2 = 0), analog input channels AN0 to AN2 are selected (CH1 = 1, CH0 = 0), and A/D conversion is started (ADST = 1). 2. When A/D conversion of the first channel (AN0) is completed, the result is transferred into ADDRA. Next, conversion of the second channel (AN1) starts automatically. 3. Conversion proceeds in the same way through the third channel (AN2). 4. When conversion of all selected channels (AN0 to AN2) is completed, the ADF flag is set to 1 and conversion of the first channel (AN0) starts again. If the ADIE bit is set to 1, an ADI interrupt is requested at this time. 5. Steps 2 to 4 are repeated as long as the ADST bit remains set to 1. When the ADST bit is cleared to 0, A/D conversion stops. After that, if the ADST bit is set to 1, A/D conversion starts again from the first channel (AN0).
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Continuous A/D conversion Set*1 Clear*1
ADST Clear*1 A/D conversion time Idle
A/D conversion (1)
ADF Idle A/D conversion (4) Idle
State of channel 0 (AN 0) Idle A/D conversion (2) Idle
State of channel 1 (AN 1) Idle A/D conversion (3)
A/D conversion (5)*2
Idle
State of channel 2 (AN 2) Idle Transfer A/D conversion result (1)
Idle
State of channel 3 (AN 3)
ADDRA
A/D conversion result (4)
ADDRB
A/D conversion result (2)
Figure 15.4 Example of A/D Converter Operation (Scan Mode, Channels AN0 to AN2 Selected)
ADDRC
A/D conversion result (3)
ADDRD
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Section 15 A/D Converter
Notes: 1. Vertical arrows ( ) indicate instructions executed by software. 2. Data currently being converted is ignored.
Section 15 A/D Converter
15.4.3
Input Sampling and A/D Conversion Time
The A/D converter has a built-in sample-and-hold circuit. The A/D converter samples the analog input at a time tD after the ADST bit is set to 1, then starts conversion. Figure 15.5 shows the A/D conversion timing. Table 15.4 indicates the A/D conversion time. As indicated in figure 15.5, the A/D conversion time includes tD and the input sampling time. The length of tD varies depending on the timing of the write access to ADCSR. The total conversion time therefore varies within the ranges indicated in table 15.4. In scan mode, the values given in table 15.4 apply to the first conversion. In the second and subsequent conversions the conversion time is fixed at 256 states when CKS = 0 or 128 states when CKS = 1.
(1)
Address bus
(2)
Write signal
Input sampling timing
ADF tD t SPL t CONV Legend: (1): ADCSR write cycle (2): ADCSR address tD : Synchronization delay t SPL : Input sampling time t CONV: A/D conversion time
Figure 15.5 A/D Conversion Timing
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Section 15 A/D Converter
Table 15.4 A/D Conversion Time (Single Mode)
CKS = 0 Symbol Synchronization delay Input sampling time A/D conversion time tD tSPL tCONV Min 10 -- 259 Typ -- 63 -- Max 17 -- 266 Min 6 -- 131 CKS = 1 Typ -- 31 -- Max 9 -- 134
Note: Values in the table are numbers of states.
15.4.4
External Trigger Input Timing
A/D conversion can be externally triggered. When the TRGE bit is set to 1 in ADCR, external trigger input is enabled at the ADTRG pin. A high-to-low transition at the ADTRG pin sets the ADST bit to 1 in ADCSR, starting A/D conversion. Other operations, in both single and scan modes, are the same as if the ADST bit had been set to 1 by software. Figure 15.6 shows the timing.
ADTRG
Internal trigger signal
ADST A/D conversion
Figure 15.6 External Trigger Input Timing
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Section 15 A/D Converter
15.5
Interrupts
The A/D converter generates an interrupt (ADI) at the end of A/D conversion. The ADI interrupt request can be enabled or disabled by the ADIE bit in ADCSR.
15.6
Usage Notes
When using the A/D converter, note the following points: 1. Analog Input Voltage Range: During A/D conversion, the voltages input to the analog input pins should be in the range AVSS ANn VREF. 2. Relationships of AVCC and AVSS to VCC and VSS: AVCC, AVSS, VCC, and VSS should be related as follows: AVSS = VSS. AVCC and AVSS must not be left open, even if the A/D converter is not used. 3. VREF Programming Range: The reference voltage input at the VREF pin should be in the range VREF AVCC. Failure to observe points 1, 2, and 3 above may degrade chip reliability. 4. Note on Board Design: In board layout, separate the digital circuits from the analog circuits as much as possible. Particularly avoid layouts in which the signal lines of digital circuits cross or closely approach the signal lines of analog circuits. Induction and other effects may cause the analog circuits to operate incorrectly, or may adversely affect the accuracy of A/D conversion. The analog input signals (AN0 to AN7), analog reference voltage (VREF), and analog supply voltage (AVCC) must be separated from digital circuits by the analog ground (AVSS). The analog ground (AVSS) should be connected to a stable digital ground (VSS) at one point on the board.
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Section 15 A/D Converter
5. Note on Noise: To prevent damage from surges and other abnormal voltages at the analog input pins (AN0 to AN7) and analog reference voltage pin (VREF), connect a protection circuit like the one in figure 15.7 between AVCC and AVSS. The bypass capacitors connected to AVCC and VREF and the filter capacitors connected to AN0 to AN7 must be connected to AVSS. If filter capacitors like the ones in figure 15.7 are connected, the voltage values input to the analog input pins (AN0 to AN7) will be smoothed, which may give rise to error. Error can also occur if A/D conversion is frequently performed in scan mode so that the current that charges and discharges the capacitor in the sample-and-hold circuit of the A/D converter becomes greater than that input to the analog input pins via input impedance Rin. The circuit constants should therefore be selected carefully.
AVCC
VREF Rin*2 *1 *1 0.1 F 100 AN0 to AN7
AVSS
Notes: 1. Numeric values are approximate.
10 F
0.01 F
2. Rin: input impedance
Figure 15.7 Example of Analog Input Protection Circuit
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Section 15 A/D Converter
10 k AN0 to AN7 To A/D converter 20 pF
Note: Numeric values are approximate.
Figure 15.8 Analog Input Pin Equivalent Circuit Table 15.5 Analog Input Pin Ratings
Item Analog input capacitance Allowable signal-source impedance 13 MHz > 13 MHz Min -- -- -- Max 20 10 5 Unit pF k k
6. A/D Conversion Accuracy Definitions: A/D conversion accuracy in the H8/3048B Group is defined as follows: * * Resolution Digital output code length of A/D converter Offset error Deviation from ideal A/D conversion characteristic of analog input voltage required to raise digital output from minimum voltage value B'0000000000 to B'0000000001 (figure 15.10) * Full-scale error Deviation from ideal A/D conversion characteristic of analog input voltage required to raise digital output from B'1111111110 to B'1111111111 (figure 15.10) * * Quantization error Intrinsic error of the A/D converter; 1/2 LSB (figure 15.9) Nonlinearity error Deviation from ideal A/D conversion characteristic in range from zero volts to full scale, exclusive of offset error, full-scale error, and quantization error. * Absolute accuracy Deviation of digital value from analog input value, including offset error, full-scale error, quantization error, and nonlinearity error.
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Section 15 A/D Converter
Digital output
111 110 101 100 011 010 001 000
Ideal A/D conversion characteristic
Quantization error
1/8 2/8 3/8 4/8 5/8 6/8 7/8 FS Analog input voltage
Figure 15.9 A/D Converter Accuracy Definitions (1)
Full-scale error
Digital output
Ideal A/D conversion characteristic
Nonlinearity error
Actual A/D conversion characteristic FS Offset error Analog input voltage
Figure 15.10 A/D Converter Accuracy Definitions (2)
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Section 15 A/D Converter
7. Allowable Signal-Source Impedance: The analog inputs of the H8/3048B Group are designed to assure accurate conversion of input signals with a signal-source impedance not exceeding 10 k ( 13 MHz) or not exceeding 5 k ( > 13 MHz) (table 15.5). The reason for this rating is that it enables the input capacitor in the sample-and-hold circuit in the A/D converter to charge within the sampling time. If the sensor output impedance exceeds 10 k, charging may be inadequate and the accuracy of A/D conversion cannot be guaranteed. If a large external capacitor is provided in scan mode, then the internal 10-k input resistance becomes the only significant load on the input. In this case the impedance of the signal source is not a problem. A large external capacitor, however, acts as a low-pass filter. This may make it impossible to track analog signals with high dv/dt (e.g. a variation of 5 mV/s) (figure 15.11). To convert high-speed analog signals or to use scan mode, insert a low-impedance buffer. 8. Effect on Absolute Accuracy: Attaching an external capacitor creates a coupling with ground, so if there is noise on the ground line, it may degrade absolute accuracy. The capacitor must be connected to an electrically stable ground, such as AVSS. If a filter circuit is used, be careful of interference with digital signals on the same board, and make sure the circuit does not act as an antenna.
H8/3048B Group Sensor output impedance Up to 10 k ( 13 MHz) Up to 5 k ( > 13 MHz) Low-pass filter Up to 0.1 F Cin = 15 pF
Equivalent circuit of A/D converter 10 k
Sensor input
20 pF
Figure 15.11 Analog Input Circuit (Example)
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Section 16 D/A Converter
Section 16 D/A Converter
16.1 Overview
The H8/3048B Group includes a D/A converter with two channels. 16.1.1 Features D/A converter features are listed below. * Eight-bit resolution * Two output channels * Conversion time: maximum 10 s (with 20-pF capacitive load) * Output voltage: 0 V to 255/256 x VREF * D/A outputs can be sustained in software standby mode
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Section 16 D/A Converter
16.1.2
Block Diagram
Figure 16.1 shows a block diagram of the D/A converter.
Module data bus
VREF
DA 0 DA 1 AVSS
8-bit D/A
Legend: DACR: D/A control register DADR0: D/A data register 0 DADR1: D/A data register 1 DASTCR: D/A standby control register
Control circuit
Figure 16.1 D/A Converter Block Diagram
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DASTCR
AVCC
DADR0
DADR1
DACR
Bus interface
Internal data bus
Section 16 D/A Converter
16.1.3
Input/Output Pins
Table 16.1 summarizes the D/A converter's input and output pins. Table 16.1 D/A Converter Pins
Pin Name Analog power supply pin Analog ground pin Analog output pin 0 Analog output pin 1 Reference voltage input pin Abbreviation AVCC AVSS DA0 DA1 VREF I/O Input Input Output Output Input Function Analog power supply Analog ground and reference voltage Analog output, channel 0 Analog output, channel 1 Analog reference voltage
16.1.4
Register Configuration
Table 16.2 summarizes the D/A converter's registers. Table 16.2 D/A Converter Registers
Address* H'FFDC H'FFDD H'FFDE H'FF5C Note: * Name D/A data register 0 D/A data register 1 D/A control register D/A standby control register Lower 16 bits of the address Abbreviation DADR0 DADR1 DACR DASTCR R/W R/W R/W R/W R/W Initial Value H'00 H'00 H'1F H'FE
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Section 16 D/A Converter
16.2
16.2.1
Bit
Register Descriptions
D/A Data Registers 0 and 1 (DADR0, DADR1)
7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
Initial value Read/Write
The D/A data registers (DADR0 and DADR1) are 8-bit readable/writable registers that store the data to be converted. When analog output is enabled, the D/A data register values are constantly converted and output at the analog output pins. The D/A data registers are initialized to H'00 by a reset and in standby mode. 16.2.2
Bit Initial value Read/Write
D/A Control Register (DACR)
7 DAOE1 0 R/W 6 DAOE0 0 R/W 5 DAE 0 R/W 4 1 3 1 2 1 1 1 0 1
D/A enable Controls D/A conversion D/A output enable 0 Controls D/A conversion and analog output D/A output enable 1 Controls D/A conversion and analog output
DACR is an 8-bit readable/writable register that controls the operation of the D/A converter. DACR is initialized to H'1F by a reset and in standby mode.
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Section 16 D/A Converter
Bit 7--D/A Output Enable 1 (DAOE1): Controls D/A conversion and analog output.
Bit 7: DAOE1 0 1 Description DA1 analog output is disabled Channel-1 D/A conversion and DA1 analog output are enabled (Initial value)
Bit 6--D/A Output Enable 0 (DAOE0): Controls D/A conversion and analog output.
Bit 6: DAOE0 0 1 Description DA0 analog output is disabled Channel-0 D/A conversion and DA0 analog output are enabled (Initial value)
Bit 5--D/A Enable (DAE): Controls D/A conversion, together with bits DAOE0 and DAOE1. When the DAE bit is cleared to 0, analog conversion is controlled independently in channels 0 and 1. When the DAE bit is set to 1, analog conversion is controlled together in channels 0 and 1. Output of the conversion results is always controlled independently by DAOE0 and DAOE1.
Bit 7: DAOE1 0 Bit 6: DAOE0 0 1 Bit 5: DAE -- 0 1 1 0 0 1 1 -- Description D/A conversion is disabled in channels 0 and 1 D/A conversion is enabled in channel 0 D/A conversion is disabled in channel 1 D/A conversion is enabled in channels 0 and 1 D/A conversion is disabled in channel 0 D/A conversion is enabled in channel 1 D/A conversion is enabled in channels 0 and 1 D/A conversion is enabled in channels 0 and 1
When the DAE bit is set to 1, even if bits DAOE0 and DAOE1 in DACR and the ADST bit in ADCSR are cleared to 0, the same current is drawn from the analog power supply as during A/D and D/A conversion. Bits 4 to 0--Reserved: Read-only bits, always read as 1.
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Section 16 D/A Converter
16.2.3
D/A Standby Control Register (DASTCR)
DASTCR is an 8-bit readable/writable register that enables or disables D/A output in software standby mode.
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 Reserved bits D/A standby enable Enables or disables D/A output in software standby mode 3 1 2 1 1 1 0 DASTE 0 R/W
DASTCR is initialized to H'FE by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 1--Reserved: Read-only bits, always read as 1. Bit 0--D/A Standby Enable (DASTE): Enables or disables D/A output in software standby mode.
Bit 0: DASTE 0 1 Description D/A output is disabled in software standby mode D/A output is enabled in software standby mode (Initial value)
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Section 16 D/A Converter
16.3
Operation
The D/A converter has two built-in D/A conversion circuits that can perform conversion independently. D/A conversion is performed constantly while enabled in DACR. If the DADR0 or DADR1 value is modified, conversion of the new data begins immediately. The conversion results are output when bits DAOE0 and DAOE1 are set to 1. An example of D/A conversion on channel 0 is given next. Timing is indicated in figure 16.2. 1. Data to be converted is written in DADR0. 2. Bit DAOE0 is set to 1 in DACR. D/A conversion starts and DA0 becomes an output pin. The converted result is output after the conversion time. The output value is (DADR0 contents/256) x VREF. Output of this conversion result continues until the value in DADR0 is modified or the DAOE0 bit is cleared to 0. 3. If the DADR0 value is modified, conversion starts immediately, and the result is output after the conversion time. 4. When the DAOE0 bit is cleared to 0, DA0 becomes an input pin.
DADR0 write cycle DACR write cycle DADR0 write cycle DACR write cycle
Address bus DADR0 DAOE0 DA 0 High-impedance state t DCONV Legend: t DCONV : D/A conversion time Conversion result 2 Conversion data 1 Conversion data 2
Conversion result 1 t DCONV
Figure 16.2 Example of D/A Converter Operation
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Section 16 D/A Converter
16.4
D/A Output Control
In the H8/3048B Group, D/A converter output can be enabled or disabled in software standby mode. When the DASTE bit is set to 1 in DASTCR, D/A converter output is enabled in software standby mode. The D/A converter registers retain the values they held prior to the transition to software standby mode. When D/A output is enabled in software standby mode, the reference supply current is the same as during normal operation.
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Section 17 RAM
Section 17 RAM
17.1 Overview
The H8/3048B Group has 4 kbytes of high-speed static RAM on-chip. The RAM is connected to the CPU by a 16-bit data bus. The CPU accesses both byte data and word data in two states, making the RAM useful for rapid data transfer. The on-chip RAM of the H8/3048B Group is assigned to addresses H'FEF10 to H'FFF0F in modes 1, 2, 5, and 7, and to addresses H'FFEF10 to H'FFFF0F in modes 3, 4, and 6. The RAM enable bit (RAME) in the system control register (SYSCR) can enable or disable the on-chip RAM.
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Section 17 RAM
17.1.1
Block Diagram
Figure 17.1 shows a block diagram of the on-chip RAM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
Bus interface
SYSCR
H'FEF10* H'FEF12*
H'FEF11* H'FEF13*
On-chip RAM H'FFF0E* Even addresses Legend: SYSCR: System control register H'FFF0F* Odd addresses
Note: * This example is of the operating in mode 7. The lower 20 bits of the address are shown.
Figure 17.1 RAM Block Diagram 17.1.2 Register Configuration
The on-chip RAM is controlled by SYSCR. Table 17.1 gives the address and initial value of SYSCR. Table 17.1 System Control Register
Address* H'FFF2 Note: * Name System control register Lower 16 bits of the address. Abbreviation SYSCR R/W R/W Initial Value H'0B
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Section 17 RAM
17.2
Bit
System Control Register (SYSCR)
7 SSBY 0 R/W 6 STS2 0 R/W 5 STS1 0 R/W 4 STS0 0 R/W 3 UE 1 R/W 2 NMIEG 0 R/W 1 1 0 RAME 1 R/W
Initial value Read/Write
RAM enable Enables or disables on-chip RAM Reserved bit NMI edge select User bit enable Standby timer select 2 to 0 Software standby
One function of SYSCR is to enable or disable access to the on-chip RAM. The on-chip RAM is enabled or disabled by the RAME bit in SYSCR. For details about the other bits, see section 3.3, System Control Register (SYSCR). Bit 0--RAM Enable (RAME): Enables or disables the on-chip RAM. The RAME bit is initialized at the rising edge of the input at the RES pin. It is not initialized in software standby mode.
Bit 0: RAME 0 1 Description On-chip RAM is disabled On-chip RAM is enabled (Initial value)
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Section 17 RAM
17.3
Operation
When the RAME bit is set to 1, the on-chip RAM is enabled. Accesses to addresses H'FEF10 to H'FFF0F in the H8/3048B Group in modes 1, 2, 5, and 7, addresses H'FFEF10 to H'FFFF0F in the H8/3048B Group in modes 3, 4, and 6 are directed to the on-chip RAM. In modes 1 to 6 (expanded modes), when the RAME bit is cleared to 0, the off-chip address space is accessed. In mode 7 (single-chip mode), when the RAME bit is cleared to 0, the on-chip RAM is not accessed: read access always results in H'FF data, and write access is ignored. Since the on-chip RAM is connected to the CPU by an internal 16-bit data bus, it can be written and read by word access. It can also be written and read by byte access. Byte data is accessed in two states using the upper 8 bits of the data bus. Word data starting at an even address is accessed in two states using all 16 bits of the data bus.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.1
18.1.1
Flash Memory Overview
Notes on H8/3048F-ONE (Single Power Supply)
There are two models of the H8/3048F-ZTAT with on-chip flash memory: a dual power supply model (H8/3048F) and single power supply model (H8/3048F-ONE). Points to be noted when using the H8/3048F-ONE single power supply is given below. For the differences between the dual power supply model and single power supply model (H8/3048F-ONE), see section 1.4.3, Differences between H8/3048F and H8/3048F-ONE. (1) Voltage Application 12 V must not be applied to the H8/3048F-ONE (single power supply), as this will permanently damage the device. The flash memory programming power supply for the H8/3048F-ONE (single power supply) is VCC. The programming power supply for the dual power supply model is the VPP pin (12 V), but there is no VPP pin in the single power supply model. In the H8/3048F-ONE (single power supply) model the FWE pin is provided at the same pin position as the VPP pin in the dual power source model, but FWE is not a power supply pin--it is used to control flash memory write enabling. Also, in boot mode, 12 V must be applied to the MD2 pin in the dual power supply model, but this is not necessary in the H8/3048F-ONE (single power supply). The maximum rating of the FWE and MD2 pins in the H8/3048F-ONE (single power supply) is VCC +0.3 V. Applying a voltage in excess of the maximum rating will permanently damage the device. Do not select the HN28F101 programmer setting for the H8/3048F-ONE (single power supply). If this setting is made by mistake, 12.0 V will be applied to the FWE pin, permanently damaging the device. When using a PROM programmer to program the on-chip flash memory in the H8/3048FONE (single power supply), use a PROM programmer that supports Renesas Technology microcomputer device types with 128-kbyte on-chip flash memory.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.1.2
Mode Pin Settings
The H8/3048F-ONE has 128 kbytes of on-chip flash memory. The flash memory is connected to the CPU by a 16-bit data bus. The CPU accesses both byte data and word data in two states, enabling rapid data transfer. The mode pins (MD2 to MD0), FWE pin, and RXD1 pin can be set to enable or disable the on-chip ROM as indicated in table 18.1. Table 18.1 Operating Mode and ROM
Pin Name Mode Mode 1 (1-Mbyte expanded mode with on-chip ROM disabled) Mode 2 (1-Mbyte expanded mode with on-chip ROM disabled) Mode 3 (16-Mbyte expanded mode with on-chip ROM disabled) Mode 4 (16-Mbyte expanded mode with on-chip ROM disabled) Mode 5 (1-Mbyte expanded mode with on-chip ROM enabled) Mode 6 (16-Mbyte expanded mode with on-chip ROM enabled) Mode 7 (single-chip mode) MD2 0 MD1 0 MD0 1 FWE 0 RXD1 0/1 On-Chip ROM Disabled (external address area)
0
1
0
0
0/1
0
1
1
0
0/1
1
0
0
0
0/1
1
0
1
0
0/1
Enabled
1
1
0
0
0/1
1
1
1
0
0/1
The H8/3048F-ONE can be set to PROM mode and programmed with a general-purpose PROM programmer.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.2
Flash Memory Features
The H8/3048F-ONE has 128 kbytes of on-chip flash memory. The features of the flash memory are summarized below. * Four flash memory operating modes Program mode Erase mode Program-verify mode Erase-verify mode * Programming/erase methods The flash memory is programmed 128 bytes at a time. Block erase (in single-block units) can be performed. To erase the entire flash memory, each block must be erased in turn. Block erasing can be performed as required on 1 kbyte, 28 kbytes, and 32 kbytes blocks. * Programming/erase times The flash memory programming time is 10 ms (typ.) for simultaneous 128-byte programming, equivalent approximately to 80 s (typ.) per byte, and the erase time is 100 ms (typ.). * Reprogramming capability The flash memory can be reprogrammed up to 100 times. * On-board programming modes There are two modes in which flash memory can be programmed/erased/verified on-board: Boot mode User program mode In the boot mode, the transferred program from the host can be recognized. * Automatic bit rate adjustment With data transfer in boot mode, the LSI's bit rate can be automatically adjusted to match the transfer bit rate of the host. * Flash memory emulation in RAM Flash memory programming can be emulated in real time by overlapping a part of RAM onto flash memory. * Protect modes There are three protect modes, hardware, software, and error which allow protected status to be designated for flash memory program/erase/verify operations. * PROM mode Flash memory can be programmed/erased in PROM mode, using a PROM programmer, as well as in on-board programming mode.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.2.1
Block Diagram
Internal address bus
Internal data bus (16 bits)
Module bus
FLMCR1 FLMCR2 EBR RAMCR Bus interface/controller Operating mode FWE pin Mode pin
Flash memory (128 kbytes)
Legend: FLMCR1: FLMCR2: EBR: RAMCR:
Flash memory control register 1 Flash memory control register 2 Erase block register RAM control register
Note: Never apply 12 V to the H8/3048F-ONE (single power supply). Otherwise, the LSI will be permanently damaged.
Figure 18.1 Block Diagram of Flash Memory 18.2.2 Mode Transitions
When the mode pins and the FWE pin are set in the reset state and a reset-start is executed, the microcomputer enters an operating mode as shown in figure 18.2. In user mode, flash memory can be read but not programmed or erased. The boot, user program and PROM modes are provided as modes to write and erase the flash memory.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
*1, *3 RES = 0
User mode
Reset state
RES = 0 *3 RES = 0 *3 RES = 0
PROM mode
*2
FWE = 1
FWE = 0
*1 User program mode
Boot mode On-board programming mode
Notes: Only make a transition between user mode and user program mode when the CPU is not accessing the flash memory. 1. 2. 3. 4. RAM emulation possible The H8/3048F-ONE is placed in PROM mode by means of a dedicated PROM writer. Mode settings are shown in the following table. For pins RXD1 and TXD1, use on-board pull-up in boot mode. Mode FWE Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Mode 7 Boot mode 5 Boot mode 6 Boot mode 7 Setting prohibited User program mode 5 User program mode 6 User program mode 7 0 MD2 0 0 0 1 1 1 1 0 0 0 1 1 1 1 Pins MD1 0 1 1 0 0 1 1 0 1 1 0 0 1 1 MD0 1 0 1 0 1 0 1 1 0 1 0 1 0 1 RXD1 0, 1 0, 1 0, 1 0, 1 0, 1 0, 1 0, 1 1*4 1*4 1*4 1 0, 1 0, 1 0, 1
1
Figure 18.2 Flash Memory State Transitions
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
State transitions between the normal user mode and on-board programming mode are performed by changing the FWE pin level from high to low or from low to high. To prevent misoperation (erroneous programming or erasing) in these cases, the bits in the flash memory control registers (FLMCR1 and FLMCR2) should be cleared to 0 before making such a transition. After the bits are cleared, a wait time is necessary. Normal operation is not guaranteed if this wait time is insufficient.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.2.3
On-Board Programming Modes
Boot Mode
1. Initial state The old program version or data remains written in the flash memory. The user should prepare the programming control program and new application program beforehand in the host. 2. Programming control program transfer When boot mode is entered, the boot program in the H8/3048F-ONE (originally incorporated in the chip) is started and the programming control program in the host is transferred to RAM via SCI communication. The boot program required for flash memory erasing is automatically transferred to the RAM boot program area.
Host
Host Programming control program New application program
New application program
H8/3048F-ONE
Boot program Flash memory RAM SCI
H8/3048F-ONE
Boot program Flash memory RAM Boot program area SCI
Application program (old version)
Application program (old version)
Programming control program
3. Flash memory initialization The erase program in the boot program area (in RAM) is executed, and the flash memory is initialized (to H'FF). In boot mode, total flash memory erasure is performed, without regard to blocks.
Host
4. Writing new application program The programming control program is recognized if it corresponds to the H8/3048F-ONE. The programming control program is then transferred from the host to RAM is executed, and the new application program in the host is written into the flash memory.
Host
New application program
H8/3048F-ONE
Boot program Flash memory RAM Boot program area Flash memory preprogramming erase
Programming control program
H8/3048F-ONE
SCI Boot program Flash memory RAM Boot program area New application program
Programming control program
SCI
Program execution state
Note: Never apply 12 V to the H8/3048F-ONE (single power supply). Otherwise, the LSI will be permanently damaged.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
User Program Mode
1. Initial state The FWE assessment program that confirms that user program mode has been entered, and the program that will transfer the programming/erase control program from flash memory to on-chip RAM should be written into the flash memory by the user beforehand. The programming/erase control program should be prepared in the host or in the flash memory.
Host Programming/ erase control program New application program New application program
2. Programming/erase control program transfer When user program mode is entered, user software confirms this fact, executes transfer program in the flash memory, and transfers the programming/erase control program to RAM.
Host
H8/3048F-ONE
Boot program Flash memory
FWE assessment program
H8/3048F-ONE
SCI RAM Boot program Flash memory
FWE assessment program
SCI RAM
Transfer program
Transfer program
Programming/ erase control program
Application program (old version)
Application program (old version)
3. Flash memory initialization The programming/erase program in RAM is executed, and the flash memory is initialized (to H'FF). Erasing can be performed in block units, but not in byte units.
Host
4. Writing new application program Next, the new application program in the host is written into the erased flash memory blocks. Do not write to unerased blocks.
Host
New application program
H8/3048F-ONE
Boot program Flash memory
FWE assessment program
H8/3048F-ONE
SCI RAM Boot program Flash memory
FWE assessment program Transfer program Programming/ erase control program Programming/ erase control program
SCI RAM
Transfer program
Flash memory erase
New application program
Program execution state
Note: Never apply 12 V to the H8/3048F-ONE (single power supply). Otherwise, the LSI will be permanently damaged.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.2.4
Flash Memory Emulation in RAM
In the H8/3048F-ONE, flash memory programming can be emulated in real time by overlapping the flash memory with part of RAM ("overlap RAM"). When the emulation block set in RAMCR is accessed while the emulation function is being executed, data written in the overlap RAM is read. Emulation should be performed in user mode or user program mode.
SCI
Flash memory Emulation block
RAM
Overlap RAM (emulation is performed on data written in RAM) Application program Execution state
Figure 18.3 Reading Overlap RAM Data in User Mode or User Program Mode When overlap RAM data is confirmed, clear the RAMS bit to release RAM overlap, and actually perform writes to the flash memory. When the programming control program is transferred to RAM in on-board programming mode, ensure that the transfer destination and the overlap RAM do not overlap, as this will cause data in the overlap RAM to be rewritten.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
SCI
Flash memory Programming data
RAM
Application program
Overlap RAM (programming data) Programming control program execution state
Figure 18.4 Writing Overlap RAM Data in User Program Mode 18.2.5
Item Total erase Block erase Programming control program*
Differences between Boot Mode and User Program Mode
Boot Mode Yes No Boot program is initiated, and programming control program is transferred from host to on-chip RAM, and executed there. User Program Mode No Yes Program that controls programming program in flash memory is executed. Program should be written beforehand in PROM mode and boot mode.
Note:
*
To be provided by the user, in accordance with the recommended algorithm.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.2.6
Block Configuration
The flash memory in the H8/3048F-ONE is divided into three 32-kbyte blocks, one 28-kbyte block, and four 1-kbyte blocks and can be erased in these block units.
Address H'00000 1 kbyte x 4
28 kbytes
128 kbytes
32 kbytes
32 kbytes
32 kbytes Address H'1FFFF
Figure 18.5 Erase Area Block Divisions
18.3
Flash Memory Pin Configuration
The flash memory is controlled by means of the pins shown in table 18.2. Table 18.2 Pin Configuration
Pin Name Reset Flash write enable Mode 2 Mode 1 Mode 0 Transmit data Receive data Abbreviation RES
1 FWE* 1 MD2*
I/O Input Input Input Input Input
Function Reset Flash program/erase protection by hardware Sets LSI operating mode Sets LSI operating mode Sets LSI operating mode Serial transmit data output Serial receive data input
MD1 MD0 TxD1* 2 RxD1*
2
Output Input
Notes: 1. Never apply 12 V to the H8/3048F-ONE (single power supply). Otherwise, the LSI will be permanently damaged. 2. In boot mode, use on-board pull-up.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.4
Flash Memory Register Configuration
The registers* used to control the on-chip flash memory when enabled are shown in table 18.3. Note: * Access is prohibited to lower 16 address bits H'FF43 to H'FF46 and H'FF48 to H'FF4F. These bits are designed for the on-chip flash memory version and do not exist in the on-chip mask ROM version. In the on-chip mask ROM version, these bits always read 1, and writing is disabled. Table 18.3 Register Configuration
Register Name Flash memory control register 1 Flash memory control register 2 Erase block register RAM control register Abbreviation FLMCR1* 5 FLMCR2*
5 5 EBR* 5 RAMCR*
R/W R/W* 26 R/W* *
2 2 R/W*
Initial Value H'00*
3
Address* H'FF40 H'FF41 H'FF42 H'FF47
1
H'00 4 H'00* H'F0
R/W
Notes: 1. Lower 16 bits of the address. 2. If the chip is in a mode in which the on-chip flash memory is disabled, a read will return H'00 and writes are invalid. Writes are also invalid when the FWE bit in FLMCR1 is not set to 1. 3. When a high level is input to the FWE pin, the initial value is H'80. 4. When a low level is input to the FWE pin, or if a high level is input and the SWE bit in FLMCR1 is 0, these registers are initialized to H'00. 5. FLMCR1, FLMCR2, EBR, and RAMCR are 8-bit registers. Byte access must be used on these registers (do not use word or longword access). 6. Bits 6 to 0 are reserved bits but are readable/writable.
18.5
18.5.1
Bit
Flash Memory Register Descriptions
Flash Memory Control Register 1 (FLMCR1)
7 FWE --* R 6 SWE 0 R/W 5 ESU 0 R/W 4 PSU 0 R/W 3 EV 0 R/W 2 PV 0 R/W 1 E 0 R/W 0 P 0 R/W
Initial value Read/Write Note: *
Determined by the state of the FWE pin.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
FLMCR1 is an 8-bit register used for flash memory operating mode control. Program-verify mode or erase-verify mode for addresses H'00000 to H'1FFFF is entered by setting SWE bit to 1 when FWE = 1, then setting the PV or EV bit. Program mode for addresses H'00000 to H'1FFFF is entered by setting SWE bit to 1 when FWE = 1, then setting the PSU bit, and finally setting the P bit. Erase mode for addresses H'00000 to H'1FFFF is entered by setting SWE bit to 1 when FWE = 1, then setting the ESU bit, and finally setting the E bit. FLMCR1 is initialized by a reset, and in hardware standby mode and software standby mode. Its initial value is H'80 when a high level is input to the FWE pin, and H'00 when a low level is input. When on-chip flash memory is disabled, a read will return H'00, and writes are invalid. Set 1 to bits 6 to 0 by each bit in this register. Writes are enabled only in the following cases: Writes to bit SWE of FLMCR1 enabled when FWE = 1, to bits ESU, PSU, EV, and PV when FWE = 1 and SWE = 1, to bit E when FWE = 1, SWE = 1 and ESU = 1, and to bit P when FWE = 1, SWE = 1, and PSU = 1. Notes: 1. The programming and erase flowcharts must be followed when setting the bits in this register to prevent erroneous programming or erasing. 2. Transitions are made to program mode, erase mode, program-verify mode, and eraseverify mode according to the settings in this register. When reading flash memory as normal on-chip ROM, bits 6 to 0 in this register must be cleared. Bit 7--Flash Write Enable Bit (FWE): Sets hardware protection against flash memory programming/erasing.
Bit 7: FWE 0 1 Description When a low level is input to the FWE pin (hardware-protected state) When a high level is input to the FWE pin
Bit 6--Software Write Enable Bit (SWE): Enables or disables flash memory programming and erasing (applicable addresses: H'00000 to H'1FFFF). Set this bit when setting bits 5 to 0, bits 7 to 0 of EBR.
Bit 6: SWE 0 1 Description Writes disabled Writes enabled* [Setting condition] When FWE = 1 Note: * Do not execute a SLEEP instruction while the SWE bit is set to 1. (Initial value)
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Bit 5--Erase Setup Bit (ESU): Prepares for a transition to erase mode (applicable addresses: H'00000 to H'1FFFF). Do not set the SWE, PSU, EV, PV, E, or P bit at the same time. Set this bit to 1 before setting bit E to 1 in FLMCR1.
Bit 5: ESU 0 1 Description Erase setup cleared Erase setup [Setting condition] When FWE = 1 and SWE = 1 (Initial value)
Bit 4--Program Setup Bit (PSU): Prepares for a transition to program mode (applicable addresses: H'00000 to H'1FFFF). Do not set the SWE, ESU, EV, PV, E, or P bit at the same time. Set this bit to 1 before setting bit P to 1 in FLMCR1.
Bit 4: PSU 0 1 Description Program setup cleared Program setup [Setting condition] When FWE = 1 and SWE = 1 (Initial value)
Bit 3--Erase-Verify Bit (EV): Selects erase-verify mode transition or clearing (applicable addresses: H'00000 to H'1FFFF). Do not set the SWE, ESU, PSU, PV, E, or P bit at the same time.
Bit 3: EV 0 1 Description Erase-verify mode cleared Transition to erase-verify mode [Setting condition] When FWE = 1 and SWE = 1 (Initial value)
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Bit 2--Program-Verify Bit (PV): Selects program-verify mode transition or clearing (applicable addresses: H'00000 to H'1FFFF). Do not set the SWE, ESU, PSU, EV, E, or P bit at the same time.
Bit 2: PV 0 1 Description Program-verify mode cleared Transition to program-verify mode [Setting condition] When FWE = 1 and SWE = 1 (Initial value)
Bit 1--Erase Bit (E): Selects erase mode transition or clearing (applicable addresses: H'00000 to H'1FFFF). Do not set the SWE, ESU, PSU, EV, PV, or P bit at the same time.
Bit 1: E 0 1 Description Erase mode cleared Transition to erase mode* [Setting condition] When FWE = 1, SWE = 1, and ESU = 1 Note: * Do not access flash memory while the E bit is set to 1. (Initial value)
Bit 0--Program Bit (P): Selects program mode transition or clearing (applicable addresses: H'00000 to H'1FFFF). Do not set the SWE, PSU, ESU, EV, PV, or E bit at the same time.
Bit 0: P 0 1 Description Program mode cleared Transition to program mode* [Setting condition] When FWE = 1, SWE = 1, and PSU = 1 Note: * Do not access flash memory while the P bit is set. (Initial value)
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.5.2
Bit
Flash Memory Control Register 2 (FLMCR2)
7 FLER 0 R 6 -- 0 R/W 5 -- 0 R/W 4 -- 0 R/W 3 -- 0 R/W 2 -- 0 R/W 1 -- 0 R/W 0 -- 0 R/W
Initial value Read/Write
FLMCR2 is an 8-bit register used for flash memory operating mode control. FLMCR2 is initialized to H'00 by a reset, and in hardware standby mode and software standby mode. When the on-chip flash memory is disabled, a read will return H'00. Note: Bits 6 to 0 are reserved bits but are readable/writable. Bit 7--Flash Memory Error (FLER): Indicates that an error has occurred during an operation on flash memory (programming or erasing). When FLER is set to 1, flash memory goes to the errorprotection state.
Bit 7: FLER 0 Description Flash memory is operating normally Flash memory program/erase protection (error protection) is disabled [Clearing condition] Reset (RES pin or WDT reset) or hardware standby mode 1 An error occurred during flash memory programming/erasing Flash memory program/erase protection (error protection) is enabled [Setting conditions] * When flash memory is read during programming/erasing (including a vector read or instruction fetch, but excluding a read of the RAM area overlapping flash memory space) Immediately after the start of exception handling during programming/erasing (excluding reset, illegal instruction, trap instruction, and division-by-zero exception handling) When a SLEEP instruction (including software standby) is executed during programming/erasing When the bus is released during programming/erasing (Initial value)
*
* *
Bits 6 to 0--Reserved: These bits are readable/writable.
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18.5.3
Erase Block Register (EBR)
EBR is an 8-bit register that designates the flash memory block for erasure. EBR is initialized to H'00 by a reset, in hardware standby mode or software standby mode, when a high level is not input to the FWE pin, or when the SWE bit in FLMCR1 is 0 when a high level is applied to the FWE pin. When a bit is set in EBR, the corresponding block can be erased. Other blocks are eraseprotected. The blocks are erased block by block. Therefore, set only one bit in EBR; do not set bits in EBR to erase two or more blocks at the same time. Each bit in EBR cannot be set until the SWE bit in FLMCR1 is set. The flash memory block configuration is shown in table 18.4. To erase all the blocks, erase each block sequentially.
Bit Initial value Read/Write Initial value Read/Write 7 EB7 Modes 1 to 4 Modes 5 to 7 0 R 0 R/W 6 EB6 0 R 0 R/W 5 EB5 0 R 0 R/W 4 EB4 0 R 0 R/W 3 EB3 0 R 0 R/W 2 EB2 0 R 0 R/W 1 EB1 0 R 0 R/W 0 EB0 0 R 0 R/W
Bits 7 to 0--Block 7 to Block 0 (EB7 to EB0): Setting one of these bits specifies the corresponding block (EB7 to EB0) for erasure.
Bits 7-0: EB7-EB0 0 1 Description Corresponding block (EB7 to EB0) not selected Corresponding block (EB7 to EB0) selected (Initial value)
Note: When not performing an erase, clear EBR to H'00.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Table 18.4 Flash Memory Erase Blocks
Block (Size) EB0 (1 kbyte) EB1 (1 kbyte) EB2 (1 kbyte) EB3 (1 kbyte) EB4 (28 kbytes) EB5 (32 kbytes) EB6 (32 kbytes) EB7 (32 kbytes) Address H'000000-H'0003FF H'000400-H'0007FF H'000800-H'000BFF H'000C00-H'000FFF H'001000-H'007FFF H'008000-H'00FFFF H'010000-H'017FFF H'018000-H'01FFFF
18.5.4
RAM Control Register (RAMCR)
Bit Initial value Read/Write Initial value Read/Write 7 1 1 6 1 1 5 1 1 4 1 1 3 RAMS 0 R 0 R/W 2 RAM2 0 R 0 R/W 1 RAM1 0 R 0 R/W 0 0 0 R/W Reserved bit RAM2, RAM1 Used together with bit 3 to select a flash memory area RAM select Used together with bits 2 and 1 to select a flash memory area
Modes 1 to 4 Modes 5 to 7
Reserved bits
RAMCR selects the RAM area to be used when emulating real-time flash memory programming. RAMCR initialized to H'F0 by a reset and in hardware standby mode. It is not initialized in software standby mode. RAMCR settings should be made in user mode or user program mode.* Note: * When performing flash memory emulation by RAM, the RAME bit in SYSCR must be set to 1. RAM area settings are shown in table 18.5. To ensure correct operation of the emulation function, the ROM for which RAM emulation is performed should not be accessed immediately after this
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
register has been modified. Normal execution of an access immediately after register modification is not guaranteed. Bits 7 to 4--Reserved: These bits always read 1. Writing is disabled. Bit 3--RAM Select (RAMS): Specifies selection or non-selection of flash memory emulation in RAM. When RAMS = 1, all flash memory block are program/erase-protected.
Bit 3: RAMS 0 1 Description Emulation not selected Program/erase-protection of all flash memory blocks is disabled Emulation selected Program/erase-protection of all flash memory blocks is enabled (Initial value)
Bits 2 and 1--RAM2 and RAM1: These bits are used with bit 3 to reassign an area to RAM (see table 18.5). Bit 0--Reserved: This bit is readable/writable. Table 18.5 RAM Area Setting
Bit 3 RAM Area H'FFF000-H'FFF3FF H'000000-H'0003FF H'000400-H'0007FF H'000800-H'000BFF H'000C00-H'000FFF RAMS 0 1 1 1 1 Bit 2 RAM2 0/1 0 0 1 1 Bit 1 RAM1 0/1 0 1 0 1 RAM Emulation Status No emulation Mapping RAM
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
ROM area H'000000 EB0 ROM blocks EB0-EB3 (H'000000- H'000FFF) H'0003FF H'000400 EB1 H'0007FF H'000800 H'000BFF H'000C00 H'000FFF Mapping RAM EB2 EB3 ROM selection area RAM selection area
RAM area H'FFEF10 H'FFEFFF H'FFF000 Actual RAM H'FFF3FF H'FFF400 H'FFFF0F RAM overlap area (H'FFF000- H'FFF3FF)
Figure 18.6 Example of ROM Area/RAM Area Overlap
18.6
Flash Memory On-Board Programming Modes
When pins are set to on-board programming mode and a reset-start is executed, a transition is made to the on-board programming state in which program/erase/verify operations can be performed on the on-chip flash memory. There are two on-board programming modes: boot mode and user program mode. The pin settings for transition to each of these modes are shown in table 18.6. For a diagram of the transitions to the various flash memory modes, see figure 18.2. Table 18.6 Setting On-Board Programming Modes
Mode Boot mode Mode 5 Mode 6 Mode 7 User program mode Mode 5 Mode 6 Mode 7
2 FWE* 1 1*
MD2*
1 0* 1 0* 1 0*
2
MD1 0 1 1 0 1 1
MD0 1 0 1 1 0 1
RxD1
3 1* 3 1* 3 1*
Notes 0: VIL 1: VIH
1* 1 1*
1
0/1 0/1 0/1
1*
1
Notes: 1. (1) For the high-level application timing, see Notes on Use of Boot Mode. (2) In boot mode, the inverse of the MD2 setting should be input. (3) In boot mode, the mode control register (MDCR) can be used to monitor the status of modes 5, 6, and 7, in the same way as in normal mode. 2. Never apply 12 V to the H8/3048F-ONE (single power supply). If do so, the LSI will be permanently damaged. 3. For pins RXD1 and TXD1, use on-board pull-up.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.6.1
Boot Mode
When boot mode is used, the flash memory programming control program must be prepared in the host beforehand. The SCI channel to be used is set to asynchronous mode. When a reset-start is executed after H8/3048F-ONE's pins have been set to boot mode, the boot program built into the LSI is started and the programming control program prepared in the host is serially transmitted to the LSI via the SCI. In the LSI, the programming control program received via the SCI is written into the programming control program area in on-chip RAM. After the transfer is completed, the programming control program is recognized (the ID code is checked) if it corresponds to the H8/3048F-ONE. When the ID code is matched, control branches to the start address of the programming control program area and the programming control program execution state is entered (flash memory programming is performed). The transferred programming control program must therefore include coding that follows the programming algorithm given later. The system configuration in boot mode is shown in figure 18.7, and the boot mode execution procedure in figure 18.8.
H8/3048F-ONE
Flash memory
Host
Write data reception Verify data transmission
RxD1* SCI1 TxD1*
On-chip RAM
Note: * For pins RxD1 and TxD1, use on-board pull-up.
Figure 18.7 System Configuration in Boot Mode
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Start Set pins to boot program mode and execute reset-start Host transfers data (H'00) continuously at prescribed bit rate H8/3048F-ONE measures low period of H'00 data transmitted by host H8/3048F-ONE calculates bit rate and sets value in bit rate register After bit rate adjustment, H8/3048F-ONE transmits one H'00 data byte to host to indicate end of adjustment Host confirms normal reception of bit rate adjustment end indication (H'00), and transmits one H'55 data byte After receiving H'55, H8/3048F-ONE transmits one H'AA byte to host Host transmits number of programming control program bytes (N), upper byte followed by lower byte H8/3048F-ONE transmits received number of bytes to host as verify data (echo-back) n=1 Host transmits programming control program sequentially in byte units H8/3048F-ONE transmits received programming control program to host as verify data (echo-back) Transfer received programming control program to on-chip RAM n = N? Yes End of transmission Check flash memory data, and if data has already been written, erase all blocks Confirm that all flash memory data has been erased* Check ID code at beginning of user program transfer area (Match) Transmit one H'AA byte to host Execute programming control program transferred to on-chip RAM Note: * If a memory cell does not operate normally and cannot be erased, one H'FF byte is transmitted as an erase error indication, and the erase operation and subsequent operations are halted. Transmit H'FF as error notification (Mismatch) No n+1n
Figure 18.8 Boot Mode Execution Procedure
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Automatic SCI Bit Rate Adjustment
Start bit Stop bit
D0
D1
D2
D3
D4
D5
D6
D7
Low period (9 bits) measured (H'00 data)
High period (1 or more bits)
When boot mode is initiated, H8/3048F-ONE measures the low period of the asynchronous SCI communication data (H'00) transmitted continuously from the host. The SCI transmit/receive format should be set as follows: 8-bit data, 1 stop bit, no parity. H8/3048F-ONE calculates the bit rate of the transmission from the host from the measured low period, and transmits one H'00 byte to the host to indicate the end of bit rate adjustment. The host should confirm that this adjustment end indication (H'00) has been received normally, and transmit one H'55 byte to H8/3048F-ONE. If reception cannot be performed normally, initiate boot mode again (reset), and repeat the above operations. Depending on the host's transmission bit rate and H8/3048F-ONE's system clock frequency, there will be a discrepancy between the bit rates of the host and H8/3048F-ONE. Set the host transfer bit rate at 4,800, 9,600 or 19,200 bps* to operate the SCI properly. Table 18.7 shows host transfer bit rates and system clock frequencies for which automatic adjustment of H8/3048F-ONE bit rate is possible. The boot program should be executed within this system clock range. Table 18.7 System Clock Frequencies for which Automatic Adjustment of H8/3048F-ONE Bit Rate is Possible
Host Bit Rate 4800 bps 9,600 bps 19,200 bps System Clock Frequency for Which Automatic Adjustment of LSI Bit Rate is Possible (MHz) 4 to 25 8 to 25 16 to 25
Note: * Use a host bit rate setting of 4800, 9600, or 19200 bps only. No other setting should be used. Although the H8/3048F-ONE may also perform automatic bit rate adjustment with bit rate and system clock combinations other than those shown in table 18.7, a degree of error will arise between the bit rates of the host and the H8/3048F-ONE, and subsequent transfer will not be performed normally. Therefore, only combinations of bit rate and system clock within the ranges shown in table 18.7 can be used for boot mode execution.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
On-Chip RAM Area Divisions in Boot Mode In boot mode, the RAM area is divided into an area used by the boot program and an area to which the programming control program is transferred via the SCI, as shown in figure 18.9. The boot program area cannot be used until the execution state in boot mode switches to the programming control program transferred from the host.
H'FFEF10 Boot program area H'FFF50F H'FFF510 Programming control program area
ID code area (8 bytes)
H'FFFF0F
Figure 18.9 RAM Areas in Boot Mode Note: The boot program area cannot be used until a transition is made to the execution state for the programming control program transferred to RAM. Note also that the boot program remains in this area of the on-chip RAM even after control branches to the programming control program. In boot mode in the H8/3048F-ONE, the contents of the 8-byte ID code area shown below are checked to determine whether the program is a programming control program compatible with the H8/3048F-ONE.
H'FFF510
40
FE
62
66
33
30
34
38
(Product ID code) H'FFF518 onward
Programming control program instruction codes
If an original programming control program is used in boot mode, the 8-byte ID code shown above should be added at the beginning of the program.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Notes on Using the Boot Mode 1. When this LSI comes out of reset in boot mode, it measures the low period the input at the SCI's RXD1 pin. The reset should end with RXD1 high. After the reset ends, it takes about 100 states for this LSI to get ready to measure the low period of the RXD1 input. 2. In boot mode, if any data has been written to the flash memory (if all data is not H'FF), all flash memory blocks are erased. Therefore, this mode should be used for initial on-board programming, or for forced recovery if the program to be activated in user program mode is accidentally erased and user program mode cannot be executed, for example. 3. Interrupts cannot be used during programming or erasing of flash memory. 4. The RXD1 and TXD1 pins should be pulled up on the board.
5. This LSI terminates transmit and receive operations by the on-chip SCI(channel 1) (by clearing the RE and TE bits in serial control register (SCR)) before branching to the transmit data output pin. However, the adjusted bit rate is held in the bit rate register (BRR). At this time, the TXD1 is in the high level output state (P9DDR P91DDR=1, P9DR P91DR=1). Before branching to the programming control program the value of the general registers in the CPU are also undefined. Therefore, the general registers must be initialized immediately after control branches to the programming control program. Since the stack pointer (SP) is implicitly used during subroutine call, etc., a stack area must be specified for use by the programming control program. There are no other internal I/O registers in which the initial value is changed. 6. Transition to the boot mode executes a reset-start of this LSI after setting the MD0 to MD2, FWE, and RXD1 pins according to the mode setting conditions shown in table 18.6. At this time, this LSI latches the status of the mode pin inside the microcomputer to maintain 1 the boot mode status at the reset clear (startup from Low level to High level) timing* . To clear boot mode, it is necessary to drive the FWE pin low during the reset, and then execute 1 reset release* . The following points must be noted: * Before making a transition from the boot mode to the regular mode, the microcomputer 1 boot mode must be reset by reset input via the RES pin* . At this time, the RES pin must be 2 hold at low level for at least 20 system clock* . Do not change the input levels at the mode pins (MD2 to MD0) or the FWE pin while in boot mode. When making a mode transition, first enter the reset state by inputting a low level to the RES pin. When a watchdog timer reset was generated in the boot mode, the microcomputer mode is not reset and the on-chip boot program is restarted regardless of the state of the mode pin.
*
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
*
Do not input low level to the FWE pin while the boot program is executing and when 3 programming/erasing flash memory* .
7. If the mode pins (MD2 to MD0), FWE pin, and RXD1 pin input levels are changed (e.g., from low level to high level) during a reset (while a low level is being input to the RES pin), since the microcomputer's operating mode will change and the state of the address dual port and bus control output signals (CSn, RD, HWR, LWR) changes, use of these pins as output signals during reset must be disabled outside the microcomputer.
H8/3048F-ONE CSn External memory, etc. MD2 MD1 MD0 FWE RES
System control unit
Figure 18.10 Recommended System Block Diagram Notes: 1. The mode pin, FWE pin, and RXD1 pin input must satisfy the mode programming setup time (tMDS) relative to the reset clear timing. 2. See section 4.2.2, Reset Sequence and 18.11, Notes on Flash Memory Programming/Erasing. The H8/3048F-ONE requires a minimum of 20 system clocks. 3. For notes on FWE pin High/Low, see section 18.11, Notes on Flash Memory Programming/Erasing. 18.6.2 User Program Mode
When set to the user program mode, user's programming/erasing control program can erase and program the flash memory. Therefore, on-chip flash memory on-board programming can be performed by providing a means of controlling FWE and supplying the write data on the board and providing a programming/erasing program in a part of the program area. To select this mode, activate H8/3048F-ONE to on-chip flash memory enable modes 5, 6, and 7 and apply a high level to the FWE pin. In this state, the peripheral functions, other than flash memory, are performed the same as in modes 5, 6, and 7.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Since the flash memory cannot be read while it is being programmed/erased, place a programming program on external memory, or transfer the programming program to RAM area, and execute it in the RAM. Figure 18.11 shows the procedure for executing when transferred to on-chip RAM. During reset start, starting from the user program mode is possible.
Procedure 1 MD2-MD0 = 101, 110, 111 The user writes a program that executes steps 3 to 8 in advance as shown below. 1. Sets the mode pin to an on-chip ROM enable mode (mode 5, 6, or 7). 2. Starts the CPU via reset. (The CPU can also be started from the user program mode by setting the FWE pin to High level during reset; that is, during the period the RES pin is a low level.) 3. Transfers the programming/erasing program to RAM. 4 Branch to programming/erasing program in RAM area 4. Branches to the program in RAM area. 5. Sets the FWE pin to a high level.* (Switches to user program mode.) 5 FWE = high (user program mode) 6. After confirming that the FWE pin is a high level, executes the programming/erasing program in RAM. This reprograms the user application program in flash memory. 7. At the end of reprograming, clears the SWE bit, and exits the user program mode by switching the FWE pin from a high level to a low level.* 8. Branches to, and executes, the user application program reprogrammed in flash memory.
2
Reset start
3
Transfer programming/erasing program to RAM
6
Execute programming/erasing program in RAM (flash memory reprogramming)
7
Input low level to FWE after SWE bit clear (user program mode exit)
8
Execute user application program in flash memory
Note: * For notes on FWE pin High/Low, see section 18.11, Notes on Flash Memory Programming/Erasing.
Figure 18.11 User Program Mode Execution Procedure (Example)
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Notes: 1. Normally do not apply a high level to the FWE pin. Apply a high level to the FWE pin only when programming/erasing flash memory (including flash memory emulation by RAM). Also, while a high level is input to the FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc. 2. When the flash memory is read normally in the user program mode, the programming/ erasing program must not be executed. Bits 6 to 0 in FLMCR1 must be cleared to 0.
18.7
Programming/Erasing Flash Memory
A software method, using the CPU, is employed to program and erase flash memory in the onboard programming modes. There are four flash memory operating modes: program mode, erase mode, program-verify mode, and erase-verify mode. Transitions to these modes are made by setting the PSU, ESU, P, E, PV, and EV bits in FLMCR1 for addresses H'000000 to H'01FFFF. The flash memory cannot be read while it is being written or erased. Install the program to control flash memory programming and erasing (programming control program) in the on-chip RAM or in external memory, and execute the program from there. See section 18.11, Notes on Flash Memory Programming/Erasing, for points to be noted when programming or erasing the flash memory. In the following operation descriptions, wait times after setting or clearing individual bits in FLMCR1 are given as parameters; for details of the wait times, see section 21.1.6, Flash Memory Characteristics. Notes: 1. Operation is not guaranteed if bits SWE, ESU, PSU, EV, PV, E, and P of FLMCR1 are set/reset by a program in flash memory in the corresponding address areas. 2. When programming or erasing, set FWE to 1 (programming/erasing will not be executed if FWE = 0). 3. Programming should be performed in the erased state. Do not perform additional programming on previously programmed addresses.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
*3 E=1 Erase setup state E=0 Normal mode Erase mode
ES U
=
*1
1
FWE = 1 FWE = 0 *2 On-board programming mode Software programming disable state SWE = 1 SWE = 0 Software programming enable state
ES U
=
0
= EV
1
Erase-verify mode
= EV
0
PS
PS
U=
0
1
*4 Program setup state P=1 Program mode P=0
U=
PV = 1 0
Program-verify mode Notes: In order to perform a normal read of flash memory, SWE must be cleared to 0. Also note that verify-reads can be performed during the programming/erasing process. 1. : Normal mode : On-board programming mode 2. Do not make a state transition by setting or clearing multiple bits simultaneously. 3. After a transition from erase mode to the erase setup state, do not enter erase mode without passing through the software programming enable state. 4. After a transition from program mode to the program setup state, do not enter program mode without passing through the software programming enable state.
Figure 18.12 State Transitions Caused by FLMCR1 Bit Settings
PV =
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.7.1
Program Mode
To write data or programs to flash memory, the program/program-verify flowchart shown in figure 18.13 should be followed. Performing program operations according to this flowchart will enable data or programs to be written to flash memory without subjecting the device to voltage stress or sacrificing program data reliability. Programming should be carried out 128 bytes at a time. The wait times after bits are set or cleared in the flash memory control register 1 (FLMCR1) and the maximum number of programming operations (N) are shown in table 21.11 in section 21.1.6, Flash Memory Characteristics. Following the elapse of (tsswe) s or more after the SWE bit is set to 1 in FLMCR1, 128-byte data is written consecutively to the write addresses. The lower 8 bits of the first address written to must be H'00 and H'80, 128 consecutive byte data transfers are performed. The program address and program data are latched in the flash memory. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. Next, the watchdog timer (WDT) is set to prevent overprogramming due to program runaway, etc. Set a value greater than (tspsu + tsp + tcp + tcpsu) s as the WDT overflow period. Preparation for entering program mode (program setup) is performed next by setting the PSU bit in FLMCR1. The operating mode is then switched to program mode by setting the P bit in FLMCR1 after the elapse of at least (tspsu) s. The time during which the P bit is set is the flash memory programming time. Make a program setting so that the time for one programming operation is within the range of (tsp) s. The wait time after P bit setting must be changed according to the number of reprogramming loops. For details, see Notes on Program/Program-Verify Procedure.
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18.7.2
Program-Verify Mode
In program-verify mode, the data written in program mode is read to check whether it has been correctly written in the flash memory. After the elapse of the given programming time, clear the P bit in FLMCR1, then wait for at least (tcp) s before clearing the PSU bit to exit program mode. After exiting program mode, the watchdog timer setting is also cleared. The operating mode is then switched to program-verify mode by setting the PV bit in FLMCR1. Before reading in program-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of (tspv) s or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least (tspvr) s after the dummy write before performing this read operation. Next, the originally written data is compared with the verify data, and reprogram data is computed (see figure 18.13) and transferred to RAM. After verification of 128 bytes of data has been completed, exit program-verify mode, wait for at least (tcpv) s, then determine whether 128-byte programming has finished. If reprogramming is necessary, set program mode again, and repeat the program/program-verify sequence as before. The maximum value for repetition of the program/program-verify sequence is indicated by the maximum programming count (N). Leave a wait time of at least (tcswe) s after clearing SWE. Notes on Program/Program-Verify Procedure 1. The program/program-verify procedure for the H8/3048F-ONE is a 128-byte-unit programming algorithm. In order to perform 128-byte-unit programming, the lower 8 bits of the write start address must be H'00 or H'80. 2. When performing continuous writing of 128-byte data to flash memory, byte-unit transfer should be used. 128-byte data transfer is necessary even when writing fewer than 128 bytes of data. H'FF data must be written to the extra addresses. 3. Verify data is read in word units. 4. The write pulse is applied and a flash memory write executed while the P bit in FLMCR1 is set. In the H8/3048F-ONE, write pulses should be applied as follows in the program/programverify procedure to prevent voltage stress on the device and loss of write data reliability. a. After write pulse application, perform a verify-read in program-verify mode and apply a write pulse again for any bits read as 1 (reprogramming processing). When all the 0-write bits in the 128-byte write data are read as 0 in the verify-read operation, the program/program-verify procedure is completed. In the H8/3048F-ONE, the number of
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
loops in reprogramming processing is guaranteed not to exceed the maximum value of the maximum programming count (N). b. After write pulse application, a verify-read is performed in program-verify mode, and programming is judged to have been completed for bits read as 0. The following processing is necessary for programmed bits. When programming is completed at an early stage in the program/program-verify procedure: If programming is completed in the 1st to 6th reprogramming processing loop, additional programming should be performed on the relevant bits. Additional programming should only be performed on bits which first return 0 in a verify-read in certain reprogramming processing. When programming is completed at a late stage in the program/program-verify procedure: If programming is completed in the 7th or later reprogramming processing loop, additional programming is not necessary for the relevant bits. c. If programming of other bits is incomplete in the 128 bytes, reprogramming process should be executed. If a bit for which programming has been judged to be completed is read as 1 in a subsequent verify-read, a write pulse should again be applied to that bit. 5. The period for which the P bit in FLMCR1 is set (the write pulse width) should be changed according to the degree of progress through the program/program-verify procedure. For detailed wait time specifications, see section 21.1.6, Flash Memory Characteristics. Table 18.8 Wait Time after P Bit Setting
Item Wait time after P bit setting Symbol tsp Conditions When reprogramming loop count (n) is 1 to 6 When reprogramming loop count (n) is 7 or more In case of additional programming processing* Symbol tsp30 tsp200 tsp10
Note:
*
Additional programming processing is necessary only when the reprogramming loop count (n) is 1 to 6.
6. The program/program-verify flowchart for the H8/3048F-ONE is shown in figure 18.13. To cover the points noted above, bits on which reprogramming processing is to be executed, and bits on which additional programming is to be executed, must be determined as shown below. Since reprogram data and additional-programming data vary according to the progress of the programming procedure, it is recommended that the following data storage areas (128 bytes each) be provided in RAM.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Table 18.9 Reprogram Data Computation Table
Result of Verify-Read after Write Pulse (X) Application (V) Result of Operation 0 1 0 1 1 0 1 1
(D) 0 0 1 1
Comments Programming completed: reprogramming processing not to be executed Programming incomplete: reprogramming processing to be executed Still in erased state: no action
Legend: Source data of bits on which programming is executed: (D) Data of bits on which reprogramming is executed: (X)
Table 18.10 Additional-Programming Data Computation Table
Result of Verify-Read after Write Pulse (Y) Application (V) Result of Operation 0 0
X 0
Comments Programming by write pulse application judged to be completed: additional programming processing to be executed Programming by write pulse application incomplete: additional programming processing not to be executed Programming already completed: additional programming processing not to be executed Still in erased state: no action
0
1
1
1 1
0 1
1 1
Legend: Data of bits on which additional programming is executed: (Y) Data of bits on which reprogramming is executed in a certain reprogramming loop: (X')
7. It is necessary to execute additional programming processing during the course of the H8/3048F-ONE program/program-verify procedure. However, once 128-byte-unit programming is finished, additional programming should not be carried out on the same address area. When executing reprogramming, an erase must be executed first. Note that normal operation of reads, etc., is not guaranteed if additional programming is performed on addresses for which a program/program-verify operation has finished.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Write pulse application subroutine Sub-Routine Write Pulse WDT enable Set PSU in FLMCR1 Wait (tspsu) s Set P bit in FLMCR1 Wait (tsp) s Clear P bit in FLMCR1 Wait (tcp) s Clear PSU bit in FLMCR1 Wait (tcpsu) s Disable WDT End Sub *7 *7 Start of programming *5 *7 Programming halted *7
Start of programming START Set SWE bit in FLMCR1 Wait (tsswe) s Store 128-byte program data in program data area and reprogram data area n= 1 m= 0 Write 128-byte data in RAM reprogram data area consecutively to flash memory Sub-Routine-Call Write pulse Set PV bit in FLMCR1 Wait (tspv) s H'FF dummy write to verify address Wait (tspvr) s Read verify data *7 *2 NG *7 *1 *7 *4
Perform programming in the erased state. Do not perform additional programming on previously programmed addresses.
See Note 6 for pulse width
nn+1
Note: 6. Write Pulse Width Number of Writes n Write Time (tsp) sec 1 30 2 30 3 30 4 30 5 30 6 30 7 200 8 200 9 200 10 200 11 200 12 200 13 200
Increment address
Write data = verify data? OK
m=1 6n? OK Additional-programming data computation Transfer additional-programming data to additional-programming data area Reprogram data computation Transfer reprogram data to reprogram data area 128-byte data verification completed? OK Clear PV bit in FLMCR1 Wait (tcpv) s *7 *4 *3 *4 NG
NG 998 999 1000 200 200 200
Reprogram
Note: Use a 10 s write pulse for additional programming.
RAM Program data storage area (128 bytes)
NG 6 n? OK Successively write 128-byte data from additionalprogramming data area in RAM to flash memory *1 Sub-Routine-Call Write Pulse (Additional programming) m=0? OK Clear SWE bit in FLMCR1 Wait (tcswe) s End of programming NG *7 NG n N? OK Clear SWE bit in FLMCR1 Wait (tcswe) s Programming failure *7
Reprogram data storage area (128 bytes)
Additional-programming data storage area (128 bytes)
Notes: 1. Data transfer is performed by byte transfer. The lower 8 bits of the first address written to must be H'00 or H'80. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. 2. Verify data is read in 16-bit (word) units. 3. Reprogram data is determined by the operation shown in the table below (comparison between the data stored in the program data area and the verify data). Bits for which the reprogram data is 0 are programmed in the next reprogramming loop. Therefore, even bits for which programming has been completed will be subjected to programming once again if the result of the subsequent verify operation is NG. 4. A 128-byte area for storing program data, a 128-byte area for storing reprogram data, and a 128-byte area for storing additional data must be provided in RAM. The contents of the reprogram data area and additional data area are modified as programming proceeds. 5. A write pulse of 30 s or 200 s is applied according to the progress of the programming operation. See Note 6 for details of the pulse widths. When writing of additional-programming data is executed, a 10 s write pulse should be applied. Reprogram data X' means reprogram data when the write pulse is applied. 7. The wait times and value of N are shown in section 21.1.6, Flash Memory Characteristics. Reprogram Data Computation Table Original Data Verify Data Reprogram Data (D) (V) (X) 0 0 1 1 0 1 0 1 1 0 1 1 Still in erased state; no action Additional-Programming Data Computation Table Reprogram Data Verify Data Additional(X') (V) Programming Data (Y) 0 0 1 1 0 1 0 1 0 1 1 1
Comments Programming completed Programming incomplete; reprogram
Comments Additional programming to be executed Additional programming not to be executed Additional programming not to be executed Additional programming not to be executed
Figure 18.13 Program/Program-Verify Flowchart (128-Byte Programming)
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.7.3
Erase Mode
To erase an individual flash memory block, follow the flowchart for erasing one block (singleblock erase) shown in figure 18.14. The wait times after bits are set or cleared in the flash memory control register 1 (FLMCR1) and the maximum number of erase operations (N) are shown in table 21.11 in section 21.1.6, Flash Memory Characteristics. To erase flash memory contents, make a 1-bit setting for the flash memory area to be erased in erase block register (EBR1) at least (tsswe) s after setting the SWE bit to 1 in FLMCR1. Next, the watchdog timer (WDT) is set to prevent overerasing due to program runaway, etc. Set a value greater than (tse) ms + (tsesu + tce + tcesu) s as the WDT overflow period. Preparation for entering erase mode (erase setup) is performed next by setting the ESU bit in FLMCR1. The operating mode is then switched to erase mode by setting the E bit in FLMCR1 after the elapse of at least (tsesu) s. The time during which the E bit is set is the flash memory erase time. Ensure that the erase time does not exceed (tse) ms. Note: With flash memory erasing, preprogramming (setting all memory data in the memory to be erased to all 0) is not necessary before starting the erase procedure. 18.7.4 Erase-Verify Mode
In erase-verify mode, data is read after memory has been erased to check whether it has been correctly erased. After the elapse of the fixed erase time, clear the E bit in FLMCR1, then wait for at least (tce) s before clearing the ESU bit to exit erase mode. After exiting erase mode, the watchdog timer setting is also cleared. The operating mode is then switched to erase-verify mode by setting the EV bit in FLMCR1. Before reading in erase-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of (tsev) s or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least (tsevr) s after the dummy write before performing this read operation. If the read data has been erased (all 1), a dummy write is performed to the next address, and erase-verify is performed. If the read data is unerased, set erase mode again, and repeat the erase/erase-verify sequence as before. The maximum value for repetition of the erase/erase-verify sequence is indicated by the maximum erase count (N). When verification is completed, exit erase-verify mode, and wait for at least (tcev) s. If erasure has been completed on all the erase blocks, clear bit SWE1 in FLMCR1, and leave a wait time of at least (tcswe) s.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
If erasing multiple blocks, set a single bit in EBR for the next block to be erased, and repeat the erase/erase-verify sequence as before.
Start *1
Perform erasing in block units.
Set SWE bit in FLMCR1 Wait (tsswe) s n=1 Set EBR Enable WDT Set ESU bit in FLMCR1 Wait (tsesu) s Set E bit in FLMCR1 Wait (tse) ms Clear E bit in FLMCR1 Wait (tce) s Clear ESU bit in FLMCR1 Wait (tcesu) s Disable WDT Set EV bit in FLMCR1 Wait (tsev) s Set block start address as verify address *5 nn+1 *5 *5 Start of erase *5 Erase halted *5 *3, *4 *5
H'FF dummy write to verify address Wait (tsevr) s Increment address Read verify data Verify data = all 1s? Yes No Last address of block? Yes Clear EV bit in FLMCR1 Wait (tcev) s Clear EV bit in FLMCR1 Wait (tcev) s *5 n N? Clear SWE bit in FLMCR1 Wait (tcswe) s End of erasing Notes: 1. 2. 3. 4. 5. *5 Yes Clear SWE bit in FLMCR1 Wait (tcswe) s Erase failure No No *5 *2
*5
*5
*5
Prewriting (setting erase block data to all 0s) is not necessary. Verify data is read in 16-bit (word) units. Make only a single-bit specification in the erase block register (EBR). Two or more bits must not be set simultaneously. Erasing is performed in block units. To erase multiple blocks, each block must be erased in turn. The wait times and the value of N are shown in section 21.1.6, Flash Memory Characteristics.
Figure 18.14 Erase/Erase-Verify Flowchart (Single-Block Erasing)
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.8
Flash Memory Protection
There are three kinds of flash memory program/erase protection: hardware protection, software protection, and error protection. 18.8.1 Hardware Protection
Hardware protection refers to a state in which programming/erasing of flash memory is forcibly disabled or aborted. Hardware protection is reset by settings in flash memory control register 1 (FLMCR1), and erase block register (EBR). In the error-protected state, the FLMCR1, FLMCR2, and EBR settings are retained; the P and E bits can be set, but a transition is not made to program mode or erase mode. (See table 18.11.)
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Table 18.11 Hardware Protection
Functions Item FWE pin protection Reset/ standby protection Description * When a low level is input to the FWE pin, FLMCR1, and EBR are initialized, and the program/erase-protected state is entered. In a reset (including a WDT overflow reset) and in standby mode, FLMCR1, FLMCR2, and EBR are initialized, and the program/erase-protected state is entered. In a reset via the RES pin, the reset state is not entered unless the RES pin is held low until oscillation stabilizes after powering on. In the case of a reset during operation, hold the RES pin low for the RES pulse width specified in the 4 AC Characteristics section* . When a microcomputer operation error (error generation (FLER = 1)) was detected while flash memory was being programmed/erased, error protection is enabled. At this time, the FLMCR1 and EBR settings are held, but programming/ erasing is aborted at the time the error was generated. Error protection is released only by a reset via the RES pin or a WDT reset, or in the hardware standby mode. No No*
3
Program Erase
1 No* 3 No*
Verify No
*
No
No*
3
No
*
Error protection
*
Yes*
2
Notes: 1. Excluding a RAM area overlapping flash memory. 2. It is possible to perform a program-verify operation on the 128 bytes being programmed, or an erase-verify operation on the block being erased. 3. All blocks are unerasable and block-by-block specification is not possible. 4. See section 4.2.2, Reset Sequence, and section 18.11, Notes on Flash Memory Programming/Erasing. The H8/3048F-ONE requires at least 20 system clocks for a reset period during operation.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.8.2
Software Protection
Software protection can be implemented by setting, erase block register (EBR) and the RAMS bit in the RAM control register (RAMCR). When software protection is in effect, setting the P or E bit in flash memory control register 1 (FLMCR1) does not cause a transition to program mode or erase mode. (See table 18.12.) Table 18.12 Software Protection
Functions Item Block specification protection Description * Erase protection can be set for individual blocks by settings in erase block register 2 (EBR)* . However, programming protection is disabled. Setting EBR to H'00 places all blocks in the erase-protected state. Setting the RAMS bit to 1 in the RAM control register (RAMCR) places all blocks in the program/erase-protected state. No*
1
Program Erase -- No
Verify Yes
* Emulation protection *
No*
3
Yes
Notes: 1. A RAM area overlapping flash memory can be written to. 2. When not erasing, clear all EBR bits to 0. 3. All blocks are unerasable and block-by-block specification is not possible.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.8.3
Error Protection
In error protection, an error is detected when H8/3048F-ONE runaway occurs during flash 1 memory programming/erasing* , or operation is not performed in accordance with the program/erase algorithm, and the program/erase operation is aborted. Aborting the program/erase operation prevents damage to the flash memory due to overprogramming or overerasing. If the H8/3048F-ONE malfunctions during flash memory programming/erasing, the FLER bit is set to 1 in FLMCR2 and the error protection state is entered. The FLMCR1, FLMCR2, EBR 3 settings* are retained, but program mode or erase mode is aborted at the point at which the error occurred. Program mode or erase mode cannot be re-entered by re-setting the P, E bit. However, 2 PV, EV bit setting is enabled, and a transition can be made to verify mode* . FLER bit setting conditions are as follows: 1. When the flash memory of the relevant address area is read during programming/erasing (including vector read and instruction fetch) 2. Immediately after exception handling (excluding an illegal reset or trap instruction and exception handling at zero division) during programming/erasing 3. When a SLEEP instruction (including software standby) is executed during programming/erasing 4. When the CPU releases the bus to the DMAC, refresh controller, and external bus master during programming/erasing Error protection is released only by a reset (RES pin or WDT reset) and in hardware standby mode. Notes: 1. State in which the P bit or E bit in FLMCR1 is set to 1. Note that NMI input is disabled in this state. 2. It is possible to perform a program-verify operation on the 128 bytes being programmed, or an erase-verify on the block being erased. 3. FLMCR1 and EBR can be written to. However, the registers are initialized if a transition is made to software standby mode while in the error-protected state.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Program mode Erase mode RD VF PR ER FLER = 0
WDT reset, RES = 0 or STBY = 0
Reset or standby (hardware protection) RD VF PR ER INIT FLER = 0
Error occurrence (software standby) Error occurrence
WDT reset, RES = 0 or STBY = 0 WDT reset, RES = 0 or STBY = 0
FLMCR1, FLMCR2, EBR initialization state
Error protection mode RD VF PR ER FLER = 1
Software standby mode Software standby mode release
Error protection mode (software standby) RD VF PR ER INIT FLER = 1 FLMCR1, EBR initialization state
Legend: RD: Memory read possible VF: Verify-read possible PR: Programming possible ER: Erasing possible
RD: VF: PR: ER: INIT:
Memory read not possible Verify-read not possible Programming not possible Erasing not possible Register initialization state
Figure 18.15 Flash Memory State Transitions (When High Level Is Applied to FWE Pin in Mode 5, 6, and 7 (On-Chip ROM Enabled)) The error protection function is invalid for abnormal operations other than the FLER bit setting conditions. Also, if a certain time has elapsed before this protection state is entered, damage may already have been caused to the flash memory. Consequently, this function cannot provide complete protection against damage to flash memory. To prevent such abnormal operations, therefore, it is necessary to ensure correct operation in accordance with the program/erase algorithm, with the flash write enable (FWE) voltage applied, and to conduct constant monitoring for MCU errors, internally and externally, using the watchdog timer or other means. There may also be cases where the flash memory is in an erroneous programming or erroneous erasing state at the point of transition to this protection mode, or where programming or erasing is not properly carried out because of an abort. In cases such as these, a forced recovery (program rewrite) must be executed using boot mode. However, it may also happen that boot mode cannot be normally initiated because of overprogramming or overerasing.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.8.4
NMI Input Disable Conditions
While flash memory is being programmed/erased (P bit or E bit in FLMCR1 is set) and the boot 1 program is executing in the boot mode* , all interrupts including NMI input must be disabled because the programming/erasing have priority. This is done to avoid the following operation states: 1. Generation of an interrupt during programming/erasing violates the program/erase algorithms and normal operation can not longer be assured. 2 2. Vector-read cannot be carried out normally* during interrupt exception handling during programming/erasing and the microcomputer runs away as a result. 3. If an interrupt is generated during boot program execution, the normal boot mode sequence cannot be executed. With above reasons, there are conditions that exceptionally disable NMI inputs only in the onboard programming mode. However, this does not assure normal programming/erasing and microcomputer operation. Thus, when the flash memory is programmed/erased, all interrupt requests (exception handling and bus release), including NMI, inside and outside the microcomputer, must be disabled. NMI interrupt is also disabled in the error-protected state and when the P bit or E bit in FLMCR1 is retained during flash memory emulation by RAM. Notes: 1. Indicates the period up to branching to the on-chip RAM boot program area (H'FFEF10). (This branch occurs immediately after programming control program transfer was completed.) Therefore, after branching to RAM area, NMI input is enabled in states other than the program/erase state. Thus, interrupt requests inside and outside the microcomputer must be disabled until initial writing by programming control program (writing of vector table and NMI processing program, etc.) is completed. 2. In this case, vector read is not performed normally for the following two reasons: * * The correct value cannot be read even by reading the flash memory during programming/erasing (P bit or E bit in FLMCR1 is set). (Value is undefined.) If a value has not yet been written to the interrupt vector table, interrupt exception handling will not be performed correctly.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.9
Flash Memory Emulation in RAM
As flash memory programming and erasing takes time, it may be difficult to carry out tuning by writing parameters and other data in real time. In this case, real-time programming of flash memory can be emulated by overlapping part of RAM (H'FFF000-H'FFF3FF) onto a small block area in flash memory. This RAM area change is executed by means of bits 3 to 1 in the RAM control register (RAMCR). After the RAM area change, access is possible both from the area overlapped onto flash memory and from the original area (H'FFF000-H'FFF3FF). For details of RAMCR and the RAM area setting method, see section 18.5.4, RAM Control Register (RAMCR). Example of Emulation of Real-Time Flash Memory Programming In the following example, RAM area H'FFF000-H'FFF3FF is overlapped onto flash memory area EB2 (H'000800-H'000BFF).
Procedure: 1. Part of RAM (H'FFF000- H'FFF3FF) is overlapped onto the area (EB2) requiring real-time programming. (RAMCR bits 3-1 are set to 1, 1, 0, and the flash memory area to be overlapped (EB2) is selected.) 2. Real-time programming is performed using the overlapping RAM.
H'000000
Flash memory space Block area
Overlapping RAM EB2 H'000800 area H'000BFF H'000FFF * (Mapping RAM area)
H'FFEF10
3. The programmed data is checked, then RAM overlapping is cleared. (RAMS bit is cleared.) On-chip RAM area 4. The data written in RAM area H'FFF000-H'FFF3FF is written to flash memory space.
H'FFEFFF H'FFF000 H'FFF3FF H'FFF400 H'FFFF0F
(Actual RAM area)
Note: * When part of RAM (H'FFF000-H'FFF3FF) is overlapped onto a flash memory small block area, the flash memory in the overlapped area cannot be accessed. It can be accessed when the overlapping is cleared.
Figure 18.16 Example of RAM Overlap Operation
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Notes on Using the Emulation Function by RAM 1. When the RAMS bit is set to 1, program/erase protection is enabled for all blocks regardless of the value of RAM2 and RAM1 (emulation protection). In this state, setting the P or E bit in flash memory control register 1 (FLMCR1), will not cause a transition to program mode or erase mode. When actually programming or erasing a flash memory area, the RAMS bit should be cleared to 0. 2. A RAM area cannot be erased by execution of software in accordance with the erase algorithm while flash memory emulation in RAM is being used. 3. Block area EB0 includes the vector table. When performing RAM emulation, the vector table is needed by the overlap RAM. 4. Flash write enable (FWE) application and releasing As in on-board programming mode, care is required when applying and releasing FWE to prevent erroneous programming or erasing. To prevent erroneous programming and erasing due to program runaway during FWE application, in particular, the watchdog timer should be set when the PSU, P, ESU, or E bit in FLMCR1 is set to 1, even while the emulation function is being used. For details, see section 18.11, Notes on Flash Memory Programming/Erasing. 5. Prohibited conditions of NMI input When the emulation function is used, NMI input is prohibited when the P bit or E bit in FLMCR1 is set to 1, in the same way as with normal programming and erasing. The P and E bits are cleared by a reset (including a watchdog timer reset), in standby mode, when a high level is not being input to the FWE pin, or when the SWE bit in FLMCR1 is 0, while a high level is being input to the FWE pin.
18.10
Flash Memory PROM Mode
The H8/3048F-ONE has a PROM mode as well as the on-board programming modes for programming and erasing flash memory. In PROM mode, the on-chip ROM can be freely programmed using a general-purpose PROM writer that supports the Renesas Technology microcomputer device type with 128-kbyte on-chip flash memory.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.10.1 Socket Adapters and Memory Map In PROM mode using a PROM writer, memory reading (verification) and writing and flash memory initialization (total erasure) can be performed. For these operations, a special socket adapter is mounted in the PROM writer. The socket adapter product codes are given in table 18.13*. In the H8/3048F-ONE PROM mode, only the socket adapters shown in this table should be used. Table 18.13 H8/3048F-ONE Socket Adapter Product Codes
Product Code HD64F3048BF HD64F3048BVF HD64F3048BTE HD64F3048BVTE HD64F3048BF HD64F3048BVF HD64F3048BTE HD64F3048BVTE Note: * Package 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) Socket Adapter Product Code* ME3064ESHF1H ME3024ESHF1H ME3064ESNF1H ME3024ESNF1H HF306BQ100D4001 HF302BQ100D4001 HF306BT100D4001 HF302BT100D4001 Data IO Japan Manufacturer Minato Electronics
Use of the wrong socket adapter may destroy the chip.
Figure 18.17 shows the memory map in PROM mode.
MCU mode H'000000 H8/3048F-ONE PROM mode H'00000
On-chip ROM
H'01FFFF
H'1FFFF
Figure 18.17 Memory Map in PROM Mode
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.10.2 Notes on Use of PROM Mode 1. A write to a 128-byte programming unit in PROM mode should be performed once only. Erasing must be carried out before reprogramming an address that has already been programmed. 2. When using a PROM writer to reprogram a device on which on-board programming/erasing has been performed, it is recommended that erasing be carried out before executing programming. 3. The memory is initially in the erased state when the device is shipped by Renesas. For samples for which the erasure history is unknown, it is recommended that erasing be executed to check and correct the initialization (erase) level. 4. The H8/3048F-ONE does not support a product identification mode as used with generalpurpose EPROMs, and therefore the device name cannot be set automatically in the PROM writer. 5. Refer to the instruction manual provided with the socket adapter, or other relevant documentation, for information on PROM writers and associated program versions that are compatible with the PROM mode of the H8/3048F-ONE. 6. Select a Renesas Technology 128 kbytes flash memory on-board microcomputer device type. If HN28F101 is selected, the LSI may be permanently damaged.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.11
Notes on Flash Memory Programming/Erasing
The following describes notes when using the on-board programming mode, RAM emulation function, and PROM mode. 1. Program/erase with the specified voltage and timing. Applied voltages in excess of the rating can permanently damage the device. Note that the pins FWE, VPP, and MD2 have different absolute maximum ratings between the H8/3048F-ONE (single power supply) and H8/3048F (dual power supply) models. Use a PROM writer that supports the Renesas Technology 128 kbytes flash memory on-board microcomputer device type. Do not select the HN28F101 as the PROM writer. Otherwise, 12 V will be applied to the FWE pin and this will permanently damage H8/3048F-ONE. 2. Notes on powering on/powering off (see figures 18.18 to 18.20) Input a high level to the FWE pin after verifying Vcc. Before turning off Vcc, set the FWE pin to a low level. When powering on and powering off the Vcc power supply, fix the FWE pin low and set the flash memory to the hardware protection mode. Be sure that the powering on and powering off timing is satisfied even when the power is turned off and back on in the event of a power interruption, etc. If this timing is not satisfied, microcomputer runaway, etc., may cause overprogramming or overerasing and the memory cells may not operate normally. 3. Notes on FWE pin High/Low switching (see figures 18.18 to 18.20) Input FWE in the state microcomputer operation is verified. If the microcomputer does not satisfy the operation confirmation state, fix the FWE pin low to set the protection mode. To prevent erroneous programming/erasing of flash memory, note the following in FWE pin High/Low switching: a. Apply an input to the FWE pin after the Vcc voltage has stabilized within the rated voltage. If an input is applied to the FWE pin when the microcomputer Vcc voltage does not satisfy the rated voltage, flash memory may be erroneously programmed or erased because the microcomputer is in the unconfirmed state. b. Apply an input to the FWE pin when the oscillation has stabilized (after the oscillation stabilization time). When turning on the Vcc power, apply an input to the FWE pin after holding the RES pin at a low level during the oscillation stabilization time. Do not apply an input to the FWE pin when oscillation is stopped or unstable.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
c. In the boot mode, perform FWE pin High/Low switching during reset. In transition to the boot mode, input FWE = high level and set MD2 to MD0 and RXD1 pins while the RES input is low. At this time, the FWE, MD2 to MD0, and RXD1 inputs must satisfy the mode programming setup time (tMDS) relative to the reset clear timing. The mode programming setup time is necessary for RES reset timing even in transition from the boot mode to another mode. In reset during operation, the RES pin must be held at a low level for at least 20 system clocks. d. In the user program mode, FWE = High/Low switching is possible regardless of the RES input. FWE input switching is also possible during program execution on flash memory. e. Apply an input to FWE when the program is not running away. When applying an input to the FWE pin, the program execution state must be supervised using a watchdog timer, etc. f. Release FWE pin input only when the SWE, ESU, PSU, EV, PV, E, and P bits in FLMCR1 are cleared. Do not erroneously set any of bits SWE, ESU, PSU, EV, PV, E, or P when applying or releasing FWE. 4. Do not input a constant high level to the FWE pin. To prevent erroneous programming/erasing in the event of program runaway, etc., input a high level to the FWE pin only when programming/erasing flash memory (including flash memory emulation by RAM). Avoid system configurations that constantly input a high level to the FWE pin. Handle program runaway, etc. by starting the watchdog timer so that flash memory is not overprogrammed/overerased even while a high level is input to the FWE pin. 5. Program/erase the flash memory in accordance with the recommended algorithms. The recommended algorithms can program/erase the flash memory without applying voltage stress to the device or sacrificing the reliability of the program data. When setting the P and E bits in FLMCR1, set the watchdog timer for program runaway, etc. Accesses to flash memory by means of an MOV instruction, etc., are prohibited while bit P or bit E is set. 6. Do not set/clear the SWE bit while a program is executing on flash memory. Before performing flash memory program execution or data read, clear the SWE bit. If the SWE bit is set, the flash data can be reprogrammed, but flash memory cannot be accessed for purposes other than verify (verify during programming/erase).
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Similarly perform flash memory program execution and data read after clearing the SWE bit even when using the RAM emulation function with a high level input to the FWE pin. However, RAM area that overlaps flash memory space can be read/programmed whether the SWE bit is set or cleared. After the SWE bit is cleared, waiting time is required. For details, refer to table 21.11 in section 21.1.6, Flash Memory Characteristics. 7. Do not use an interrupt during flash memory programming or erasing. Since programming/erase operations (including emulation by RAM) have priority when a high level is input to the FWE pin, disable all interrupt requests, including NMI. The bus release should also be disabled. 8. Do not perform additional programming. Reprogram flash memory after erasing. With on-board programming, program to 128-byte programming unit blocks one time only. Erase all the programming unit blocks before reprogramming. 9. Before programming, check that the chip is correctly mounted in the PROM programmer. Overcurrent damage to the device can result if the index marks on the PROM programmer socket, socket adapter, and chip are not correctly aligned. 10. Do not touch the socket adapter or chip during programming. Touching either of these can cause contact faults and write errors. 11. A wait time of 100 s or more is necessary when performing a read after a transition to normal mode from program, erase, or verify mode. 12. Use byte access on the registers that control the flash memory (FLMCR1, FLMCR2, EBR, and RAMCR).
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Programming and erase possible Wait time: x Wait time: y
tOSC1 VCC Min 0 s
FWE
tMDS
Min 0 s
MD2 to MD0*1, RXD1*3 RES
tMDS
SWE set SWE bit SWE clear
Flash memory access disabled period (x: Wait time after SWE setting, y: wait time after SWE clearing)*2 Flash memory reprogrammable period (Flash memory program execution and data read, other than verify, are disabled.) Notes: 1. Always fix the level by pulling down or pulling up the mode pins (MD2 to MD0) until powering off, except for mode switching. 2. See section 21.1.6, Flash Memory Characteristics. 3. For pins RXD1 and TXD1, use on-board pull-up.
Figure 18.18 Powering On/Off Timing (Boot Mode)
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Programming and erase possible Wait time: x Wait time: y
tOSC1 VCC Min 0 s
FWE
MD2 to MD0*1 tMDS RES SWE set SWE bit SWE clear
Flash memory access disabled period (x: Wait time after SWE setting, y: wait time after SWE clearing)*2 Flash memory reprogrammable period (Flash memory program execution and data read, other than verify, are disabled.) Notes: 1. Always fix the level by pulling down or pulling up the mode pins (MD2 to MD0) up to powering off, except for mode switching. 2. See section 21.1.6, Flash Memory Characteristics.
Figure 18.19 Powering On/Off Timing (User Program Mode)
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Programming and erase possible
Wait time: x Programming and erase possible Wait time: y
Wait time: x Programming and erase possible Wait time: y
tOSC1 VCC
Min 0 s
FWE tMDS * tMDS2
MD2 to MD0, RXD1*4
tMDS tRESW
RES
SWE set
SWE bit
Mode switching*1 Boot mode
SWE clear
Mode User switching*1 mode
User program mode
User mode
User program mode
Flash memory access disabled time (x: Wait time after SWE setting, y: wait time after SWE clearing)*3 Flash memory reprogammable period (Flash memory program execution and data read, other than verify, are disabled.) Notes: 1. In transition to the boot mode and transition from the boot mode to another mode, mode switching via RES input is necessary. During this switching period (period during which a low level is input to the RES pin),the state of the address dual port and bus control output signals (CSn, AS, RD, WR) changes. Therefore, do not use these pins as output signals during this switching period. 2. When making a transition from the boot mode to another mode, the mode programming setup time tMDS relative to the RES clear timing is necessary. 3. See section 21.1.6, Flash Memory Characteristics. 4. For pin RXD1, use on-board pull-up.
Figure 18.20 Mode Transition Timing (Example: Boot mode User mode User program mode)
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Programming and erase possible
Wait time: x
Wait time: y
Wait time: x
Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.12
Mask ROM (H8/3048B Mask ROM Version) Overviews
18.12.1 Block Diagram Figure 18.21 shows a block diagram of the ROM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'00000 H'00002
H'00001 H'00003 On-chip ROM
H'1FFFE Even addresses
H'1FFFF Odd addresses
Figure 18.21 ROM Block Diagram (H8/3048B Mask ROM Version)
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.13
Notes on Ordering Mask ROM Version Chips
When ordering H8/3048B with mask ROM, note the following. 1. When ordering by means of an EPROM, use a 128-kbyte one. 2. Fill all unused addresses with H'FF and order the same ROM data size as for the 128-kbyte version. This applies to ordering by means of an EPROM and by means of data transmission.
HD6433048B (ROM: 128 kbytes) Addresses: H'00000-1FFFF H'00000
Unused area*
H'1FFFF Note: * Write H'FF data in all addresses in this area.
Figure 18.22 Mask ROM Addresses and Data 3. The flash memory control registers (FLMCR, EBR, RAMCR, FLMSR, FLMCR1, FLMCR2, EBR1, and EBR2)used by the versions with on-chip flash memory are not provided in the mask ROM versions. Reading the corresponding addresses in a mask ROM version will always return 1s, and writes to these addresses are disabled. This must be borne in mind when switching from a flash memory version to a mask ROM version.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.14
Notes when Converting the F-ZTAT (Single Power Supply) Application Software to the Mask-ROM Versions
Please note the following when converting the F-ZTAT (single power supply) application software to the mask-ROM versions. The values read from the internal registers (refer to appendix B, Internal I/O Register, Table B.1) for the F-ZTAT (single power supply) version differ as follows.
Status Register FLMCR1 Bit FWE F-ZTAT (Single Power Supply) Version 0: Application software running 1: Programming Mask-ROM Version 0: Is not read out 1: Application software running
Note: This difference applies to all the F-ZTAT (single power supply) versions and all the maskROM versions that have different ROM size.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
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Section 19 Clock Pulse Generator
Section 19 Clock Pulse Generator
19.1 Overview
The H8/3048B Group has a built-in clock pulse generator (CPG) that generates the system clock () and other internal clock signals (/2 to /4096). After duty adjustment, a frequency divider divides the clock frequency to generate the system clock (). The system clock is output at the 1 pin* and furnished as a master clock to prescalers that supply clock signals to the on-chip supporting modules. Frequency division ratios of 1/1, 1/2, 1/4, and 1/8 can be selected for the frequency divider by settings in a division control register (DIVCR). Power consumption in the 2 chip is reduced in almost direct proportion to the frequency division ratio* . Notes: 1. Usage of the pin differs depending on the chip operating mode and the PSTOP bit setting in the module standby control register (MSTCR). For details, see section 20.7, System Clock Output Disabling Function. 2. The division ratio of the frequency divider can be changed dynamically during operation. The clock output at the pin also changes when the division ratio is changed. The frequency output at the pin is shown below. = EXTAL x n where, EXTAL: Frequency of crystal resonator or external clock signal n: Frequency division ratio (n = 1/1, 1/2, 1/4, or 1/8)
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Section 19 Clock Pulse Generator
19.1.1
Block Diagram
Figure 19.1 shows a block diagram of the clock pulse generator.
CPG XTAL Oscillator EXTAL
Duty adjustment circuit
Frequency divider
Prescalers
Division control register
Data bus
/2 to /4096
Figure 19.1 Block Diagram of Clock Pulse Generator
19.2
Oscillator Circuit
Clock pulses can be supplied by connecting a crystal resonator, or by input of an external clock signal. 19.2.1 Connecting a Crystal Resonator
Circuit Configuration A crystal resonator can be connected as in the example in figure 19.2. The damping resistance Rd should be selected according to table 19.1, and external capacitance CL1 or CL2 to table 19.2. An AT-cut parallel-resonance crystal should be used.
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Section 19 Clock Pulse Generator
C L1 EXTAL
XTAL Rd C L2
Figure 19.2 Connection of Crystal Resonator (Example) If a crystal resonator with a frequency higher than 20 MHz in the case of the 5 V version, or 13 MHz in the case of the 3 V version, is connected, the external load capacitance values in table 19.2 should not exceed 10 [pF]. Also, in order to improve the accuracy of the oscillation frequency, a thorough study of oscillation matching evaluation, etc., should be carried out when deciding the circuit constants. Table 19.1 Damping Resistance Value
Damping Resistance Value Rd () H8/3048B Group Frequency f (MHz) 2 1k 2 < f 4 4 < f 8 8 < f 10 10 < f 13 13 < f 16 16 < f 18 18 < f 25 500 200 0 0 0 0 0
Note: A crystal resonator between 2 MHz and 25 MHz can be used. If the chip is to be operated at less than 2 MHz, the on-chip frequency divider should be used. (A crystal resonator of less than 2 MHz cannot be used.)
Table 19.2 External Capacitance Values
External Capacitance Value Frequency f (MHz) CL1 = CL2 (pF) 5 V Version 20 < f 25 10 2 f 20 10 to 22 3 V Version 2 f 13 10 to 22 13 < f 25 10
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Section 19 Clock Pulse Generator
Crystal Resonator Figure 19.3 shows an equivalent circuit of the crystal resonator. The crystal resonator should have the characteristics listed in table 19.3.
CL L XTAL Rs EXTAL
C0
AT-cut parallel-resonance type
Figure 19.3 Crystal Resonator Equivalent Circuit Table 19.3 Crystal Resonator Parameters
Frequency (MHz) Rs max () C0 max (pF) 2 500 4 120 8 80 10 70 12 60 7 16 50 18 40 20 40 25 40
Use a crystal resonator with a frequency equal to the system clock frequency (). Notes on Board Design When a crystal resonator is connected, the following points should be noted: Other signal lines should be routed away from the oscillator circuit to prevent induction from interfering with correct oscillation. See figure 19.4. When the board is designed, the crystal resonator and its load capacitors should be placed as close as possible to the XTAL and EXTAL pins.
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Section 19 Clock Pulse Generator
Avoid C L2
Signal A
Signal B H8/3048B Group XTAL
EXTAL C L1
Figure 19.4 Example of Incorrect Board Design 19.2.2 External Clock Input
Circuit Configuration An external clock signal can be input as shown in the examples in figure 19.5. The external clock is input from the EXTAL pin. If the XTAL pin is left open, the stray capacitance should not exceed 10 pF. If the stray capacitance at the XTAL pin exceeds 10 pF in configuration a, use configuration b instead and hold the clock high in standby mode.
EXTAL
External clock input
XTAL
Open
a. XTAL pin left open
EXTAL 74HC04 XTAL
External clock input
b. Complementary clock input at XTAL pin
Figure 19.5 External Clock Input (Examples)
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Section 19 Clock Pulse Generator
External Clock The external clock frequency should be equal to the system clock frequency () when not divided by the on-chip frequency divider. Table 19.4, figures 19.6 and 19.7 indicate the clock timing. When the appropriate external clock is input via the EXTAL pin, its waveform is corrected by the on-chip oscillator and duty adjustment circuit. The resulting stable clock is output to external devices after the external clock settling time (tDEXT) has passed after the clock input. The system must remain reset with the reset signal low during tDEXT, while the clock output is unstable. Table 19.4(1) Clock Timing for H8/3048B Group (8 MHz f 25 MHz)
VCC = 3.0 V to 3.6 V Item External clock input low pulse width External clock input high pulse width External clock rise time External clock fall time Clock low pulse width Clock high pulse width External clock output settling delay time Note: * Symbol Min tEXL tEXH tEXr tEXf tCL tCH tDEXT* tcyc/2-5 tcyc/2-5 -- -- 0.4 0.4 500 Max -- -- 5 5 0.6 0.6 -- VCC = 5.0 V 10% Min tcyc/2-5 tcyc/2-5 -- -- 0.4 0.4 500 Max -- -- 5 5 0.6 0.6 -- Unit ns ns ns ns tcyc tcyc s Figure 19.7 Figure 21.7
Test Conditions Figure 19.6
tDEXT includes a RES pulse width (tRESW). tRESW = 20 tcyc
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Section 19 Clock Pulse Generator
Table 19.4(2) Clock Timing for H8/3048B Group (2 MHz f < 8 MHz)
VCC = 3.0 V to 3.6 V Item External clock input low pulse width External clock input high pulse width External clock rise time External clock fall time Clock low pulse width Clock high pulse width External clock output settling delay time Note: * Symbol tEXL Min 57 Max -- VCC = 5.0 V 10% Min 57 Max -- Unit ns Test Conditions Figure 19.6
tEXH
57
--
57
--
ns
tEXr tEXf tCL tCH tDEXT*
-- -- 0.4 80 0.4 80 500
5 5 0.6 -- 0.6 -- --
-- -- 0.4 80 0.4 80 500
5 5 0.6 -- 0.6 -- --
ns ns tcyc ns tcyc ns s 5 MHz < 5 MHz 5 MHz < 5 MHz Figure 19.7 Figure 21.7
tDEXT includes a RES pulse width (tRESW). tRESW = 20 tcyc
tEXH
tEXL
VCC x 0.7
EXTAL VCC x 0.5
0.3 V
tEXr tEXf
Figure 19.6 External Clock Input Timing
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Section 19 Clock Pulse Generator
VCC
STBY EXTAL
VIH
(internal or external) RES tDEXT
Figure 19.7 External Clock Output Settling Delay Timing
19.3
Duty Adjustment Circuit
When the oscillator frequency is 5 MHz or higher, the duty adjustment circuit adjusts the duty cycle of the clock signal from the oscillator to generate the signal that becomes the system clock.
19.4
Prescalers
The prescalers divide the system clock () to generate internal clocks (/2 to /4096).
19.5
Frequency Divider
The frequency divider divides the duty-adjusted clock signal to generate the system clock (). The frequency division ratio can be changed dynamically by modifying the value in DIVCR, as described below. Power consumption in the chip is reduced in almost direct proportion to the frequency division ratio. The system clock generated by the frequency divider can be output at the pin.
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Section 19 Clock Pulse Generator
19.5.1
Register Configuration
Table 19.5 summarizes the frequency division register. Table 19.5
Address* H'FF5D Note: *
Frequency Division Register
Name Division control register Abbreviation DIVCR R/W R/W Initial Value H'FC
The lower 16 bits of the address are shown.
19.5.2
Division Control Register (DIVCR)
DIVCR is an 8-bit readable/writable register that selects the division ratio of the frequency divider.
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 1 2 1 1 DIV1 0 R/W 0 DIV0 0 R/W
Reserved bits Divide bits 1 and 0 These bits select the frequency division ratio
DIVCR is initialized to H'FC by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 2--Reserved: Read-only bits, always read as 1. Bits 1 and 0--Divide (DIV1 and DIV0): These bits select the frequency division ratio, as follows.
Bit 1: DIV1 0 1 Bit 0: DIV0 0 1 0 1 Frequency Division Ratio 1/1 1/2 1/4 1/8 (Initial value)
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Section 19 Clock Pulse Generator
19.5.3
Usage Notes
The DIVCR setting changes the frequency, so note the following points. * Select a frequency division ratio that stays within the assured operation range specified for the clock cycle time tcyc in the AC electrical characteristics. Note that MIN must be in the lower limit of the clock frequency range. Avoid settings that give system clock frequencies less than the lower limit. Table 19.6 shows the comparison with the clock frequency range for each version. Table 19.6 Comparison with the Clock Frequency Ranges in the H8/3048 Group and H8/3048B Group
ROM type F-ZTAT ZTAT H8/3048 Mask ROM Version Mask ROM H8/3047 H8/3045 H8/3044 H8/3048B Mask Mask Mask Mask ROM ROM ROM ROM Version Version Version Version 1-18 MHz 1-13 MHz 1-8 MHz -- 2-18 MHz 2-25 MHz -- -- 2-25 MHz 2-25 MHz
Product type
H8/3048 H8/3048F H8/3048 F-ONE 2-25 MHz -- -- 2-25 MHz 2-25 MHz 1-8 MHz -- 2-16 MHz 1-16 MHz 1-18 MHz 1-13 MHz 1-8 MHz -- 2-18 MHz
Guaranteed 4.5-5.5 V clock frequency 3.15-5.5 V range 2.7-5.5 V 3.0-3.6 V Crystal oscillation range
* All on-chip module operations are based on . Note that the timing of timer operations, serial communication, and other time-dependent processing differs before and after any change in the division ratio. The waiting time for exit from software standby mode also changes when the division ratio is changed. For details, see section 20.4.3, Selection of Waiting Time for Exit from Software Standby Mode.
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Section 20 Power-Down State
Section 20 Power-Down State
20.1 Overview
The H8/3048B Group has a power-down state that greatly reduces power consumption by halting the CPU, and a module standby function that reduces power consumption by selectively halting on-chip modules. The power-down state includes the following three modes: * Sleep mode * Software standby mode * Hardware standby mode The module standby function can halt on-chip supporting modules independently of the powerdown state. The modules that can be halted are the ITU, SCI0, SCI1, DMAC, refresh controller, and A/D converter. Table 20.1 indicates the methods of entering and exiting the power-down modes and module standby mode, and gives the status of the CPU and on-chip supporting modules in each mode.
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State CPU Halted Held Active Active Active Active Active Active Active Held output Held * Interrupt * RES * STBY CPU Registers DMAC SCI0 SCI1 A/D I/O Ports Refresh Controller ITU Other Modules RAM Clock Output Exiting Conditions
Mode
Entering Conditions
Clock
Sleep mode
SLEEP instruction executed while SSBY = 0 in SYSCR Held Halted and reset Halted and held*1 Halted and reset Halted and reset Halted and reset Halted and reset Halted and reset Held High output Held
Active
Section 20 Power-Down State
Software SLEEP standby instruction mode executed while SSBY = 1 in SYSCR Undetermined Halted and reset Halted and reset Halted and reset Halted and reset Halted and reset Halted and reset Halted*2 Halted*2 Halted*2 Halted*2 Active and and and and reset reset reset reset Halted*2 Halted*2 and and reset held*1 Halted and reset Held*3 High impedance
Halted Halted
* NMI * IRQ0 to IRQ2 * RES * STBY
Hardware Low input at standby STBY pin mode Active
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High * STBY impedance * RES High impedance*2 * STBY * RES * Clear MSTCR bit to 0*4
Halted Halted
Module standby
Corresponding Active bit set to 1 in MSTCR
Legend: SYSCR: System control register SSBY: Software standby bit MSTCR: Module standby control register
Table 20.1 Power-Down State and Module Standby Function
Notes: 1. 2. 3. 4.
RTCNT and bits 7 and 6 of RTMCSR are initialized. Other bits and registers hold their previous states. State in which the corresponding MSTCR bit was set to 1. For details see section 20.2.2, Module Standby Control Register (MSTCR). The RAME bit must be cleared to 0 in SYSCR before the transition from the program execution state to hardware standby mode. When a MSTCR bit is set to 1, the registers of the corresponding on-chip supporting module are initialized. To restart the module, first clear the MSTCR bit to 0, then set up the module registers again.
Section 20 Power-Down State
20.2
Register Configuration
The H8/3048B Group has a system control register (SYSCR) that controls the power-down state, and a module standby control register (MSTCR) that controls the module standby function. Table 20.2 summarizes these registers. Table 20.2 Control Register
Address* H'FFF2 H'FF5E Note: * Name System control register Module standby control register Lower 16 bits of the address. Abbreviation SYSCR MSTCR R/W R/W R/W Initial Value H'0B H'40
20.2.1
Bit
System Control Register (SYSCR)
7 SSBY 0 R/W 6 STS2 0 R/W 5 STS1 0 R/W 4 STS0 0 R/W 3 UE 1 R/W 2 NMIEG 0 R/W 1 1 0 RAME 1 R/W RAM enable
Initial value Read/Write
Reserved bit NMI edge select User bit enable Standby timer select 2 to 0 These bits select the waiting time at exit from software standby mode Software standby Enables transition to software standby mode
SYSCR is an 8-bit readable/writable register. Bit 7 (SSBY) and bits 6 to 4 (STS2 to STS0) control the power-down state. For information on the other SYSCR bits, see section 3.3, System Control Register (SYSCR).
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Section 20 Power-Down State
Bit 7--Software Standby (SSBY): Enables transition to software standby mode. When software standby mode is exited by an external interrupt, this bit remains set to 1 after the return to normal operation. To clear this bit, write 0.
Bit 7: SSBY 0 1 Description SLEEP instruction causes transition to sleep mode SLEEP instruction causes transition to software standby mode (Initial value)
Bits 6 to 4--Standby Timer Select (STS2 to STS0): These bits select the length of time the CPU and on-chip supporting modules wait for the clock to settle when software standby mode is exited by an external interrupt. If the clock is generated by a crystal resonator, set these bits according to the clock frequency so that the waiting time will be at least 7 ms. See table 20.3. If an external clock is used, select the setting so that the waiting time is 100 s or more according to the clock frequency.
Bit 6: STS2 0 Bit 5: STS1 0 1 1 0 1 Bit 4: STS0 0 1 0 1 0 1 0 1 Description Waiting time = 8,192 states Waiting time = 16,384 states Waiting time = 32,768 states Waiting time = 65,536 states Waiting time = 131,072 states Waiting time = 262,144 states Waiting time = 1,024 states Illegal setting (Initial value)
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Section 20 Power-Down State
20.2.2
Module Standby Control Register (MSTCR)
MSTCR is an 8-bit readable/writable register that controls output of the system clock (). It also controls the module standby function, which places individual on-chip supporting modules in the standby state. Module standby can be designated for the ITU, SCI0, SCI1, DMAC, refresh controller, and A/D converter modules.
Bit Initial value Read/Write 7 PSTOP 0 R/W 6 1 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
MSTOP5 MSTOP4 MSTOP3 MSTOP2 MSTOP1 MSTOP0
Reserved bit clock stop Enables or disables output of the system clock
Module standby 5 to 0 These bits select modules to be placed in standby
MSTCR is initialized to H'40 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7-- Clock Stop (PSTOP): Enables or disables output of the system clock ().
Bit 1: PSTOP 0 1 Description System clock output is enabled System clock output is disabled (Initial value)
Bit 6--Reserved: Read-only bit, always read as 1. Bit 5--Module Standby 5 (MSTOP5): Selects whether to place the ITU in standby.
Bit 5: MSTOP5 0 1 Description ITU operates normally ITU is in standby state (Initial value)
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Section 20 Power-Down State
Bit 4--Module Standby 4 (MSTOP4): Selects whether to place SCI0 in standby.
Bit 4: MSTOP4 0 1 Description SCI0 operates normally SCI0 is in standby state (Initial value)
Bit 3--Module Standby 3 (MSTOP3): Selects whether to place SCI1 in standby.
Bit 3: MSTOP3 0 1 Description SCI1 operates normally SCI1 is in standby state (Initial value)
Bit 2--Module Standby 2 (MSTOP2): Selects whether to place the DMAC in standby.
Bit 2: MSTOP2 0 1 Description DMAC operates normally DMAC is in standby state (Initial value)
Bit 1--Module Standby 1 (MSTOP1): Selects whether to place the refresh controller in standby.
Bit 1: MSTOP1 0 1 Description Refresh controller operates normally Refresh controller is in standby state (Initial value)
Bit 0--Module Standby 0 (MSTOP0): Selects whether to place the A/D converter in standby.
Bit 0: MSTOP0 0 1 Description A/D converter operates normally A/D converter is in standby state (Initial value)
Rev. 3.00 Sep 27, 2006 page 644 of 872 REJ09B0325-0300
Section 20 Power-Down State
20.3
20.3.1
Sleep Mode
Transition to Sleep Mode
When the SSBY bit is cleared to 0 in SYSCR, execution of the SLEEP instruction causes a transition from the program execution state to sleep mode. Immediately after executing the SLEEP instruction the CPU halts, but the contents of its internal registers are retained. The DMA controller (DMAC), refresh controller, and on-chip supporting modules do not halt in sleep mode. Modules which have been placed in standby by the module standby function, however, remain halted. 20.3.2 Exit from Sleep Mode
Sleep mode is exited by an interrupt, or by input at the RES or STBY pin. Exit by Interrupt: An interrupt terminates sleep mode and causes a transition to the interrupt exception handling state. Sleep mode is not exited by an interrupt source in an on-chip supporting module if the interrupt is disabled in the on-chip supporting module. Sleep mode is not exited by an interrupt other than NMI if the interrupt is masked by the I and UI bits in CCR and IPR. Exit by RES Input: Low input at the RES pin exits from sleep mode to the reset state. Exit by STBY Input: Low input at the STBY pin exits from sleep mode to hardware standby mode.
20.4
20.4.1
Software Standby Mode
Transition to Software Standby Mode
To enter software standby mode, execute the SLEEP instruction while the SSBY bit is set to 1 in SYSCR. In software standby mode, current dissipation is reduced to an extremely low level because the CPU, clock, and on-chip supporting modules all halt. The DMAC and on-chip supporting modules are reset. As long as the specified voltage is supplied, however, CPU register contents and on-chip RAM data are retained. The settings of the I/O ports and refresh controller* are also held. Note: * RTCNT and bits 7 and 6 of RTMCSR are initialized. Other bits and registers hold their previous states.
Rev. 3.00 Sep 27, 2006 page 645 of 872 REJ09B0325-0300
Section 20 Power-Down State
When the WDT is used as a watchdog timer (WT/IT = 1), the TME bit must be cleared to 0 before setting SSBY. Also, when setting TME to 1, SSBY should be cleared to 0. Clear the BRLE bit in BRCR (inhibiting bus release) before making a transition to software standby mode. 20.4.2 Exit from Software Standby Mode
Software standby mode can be exited by input of an external interrupt at the NMI, IRQ0, IRQ1, or IRQ2 pin, or by input at the RES or STBY pin. Exit by Interrupt: When an NMI, IRQ0, IRQ1, or IRQ2 interrupt request signal is received, the clock oscillator begins operating. After the oscillator settling time selected by bits STS2 to STS0 in SYSCR, stable clock signals are supplied to the entire chip, software standby mode ends, and interrupt exception handling begins. Software standby mode is not exited if the interrupt enable bits of interrupts IRQ0, IRQ1, and IRQ2 are cleared to 0, or if these interrupts are masked in the CPU. Exit by RES Input: When the RES input goes low, the clock oscillator starts and clock pulses are supplied immediately to the entire chip. The RES signal must be held low long enough for the clock oscillator to stabilize. When RES goes high, the CPU starts reset exception handling. Exit by STBY Input: Low input at the STBY pin causes a transition to hardware standby mode. 20.4.3 Selection of Waiting Time for Exit from Software Standby Mode
Bits STS2 to STS0 in SYSCR and bits DIV1 and DIV0 in DIVCR should be set as follows. Crystal Resonator: Set STS2 to STS0, DIV1, and DIV0 so that the waiting time (for the clock to stabilize) is at least 7 ms. Table 20.3 indicates the waiting times that are selected by STS2 to STS0, DIV1, and DIV0 settings at various system clock frequencies. Refer to the clock frequency and the waiting time in which it takes for the clock to settle, as shown in table 20.3. External Clock: Set bits STS2 to STS0, Bits DIV0, and DIV1 so that the waiting time is 100 s or more.
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Section 20 Power-Down State
Table 20.3 Clock Frequency and Waiting Time for Clock to Settle
DIV1 DIV0 STS2 STS1 STS0 Waiting Time 25 MHz 20 MHz 18 MHz 16 MHz 12 MHz 10 MHz 8 MHz 6 MHz 4 MHz 2 MHz Unit 0 0 0 0 0 0 1 1 1 1 0 1 0 0 0 0 1 1 1 1 1 0 0 0 0 0 1 1 1 1 1 1 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 8192 states 16384 states 32768 states 65536 states 2.6 5.2 10.5 21.0* 3.3 6.6 13.1* 26.2 52.4 104.9 0.41 3.6 7.3* 14.6 29.1 58.3 116.5 0.46 4.1 8.2* 16.4 32.8 65.5 131.1 0.51 8192 states 16384 states 32768 states 65536 states 1.3 2.6 5.2 10.5* 1.6 3.3 6.6 13.1* 26.2 52.4 0.20 1.8 3.6 7.3* 14.6 29.1 58.3 0.23 2.0 4.1 8.2* 16.4 32.8 65.5 0.26 8192 states 16384 states 32768 states 65536 states 0.7 1.3 2.6 5.2 0.8 1.6 3.3 6.6 13.1* 26.2 0.10 0.91 1.8 3.6 7.3* 14.6 29.1 0.11 1.02 2.0 4.1 8.2* 16.4 32.8 0.13 8192 states 16384 states 32768 states 65536 states 0.3 0.7 1.3 2.6 0.4 0.8 1.6 3.3 6.6 13.1* 0.05 0.46 0.91 1.8 3.6 7.3* 14.6 0.057 0.51 1.0 2.0 4.1 8.2* 16.4 0.064 0.65 1.3 2.7 5.5 10.9* 21.8 0.085 1.4 2.7 5.5 10.9* 21.8 43.7 0.17 2.7 5.5 10.9* 21.8 43.7 87.4 0.34 5.5 10.9* 21.8 43.7 87.4 174.8 0.68 0.8 1.6 3.3 6.6 13.1* 26.2 0.10 1.6 3.3 6.6 13.1* 26.2 52.4 0.20 3.3 6.6 13.1* 26.2 52.4 104.9 0.41 6.6 13.1* 26.2 52.4 104.9 209.7 0.82 1.0 2.0 4.1 8.2* 16.4 32.8 0.13 2.0 4.1 8.2* 16.4 32.8 65.5 0.26 4.1 8.2* 16.4 32.8 65.5 0.51 8.2* 16.4 32.8 65.5 1.3 2.7 5.5 21.8 43.7 0.17 2.7 5.5 21.8 43.7 87.4 0.34 5.5 21.8 43.7 87.4 0.68 2.0 4.1 8.2* 32.8 65.5 0.26 4.1 8.2* 32.8 65.5 0.51 8.2* 32.8 65.5 4.1 8.2* 16.4 32.8 65.5 131.1 0.51 8.2* 16.4 32.8 65.5 131.1 1.0 16.4* 32.8 65.5 131.1 ms ms ms
10.9* 16.4
131072 states 5.2 262144 states 10.5* 1024 states 0.04
Illegal setting
10.9* 16.4
131072 states 10.5* 262144 states 21.0 1024 states 0.08
131.1 262.1
Illegal setting 10.9* 16.4
131072 states 21.0 262144 states 41.9 1024 states 0.16
131.1 262.1 1.02 2.0 ms
131.1 174.8 262.1 524.3
Illegal setting 10.9* 16.4* 32.8* 21.8 43.7 87.4 32.8 65.5 65.5 131.1
131.1 262.1
131072 states 41.9 262144 states 83.9 1024 states 0.33
131.1 174.8 262.1 524.3 262.1 349.5 524.3 1048.6 1.0 1.4 2.0 4.1
Illegal setting
Note: * Recommended setting
Rev. 3.00 Sep 27, 2006 page 647 of 872 REJ09B0325-0300
Section 20 Power-Down State
20.4.4
Sample Application of Software Standby Mode
Figure 20.1 shows an example in which software standby mode is entered at the fall of NMI and exited at the rise of NMI. With the NMI edge select bit (NMIEG) cleared to 0 in SYSCR (selecting the falling edge), an NMI interrupt occurs. Next the NMIEG bit is set to 1 (selecting the rising edge) and the SSBY bit is set to 1; then the SLEEP instruction is executed to enter software standby mode. Software standby mode is exited at the next rising edge of the NMI signal.
Clock oscillator NMI NMIEG SSBY
NMI interrupt handler NMIEG = 1 SSBY = 1
Software standby mode (powerdown state)
Oscillator settling time (tosc2)
NMI exception handling
SLEEP instruction
Figure 20.1 NMI Timing for Software Standby Mode (Example) 20.4.5 Note
The I/O ports retain their existing states in software standby mode. If a port is in the high output state, its output current is not reduced.
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Section 20 Power-Down State
20.5
20.5.1
Hardware Standby Mode
Transition to Hardware Standby Mode
Regardless of its current state, the chip enters hardware standby mode whenever the STBY pin goes low. Hardware standby mode reduces power consumption drastically by halting all functions of the CPU, DMAC, refresh controller, and on-chip supporting modules. All modules are reset except the on-chip RAM. As long as the specified voltage is supplied, on-chip RAM data is retained. I/O ports are placed in the high-impedance state. Clear the RAME bit to 0 in SYSCR before STBY goes low to retain on-chip RAM data. The inputs at the mode pins (MD2 to MD0) should not be changed during hardware standby mode. 20.5.2 Exit from Hardware Standby Mode
Hardware standby mode is exited by inputs at the STBY and RES pins. While RES is low, when STBY goes high, the clock oscillator starts running. RES should be held low long enough for the clock oscillator to settle. When RES goes high, reset exception handling begins, followed by a transition to the program execution state. 20.5.3 Timing for Hardware Standby Mode
Figure 20.2 shows the timing relationships for hardware standby mode. To enter hardware standby mode, first drive RES low, then drive STBY low. To exit hardware standby mode, first drive STBY high, wait for the clock to settle, then bring RES from low to high.
Rev. 3.00 Sep 27, 2006 page 649 of 872 REJ09B0325-0300
Section 20 Power-Down State
Clock oscillator RES
STBY
Oscillator settling time Reset exception handling
Figure 20.2 Hardware Standby Mode Timing
20.6
20.6.1
Module Standby Function
Module Standby Timing
The module standby function can halt several of the on-chip supporting modules (the ITU, SCI0, SCI1, DMAC, refresh controller, and A/D converter) independently of the power-down state. This standby function is controlled by bits MSTOP5 to MSTOP0 in MSTCR. When one of these bits is set to 1, the corresponding on-chip supporting module is placed in standby and halts at the beginning of the next bus cycle after the MSTCR write cycle. 20.6.2 Read/Write in Module Standby
When an on-chip supporting module is in module standby, read/write access to its registers is disabled. Read access always results in H'FF data. Write access is ignored.
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Section 20 Power-Down State
20.6.3
Usage Notes
When using the module standby function, note the following points. DMAC and Refresh Controller: When setting bit MSTOP2 or MSTOP1 to 1 to place the DMAC or refresh controller in module standby, make sure that the DMAC or refresh controller is not currently requesting the bus right. If bit MSTOP2 or MSTOP1 is set to 1 when a bus request is present, operation of the bus arbiter becomes ambiguous and a malfunction may occur. Internal Peripheral Module Interrupt: When MSTCR is set to 1, prevent module interrupt in advance. When an on-chip supporting module is placed in standby by the module standby function, its registers, including the interrupt flag, are initialized. Pin States: Pins used by an on-chip supporting module lose their module functions when the module is placed in module standby. What happens after that depends on the particular pin. For details, see section 9, I/O Ports. Pins that change from the input to the output state require special care. For example, if SCI1 is placed in module standby, the receive data pin loses its receive data function and becomes a generic I/O pin. If its data direction bit is set to 1, the pin becomes a data output pin, and its output may collide with external serial data. Data collisions should be prevented by clearing the data direction bit to 0 or taking other appropriate action. Register Resetting: When an on-chip supporting module is halted by the module standby function, all its registers are initialized. To restart the module, after its MSTCR bit is cleared to 0, its registers must be set up again. It is not possible to write to the registers while the MSTCR bit is set to 1. MSTCR Access from DMAC Disabled: To prevent malfunctions, MSTCR can only be accessed from the CPU. It can be read by the DMAC, but it cannot be written by the DMAC.
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Section 20 Power-Down State
20.7
System Clock Output Disabling Function
Output of the system clock () can be controlled by the PSTOP bit in MSTCR. When the PSTOP bit is set to 1, output of the system clock halts and the pin is placed in the high-impedance state. Figure 20.3 shows the timing of the stopping and starting of system clock output. When the PSTOP bit is cleared to 0, output of the system clock is enabled. Table 20.4 indicates the state of the pin in various operating states.
MSTCR write cycle (PSTOP = 1) T1 pin High-impedance T2 T3 MSTCR write cycle (PSTOP = 0) T1 T2 T3
Figure 20.3 Starting and Stopping of System Clock Output Table 20.4 Pin State in Various Operating States
PSTOP = 0 High-impedance Always high System clock output System clock output PSTOP = 1 High-impedance High-impedance High-impedance High-impedance
Operating State Hardware standby Software standby Sleep mode Normal operation
Rev. 3.00 Sep 27, 2006 page 652 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
Section 21 Electrical Characteristics
Table 21.1 shows the electrical characteristics of the various products in the H8/3048 Group and H8/3048B Group. Table 21.1 Electrical Characteristics of H8/3048 Group and H8/3048B Group Products
H8/3048 Group Item Symbol Unit H8/3048 F-ZTAT (Dual Power Supply) 1 to 16 H8/3048 H8/3047 H8/3045 H8/3044 1 to 18 H8/3048B Group H8/3048 F-ONE H8/3048B Mask (Single ROM Power Supply) 2 to 25 (5 V operation model) -- -- 2 to 25 (3 V operation model) -20 to +75*1 -40 to +85*1 -- Yes Cannot be connected to power supply*2 (5 V operation model only) 2 to 25 (5 V operation model) -- -- 2 to 25 (3 V operation model) -20 to +75*1 -40 to +85*1 -- -- Cannot be connected to power supply*2 (5 V operation model only)
H8/3048 ZTAT
Operating range
VCC = 4.5 to 5.5 V
MHz
1 to 18
VCC = 3.15 to 5.5 V VCC = 2.7 to 5.5 V VCC = 3.0 to 3.6 V
-- 1 to 8 --
1 to 13 1 to 8 --
1 to 13 1 to 8 --
Operating Regular temperature specifications range Wide-range specifications Absolute maximum ratings VPP pin rating FWE pin rating VCL pin
Topr
C
-20 to +75 -20 to +75 -20 to +75 -40 to +85 -40 to +85 -40 to +85
Vin
Yes -- --
-- -- --
Yes -- --
Rev. 3.00 Sep 27, 2006 page 653 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
H8/3048 Group Item Symbol Unit H8/3048 F-ZTAT (Dual Power Supply) -0.3 to +7.0 H8/3048 H8/3047 H8/3045 H8/3044 -0.3 to +7.0 H8/3048B Group H8/3048 F-ONE H8/3048B Mask (Single Power ROM Supply) -0.3 to +7.0 (5 V operation model) -0.3 to +4.6 (3 V operation model) DC characteristics RESO pin specification FWE pin specification Determination level for applying high voltage (12 V) Standby current (Ta 50C) Standby current (50C < Ta) AC characteristics Clock cycle time RES pulse width RESO output delay time RESO output pulse width Flash memory characteristics*4 tcyc tRESW tRESD tRESOW ns tcyc ns tcyc ICC*3 A Yes -- Yes Yes -- -- Yes -- -- -- Yes -- -0.3 to +7.0 (5 V operation model) -0.3 to +4.6 (3 V operation model) Yes -- --
H8/3048 ZTAT
Absolute maximum ratings
Power supply voltage
Vin
V
-0.3 to +7.0
Max 5 Max 20 Max 1000 Min 10 Max 100 Min 132 Refer to the H8/3048 Group Hardware Manual (revision 7.0) for details.
Max 5 Max 20 Max 1000 Min 10 Max 100 Min 132 --
Max 5 Max 20 Max 1000 Min 10 Max 100 Min 132 --
Max 10 Max 80 Max 500 Min 20 -- -- See table 21.11
Max 10 Max 80 Max 500 Min 20 -- -- --
Notes: 1. 2. 3. 4.
The operating temperature range for flash memory programming/erasing is 0C to +75. Connect an external capacitor between the VCL pin and GND. See the DC Characteristics table for current dissipation during operation. Refer to the program/erase algorithms for details of flash memory characteristics.
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Section 21 Electrical Characteristics
21.1
21.1.1
Electrical Characteristics of H8/3048F-ONE (Single-Power Supply)
Absolute Maximum Ratings
Table 21.2 lists the absolute maximum ratings. Table 21.2 Absolute Maximum Ratings
Item Power supply voltage Input voltage (FWE)* Input voltage (port 7) Reference voltage Analog power supply voltage Analog input voltage Operating temperature Storage temperature
2
Symbol
1 VCC*
Value 5 V operation model: -0.3 to +7.0 3 V operation model: -0.3 to +4.6 -0.3 to VCC +0.3 -0.3 to VCC +0.3 -0.3 to AVCC +0.3 -0.3 to AVCC +0.3 5 V operation model: -0.3 to +7.0 3 V operation model: -0.3 to +4.6 -0.3 to AVCC +0.3
3 Regular specifications: -20 to +75* 3 Wide-range specifications: -40 to +85*
Unit V V V V V V V C C
Vin Vin Vin VREF AVCC VAN Topr Tstg
2 Input voltage (except for port 7)*
-55 to +125
Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded. Notes: 1. Do not apply the power supply voltage to the VCL pin in 5 V operation models. Connect an external capacitor between this pin and GND. 2. 12 V must not be applied to any pin, as this may cause permanent damage to the device. 3. The operating temperature range for flash memory programming/erasing is 0C to +75C.
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Section 21 Electrical Characteristics
21.1.2
DC Characteristics
Table 21.3 lists the DC characteristics. Table 21.4 lists the permissible output currents. Table 21.3 DC Characteristics (1) Conditions: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC, 1 VSS = AVSS = 0 V* , Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications), (Ta = 0C to +75C during program/erase)
Item Schmitt trigger input voltages Input high voltage Port A, P82 to P80, PB3 to PB0 RES, STBY, FWE, NMI, MD2 to MD0 EXTAL Port 7 Ports 1 to 6, 9, P84, P83, PB7 to PB4 Input low voltage RES, STBY, MD2 to MD0, FWE NMI, EXTAL, ports 1 to 7, 9, P84, P83, PB7 to PB4 Output high voltage Output low voltage Input leakage current All output pins All output pins Ports 1, 2, 5, and B STBY, NMI, RES, FWE, MD2 to MD0 Port 7 |Iin| VOH VOL VIL Symbol VT VT
- + + -
Min 1.0 -- 0.4 VCC -0.7 VCC x 0.7 2.0 2.0
Typ -- -- -- --
Max -- VCC x 0.7 -- VCC +0.3
Unit Test Conditions V V V V
VT - VT VIH
-- -- --
VCC +0.3 VCC +0.3
V V
AVCC +0.3 V
-0.3
--
0.5
V
-0.3
--
0.8
V
VCC -0.5 3.5 -- -- --
-- -- -- -- --
-- -- 0.4 1.0 1.0
V V V V A
IOH = -200 A IOH = -1 mA IOL = 1.6 mA IOL = 10 mA Vin = 0.5 to VCC -0.5 V Vin = 0.5 to AVCC -0.5 V
--
--
1.0
A
Rev. 3.00 Sep 27, 2006 page 656 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics Item Three-state leakage current (off state) Ports 1 to 6, 8 to B Symbol |ITSI| Min -- Typ -- Max 1.0 Unit Test Conditions A Vin = 0.5 to VCC -0.5 V
Input pull-up Ports 2, 4, MOS current and 5 Input FWE capacitance NMI All input pins except NMI, FWE Current Normal 2 5 dissipation* operation* Sleep mode Module standby 4 mode*
3 Standby mode*
-IP Cin
50 -- -- --
-- -- -- --
300 60 50 15
A pF pF pF
Vin = 0 V VIN = 0 V, f = fmin, Ta = 25C
6 ICC*
-- -- -- -- --
45 35 20 1 -- 0.5 0.5 0.01 0.4 1.5 0.01 --
60 50 25 10 80 1.5 1.5 5.0 0.8 3.0 5.0 --
mA mA mA A A mA mA A mA mA A V
f = 25 MHz
Ta 50C 50C < Ta AVCC = 5.0 V
Analog power supply current
During A/D conversion During A/D and D/A conversion Idle
AICC
-- -- --
DASTE = 0 VREF = 5.0 V
Reference current
During A/D conversion During A/D and D/A conversion Idle
AICC
-- -- --
DASTE = 0
RAM standby voltage
VRAM
2.0
Notes: 1. If the A/D and D/A converters are not used, do not leave the AVCC, AVSS, and VREF pins open. Connect AVCC and VREF to VCC, and connect AVSS to VSS. 2. Current dissipation values are for VIH min = VCC -0.5 V and VIL max = 0.5 V with all output pins unloaded and the on-chip pull-up transistors in the off state. 3. The values are for VRAM VCC < 4.5 V, VIH min = VCC x 0.9, and VIL max = 0.3 V. 4. Module standby current values apply in sleep mode with all modules halted. 5. The current dissipation value for flash memory program/erase operations (Ta = 0C to +75C) is 10 mA (max.) greater than the current dissipation value for normal operation.
Rev. 3.00 Sep 27, 2006 page 657 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics 6. ICC depends on VCC and f, according to the following expressions. ICC max. (normal operation) = 10.0 [mA] + 0.36 [mA/(MHz x V)] x VCC x f ICC max. (sleep mode) = 10.0 [mA] + 0.29 [mA/(MHz x V)] x VCC x f ICC max. (sleep mode and module standby mode) = 10.0 [mA] + 0.11 [mA/(MHz x V)] x VCC x f The typical values of current dissipation are reference values.
Rev. 3.00 Sep 27, 2006 page 658 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
Table 21.3 DC Characteristics (2) Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, 1 VSS = AVSS = 0 V* , Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications), (Ta = 0C to +75C during program/erase)
Item Schmitt trigger input voltages Input high voltage Port A, P82 to P80, PB3 to PB0 RES, STBY, FWE, NMI, MD2 to MD0 EXTAL Port 7 Ports 1 to 6, 9, P84, P83, PB7 to PB4 Input low voltage RES, STBY, MD2 to MD0, FWE NMI, EXTAL, ports 1 to 7, 9, P84, P83, PB7 to PB4 Output high voltage Output low voltage Input leakage current All output pins All output pins Ports 1, 2, 5, and B STBY, NMI, RES, FWE, MD2 to MD0 Port 7 Three-state leakage current (off state) Ports 1 to 6, 8 to B |ITSI| |Iin| VOH VOL VIL Symbol VT VT
- + + -
Min VCC x 0.2 -- VCC x 0.9
Typ -- -- --
Max -- VCC x 0.7 -- VCC +0.3
Unit Test Conditions V V V V
VT - VT VIH
VCC x 0.05 --
VCC x 0.7 VCC x 0.7 VCC x 0.7
-- -- --
VCC +0.3 VCC +0.3
V V
AVCC +0.3 V
-0.3
--
VCC x 0.1
V
-0.3
--
VCC x 0.2
V
VCC -0.5 VCC -1.0 -- -- --
-- -- -- -- --
-- -- 0.4 1.0 1.0
V V V V A
IOH = -200 A IOH = -1 mA IOL = 1.6 mA IOL = 5 mA Vin = 0.5 to VCC -0.5 V Vin = 0.5 to AVCC -0.5 V Vin = 0.5 to VCC -0.5 V
-- --
-- --
1.0 1.0
A A
Rev. 3.00 Sep 27, 2006 page 659 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics Item Input pull-up Ports 2, 4, MOS current and 5 Input FWE capacitance NMI All input pins except NMI, FWE Current Normal 2 5 dissipation* operation* Sleep mode Module standby 4 mode*
3 Standby mode* 6 ICC*
Symbol -IP Cin
Min 10 -- -- --
Typ -- -- -- --
Max 300 60 50 15
Unit Test Conditions A pF pF pF Vin = 0 V Vin = 0 V, f = fmin, Ta = 25C
-- -- -- -- --
40 30 20 1 -- 0.5 0.5 0.01 0.4 1.5 0.01 --
60 50 25 10 80 1.5 1.5 5 0.8 3 5 --
mA mA mA A A mA mA A mA mA A V
f = 25 MHz
Ta 50C 50C < Ta AVCC = 3.3 V
Analog power supply current
During A/D conversion During A/D and D/A conversion Idle
AICC
-- -- --
DASTE = 0 VREF = 3.3 V
Reference current
During A/D conversion During A/D and D/A conversion Idle
AICC
-- -- --
DASTE = 0
RAM standby voltage
VRAM
2.0
Notes: 1. If the A/D and D/A converters are not used, do not leave the AVCC, AVSS, and VREF pins open. Connect AVCC and VREF to VCC, and connect AVSS to VSS. 2. Current dissipation values are for VIH min = VCC -0.5 V and VIL max = 0.5 V with all output pins unloaded and the on-chip pull-up transistors in the off state. 3. The values are for VRAM VCC < 3.0 V, VIH min = VCC x 0.9, and VIL max = 0.3 V. 4. Module standby current values apply in sleep mode with all modules halted. 5. The current dissipation value for flash memory program/erase operations (Ta = 0C to +75C) is 10 mA (max.) greater than the current dissipation value for normal operation. 6. ICC depends on VCC and f, according to the following expressions. ICC max. (normal operation) = 6.0 [mA] + 0.60 [mA/(MHz x V)] x VCC x f ICC max. (sleep mode) = 6.0 [mA] + 0.49 [mA/(MHz x V)] x VCC x f ICC max. (sleep mode and module standby mode) = 6.0 [mA] + 0.21 [mA/(MHz x V)] x VCC x f The typical values of current dissipation are reference values.
Rev. 3.00 Sep 27, 2006 page 660 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
Table 21.4 Permissible Output Currents Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC, VSS = AVSS = 0 V, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications)
Conditions A, B Item Permissible output low current (per pin) Permissible output low current (total) Ports 1, 2, 5, and B Other output pins Total of 28 pins in ports 1, 2, 5, and B Total of all output pins, including the above Permissible output high current (per pin) Permissible output high current (total) All output pins Total of all output pins IOH IOH IOL Symbol IOL Min -- -- -- -- -- -- Typ -- -- -- -- -- -- Max 10 2.0 80 120 2.0 40 Unit mA mA mA mA mA mA
Notes: 1. To protect chip reliability, do not exceed the output current values in table 21.4. 2. When driving a darlington pair or LED, always insert a current-limiting resistor in the output line, as shown in figures 21.1 and 21.2.
Rev. 3.00 Sep 27, 2006 page 661 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
H8/3048F-ONE
2 k Port
Darlington pair
Figure 21.1 Darlington Pair Drive Circuit (Example)
H8/3048F-ONE
Ports 1, 2, 5, and B
600
LED
Figure 21.2 LED Drive Circuit (Example)
Rev. 3.00 Sep 27, 2006 page 662 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
21.1.3
AC Characteristics
Bus timing parameters are listed in table 21.5. Refresh controller bus timing parameters are listed in table 21.6. Control signal timing parameters are listed in table 21.7. Timing parameters of the on-chip supporting modules are listed in table 21.8. Table 21.5 Bus Timing Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications)
Condition A 25 MHz Item Clock cycle time Clock pulse low width Clock pulse high width Clock rise time Clock fall time Address delay time Address hold time Symbol tcyc tCL tCH tCR tCF tAD tAH Min 40 10 10 -- -- -- 0.5tcyc -20 -- -- -- 1.0tcyc -25 1.5tcyc -25 0.5tcyc -20 1.0tcyc -20 15 0 Max 500 -- -- 10 10 28 -- 25 25 25 -- -- -- -- -- -- Min 40 10 10 -- -- -- 0.5tcyc -20 -- -- -- 1.0tcyc -25 1.5tcyc -25 0.5tcyc -20 1.0tcyc -20 15 0 Condition B 25 MHz Max 500 -- -- 10 10 25 -- 25 25 25 -- -- -- -- -- -- Unit ns Test Conditions Figure 21.7 Figure 21.8
Address strobe delay time tASD Write strobe delay time Strobe delay time Write data strobe pulse width 1 Write data strobe pulse width 2 Address setup time 1 Address setup time 2 Read data setup time Read data hold time tWSD tSD tWSW1 tWSW2 tAS1 tAS2 tRDS tRDH
Rev. 3.00 Sep 27, 2006 page 663 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
Condition A 25 MHz Item Write data delay time Write data setup time 1 Write data setup time 2 Write data hold time Read data access time 1 Read data access time 2 Read data access time 3 Read data access time 4 Precharge time Wait setup time Wait hold time Bus request setup time Bus acknowledge delay time 1 Bus acknowledge delay time 2 Bus-floating time Symbol tWDD tWDS1 tWDS2 tWDH tACC1 tACC2 tACC3 tACC4 tPCH tWTS tWTH tBRQS tBACD1 tBACD2 tBZD Min -- 1.0tcyc -30 0.5tcyc -30 0.5tcyc -15 -- -- -- -- 1.0tcyc -20 25 5 25 -- -- -- Max 35 -- -- -- 1.5tcyc -40 2.5tcyc -40 1.0tcyc -28 2.0tcyc -32 -- -- -- -- 30 30 40 Min -- 1.0tcyc -30 0.5tcyc -30 0.5tcyc -15 -- -- -- -- 1.0tcyc -20 25 5 25 -- -- -- Condition B 25 MHz Max 35 -- -- -- 1.5tcyc -40 2.5tcyc -40 1.0tcyc -28 2.0tcyc -32 -- -- -- -- 30 30 40 ns Figure 21.21 ns Figure 21.9 Unit ns Test Conditions Figure 21.7 Figure 21.8
Rev. 3.00 Sep 27, 2006 page 664 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
Table 21.6 Refresh Controller Bus Timing Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications)
Condition A 25 MHz Item RAS delay time 1*1 RAS delay time 2*1 RAS delay time 3*1 Row address hold time RAS precharge time*1 CAS to RAS precharge time*1 *2 CAS pulse width*2 RAS access time*1 Address access time CAS access time*2 Write data setup time 3 CAS setup time*2 Read strobe delay time Signal rise time (all input pins except EXTAL) Signal fall time (all input pins except EXTAL) Symbol tRAD1 tRAD2 tRAD3 tRAH tRP tCRP tCAS tRAC tAA tCAC tWDS3 tCSR tRSD tSR tSF Min -- -- -- 0.5tcyc -5 1.0tcyc -15 1.0tcyc -15 1.0tcyc -18 -- -- -- 1.0tcyc -25 0.5tcyc -15 -- -- -- Max 20 20 20 -- -- -- -- 2.0tcyc -35 1.5tcyc -40 1.0tcyc -30 -- -- 25 100 100 Min -- -- -- 0.5tcyc -5 1.0tcyc -15 1.0tcyc -15 1.0tcyc -18 -- -- -- 1.0tcyc -25 0.5tcyc -15 -- -- -- Condition B 25 MHz Max 18 18 18 -- -- -- -- 2.0tcyc -35 1.5tcyc -40 1.0tcyc -30 -- -- 25 100 100 ns Figure 21.18 Unit ns Test Conditions Figure 21.10 to Figure 21.16
Notes: 1. The RAS pin is assigned to the CS3 pin. 2. The CAS pin is assigned to the RD pin.
Rev. 3.00 Sep 27, 2006 page 665 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
Table 21.7 Control Signal Timing Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications)
Condition A 25 MHz Item RES setup time RES pulse width Mode programming setup time NMI setup time (NMI, IRQ5 to IRQ0) NMI hold time (NMI, IRQ5 to IRQ0) Interrupt pulse width (NMI, IRQ2 to IRQ0 when exiting software standby mode) Clock oscillator settling time at reset (crystal) Clock oscillator settling time in software standby (crystal) Symbol tRESS tRESW tMDS tNMIS tNMIH tNMIW Min 200 20 200 150 10 200 Max -- -- -- -- -- -- Min 200 20 200 150 10 200 Condition B 25 MHz Max -- -- -- -- -- -- Unit ns tcyc ns ns Figure 21.20 Test Conditions Figure 21.18
tOSC1 tOSC2
20 7
-- --
20 7
-- --
ms ms
Figure 21.22 Figure 20.1
Rev. 3.00 Sep 27, 2006 page 666 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
Table 21.8 Timing of On-Chip Supporting Modules Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications)
Condition A 25 MHz Item DMAC DREQ setup time DREQ hold time TEND delay time 1 TEND delay time 2 ITU Timer output delay time Timer input setup time Timer clock input setup time Timer clock pulse width SCI Input clock cycle Single edge Both edges Asynchronous Synchronous Symbol tDRQS tDRQH tTED1 tTED2 tTOCD tTICS tTCKS tTCKWH tTCKWL tSCYC tSCYC tSCKr tSCKf tSCKW tTXD tRXS tRXH tRXH tPWD tPRS tPRH Min 20 10 -- -- -- 40 40 1.5 2.5 4 6 -- -- 0.4 -- 100 100 0 -- 50 50 Max -- -- 50 50 50 -- -- -- -- -- -- 1.5 1.5 0.6 100 -- -- -- 50 -- -- Min 20 10 -- -- -- 40 40 1.5 2.5 4 6 -- -- 0.4 -- 100 100 0 -- 50 50 Condition B 25 MHz Max -- -- 50 50 50 -- -- -- -- -- -- 1.5 1.5 0.6 100 -- -- -- 50 -- -- ns Figure 21.23 tSCYC ns Figure 21.27 tCYC Figure 21.26 tCYC Figure 21.25 ns Figures 21.28 and 21.29 Figure 21.24 Unit ns Test Conditions Figure 21.30
Input clock rise time Input clock fall time Input clock pulse width Transmit data delay time Receive data setup time (synchronous) Receive data hold time (synchronous) Ports and TPC Clock input Clock output
Output data delay time Input data setup time Input data hold time
Rev. 3.00 Sep 27, 2006 page 667 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
RL H8/3048F-ONE output pin
C = 90 pF: ports 4, 5, 6, 8, A (19 to 0), D (15 to 8), C = 30 pF: ports 9, A, B R L = 2.4 k R H = 12 k
C
RH
Input/output timing measurement levels * Low: 0.8 V * High: 2.0 V
Figure 21.3 Output Load Circuit
Rev. 3.00 Sep 27, 2006 page 668 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
21.1.4
A/D Conversion Characteristics
Table 21.9 lists the A/D conversion characteristics. Table 21.9 A/D Converter Characteristics Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications)
Condition A 25 MHz Item Resolution Conversion time (single mode) Analog input capacitance Permissible signal-source impedance Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy 13 MHz > 13 MHz Min 10 5.36 -- -- -- -- -- -- -- -- Typ 10 -- -- -- -- -- -- -- -- -- Max 10 -- 20 10 5 3.5 3.5 3.5 0.5 4.0 Min 10 5.36 -- -- -- -- -- -- -- -- Condition B 25 MHz Typ 10 -- -- -- -- -- -- -- -- -- Max 10 -- 20 10 5 3.5 3.5 3.5 0.5 4.0 LSB LSB LSB LSB LSB Unit bits s pF k
Rev. 3.00 Sep 27, 2006 page 669 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
21.1.5
D/A Conversion Characteristics
Table 21.10 lists the D/A conversion characteristics. Table 21.10 D/A Converter Characteristics Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications)
Condition A 25 MHz Item Resolution Conversion time (centering time) Absolute accuracy Min 8 -- -- -- Typ 8 -- 2.0 -- Max 8 10 3.0 2.0 Min 8 -- -- -- Condition B 25 MHz Typ 8 -- 1.5 -- Max 8 10 2.0 1.5 Unit bits s LSB LSB 20-pF capacitive load 2-M resistive load 4-M resistive load Test Conditions
Rev. 3.00 Sep 27, 2006 page 670 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
21.1.6
Flash Memory Characteristics
Table 21.11 lists the flash memory characteristics. Table 21.11 Flash Memory Characteristics (1) Conditions: VCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, VREF = 4.5 V to AVCC, VSS = AVSS = 0 V, Ta = 0C to +75C (program/erase operating temperature range)
Symbol tP tE NWEC tsswe tspsu tsp30 tsp200 tsp10 Min -- -- -- 1 50 28 198 8 Typ 10 100 -- 1 50 30 200 10 Max 200 Unit ms/ 128 bytes Times s s s s s Programming time wait Programming time wait Additional programming time wait Notes
Item Programming time*1 *2 *4 Erase time*1 *3 *5 Reprogramming count Programming Wait time after SWE bit setting*1 Wait time after PSU bit setting*1 Wait time after P bit setting*1 *4
1200 ms/block 100 -- -- 32 202 12
Wait time after P bit clear*1 Wait time after PSU bit clear*1 Wait time after PV bit setting*1
tcp tcpsu
5 5 4 2 2 100 -- 1 100 10 10 10 20 2 4 100 12
5 5 4 2 2 100 -- 1 100 10 10 10 20 2 4 100 --
-- -- -- -- -- -- -- 100 -- -- -- -- -- 120
s s s s s s s s ms s s s s s s Times Erase time wait
tspv Wait time after H'FF dummy write*1 tspvr Wait time after PV bit clear*1 tcpv *1 Wait time after SWE bit clear t Erase Maximum programming count*1 *4 Wait time after SWE bit setting*1 Wait time after ESU bit setting*1 Wait time after E bit setting*1 *5 Wait time after E bit clear*1 Wait time after ESU bit clear*1 Wait time after EV bit setting*1 N
cswe
1000 Times
tsswe tsesu tse tce tcesu tsev
Wait time after H'FF dummy write*1 tsevr Wait time after EV bit clear*1 tcev *1 Wait time after SWE bit clear t Maximum erase count*1 *5 N
cswe
Rev. 3.00 Sep 27, 2006 page 671 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics Notes: 1. Set the times according to the program/erase algorithms. 2. Programming time per 128 bytes. (Shows the total time the P bit in the flash memory control register (FLMCR1) is set. It does not include the programming verification time.) 3. Block erase time. (Shows the total time the E bit in FLMCR1 is set. It does not include the erase verification time.) 4. To specify the maximum programming time value (tP(max)) in the 128-byte programming algorithm, set the max. value (1000) for the maximum programming count (N). The wait time after P bit setting should be changed as follows according to the value of the programming counter (n). Programming counter (n) = 1 to 6: tsp30 = 30 s Programming counter (n) = 7 to 1000: tsp200 = 200 s Programming counter (n) [in additional programming] = 1 to 6: tsp10 = 10 s 5. For the maximum erase time (tE(max)), the following relationship applies between the wait time after E bit setting (tse) and the maximum erase count (N): tE(max) = Wait time after E bit setting (tse) x maximum erase count (N) To set the maximum erase time, the values of tse and N should be set so as to satisfy the above formula. Examples: When tse = 100 [ms], N = 12 When tse = 10 [ms], N = 120
Rev. 3.00 Sep 27, 2006 page 672 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
Table 21.11 Flash Memory Characteristics (2) Conditions: VCC = 3.0 to 3.6 V, AVCC = 3.0 to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V, Ta = 0C to +75C (operating temperature range for programming/erasing)
Item Programming time*1 *2 *4 Erase time*1 *3 *5 Reprogramming count Programming Wait time after SWE bit setting*1 Wait time after PSU bit setting*1 Wait time after P bit setting* *
1 4
Symbol tP tE NWEC tsswe tspsu tsp30 tsp200 tsp10
Min -- -- -- 1 50 28 198 8
Typ 10 100 -- 1 50 30 200 10
Max 200 1200 100 -- -- 32 202 12
Unit ms/ 128 bytes ms/block Times s s s s s
Notes
Programming time wait Programming time wait Additionalprogramming time wait
Wait time after P bit clear*1 Wait time after PSU bit clear*1 Wait time after PV bit setting*1 Wait time after H'FF dummy write*1 Wait time after PV bit clear*1 Wait time after SWE bit clear*1 Maximum programming count*1 *4 Erase Wait time after SWE bit setting*1 Wait time after ESU bit setting*1 Wait time after E bit setting*1 *5 Wait time after E bit clear*
1
tcp tcpsu tspv tspvr tcpv tcswe N tsswe tsesu tse tce tcesu tsev tsevr tcev tcswe N
5 5 4 2 2 100 -- 1 100 10 10 10 20 2 4 100 12
5 5 4 2 2 100 -- 1 100 10 10 10 20 2 4 100 --
-- -- -- -- -- -- 1000 -- -- 100 -- -- -- -- -- -- 120
s s s s s s Times s s ms s s s s s s Times Erase time wait
Wait time after ESU bit clear*1 Wait time after EV bit setting*1 Wait time after H'FF dummy write*1 Wait time after EV bit clear*1 Wait time after SWE bit clear*1 Maximum erase count*1 *5
Rev. 3.00 Sep 27, 2006 page 673 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics Notes: 1. Make each time setting in accordance with the program/program-verify flowchart or erase/erase-verify flowchart. 2. Programming time per 128 bytes (Shows the total period for which the P bit in the flash memory control register 1 (FLMCR1) is set. It does not include the programming verification time.) 3. Block erase time (Shows the total period for which the E bit in FLMCR1 is set. It does not include the erase verification time.) 4. To specify the maximum programming time (tP(max)) in the 128-byte programming flowchart, set the maximum value (1000) for the maximum programming count (N). The wait time after P bit setting should be changed as follows according to the value of the programming counter (n). Programming counter (n) = 1 to 6: tsp30 = 30 s Programming counter (n) = 7 to 1000: tsp200 = 200 s Programming counter (n) [in additional programming] = 1 to 6: tsp10 = 10 s 5. For the maximum erase time (tE(max)), the following relationship applies between the wait time after E bit setting (tse) and the maximum erase count (N): tE(max) = Wait time after E bit setting (tse) x maximum erase count (N) To set the maximum erase time, the values of tse and N should be set so as to satisfy the above formula. Examples: When tse = 100 [ms], N = 12 times When tse = 10 [ms], N = 120 times
Rev. 3.00 Sep 27, 2006 page 674 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
21.2
21.2.1
Electrical Characteristics of H8/3048B (Mask ROM)
Absolute Maximum Ratings
Table 21.12 lists the absolute maximum ratings. Table 21.12 Absolute Maximum Ratings
Item Power supply voltage Input voltage (FWE)* Input voltage (port 7) Reference voltage Analog power supply voltage Analog input voltage Operating temperature Storage temperature
2
Symbol
1 VCC*
Value 5 V operation model: -0.3 to +7.0 3 V operation model: -0.3 to +4.6 -0.3 to VCC +0.3 -0.3 to VCC +0.3 -0.3 to AVCC +0.3 -0.3 to AVCC +0.3 5 V operation model: -0.3 to +7.0 3 V operation model: -0.3 to +4.6 -0.3 to AVCC +0.3
3 Regular specifications: -20 to +75* 3 Wide-range specifications: -40 to +85*
Unit V V V V V V V C C
Vin Vin Vin VREF AVCC VAN Topr Tstg
2 Input voltage (except for port 7)*
-55 to +125
Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded. Notes: 1. Do not apply the power supply voltage to the VCL pin in 5 V operation models. Connect an external capacitor between this pin and GND. 2. 12 V must not be applied to any pin, as this may cause permanent damage to the device. 3. The operating temperature range for flash memory programming/erasing is 0C to +75C.
Rev. 3.00 Sep 27, 2006 page 675 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
21.2.2
DC Characteristics
Table 21.13 lists the DC characteristics. Table 21.14 lists the permissible output currents. Table 21.13 DC Characteristics (1) Conditions: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC, 1 VSS = AVSS = 0 V* , Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications)
Item Schmitt trigger input voltages Input high voltage Port A, P82 to P80, PB3 to PB0 RES, STBY, NMI, MD2 to MD0 EXTAL Port 7 Ports 1 to 6, 9, P84, P83, PB7 to PB4 Input low voltage RES, STBY, MD2 to MD0 NMI, EXTAL, ports 1 to 7, 9, P84, P83, PB7 to PB4 Output high voltage Output low voltage All output pins VOH (Except RESO) All output pins VOL (Except RESO) Ports 1, 2, 5, and B RESO Input leakage current STBY, NMI, RES, MD2 to MD0 Port 7 |Iin| VIL Symbol VT VT
- + + -
Min 1.0 -- 0.4 VCC -0.7 VCC x 0.7 2.0 2.0
Typ -- -- -- --
Max -- VCC x 0.7 -- VCC +0.3
Unit Test Conditions V V V V
VT - VT VIH
-- -- --
VCC +0.3 VCC +0.3
V V
AVCC +0.3 V
-0.3 -0.3
-- --
0.5 0.8
V V
VCC -0.5 3.5 -- -- -- --
-- -- -- -- -- --
-- -- 0.4 1.0 0.4 1.0
V V V V
IOH = -200 A IOH = -1 mA IOL = 1.6 mA IOL = 10 mA IOL = 1.6 mA
A
Vin = 0.5 to VCC -0.5 V Vin = 0.5 to AVCC -0.5 V
--
--
1.0
A
Rev. 3.00 Sep 27, 2006 page 676 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics Item Three-state leakage current (off state) Ports 1 to 6, 8 to B Symbol |ITSI| Min -- Typ -- Max 1.0 Unit Test Conditions A Vin = 0.5 to VCC -0.5 V
Input pull-up Ports 2, 4, MOS current and 5 Input NMI capacitance All input pins except NMI Current Normal 2 dissipation* operation Sleep mode Module standby 4 mode* 3 Standby mode* Analog power supply current During A/D conversion During A/D and D/A conversion Idle Reference current During A/D conversion During A/D and D/A conversion Idle RAM standby voltage
-IP Cin
50 -- --
-- -- -- 45 35 20 1 -- 0.5 0.5 0.01 0.4 1.5 0.01 --
300 50 15 60 50 25 10 80 1.5 1.5 5.0 0.8 3.0 5.0 --
A pF pF mA mA mA A A mA mA A mA mA A V
Vin = 0 V VIN = 0 V, f = fmin, Ta = 25C f = 25 MHz
5 ICC*
-- -- -- -- --
Ta 50C 50C < Ta AVCC = 5.0 V
AICC
-- -- --
DASTE = 0 VREF = 5.0 V
AICC
-- -- --
DASTE = 0
VRAM
2.0
Notes: 1. If the A/D and D/A converters are not used, do not leave the AVCC, AVSS, and VREF pins open. Connect AVCC and VREF to VCC, and connect AVSS to VSS. 2. Current dissipation values are for VIH min = VCC -0.5 V and VIL max = 0.5 V with all output pins unloaded and the on-chip pull-up transistors in the off state. 3. The values are for VRAM VCC < 4.5 V, VIH min = VCC x 0.9, and VIL max = 0.3 V. 4. Module standby current values apply in sleep mode with all modules halted. 5. ICC depends on VCC and f, according to the following expressions. [Applicable operating frequency: 2 to 25 MHz] ICC max. (normal operation) = 5.0 [mA] + 0.32 [mA/(MHz x V)] x VCC x (f -2) ICC max. (sleep mode) = 7.0 [mA] + 0.26 [mA/(MHz x V)] x VCC x (f -2) ICC max. (sleep mode and module standby mode) = 6.0 [mA] + 0.11 [mA/(MHz x V)] x VCC x (f -2) The typical values of current dissipation are reference values. Rev. 3.00 Sep 27, 2006 page 677 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
Table 21.13 DC Characteristics (2) Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, 1 VSS = AVSS = 0 V* , Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications)
Item Schmitt trigger input voltages Input high voltage Port A, P82 to P80, PB3 to PB0 RES, STBY, NMI, MD2 to MD0 EXTAL Port 7 Ports 1 to 6, 9, P84, P83, PB7 to PB4 Input low voltage RES, STBY, MD2 to MD0 NMI, EXTAL, ports 1 to 7, 9, P84, P83, PB7 to PB4 Output high voltage Output low voltage All output pins VOH (Except RESO) All output pins VOL (Except RESO) Ports 1, 2, 5, and B RESO Input leakage current STBY, NMI, RES, MD2 to MD0 Port 7 |Iin| VIL Symbol VT VT
- + + -
Min VCC x 0.2 -- VCC x 0.9
Typ -- -- --
Max -- VCC x 0.7 -- VCC +0.3
Unit Test Conditions V V V V
VT - VT VIH
VCC x 0.05 --
VCC x 0.7 VCC x 0.7 VCC x 0.7
-- -- --
VCC +0.3 VCC +0.3
V V
AVCC +0.3 V
-0.3 -0.3
-- --
VCC x 0.1 VCC x 0.2
V V
VCC -0.5 VCC -1.0 -- -- -- --
-- -- -- -- -- --
-- -- 0.4 1.0 0.4 1.0
V V V V
IOH = -200 A IOH = -1 mA IOL = 1.6 mA IOL = 5 mA IOL = 1.6 mA
A
Vin = 0.5 to VCC -0.5 V Vin = 0.5 to AVCC -0.5 V
--
--
1.0
A
Rev. 3.00 Sep 27, 2006 page 678 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics Item Three-state leakage current (off state) Ports 1 to 6, 8 to B Symbol |ITSI| Min -- Typ -- Max 1.0 Unit Test Conditions A Vin = 0.5 to VCC -0.5 V
Input pull-up Ports 2, 4, MOS current and 5 Input NMI capacitance All input pins except NMI Current Normal 2 dissipation* operation Sleep mode Module standby 4 mode* 3 Standby mode* Analog power supply current During A/D conversion During A/D and D/A conversion Idle Reference current During A/D conversion During A/D and D/A conversion Idle RAM standby voltage
-IP Cin
10 -- --
-- -- -- 40 25 15 1 -- 0.5 0.5 0.01 0.4 1.5 0.01 --
300 50 15 50 40 20 10 80 1.5 1.5 5 0.8 3 5 --
A pF pF mA mA mA A A mA mA A mA mA A V
Vin = 0 V VIN = 0 V, f = fmin, Ta = 25C f = 25 MHz
5 ICC*
-- -- -- -- --
Ta 50C 50C < Ta AVCC = 3.3 V
AICC
-- -- --
DASTE = 0 VREF = 3.3 V
AICC
-- -- --
DASTE = 0
VRAM
2.0
Notes: 1. If the A/D and D/A converters are not used, do not leave the AVCC, AVSS, and VREF pins open. Connect AVCC and VREF to VCC, and connect AVSS to VSS. 2. Current dissipation values are for VIH min = VCC -0.5 V and VIL max = 0.5 V with all output pins unloaded and the on-chip pull-up transistors in the off state. 3. The values are for VRAM VCC < 3.0 V, VIH min = VCC x 0.9, and VIL max = 0.3 V. 4. Module standby current values apply in sleep mode with all modules halted. 5. ICC depends on VCC and f, according to the following expressions. [Applicable operating frequency: 2 to 25 MHz] ICC max. (normal operation) = 6.0 [mA] + 0.53 [mA/(MHz x V)] x VCC x (f -2) ICC max. (sleep mode) = 4.0 [mA] + 0.43 [mA/(MHz x V)] x VCC x (f -2) ICC max. (sleep mode and module standby mode) = 3.0 [mA] + 0.20 [mA/(MHz x V)] x VCC x (f -2) The typical values of current dissipation are reference values. Rev. 3.00 Sep 27, 2006 page 679 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
Table 21.14 Permissible Output Currents Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC, VSS = AVSS = 0 V, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications)
Conditions A, B Item Permissible output low current (per pin) Permissible output low current (total) Ports 1, 2, 5, and B Other output pins Total of 28 pins in ports 1, 2, 5, and B Total of all output pins, including the above Permissible output high current (per pin) Permissible output high current (total) All output pins Total of all output pins IOH IOH IOL Symbol IOL Min -- -- -- -- -- -- Typ -- -- -- -- -- -- Max 10 2.0 80 120 2.0 40 Unit mA mA mA mA mA mA
Notes: 1. To protect chip reliability, do not exceed the output current values in table 21.14. 2. When driving a darlington pair or LED, always insert a current-limiting resistor in the output line, as shown in figures 21.4 and 21.5.
Rev. 3.00 Sep 27, 2006 page 680 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
H8/3048B Group
2 k Port
Darlington pair
Figure 21.4 Darlington Pair Drive Circuit (Example)
H8/3048B Group
Ports 1, 2, 5, and B
600
LED
Figure 21.5 LED Drive Circuit (Example)
Rev. 3.00 Sep 27, 2006 page 681 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
21.2.3
AC Characteristics
Bus timing parameters are listed in table 21.15. Refresh controller bus timing parameters are listed in table 21.16. Control signal timing parameters are listed in table 21.17. Timing parameters of the on-chip supporting modules are listed in table 21.18. Table 21.15 Bus Timing Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications)
Condition A 25 MHz Item Clock cycle time Clock pulse low width Clock pulse high width Clock rise time Clock fall time Address delay time Address hold time Symbol tcyc tCL tCH tCR tCF tAD tAH Min 40 10 10 -- -- -- 0.5tcyc -20 -- -- -- 1.0tcyc -25 1.5tcyc -25 0.5tcyc -20 1.0tcyc -20 15 0 Max 500 -- -- 10 10 28 -- 25 25 25 -- -- -- -- -- -- Min 40 10 10 -- -- -- 0.5tcyc -20 -- -- -- 1.0tcyc -25 1.5tcyc -25 0.5tcyc -20 1.0tcyc -20 15 0 Condition B 25 MHz Max 500 -- -- 10 10 25 -- 25 25 25 -- -- -- -- -- -- Unit ns Test Conditions Figure 21.7 Figure 21.8
Address strobe delay time tASD Write strobe delay time Strobe delay time Write data strobe pulse width 1 Write data strobe pulse width 2 Address setup time 1 Address setup time 2 Read data setup time Read data hold time tWSD tSD tWSW1 tWSW2 tAS1 tAS2 tRDS tRDH
Rev. 3.00 Sep 27, 2006 page 682 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
Condition A 25 MHz Item Write data delay time Write data setup time 1 Write data setup time 2 Write data hold time Read data access time 1 Read data access time 2 Read data access time 3 Read data access time 4 Precharge time Wait setup time Wait hold time Bus request setup time Bus acknowledge delay time 1 Bus acknowledge delay time 2 Bus-floating time Symbol tWDD tWDS1 tWDS2 tWDH tACC1 tACC2 tACC3 tACC4 tPCH tWTS tWTH tBRQS tBACD1 tBACD2 tBZD Min -- 1.0tcyc -30 0.5tcyc -30 0.5tcyc -15 -- -- -- -- 1.0tcyc -20 25 5 25 -- -- -- Max 35 -- -- -- 1.5tcyc -40 2.5tcyc -40 1.0tcyc -28 2.0tcyc -32 -- -- -- -- 30 30 40 Min -- 1.0tcyc -30 0.5tcyc -30 0.5tcyc -15 -- -- -- -- 1.0tcyc -20 25 5 25 -- -- -- Condition B 25 MHz Max 35 -- -- -- 1.5tcyc -40 2.5tcyc -40 1.0tcyc -28 2.0tcyc -32 -- -- -- -- 30 30 40 ns Figure 21.21 ns Figure 21.9 Unit ns Test Conditions Figure 21.7 Figure 21.8
Rev. 3.00 Sep 27, 2006 page 683 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
Table 21.16 Refresh Controller Bus Timing Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications)
Condition A 25 MHz Item RAS delay time 1*1 RAS delay time 2*1 RAS delay time 3*1 Row address hold time RAS precharge time*1 CAS to RAS precharge time*1 *2 CAS pulse width*2 RAS access time*1 Address access time CAS access time*2 Write data setup time 3 CAS setup time*2 Read strobe delay time Signal rise time (all input pins except EXTAL) Signal fall time (all input pins except EXTAL) Symbol tRAD1 tRAD2 tRAD3 tRAH tRP tCRP tCAS tRAC tAA tCAC tWDS3 tCSR tRSD tSR tSF Min -- -- -- 0.5tcyc -5 1.0tcyc -15 1.0tcyc -15 1.0tcyc -18 -- -- -- 1.0tcyc -25 0.5tcyc -15 -- -- -- Max 20 20 20 -- -- -- -- 2.0tcyc -35 1.5tcyc -40 1.0tcyc -30 -- -- 25 100 100 Min -- -- -- 0.5tcyc -5 1.0tcyc -15 1.0tcyc -15 1.0tcyc -18 -- -- -- 1.0tcyc -25 0.5tcyc -15 -- -- -- Condition B 25 MHz Max 18 18 18 -- -- -- -- 2.0tcyc -35 1.5tcyc -40 1.0tcyc -30 -- -- 25 100 100 ns Figure 21.18 Unit ns Test Conditions Figure 21.10 to Figure 21.16
Notes: 1. The RAS pin is assigned to the CS3 pin. 2. The CAS pin is assigned to the RD pin.
Rev. 3.00 Sep 27, 2006 page 684 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
Table 21.17 Control Signal Timing Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications)
Condition A 25 MHz Item RES setup time RES pulse width Mode programming setup time RESO output delay time RESO output pulse width NMI setup time (NMI, IRQ5 to IRQ0) NMI hold time (NMI, IRQ5 to IRQ0) Interrupt pulse width (NMI, IRQ2 to IRQ0 when exiting software standby mode) Clock oscillator settling time at reset (crystal) Clock oscillator settling time in software standby (crystal) Symbol tRESS tRESW tMDS tRESD tRESOW tNMIS tNMIH tNMIW Min 200 20 200 -- 132 150 10 200 Max -- -- -- 50 -- -- -- -- Min 200 20 200 -- 132 150 10 200 Condition B 25 MHz Max -- -- -- 50 -- -- -- -- Unit ns tcyc ns ns tcyc ns Figure 21.20 Figure 21.19 Test Conditions Figure 21.18
tOSC1 tOSC2
20 7
-- --
20 7
-- --
ms ms
Figure 21.22 Figure 20.1
Rev. 3.00 Sep 27, 2006 page 685 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
Table 21.18 Timing of On-Chip Supporting Modules Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications)
Condition A 25 MHz Item DMAC DREQ setup time DREQ hold time TEND delay time 1 TEND delay time 2 ITU Timer output delay time Timer input setup time Timer clock input setup time Timer clock pulse width SCI Input clock cycle Single edge Both edges Asynchronous Synchronous Symbol tDRQS tDRQH tTED1 tTED2 tTOCD tTICS tTCKS tTCKWH tTCKWL tSCYC tSCYC tSCKr tSCKf tSCKW tTXD tRXS tRXH tRXH tPWD tPRS tPRH Min 20 10 -- -- -- 40 40 1.5 2.5 4 6 -- -- 0.4 -- 100 100 0 -- 50 50 Max -- -- 50 50 50 -- -- -- -- -- -- 1.5 1.5 0.6 100 -- -- -- 50 -- -- Min 20 10 -- -- -- 40 40 1.5 2.5 4 6 -- -- 0.4 -- 100 100 0 -- 50 50 Condition B 25 MHz Max -- -- 50 50 50 -- -- -- -- -- -- 1.5 1.5 0.6 100 -- -- -- 50 -- -- ns Figure 21.23 tSCYC ns Figure 21.27 tCYC Figure 21.26 tCYC Figure 21.25 ns Figures 21.28 and 21.29 Figure 21.24 Unit ns Test Conditions Figure 21.30
Input clock rise time Input clock fall time Input clock pulse width Transmit data delay time Receive data setup time (synchronous) Receive data hold time (synchronous) Ports and TPC Clock input Clock output
Output data delay time Input data setup time Input data hold time
Rev. 3.00 Sep 27, 2006 page 686 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
RL H8/3048B Group output pin
C = 90 pF: ports 4, 5, 6, 8, A (19 to 0), D (15 to 8), C = 30 pF: ports 9, A, B, RESO R L = 2.4 k R H = 12 k
C
RH
Input/output timing measurement levels * Low: 0.8 V * High: 2.0 V
Figure 21.6 Output Load Circuit
Rev. 3.00 Sep 27, 2006 page 687 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
21.2.4
A/D Conversion Characteristics
Table 21.19 lists the A/D conversion characteristics. Table 21.19 A/D Converter Characteristics Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications)
Condition A 25 MHz Item Resolution Conversion time (single mode) Analog input capacitance Permissible signal-source impedance Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy 13 MHz > 13 MHz Min 10 5.36 -- -- -- -- -- -- -- -- Typ 10 -- -- -- -- -- -- -- -- -- Max 10 -- 20 10 5 3.5 3.5 3.5 0.5 4.0 Min 10 5.36 -- -- -- -- -- -- -- -- Condition B 25 MHz Typ 10 -- -- -- -- -- -- -- -- -- Max 10 -- 20 10 5 3.5 3.5 3.5 0.5 4.0 LSB LSB LSB LSB LSB Unit bits s pF k
Rev. 3.00 Sep 27, 2006 page 688 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
21.2.5
D/A Conversion Characteristics
Table 21.20 lists the D/A conversion characteristics. Table 21.20 D/A Converter Characteristics Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC, VSS = AVSS = 0 V, = 2 MHz to 25 MHz, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications)
Condition A 25 MHz Item Resolution Conversion time (centering time) Absolute accuracy Min 8 -- -- -- Typ 8 -- 2.0 -- Max 8 10 3.0 2.0 Min 8 -- -- -- Condition B 25 MHz Typ 8 -- 1.5 -- Max 8 10 2.0 1.5 Unit bits s LSB LSB 20-pF capacitive load 2-M resistive load 4-M resistive load Test Conditions
Rev. 3.00 Sep 27, 2006 page 689 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
21.3
Operational Timing
This section shows timing diagrams. 21.3.1 Bus Timing
Bus timing is shown as follows: * Basic bus cycle: two-state access Figure 21.7 shows the timing of the external two-state access cycle. * Basic bus cycle: three-state access Figure 21.8 shows the timing of the external three-state access cycle. * Basic bus cycle: three-state access with one wait state Figure 21.9 shows the timing of the external three-state access cycle with one wait state inserted.
Rev. 3.00 Sep 27, 2006 page 690 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
T1 tcyc tCH tCF tAD A23 to A0, CS 7 to CS 0 tASD AS tAS1 tACC3 tcyc tCR tCL
T2
tPCH tSD tAH
tPCH tASD RD (read) tAS1 tACC1 D15 to D0 (read) tASD HWR, LWR (write) tAS1 tWSW1 tWDD D15 to D0 (write) tWDS1 tWDH tSD tAH tRDS tRDH tACC3 tSD tAH
tPCH
Figure 21.7 Basic Bus Cycle: Two-State Access
Rev. 3.00 Sep 27, 2006 page 691 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
T1 A23 to A0
T2
T3
tACC4 AS tACC4 RD (read) tACC2 D15 to D0 (read) tWSD HWR, LWR (write) D15 to D0 (write) tAS2 tWDS2 tWSW2 tRDS
Figure 21.8 Basic Bus Cycle: Three-State Access
Rev. 3.00 Sep 27, 2006 page 692 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
T1 A23 to A0 AS RD (read) D15 to D0 (read)
T2
TW
T3
HWR, LWR (write) D15 to D0 (write) tWTS WAIT tWTH tWTS tWTH
Figure 21.9 Basic Bus Cycle: Three-State Access with One Wait State
Rev. 3.00 Sep 27, 2006 page 693 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
21.3.2
Refresh Controller Bus Timing
Refresh controller bus timing is shown as follows: * DRAM bus timing Figures 21.10 to 21.15 show the DRAM bus timing in each operating mode. * PSRAM bus timing Figures 21.16 and 21.17 show the pseudo-static RAM bus timing in each operating mode.
T1 A9 to A1 AS tRAD1 CS 3 (RAS) tAS1 tASD RD (CAS) HWR (UW), LWR (LW ) (read) HWR (UW), LWR (LW ) (write) RFSH D15 to D0 (read) tWDS3 D15 to D0 (write) tASD tAS1 tCAS tSD tCRP tRAH tRAD3 tRP tAD tAD T2 T3
tRAC tAA tCAC
tSD
tWDH
tRDS
tRDH
Figure 21.10 DRAM Bus Timing (Read/Write): Three-State Access -- 2WE Mode -- WE
Rev. 3.00 Sep 27, 2006 page 694 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
T1
T2
T3
A9 to A1 tASD AS tCSR CS3 (RAS) tASD RD (CAS) HWR (UW), LWR (LW) tRAD2 RFSH tCSR tRAD3 tRAD2 tSD tRAD3 tSD
Figure 21.11 DRAM Bus Timing (Refresh Cycle): Three-State Access -- 2WE Mode -- WE
CS3 (RAS) RD (CAS) RFSH
tCSR tCSR
Figure 21.12 DRAM Bus Timing (Self-Refresh Mode) -- 2WE Mode -- WE
Rev. 3.00 Sep 27, 2006 page 695 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
T1 tAD tAD
T2
T3
A9 to A1 AS tRAD1 tRAH tASD HWR (UCAS), LWR (LCAS) RD (WE) (read) tASD RD (WE) (write) RFSH D15 to D0 (read) tWDS3 D15 to D0 (write) tAS1 tCAS tRAD3 tRP tSD tCRP
CS 3 (RAS)
tAS1
tRAC tAA tCAC
tSD tWDH
tRDS tRDH
Figure 21.13 DRAM Bus Timing (Read/Write): Three-State Access -- 2CAS Mode -- CAS
Rev. 3.00 Sep 27, 2006 page 696 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
T1
T2
T3
A9 to A1 tASD AS tCSR CS 3 (RAS) tASD HWR (UCAS), LWR (LCAS) RD (WE) tRAD2 RFSH tCSR tRAD3 tRAD2 tSD tRAD3 tSD
Figure 21.14 DRAM Bus Timing (Refresh Cycle): Three-State Access -- 2CAS Mode -- CAS
CS 3 (RAS) HWR (UCAS), LWR (LCAS) RFSH
tCSR tCSR
Figure 21.15 DRAM Bus Timing (Self-Refresh Mode) -- 2CAS Mode -- CAS
Rev. 3.00 Sep 27, 2006 page 697 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
T1 A23 to A0 AS tRAD1 CS3 RD (read) tAS1 tRSD tAD
T2
T3
tRAD3 tRP tSD
tRDS D15 to D0 (read) HWR, LWR (write) tWDS2 D15 to D0 (write) RFSH
tRDH
tWSD
tSD
Figure 21.16 PSRAM Bus Timing (Read/Write): Three-State Access
T1 A23 to A0 AS CS3 HWR, LWR, RD RFSH tRAD2 tRAD3 T2 T3
Figure 21.17 PSRAM Bus Timing (Refresh Cycle): Three-State Access
Rev. 3.00 Sep 27, 2006 page 698 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
21.3.3
Control Signal Timing
Control signal timing is shown as follows: * Reset input timing Figure 21.18 shows the reset input timing. * Reset output timing Figure 21.19 shows the reset output timing. * Interrupt input timing Figure 21.20 shows the input timing for NMI and IRQ5 to IRQ0. * Bus-release mode timing Figure 21.21 shows the bus-release mode timing.
tRESS RES tSR tMDS MD2 to MD0 tSF tRESW tRESS
Figure 21.18 Reset Input Timing
tRESD RESO tRESOW tRESD
Figure 21.19 Reset Output Timing* Note: * This is a function for models with on-chip mask ROM (H8/3048B, H8/3048, H8/3047, H8/3045, and H8/3044), PROM (H8/3048ZTAT), and on-chip flash memory with a dual power supply (H8/3048F). The function does not exist in the product with on-chip flash memory with a single power supply (H8/3048F-ONE).
Rev. 3.00 Sep 27, 2006 page 699 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
tNMIS NMI tNMIS IRQ E tNMIS IRQ L IRQ E : Edge-sensitive IRQ i IRQ L : Level-sensitive IRQ i (i = 0 to 5) tNMIW NMI IRQ j (j = 0 to 2) tNMIH tNMIH
Figure 21.20 Interrupt Input Timing
tBRQS BREQ tBACD2 tBACD1 BACK tBZD tBRQS
A23 to A0, AS, RD, HWR, LWR
tBZD
Figure 21.21 Bus-Release Mode Timing
Rev. 3.00 Sep 27, 2006 page 700 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
21.3.4
Clock Timing
Clock timing is shown as follows: * Oscillator settling timing Figure 21.22 shows the oscillator settling timing.
VCC
STBY tOSC1 RES tOSC1
Figure 21.22 Oscillator Settling Timing 21.3.5 TPC and I/O Port Timing
Figure 21.23 shows the TPC and I/O port timing.
T1 tPRS Port 1 to B (read) tPWD Port 1 to 6, 8 to B (write) tPRH T2 T3
Figure 21.23 TPC and I/O Port Input/Output Timing
Rev. 3.00 Sep 27, 2006 page 701 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
21.3.6
ITU Timing
ITU timing is shown as follows: * ITU input/output timing Figure 21.24 shows the ITU input/output timing. * ITU external clock input timing Figure 21.25 shows the ITU external clock input timing.
tTOCD Output compare*1 tTICS Input capture*2 Notes: 1. TIOCA0 to TIOCA4, TIOCB0 to TIOCB4, TOCXA4, TOCXB4 2. TIOCA0 to TIOCA4, TIOCB0 to TIOCB4
Figure 21.24 ITU Input/Output Timing
tTCKS tTCKS TCLKA to TCLKD
tTCKWL
tTCKWH
Figure 21.25 ITU External Clock Input Timing
Rev. 3.00 Sep 27, 2006 page 702 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
21.3.7
SCI Input/Output Timing
SCI timing is shown as follows: * SCI input clock timing Figure 21.26 shows the SCK input clock timing. * SCI input/output timing (synchronous mode) Figure 21.27 shows the SCI input/output timing in synchronous mode.
tSCKW SCK0, SCK1 tScyc
tSCKr
tSCKf
Figure 21.26 SCK Input Clock Timing
tScyc SCK0, SCK1 tTXD TxD0, TxD1 (transmit data) RxD0, RxD1 (receive data)
tRXS
tRXH
Figure 21.27 SCI Input/Output Timing in Synchronous Mode
Rev. 3.00 Sep 27, 2006 page 703 of 872 REJ09B0325-0300
Section 21 Electrical Characteristics
21.3.8
DMAC Timing
DMAC timing is shown as follows. * DMAC TEND output timing for 2 state access Figure 21.28 shows the DMAC TEND output timing for 2 state access. * DMAC TEND output timing for 3 state access Figure 21.29 shows the DMAC TEND output timing for 3 state access. * DMAC DREQ input timing Figure 21.30 shows DMAC DREQ input timing.
T1 tTED1 TEND tTED2 T2
Figure 21.28 DMAC TEND Output Timing for 2 State Access
T1 tTED1 TEND tTED2 T2 T3
Figure 21.29 DMAC TEND Output Timing for 3 State Access
tDRQS DREQ tDRQH
Figure 21.30 DMAC DREQ Input Timing
Rev. 3.00 Sep 27, 2006 page 704 of 872 REJ09B0325-0300
Appendix A Instruction Set
Appendix A Instruction Set
A.1 Instruction List
Operand Notation
Symbol Rd Rs Rn ERd ERs ERn (EAd) (EAs) PC SP CCR N Z V C disp + - x / ( ), < > Description General destination register General source register General register General destination register (address register or 32-bit register) General source register (address register or 32-bit register) General register (32-bit register) Destination operand Source operand Program counter Stack pointer Condition code register N (negative) flag in CCR Z (zero) flag in CCR V (overflow) flag in CCR C (carry) flag in CCR Displacement Transfer from the operand on the left to the operand on the right, or transition from the state on the left to the state on the right Addition of the operands on both sides Subtraction of the operand on the right from the operand on the left Multiplication of the operands on both sides Division of the operand on the left by the operand on the right Logical AND of the operands on both sides Logical OR of the operands on both sides Exclusive logical OR of the operands on both sides NOT (logical complement) Contents of operand
Note: General registers include 8-bit registers (R0H to R7H and R0L to R7L) and 16-bit registers (R0 to R7 and E0 to E7). Rev. 3.00 Sep 27, 2006 page 705 of 872 REJ09B0325-0300
Appendix A Instruction Set
Condition Code Notation
Symbol
Description Changed according to execution result Undetermined (no guaranteed value) Cleared to 0 Set to 1 Not affected by execution of the instruction Varies depending on conditions, described in notes
* 0 1 --
Rev. 3.00 Sep 27, 2006 page 706 of 872 REJ09B0325-0300
Appendix A Instruction Set
Table A.1
Instruction Set
1. Data transfer instructions
Addressing Mode and Instruction Length (bytes)
@-ERn/@ERn+ Operand Size
Condition Code
No. of States*1
@(d, ERn)
I
H
N
Z
V
C
MOV.B #xx:8, Rd MOV.B Rs, Rd MOV.B @ERs, Rd MOV.B @(d:16, ERs), Rd MOV.B @(d:24, ERs), Rd MOV.B @ERs+, Rd
2 2 2 4 8 2
B #xx:8 Rd8 B Rs8 Rd8 B @ERs Rd8 B @(d:16, ERs) Rd8 B @(d:24, ERs) Rd8 B @ERs Rd8, ERs32+1 ERs32 B @aa:8 Rd8 B @aa:16 Rd8 B @aa:24 Rd8 B Rs8 @ERd B Rs8 @(d:16, ERd) B Rs8 @(d:24, ERd) B ERd32-1 ERd32, Rs8 @ERd B Rs8 @aa:8 B Rs8 @aa:16 B Rs8 @aa:24 W #xx:16 Rd16 W Rs16 Rd16 W @ERs Rd16
2 4 6 2 4 8 2 2 4 6 2 2 4 8 2 4 6 2 4 8
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
2 2 4 6 10 6
MOV.B @aa:8, Rd MOV.B @aa:16, Rd MOV.B @aa:24, Rd MOV.B Rs, @ERd MOV.B Rs, @(d:16, ERd) MOV.B Rs, @(d:24, ERd) MOV.B Rs, @-ERd
4 6 8 4 6 10 6
MOV.B Rs, @aa:8 MOV.B Rs, @aa:16 MOV.B Rs, @aa:24 MOV.W #xx:16, Rd MOV.W Rs, Rd MOV.W @ERs, Rd
4 6 8 4 2 4 6 10 6
4
MOV.W @(d:16, ERs), Rd W @(d:16, ERs) Rd16 MOV.W @(d:24, ERs), Rd W @(d:24, ERs) Rd16 MOV.W @ERs+, Rd W @ERs Rd16, ERs32+2 @ERd32 W @aa:16 Rd16 W @aa:24 Rd16 W Rs16 @ERd
MOV.W @aa:16, Rd MOV.W @aa:24, Rd MOV.W Rs, @ERd
6 8 4 6 10
MOV.W Rs, @(d:16, ERd) W Rs16 @(d:16, ERd) MOV.W Rs, @(d:24, ERd) W Rs16 @(d:24, ERd)
Rev. 3.00 Sep 27, 2006 page 707 of 872 REJ09B0325-0300
Advanced
Mnemonic
Operation
@ERn
@(d, PC)
Normal
@@aa
@aa
#xx
Rn
Appendix A Instruction Set
Addressing Mode and Instruction Length (bytes) No. of States*1
Condition Code
@(d, ERn)
I
H
N
Z
V
C
MOV.W Rs, @-ERd
W ERd32-2 ERd32, Rs16 @ERd W Rs16 @aa:16 W Rs16 @aa:24 L #xx:32 Rd32 L ERs32 ERd32 L @ERs ERd32 L @(d:16, ERs) ERd32 L @(d:24, ERs) ERd32 L @ERs ERd32, ERs32+4 ERs32 L @aa:16 ERd32 L @aa:24 ERd32 L ERs32 @ERd L ERs32 @(d:16, ERd) L ERs32 @(d:24, ERd) L ERd32-4 ERd32, ERs32 @ERd L ERs32 @aa:16 L ERs32 @aa:24 W @SP Rn16, SP+2 SP L @SP ERn32, SP+4 SP W SP-2 SP, Rn16 @SP L SP-4 SP, ERn32 @SP B Cannot be used in the H8/3048B Group B Cannot be used in the H8/3048B Group 4 6 10 6 2 4 6 10
2
4 6
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
6
MOV.W Rs, @aa:16 MOV.W Rs, @aa:24 MOV.L #xx:32, Rd MOV.L ERs, ERd MOV.L @ERs, ERd MOV.L @(d:16, ERs), ERd MOV.L @(d:24, ERs), ERd MOV.L @ERs+, ERd
6 8 6 2 8 10 14 10
4
6 8
MOV.L @aa:16, ERd MOV.L @aa:24, ERd MOV.L ERs, @ERd MOV.L ERs, @(d:16, ERd) MOV.L ERs, @(d:24, ERd) MOV.L ERs, @-ERd
10 12 8 10 14 10
4
6 8 2 4 2 4
MOV.L ERs, @aa:16 MOV.L ERs, @aa:24 POP.W Rn
10 12 6
POP.L ERn
10
PUSH.W Rn
6
PUSH.L ERn
10
MOVFPE @aa:16, Rd
4
Cannot be used in the H8/3048B Group Cannot be used in the H8/3048B Group
MOVTPE Rs, @aa:16
4
Rev. 3.00 Sep 27, 2006 page 708 of 872 REJ09B0325-0300
Advanced
Mnemonic
Operation
@-ERn/@ERn+
Operand Size
@(d, PC)
Normal
@@aa
@ERn
@aa
#xx
Rn
Appendix A Instruction Set
2. Arithmetic instructions
Addressing Mode and Instruction Length (bytes)
@-ERn/@ERn+ Operand Size
Condition Code
No. of States*1
@(d, ERn)
I
H
N
Z
V
C

ADD.B #xx:8, Rd ADD.B Rs, Rd ADD.W #xx:16, Rd ADD.W Rs, Rd ADD.L #xx:32, ERd
2 2 4 2 6
B Rd8+#xx:8 Rd8 B Rd8+Rs8 Rd8 W Rd16+#xx:16 Rd16 W Rd16+Rs16 Rd16 L ERd32+#xx:32 ERd32 L ERd32+ERs32 ERd32 B Rd8+#xx:8 +C Rd8 B Rd8+Rs8 +C Rd8 L ERd32+1 ERd32 L ERd32+2 ERd32 L ERd32+4 ERd32 B Rd8+1 Rd8 W Rd16+1 Rd16 W Rd16+2 Rd16 L ERd32+1 ERd32 L ERd32+2 ERd32 B Rd8 decimal adjust Rd8 B Rd8-Rs8 Rd8 W Rd16-#xx:16 Rd16 W Rd16-Rs16 Rd16 L ERd32-#xx:32 ERd32 L ERd32-ERs32 ERd32 B Rd8-#xx:8-C Rd8 B Rd8-Rs8-C Rd8 L ERd32-1 ERd32 L ERd32-2 ERd32 L ERd32-4 ERd32 B Rd8-1 Rd8 W Rd16-1 Rd16 W Rd16-2 Rd16

2 2 4 2 6
(1) (1) (2) 2 (2)

ADD.L ERs, ERd
2
ADDX.B #xx:8, Rd ADDX.B Rs, Rd ADDS.L #1, ERd ADDS.L #2, ERd ADDS.L #4, ERd INC.B Rd INC.W #1, Rd INC.W #2, Rd INC.L #1, ERd INC.L #2, ERd DAA Rd
2 2 2 2 2 2 2 2 2 2 2
(3) (3)

2 2 2 2 2 2 2 2 2 2 2


*

*

SUB.B Rs, Rd SUB.W #xx:16, Rd SUB.W Rs, Rd SUB.L #xx:32, ERd SUB.L ERs, ERd SUBX.B #xx:8, Rd SUBX.B Rs, Rd SUBS.L #1, ERd SUBS.L #2, ERd SUBS.L #4, ERd DEC.B Rd DEC.W #1, Rd DEC.W #2, Rd
2 4 2 6 2 2 2 2 2 2 2 2 2
2 4 2 6 2 2 2 2 2 2 2 2 2
(1) (1) (2) (2)

(3) (3)




Rev. 3.00 Sep 27, 2006 page 709 of 872 REJ09B0325-0300
Advanced
Mnemonic
Operation
@ERn
@(d, PC)
Normal
@@aa
@aa
#xx
Rn
Appendix A Instruction Set
Addressing Mode and Instruction Length (bytes)
@-ERn/@ERn+ Operand Size
Condition Code
No. of States*1
@(d, ERn)
I
H
N
Z
V
C
DEC.L #1, ERd DEC.L #2, ERd DAS.Rd
2 2 2
L ERd32-1 ERd32 L ERd32-2 ERd32 B Rd8 decimal adjust Rd8 B Rd8 x Rs8 Rd16 (unsigned multiplication) W Rd16 x Rs16 ERd32 (unsigned multiplication) B Rd8 x Rs8 Rd16 (signed multiplication) W Rd16 x Rs16 ERd32 (signed multiplication) B Rd16 / Rs8 Rd16 (RdH: remainder, RdL: quotient) (unsigned division) W ERd32 / Rs16 ERd32 (Ed: remainder, Rd: quotient) (unsigned division) B Rd16 / Rs8 Rd16 (RdH: remainder, RdL: quotient) (signed division) W ERd32 / Rs16 ERd32 (Ed: remainder, Rd: quotient) (signed division) B Rd8-#xx:8 B Rd8-Rs8 W Rd16-#xx:16 W Rd16-Rs16 L ERd32-#xx:32 L ERd32-ERs32 6 4 2
*

2 2 2
*
MULXU. B Rs, Rd
2


14
MULXU. W Rs, ERd
2
22
MULXS. B Rs, Rd
4
16
MULXS. W Rs, ERd
4
24
DIVXU. B Rs, Rd
2
(6) (7)
14
DIVXU. W Rs, ERd
2
(6) (7)
22
DIVXS. B Rs, Rd
4
(8) (7)
16
DIVXS. W Rs, ERd
4
(8) (7)
24

CMP.B #xx:8, Rd CMP.B Rs, Rd CMP.W #xx:16, Rd CMP.W Rs, Rd CMP.L #xx:32, ERd CMP.L ERs, ERd
2
2 2 4 2 4 2
(1) 2 (1) (2) 2 (2)
Rev. 3.00 Sep 27, 2006 page 710 of 872 REJ09B0325-0300
Advanced
Mnemonic
Operation
@ERn
@(d, PC)
Normal
@@aa
@aa
#xx
Rn
Appendix A Instruction Set
Addressing Mode and Instruction Length (bytes) No. of States*1
Condition Code
@(d, ERn)
I
H
N
Z
V
C

NEG.B Rd NEG.W Rd NEG.L ERd EXTU.W Rd
2 2 2 2
B 0-Rd8 Rd8 W 0-Rd16 Rd16 L 0-ERd32 ERd32 W 0 ( of Rd16) L 0 ( of ERd32) W ( of Rd16) ( of Rd16) L ( of ERd32) ( of ERd32)

2 2 2 2
0 0
0 0 0 0
EXTU.L ERd
2
2
EXTS.W Rd
2
2
EXTS.L ERd
2
2
Rev. 3.00 Sep 27, 2006 page 711 of 872 REJ09B0325-0300
Advanced
Mnemonic
Operation
@-ERn/@ERn+
Operand Size
@(d, PC)
Normal
@@aa
@ERn
@aa
#xx
Rn
Appendix A Instruction Set
3. Logic instructions
Addressing Mode and Instruction Length (bytes) No. of States*1
Condition Code
@(d, ERn)
I
H
N
Z
V
C
AND.B #xx:8, Rd AND.B Rs, Rd AND.W #xx:16, Rd AND.W Rs, Rd AND.L #xx:32, ERd AND.L ERs, ERd OR.B #xx:8, Rd OR.B Rs, Rd OR.W #xx:16, Rd OR.W Rs, Rd OR.L #xx:32, ERd OR.L ERs, ERd XOR.B #xx:8, Rd XOR.B Rs, Rd XOR.W #xx:16, Rd XOR.W Rs, Rd XOR.L #xx:32, ERd XOR.L ERs, ERd NOT.B Rd NOT.W Rd NOT.L ERd
2 2 4 2 6 4 2 2 4 2 6 4 2 2 4 2
B Rd8#xx:8 Rd8 B Rd8Rs8 Rd8 W Rd16#xx:16 Rd16 W Rd16Rs16 Rd16 L ERd32#xx:32 ERd32 L ERd32ERs32 ERd32 B Rd8#xx:8 Rd8 B Rd8Rs8 Rd8 W Rd16#xx:16 Rd16 W Rd16Rs16 Rd16 L ERd32#xx:32 ERd32 L ERd32ERs32 ERd32 B Rd8#xx:8 Rd8 B Rd8Rs8 Rd8 W Rd16#xx:16 Rd16 W Rd16Rs16 Rd16
4 2 2 2
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
2 2 4 2 6 4 2 2 4 2 6 4 2 2 4 2 6 4 2 2 2
L ERd32#xx:32 ERd32 6 L ERd32ERs32 ERd32 B Rd8 Rd8 W Rd16 Rd16 L Rd32 Rd32
Rev. 3.00 Sep 27, 2006 page 712 of 872 REJ09B0325-0300
Advanced
Mnemonic
Operation
@-ERn/@ERn+
Operand Size
@(d, PC)
Normal
@@aa
@ERn
@aa
#xx
Rn
Appendix A Instruction Set
4. Shift instructions
Addressing Mode and Instruction Length (bytes) No. of States*1
Condition Code
@(d, ERn)
I
H
N
Z
V
C
SHAL.B Rd SHAL.W Rd SHAL.L ERd SHAR.B Rd SHAR.W Rd SHAR.L ERd SHLL.B Rd SHLL.W Rd SHLL.L ERd SHLR.B Rd SHLR.W Rd SHLR.L ERd ROTXL.B Rd ROTXL.W Rd ROTXL.L ERd ROTXR.B Rd ROTXR.W Rd ROTXR.L ERd ROTL.B Rd ROTL.W Rd ROTL.L ERd ROTR.B Rd ROTR.W Rd ROTR.L ERd
B W L B W L B W L B W L B W L B W L B W L B W L
C MSB LSB C MSB C MSB 0 MSB C MSB LSB C MSB C MSB LSB LSB LSB LSB LSB
0
2 2 2 2 2 2 2

2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
0
2 2 2
C
2 2 2 2 2 2 2 2 2 2 2 2
C MSB LSB
2 2
Rev. 3.00 Sep 27, 2006 page 713 of 872 REJ09B0325-0300
Advanced
Mnemonic
Operation
@-ERn/@ERn+
Operand Size
@(d, PC)
Normal
@@aa
@ERn
@aa
#xx
Rn
Appendix A Instruction Set
5. Bit manipulation instructions
Addressing Mode and Instruction Length (bytes)
@-ERn/@ERn+ Operand Size
Condition Code
No. of States*1
@(d, ERn)
I
H
N
Z
V
C
BSET #xx:3, Rd BSET #xx:3, @ERd BSET #xx:3, @aa:8 BSET Rn, Rd BSET Rn, @ERd BSET Rn, @aa:8 BCLR #xx:3, Rd BCLR #xx:3, @ERd BCLR #xx:3, @aa:8 BCLR Rn, Rd BCLR Rn, @ERd BCLR Rn, @aa:8 BNOT #xx:3, Rd
B (#xx:3 of Rd8) 1 B (#xx:3 of @ERd) 1 B (#xx:3 of @aa:8) 1 B (Rn8 of Rd8) 1 B (Rn8 of @ERd) 1 B (Rn8 of @aa:8) 1 B (#xx:3 of Rd8) 0 B (#xx:3 of @ERd) 0 B (#xx:3 of @aa:8) 0 B (Rn8 of Rd8) 0 B (Rn8 of @ERd) 0 B (Rn8 of @aa:8) 0 B (#xx:3 of Rd8) (#xx:3 of Rd8) B (#xx:3 of @ERd) (#xx:3 of @ERd) B (#xx:3 of @aa:8) (#xx:3 of @aa:8) B (Rn8 of Rd8) (Rn8 of Rd8) B (Rn8 of @ERd) (Rn8 of @ERd) B (Rn8 of @aa:8) (Rn8 of @aa:8) B (#xx:3 of Rd8) Z B (#xx:3 of @ERd) Z B (#xx:3 of @aa:8) Z B (Rn8 of @Rd8) Z B (Rn8 of @ERd) Z B (Rn8 of @aa:8) Z B (#xx:3 of Rd8) C
2 4 4 2 4 4 2 4 4 2 4 4 2
4 4 4 4
2 8 8 2 8 8 2 8 8 2 8 8 2
BNOT #xx:3, @ERd
8
BNOT #xx:3, @aa:8
8
BNOT Rn, Rd
2
2
BNOT Rn, @ERd
8
BNOT Rn, @aa:8
8
BTST #xx:3, Rd BTST #xx:3, @ERd BTST #xx:3, @aa:8 BTST Rn, Rd BTST Rn, @ERd BTST Rn, @aa:8 BLD #xx:3, Rd
2 4 4 2 4 4 2


2 6 6 2 6 6 2
Rev. 3.00 Sep 27, 2006 page 714 of 872 REJ09B0325-0300
Advanced
Mnemonic
Operation
@ERn
@(d, PC)
Normal
@@aa
@aa
#xx
Rn
Appendix A Instruction Set
Addressing Mode and Instruction Length (bytes)
@-ERn/@ERn+ Operand Size
Condition Code
No. of States*1
@(d, ERn)
I
H
N
Z
V
C
BLD #xx:3, @ERd BLD #xx:3, @aa:8 BILD #xx:3, Rd BILD #xx:3, @ERd BILD #xx:3, @aa:8 BST #xx:3, Rd BST #xx:3, @ERd BST #xx:3, @aa:8 BIST #xx:3, Rd BIST #xx:3, @ERd BIST #xx:3, @aa:8 BAND #xx:3, Rd BAND #xx:3, @ERd BAND #xx:3, @aa:8 BIAND #xx:3, Rd BIAND #xx:3, @ERd BIAND #xx:3, @aa:8 BOR #xx:3, Rd BOR #xx:3, @ERd BOR #xx:3, @aa:8 BIOR #xx:3, Rd BIOR #xx:3, @ERd BIOR #xx:3, @aa:8 BXOR #xx:3, Rd BXOR #xx:3, @ERd BXOR #xx:3, @aa:8 BIXOR #xx:3, Rd BIXOR #xx:3, @ERd BIXOR #xx:3, @aa:8
4 4 2 4 4 2 4 4 2 4 4 2 4 4 2 4 4 2 4 4 2 4 4 2 4 4 2 4 4
B (#xx:3 of @ERd) C B (#xx:3 of @aa:8) C B (#xx:3 of Rd8) C B (#xx:3 of @ERd) C B (#xx:3 of @aa:8) C B C (#xx:3 of Rd8) B C (#xx:3 of @ERd24) B C (#xx:3 of @aa:8) B C (#xx:3 of Rd8) B C (#xx:3 of @ERd24) B C (#xx:3 of @aa:8) B C(#xx:3 of Rd8) C B C(#xx:3 of @ERd24) C B C(#xx:3 of @aa:8) C B C (#xx:3 of Rd8) C B C (#xx:3 of @ERd24) C B C (#xx:3 of @aa:8) C B C(#xx:3 of Rd8) C B C(#xx:3 of @ERd24) C B C(#xx:3 of @aa:8) C B C (#xx:3 of Rd8) C B C (#xx:3 of @ERd24) C B C (#xx:3 of @aa:8) C B C(#xx:3 of Rd8) C B C(#xx:3 of @ERd24) C B C(#xx:3 of @aa:8) C B C (#xx:3 of Rd8) C B C (#xx:3 of @ERd24) C B C (#xx:3 of @aa:8) C

6 6 2 6 6 2 8 8 2 8 8 2 6 6 2 6 6 2 6 6 2 6 6 2 6 6 2 6 6

Rev. 3.00 Sep 27, 2006 page 715 of 872 REJ09B0325-0300
Advanced
Mnemonic
Operation
@ERn
@(d, PC)
Normal
@@aa
@aa
#xx
Rn
Appendix A Instruction Set
6. Branching instructions
Addressing Mode and Instruction Length (bytes)
@-ERn/@ERn+ Operand Size
Condition Code
No. of States*1
@(d, ERn)
Branch Condition
I
H
N
Z
V
C
BRA d:8 (BT d:8) BRA d:16 (BT d:16) BRN d:8 (BF d:8) BRN d:16 (BF d:16) BHI d:8 BHI d:16 BLS d:8 BLS d:16 BCC d:8 (BHS d:8) BCC d:16 (BHS d:16) BCS d:8 (BLO d:8) BCS d:16 (BLO d:16) BNE d:8 BNE d:16 BEQ d:8 BEQ d:16 BVC d:8 BVC d:16 BVS d:8 BVS d:16 BPL d:8 BPL d:16 BMI d:8 BMI d:16 BGE d:8 BGE d:16 BLT d:8 BLT d:16 BGT d:8 BGT d:16 BLE d:8 BLE d:16
-- If condition Always -- is true then PC PC+d Never -- else next; -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Z (NV) = 1 Z (NV) = 0 NV = 1 NV = 0 N=1 N=0 V=1 V=0 Z=1 Z=0 C=1 C=0 CZ=1 CZ=0
2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4

4 6 4 6 4 6 4 6 4 6 4 6 4 6 4 6 4 6 4 6 4 6 4 6 4 6 4 6 4 6 4 6
Rev. 3.00 Sep 27, 2006 page 716 of 872 REJ09B0325-0300
Advanced
Mnemonic
Operation
@ERn
@(d, PC)
Normal
@@aa
@aa
#xx
Rn
Appendix A Instruction Set
Addressing Mode and Instruction Length (bytes) No. of States*1
Condition Code
@(d, ERn)
I
H
N
Z
V
C
JMP @ERn JMP @aa:24 JMP @@aa:8 BSR d:8
-- PC ERn -- PC aa:24 -- PC @aa:8 -- PC @-SP PC PC+d:8 -- PC @-SP PC PC+d:16 -- PC @-SP PC @ERn -- PC @-SP PC @aa:24 -- PC @-SP PC @aa:8 -- PC @SP+
2 4 2 2
4 2 2 8 6
4 6 10 8
BSR d:16
4
8
10
JSR @ERn
2
6
JSR @aa:24
8
10
JSR @@aa:8
8
12
RTS
8
10
Rev. 3.00 Sep 27, 2006 page 717 of 872 REJ09B0325-0300
Advanced
8
Mnemonic
Operation
@-ERn/@ERn+
Operand Size
@(d, PC)
Normal
@@aa
@ERn
@aa
#xx
Rn
Appendix A Instruction Set
7. System control instructions
Addressing Mode and Instruction Length (bytes)
@-ERn/@ERn+ Operand Size
Condition Code
No. of States*1
@(d, ERn)
I
H
N
Z
V
C
TRAPA #x:2
PC @-SP, CCR @-SP, PC CCR @SP+, PC @SP+ Transition to powerdown state B #xx:8 CCR B Rs8 CCR W @ERs CCR W @(d:16, ERs) CCR W @(d:24, ERs) CCR W @ERs CCR, ERs32+2 ERs32 W @aa:16 CCR W @aa:24 CCR B CCR Rd8 W CCR @ERd W CCR @(d:16, ERd) W CCR @(d:24, ERd) W ERd32-2 ERd32, CCR @ERd W CCR @aa:16 W CCR @aa:24 B CCR#xx:8 CCR B CCR#xx:8 CCR B CCR#xx:8 CCR PC PC+2 2 2 2 2 4 6 10 4 2 2 4 6 10 4
2
1 14
16

RTE
10
SLEEP

2
LDC #xx:8, CCR LDC Rs, CCR LDC @ERs, CCR LDC @(d:16, ERs), CCR LDC @(d:24, ERs), CCR LDC @ERs+, CCR
2 2 6 8 12 8

LDC @aa:16, CCR LDC @aa:24, CCR STC CCR, Rd STC CCR, @ERd STC CCR, @(d:16, ERd) STC CCR, @(d:24, ERd) STC CCR, @-ERd
6 8
8 10 2 6 8 12 8
6 8

STC CCR, @aa:16 STC CCR, @aa:24 ANDC #xx:8, CCR ORC #xx:8, CCR XORC #xx:8, CCR NOP
8 10 2 2 2 2
2
Rev. 3.00 Sep 27, 2006 page 718 of 872 REJ09B0325-0300
Advanced
Mnemonic
Operation
@ERn
@(d, PC)
Normal
@@aa
@aa
#xx
Rn
Appendix A Instruction Set
8. Block transfer instructions
Addressing Mode and Instruction Length (bytes) No. of States*1
Condition Code
@(d, ERn)
I
H
N
Z
V
C
EEPMOV. B
if R4L 0 then repeat @R5 @R6 R5+1 R5 R6+1 R6 R4L-1 R4L until R4L=0 else next if R4 0 then repeat @R5 @R6 R5+1 R5 R6+1 R6 R4-1 R4 until R4=0 else next
4 8+ 4n*2
EEPMOV. W
4 8+ 4n*2
Notes: 1. The number of states is the number of states required for execution when the instruction and its operands are located in on-chip memory. For other cases see section A.3, Number of States Required for Execution. 2. n is the value set in register R4L or R4. (1) Set to 1 when a carry or borrow occurs at bit 11; otherwise cleared to 0. (2) Set to 1 when a carry or borrow occurs at bit 27; otherwise cleared to 0. (3) Retains its previous value when the result is zero; otherwise cleared to 0. (4) Set to 1 when the adjustment produces a carry; otherwise retains its previous value. (5) The number of states required for execution of an instruction that transfers data in synchronization with the E clock is variable. (6) Set to 1 when the divisor is negative; otherwise cleared to 0. (7) Set to 1 when the divisor is zero; otherwise cleared to 0. (8) Set to 1 when the quotient is negative; otherwise cleared to 0.
Rev. 3.00 Sep 27, 2006 page 719 of 872 REJ09B0325-0300
Advanced
Mnemonic
Operation
@-ERn/@ERn+
Operand Size
@(d, PC)
Normal
@@aa
@ERn
@aa
#xx
Rn
A.2
Table A.2
Instruction code: Instruction when most significant bit of BH is 1.
4 ORC ADD SUB Table A.2 Table A.2 (2) (2) CMP MOV OR.B XOR.B AND.B Table A.2 (2) XORC ANDC LDC Table A.2 Table A.2 (2) (2) ADDX SUBX 5 6 7 8 9 A B C D E F Table A.2 (2) Table A.2 (2)
1st byte 2nd byte AH AL BH BL Instruction when most significant bit of BH is 0.
2 LDC 3
AL
AH
0
1
0
NOP
Table A.2 (2)
STC
Appendix A Instruction Set
1
Table A.2 Table A.2 Table A.2 Table A.2 (2) (2) (2) (2)
2 MOV.B
Operation Code Map
Operation Code Map
3 BLS BVS JMP MOV MOV BIOR ADD ADDX CMP SUBX OR XOR AND MOV BIXOR BIAND BILD Table A.2 Table A.2 EEPMOV (2) (2) Table A.2 (3) DIVXU BST OR BTST BOR BXOR BAND BIST BLD XOR AND RTS BSR RTE TRAPA Table A.2 (2) BCC BCS BNE BEQ BVC BPL BMI BGE BSR BLT BGT JSR BLE
Rev. 3.00 Sep 27, 2006 page 720 of 872 REJ09B0325-0300
4
BRA
BRN
BHI
5
MULXU
DIVXU
MULXU
6
BSET
BNOT
BCLR
7
8
9
A
B
C
D
E
F
Instruction code:
1st byte 2nd byte AH AL BH BL
2 LDC/STC ADD INC ADDS MOV SHLL SHAL SHAR ROTL ROTR EXTU EXTU NEG SHLR ROTXL ROTXR NOT SHAL SHAR ROTL ROTR NEG SUB DEC DEC SUBS CMP BHI CMP CMP SUB SUB OR OR BLS BCC BCS XOR XOR BNE AND AND BEQ BVC BVS BPL BMI BGE BLT BGT BLE DEC DEC EXTS EXTS INC INC INC SLEEP 3 4 5 6 7 8 9 A B C D E F Table A.2 (3)
BH AH AL
0
1
01
MOV
Table A.2 Table A.2 (3) (3)
0A
INC
0B
ADDS
0F
DAA
10
SHLL
11
SHLR
12
ROTXL
13
ROTXR
17
NOT
1A
DEC
1B
SUBS
1F
DAS
58
BRA
BRN
79
MOV
ADD
Appendix A Instruction Set
Rev. 3.00 Sep 27, 2006 page 721 of 872 REJ09B0325-0300
7A
MOV
ADD
Instruction code:
1st byte 2nd byte 3rd byte 4th byte AH AL BH BL CH CL DH DL
Instruction when most significant bit of DH is 0. Instruction when most significant bit of DH is 1.
CL 2 3 4 5 6 7 8 9 A B C D E F
Appendix A Instruction Set
AH ALBH BLCH LDC STC STC MULXS DIVXS OR BTST BOR BTST BIOR BCLR BIST BCLR BTST BOR BTST BIOR BCLR BIST BCLR BIXOR BIAND BILD BST BXOR BAND BLD BIXOR BIAND BILD BST BXOR BAND BLD XOR AND LDC
0
1
01406
LDC STC
LDC STC
01C05
MULXS
Rev. 3.00 Sep 27, 2006 page 722 of 872 REJ09B0325-0300
01D05
DIVXS
01F06
7Cr06 *1
7Cr07 *1
7Dr06 *1
BSET
BNOT
7Dr07 *1
BSET
BNOT
7Eaa6 *2
7Eaa7 *2
7Faa6 *2
BSET
BNOT
7Faa7 *2
BSET
BNOT
Notes: 1. r is the register designation field. 2. aa is the absolute address field.
Appendix A Instruction Set
A.3
Number of States Required for Execution
The tables in this section can be used to calculate the number of states required for instruction execution by the H8/300H CPU. Table A.4 indicates the number of instruction fetch, data read/write, and other cycles occurring in each instruction. Table A.3 indicates the number of states required per cycle according to the bus size. The number of states required for execution of an instruction can be calculated from these two tables as follows: Number of states = I x SI + J x SJ + K x SK + L x SL + M x SM + N x SN Examples of Calculation of Number of States Required for Execution Examples: Advanced mode, stack located in external address space, on-chip supporting modules accessed with 8-bit bus width, external devices accessed in three states with one wait state and 16-bit bus width. BSET #0, @FFFFC7:8 From table A.4, I = L = 2 and J = K = M = N = 0 From table A.3, SI = 4 and SL = 3 Number of states = 2 x 4 + 2 x 3 = 14 JSR @@30 From table A.4, I = J = K = 2 and L = M = N = 0 From table A.3, SI = SJ = SK = 4 Number of states = 2 x 4 + 2 x 4 + 2 x 4 = 24
Rev. 3.00 Sep 27, 2006 page 723 of 872 REJ09B0325-0300
Appendix A Instruction Set
Table A.3
Number of States per Cycle
Access Conditions On-Chip Supporting Module External Device 8-Bit Bus 2-State Access 4 3-State Access 6 + 2m 16-Bit Bus 2-State Access 2 3-State Access 3+m
Cycle Instruction fetch Branch address read Stack operation Byte data access Word data access Internal operation SI SJ SK SL SM SN
On-Chip Memory 2
8-Bit Bus 6
16-Bit Bus 3
3 6 1 1 1
2 4 1
3+m 6 + 2m 1 1 1
Legend: m: Number of wait states inserted into external device access
Rev. 3.00 Sep 27, 2006 page 724 of 872 REJ09B0325-0300
Appendix A Instruction Set
Table A.4
Number of Cycles per Instruction
Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N 1 1 2 1 3 1 1 1 1 1 1 2 1 3 2 1 1 2 2 2 2 2 2 2 2 2 2 2 2 2 2 1 1
Instruction Mnemonic ADD ADD.B #xx:8, Rd ADD.B Rs, Rd ADD.W #xx:16, Rd ADD.W Rs, Rd ADD.L #xx:32, ERd ADD.L ERs, ERd ADDS ADDX ADDS #1/2/4, ERd ADDX #xx:8, Rd ADDX Rs, Rd AND AND.B #xx:8, Rd AND.B Rs, Rd AND.W #xx:16, Rd AND.W Rs, Rd AND.L #xx:32, ERd AND.L ERs, ERd ANDC BAND ANDC #xx:8, CCR BAND #xx:3, Rd BAND #xx:3, @ERd BAND #xx:3, @aa:8 Bcc BRA d:8 (BT d:8) BRN d:8 (BF d:8) BHI d:8 BLS d:8 BCC d:8 (BHS d:8) BCS d:8 (BLO d:8) BNE d:8 BEQ d:8 BVC d:8 BVS d:8 BPL d:8 BMI d:8
Rev. 3.00 Sep 27, 2006 page 725 of 872 REJ09B0325-0300
Appendix A Instruction Set
Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 1 2 2 1 2 2 1 2 2 1 2 2 1 1 1 1 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2
Instruction Mnemonic Bcc BGE d:8 BLT d:8 BGT d:8 BLE d:8 BRA d:16 (BT d:16) BRN d:16 (BF d:16) BHI d:16 BLS d:16 BCC d:16 (BHS d:16) BCS d:16 (BLO d:16) BNE d:16 BEQ d:16 BVC d:16 BVS d:16 BPL d:16 BMI d:16 BGE d:16 BLT d:16 BGT d:16 BLE d:16 BCLR BCLR #xx:3, Rd BCLR #xx:3, @ERd BCLR #xx:3, @aa:8 BCLR Rn, Rd BCLR Rn, @ERd BCLR Rn, @aa:8 BIAND BIAND #xx:3, Rd BIAND #xx:3, @ERd BIAND #xx:3, @aa:8 BILD BILD #xx:3, Rd BILD #xx:3, @ERd BILD #xx:3, @aa:8
Rev. 3.00 Sep 27, 2006 page 726 of 872 REJ09B0325-0300
Appendix A Instruction Set
Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N 1 2 2 1 2 2 1 2 2 1 2 2 1 2 2 1 2 2 1 2 2 1 2 2 1 2 2 2 2 2 2 1 2 1 2 2 2 2 2 2 2 1 1 2 2 2 2 1 1 1 1 2 2 1 1
Instruction Mnemonic BIOR BIOR #xx:8, Rd BIOR #xx:8, @ERd BIOR #xx:8, @aa:8 BIST BIST #xx:3, Rd BIST #xx:3, @ERd BIST #xx:3, @aa:8 BIXOR BIXOR #xx:3, Rd BIXOR #xx:3, @ERd BIXOR #xx:3, @aa:8 BLD BLD #xx:3, Rd BLD #xx:3, @ERd BLD #xx:3, @aa:8 BNOT BNOT #xx:3, Rd BNOT #xx:3, @ERd BNOT #xx:3, @aa:8 BNOT Rn, Rd BNOT Rn, @ERd BNOT Rn, @aa:8 BOR BOR #xx:3, Rd BOR #xx:3, @ERd BOR #xx:3, @aa:8 BSET BSET #xx:3, Rd BSET #xx:3, @ERd BSET #xx:3, @aa:8 BSET Rn, Rd BSET Rn, @ERd BSET Rn, @aa:8 BSR BSR d:8
1 Normal*
Advanced BSR d:16
1 Normal*
Advanced
Rev. 3.00 Sep 27, 2006 page 727 of 872 REJ09B0325-0300
Appendix A Instruction Set
Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N 1 2 2 1 2 2 1 2 2 1 2 2 1 1 2 1 3 1 1 1 1 1 1 2 2 1 1 2 2 1 1 1 1 2n + 2*
2
Instruction Mnemonic BST BST #xx:3, Rd BST #xx:3, @ERd BST #xx:3, @aa:8 BTST BTST #xx:3, Rd BTST #xx:3, @ERd BTST #xx:3, @aa:8 BTST Rn, Rd BTST Rn, @ERd BTST Rn, @aa:8 BXOR BXOR #xx:3, Rd BXOR #xx:3, @ERd BXOR #xx:3, @aa:8 CMP CMP.B #xx:8, Rd CMP.B Rs, Rd CMP.W #xx:16, Rd CMP.W Rs, Rd CMP.L #xx:32, ERd CMP.L ERs, ERd DAA DAS DEC DAA Rd DAS Rd DEC.B Rd DEC.W #1/2, Rd DEC.L #1/2, ERd DIVXS DIVXS.B Rs, Rd DIVXS.W Rs, ERd DIVXU DIVXU.B Rs, Rd DIVXU.W Rs, ERd EEPMOV EEPMOV.B EEPMOV.W EXTS EXTS.W Rd EXTS.L ERd EXTU EXTU.W Rd EXTU.L ERd
2 2
1 1
1 1
1 1
12 20 12 20
2 2n + 2*
Rev. 3.00 Sep 27, 2006 page 728 of 872 REJ09B0325-0300
Appendix A Instruction Set
Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N 1 1 1 2 2 2 2 2 2 2 2 2 2 1 1 2 3 5 2 3 4 1 1 1 2 4 1 1 2 3 1 2 1 1 1 1 1 1 1 1 1 2 1 1 1 1 1 1 2 1 2 1 2 1 2 1 2 1 2 2 2 2 2 2
Instruction Mnemonic INC INC.B Rd INC.W #1/2, Rd INC.L #1/2, ERd JMP JMP @ERn JMP @aa:24
1 JMP @@aa:8 Normal*
Advanced JSR JSR @ERn
1 Normal*
Advanced JSR @aa:24
1 Normal*
Advanced JSR @@aa:8 Normal*
1
Advanced LDC LDC #xx:8, CCR LDC Rs, CCR LDC @ERs, CCR LDC @(d:16, ERs), CCR LDC @(d:24, ERs), CCR LDC @ERs+, CCR LDC @aa:16, CCR LDC @aa:24, CCR MOV MOV.B #xx:8, Rd MOV.B Rs, Rd MOV.B @ERs, Rd MOV.B @(d:16, ERs), Rd MOV.B @(d:24, ERs), Rd MOV.B @ERs+, Rd MOV.B @aa:8, Rd MOV.B @aa:16, Rd MOV.B @aa:24, Rd MOV.B Rs, @ERd MOV.B Rs, @(d:16, ERd)
Rev. 3.00 Sep 27, 2006 page 729 of 872 REJ09B0325-0300
Appendix A Instruction Set
Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N 4 1 1 2 3 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 1 1 1 1 1 2
Instruction Mnemonic MOV MOV.B Rs, @(d:24, ERd) MOV.B Rs, @-ERd MOV.B Rs, @aa:8 MOV.B Rs, @aa:16 MOV.B Rs, @aa:24 MOV.W #xx:16, Rd MOV.W Rs, Rd MOV.W @ERs, Rd
MOV.W @(d:16, ERs), Rd 2 MOV.W @(d:24, ERs), Rd 4 MOV.W @ERs+, Rd MOV.W @aa:16, Rd MOV.W @aa:24, Rd MOV.W Rs, @ERd 1 2 3 1
MOV.W Rs, @(d:16, ERd) 2 MOV.W Rs, @(d:24, ERd) 4 MOV.W Rs, @-ERd MOV.W Rs, @aa:16 MOV.W Rs, @aa:24 MOV.L #xx:32, ERd MOV.L ERs, ERd MOV.L @ERs, ERd 1 2 3 3 1 2
2 2 2 2 2 2 2 2 2 2 2 2 2 2
MOV.L @(d:16, ERs), ERd 3 MOV.L @(d:24, ERs), ERd 5 MOV.L @ERs+, ERd MOV.L @aa:16, ERd MOV.L @aa:24, ERd MOV.L ERs, @ERd 2 3 4 2
MOV.L ERs, @(d:16, ERd) 3 MOV.L ERs, @(d:24, ERd) 5 MOV.L ERs, @-ERd MOV.L ERs, @aa:16 MOV.L ERs, @aa:24 2 3 4
Rev. 3.00 Sep 27, 2006 page 730 of 872 REJ09B0325-0300
Appendix A Instruction Set
Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N
1
Instruction Mnemonic MOVFPE MOVTPE MULXS MOVFPE @aa:16, Rd*
2 2 2 2 1 1 1 1 1 1 1 1 1 1 1 2 1 3 2 1 1 2 1 2 1 1 1 1 1 1 1 1 1
1 1 12 20 12 20
1 MOVTPE Rs, @aa:16*
MULXS.B Rs, Rd MULXS.W Rs, ERd
MULXU
MULXU.B Rs, Rd MULXU.W Rs, ERd
NEG
NEG.B Rd NEG.W Rd NEG.L ERd
NOP NOT
NOP NOT.B Rd NOT.W Rd NOT.L ERd
OR
OR.B #xx:8, Rd OR.B Rs, Rd OR.W #xx:16, Rd OR.W Rs, Rd OR.L #xx:32, ERd OR.L ERs, ERd
ORC POP
ORC #xx:8, CCR POP.W Rn POP.L ERn
1 2 1 2
2 2 2 2
PUSH
PUSH.W Rn PUSH.L ERn
ROTL
ROTL.B Rd ROTL.W Rd ROTL.L ERd
ROTR
ROTR.B Rd ROTR.W Rd ROTR.L ERd
ROTXL
ROTXL.B Rd ROTXL.W Rd ROTXL.L ERd
Rev. 3.00 Sep 27, 2006 page 731 of 872 REJ09B0325-0300
Appendix A Instruction Set
Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N 1 1 1 2
1 Normal*
Instruction Mnemonic ROTXR ROTXR.B Rd ROTXR.W Rd ROTXR.L ERd RTE RTS RTE RTS
2 1 2
2 2 2
2 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 3 5 2 3 4 1 2 1 3 1 1
Advanced SHAL SHAL.B Rd SHAL.W Rd SHAL.L ERd SHAR SHAR.B Rd SHAR.W Rd SHAR.L ERd SHLL SHLL.B Rd SHLL.W Rd SHLL.L ERd SHLR SHLR.B Rd SHLR.W Rd SHLR.L ERd SLEEP STC SLEEP STC CCR, Rd STC CCR, @ERd STC CCR, @(d:16, ERd) STC CCR, @(d:24, ERd) STC CCR, @-ERd STC CCR, @aa:16 STC CCR, @aa:24 SUB SUB.B Rs, Rd SUB.W #xx:16, Rd SUB.W Rs, Rd SUB.L #xx:32, ERd SUB.L ERs, ERd SUBS SUBS #1/2/4, ERd
1 1 1 1 1 1 2
Rev. 3.00 Sep 27, 2006 page 732 of 872 REJ09B0325-0300
Appendix A Instruction Set
Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N 1 1 2 2 1 1 2 1 3 2 1 1 2 2 2 4 4
Instruction Mnemonic SUBX SUBX #xx:8, Rd SUBX Rs, Rd TRAPA
1 TRAPA #x:2 Normal*
Advanced XOR XOR.B #xx:8, Rd XOR.B Rs, Rd XOR.W #xx:16, Rd XOR.W Rs, Rd XOR.L #xx:32, ERd XOR.L ERs, ERd XORC XORC #xx:8, CCR
Notes: 1. Not available in the H8/3048B Group. 2. n is the value set in register R4L or R4. The source and destination are accessed n + 1 times each.
Rev. 3.00 Sep 27, 2006 page 733 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
Appendix B Internal I/O Register
Table B.1 Comparison of H8/3048 Group and H8/3048B Group Internal I/O Register Specifications
H8/3048 Mask ROM Version, H8/3047 Mask ROM Version, H8/3048F H8/3045 Mask ROM Version, H8/3044 Mask ROM Version -- -- -- -- -- -- FLMCR -- EBR1 EBR2 -- RAMCR H8/3048 F-ONE FLMCR1 FLMCR2 EBR -- RAMCR -- H8/3048B Mask ROM Version -- -- -- -- -- --
Address H8/3048 (Low) ZTAT H'FF40 H'FF41 H'FF42 H'FF43 H'FF47 H'FF48 -- -- -- -- -- --
Module
Flash memory
Note: A dash ("--") indicates that access is prohibited. Normal operation is not guaranteed if these addresses are accessed.
Rev. 3.00 Sep 27, 2006 page 734 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
B.1
Addresses (For H8/3048F-ONE, H8/3048B Mask ROM Version)
Data Bus Width Bit 7 Bit Names Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name
Address Register (low) Name H'1C H'1D H'1E H'1F H'20 H'21 H'22 H'23 H'24 H'25 H'26 H'27 MAR0AR MAR0AE MAR0AH MAR0AL ETCR0AH ETCR0AL IOAR0A DTCR0A
Reserved area (access prohibited)
8 8 8 8 8 8 8 8 DTE DTSZ DTID RPE DTIE DTS2 DTS1 DTS0
DMAC channel 0A
Short address mode Full address mode DMAC channel 0B
DTE
DTSZ
SAID
SAIDE
DTIE
DTS2A
DTS1A
DTS0A
H'28 H'29 H'2A H'2B H'2C H'2D H'2E H'2F
MAR0BR MAR0BE MAR0BH MAR0BL ETCR0BH ETCR0BL IOAR0B DTCR0B
8 8 8 8 8 8 8 8 DTE DTSZ DTID RPE DTIE DTS2 DTS1 DTS0
Short address mode Full address mode
DTME
--
DAID
DAIDE
TMS
DTS2B
DTS1B
DTS0B
Rev. 3.00 Sep 27, 2006 page 735 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
Data Bus Width Bit 7 8 8 8 8 8 8 8 8 DTE DTSZ DTID RPE DTIE DTS2 DTS1 DTS0 Short address mode Full address mode DMAC channel 1B Bit Names Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name DMAC channel 1A
Address Register (low) Name H'30 H'31 H'32 H'33 H'34 H'35 H'36 H'37 MAR1AR MAR1AE MAR1AH MAR1AL ETCR1AH ETCR1AL IOAR1A DTCR1A
DTE
DTSZ
SAID
SAIDE
DTIE
DTS2A
DTS1A
DTS0A
H'38 H'39 H'3A H'3B H'3C H'3D H'3E H'3F
MAR1BR MAR1BE MAR1BH MAR1BL ETCR1BH ETCR1BL IOAR1B DTCR1B
8 8 8 8 8 8 8 8 DTE DTSZ DTID RPE DTIE DTS2 DTS1 DTS0
Short address mode Full address mode Flash memory
DTME
--
DAID
DAIDE
TMS
DTS2B
DTS1B
DTS0B
H'40 H'41 H'42 H'43 H'44 H'45 H'46 H'47 H'48 H'49 H'4A H'4B H'4C H'4D H'4E H'4F
FLMCR1*4 8 FLMCR2*4 8 EBR*4 8
FWE FLER EB7
SWE --*3 EB6
ESU --*3 EB5
PSU --*3 EB4
EV --*3 EB3
PV --*3 EB2
E --*3 EB1
P --*3 EB0
Reserved area (access prohibited)
RAMCR*4
8
--
--
--
--
RAMS
RAM2
RAM1
--
Reserved area (access prohibited)
Rev. 3.00 Sep 27, 2006 page 736 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
Data Bus Width Bit 7 Bit Names Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name
Address Register (low) Name H'50 H'51 H'52 H'53 H'54 H'55 H'56 H'57 H'58 H'59 H'5A H'5B H'5C H'5D H'5E H'5F H'60 H'61 H'62 H'63 H'64 H'65 H'66 H'67 H'68 H'69 H'6A H'6B H'6C H'6D H'6E H'6F DASTCR DIVCR MSTCR CSCR TSTR TSNC TMDR TFCR TCR0 TIOR0 TIER0 TSR0 TCNT0H TCNT0L GRA0H GRA0L GRB0H GRB0L TCR1 TIOR1
Reserved area (access prohibited)
8 8 8 8 8 8 8 8 8 8 8 8 16
-- -- PSTOP CS7E -- -- -- -- -- -- -- --
-- -- -- CS6E -- -- MDF -- CCLR1 IOB2 -- --
-- --
-- --
-- --
-- --
-- DIV1
DASTE DIV0
D/A converter
System MSTOP5 MSTOP4 MSTOP3 MSTOP2 MSTOP1 MSTOP0 control CS4E STR4 SYNC4 PWM4 CMD0 CKEG1 IOB0 -- -- -- STR3 SYNC3 PWM3 BFB4 CKEG0 -- -- -- -- STR2 SYNC2 PWM2 BFA4 TPSC2 IOA2 OVIE OVF -- STR1 SYNC1 PWM1 BFB3 TPSC1 IOA1 IMIEB IMFB -- STR0 SYNC0 PWM0 BFA3 TPSC0 IOA0 IMIEA IMFA ITU channel 0 Bus controller ITU (all channels)
CS5E -- -- FDIR CMD1 CCLR0 IOB1 -- --
16
16
8 8
-- --
CCLR1 IOB2
CCLR0 IOB1
CKEG1 IOB0
CKEG0 --
TPSC2 IOA2
TPSC1 IOA1
TPSC0 IOA0
ITU channel 1
Rev. 3.00 Sep 27, 2006 page 737 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
Data Bus Width Bit 7 8 8 16 -- -- Bit Names Bit 6 -- -- Bit 5 -- -- Bit 4 -- -- Bit 3 -- -- Bit 2 OVIE OVF Bit 1 IMIEB IMFB Bit 0 IMIEA IMFA Module Name ITU channel 1
Address Register (low) Name H'70 H'71 H'72 H'73 H'74 H'75 H'76 H'77 H'78 H'79 H'7A H'7B H'7C H'7D H'7E H'7F H'80 H'81 H'82 H'83 H'84 H'85 H'86 H'87 H'88 H'89 H'8A H'8B H'8C H'8D H'8E H'8F TIER1 TSR1 TCNT1H TCNT1L GRA1H GRA1L GRB1H GRB1L TCR2 TIOR2 TIER2 TSR2 TCNT2H TCNT2L GRA2H GRA2L GRB2H GRB2L TCR3 TIOR3 TIER3 TSR3 TCNT3H TCNT3L GRA3H GRA3L GRB3H GRB3L BRA3H BRA3L BRB3H BRB3L
16
16
8 8 8 8 16
-- -- -- --
CCLR1 IOB2 -- --
CCLR0 IOB1 -- --
CKEG1 IOB0 -- --
CKEG0 -- -- --
TPSC2 IOA2 OVIE OVF
TPSC1 IOA1 IMIEB IMFB
TPSC0 IOA0 IMIEA IMFA
ITU channel 2
16
16
8 8 8 8 16
-- -- -- --
CCLR1 IOB2 -- --
CCLR0 IOB1 -- --
CKEG1 IOB0 -- --
CKEG0 -- -- --
TPSC2 IOA2 OVIE OVF
TPSC1 IOA1 IMIEB IMFB
TPSC0 IOA0 IMIEA IMFA
ITU channel 3
16
16
16
16
Rev. 3.00 Sep 27, 2006 page 738 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
Data Bus Width Bit 7 8 8 8 8 8 8 16 -- -- -- -- -- -- Bit Names Bit 6 -- -- CCLR1 IOB2 -- -- Bit 5 EXB4 -- CCLR0 IOB1 -- -- Bit 4 EXA4 XTGD CKEG1 IOB0 -- -- Bit 3 EB3 -- CKEG0 -- -- -- Bit 2 EB4 -- TPSC2 IOA2 OVIE OVF Bit 1 EA4 OLS4 TPSC1 IOA1 IMIEB IMFB Bit 0 EA3 OLS3 TPSC0 IOA0 IMIEA IMFA Module Name ITU (all channels) ITU channel 4
Address Register (low) Name H'90 H'91 H'92 H'93 H'94 H'95 H'96 H'97 H'98 H'99 H'9A H'9B H'9C H'9D H'9E H'9F H'A0 H'A1 H'A2 H'A3 H'A4 TOER TOCR TCR4 TIOR4 TIER4 TSR4 TCNT4H TCNT4L GRA4H GRA4L GRB4H GRB4L BRA4H BRA4L BRB4H BRB4L TPMR TPCR NDERB NDERA NDRB*1 NDRA*1 NDRB*1 NDRA*1 TCSR*2 TCNT*2 --
16
16
16
16
8 8 8 8 8 8
--
--
--
--
G3NOV
G2NOV
G1NOV
G0NOV
TPC
G3CMS1 G3CMS0 G2CMS1 G2CMS0 G1CMS1 G1CMS0 G0CMS1 G0CMS0 NDER15 NDER14 NDER13 NDER12 NDER11 NDER10 NDER9 NDER7 NDR15 NDR15 NDR7 NDR7 -- -- -- -- OVF NDER6 NDR14 NDR14 NDR6 NDR6 -- -- -- -- WT/IT NDER5 NDR13 NDR13 NDR5 NDR5 -- -- -- -- TME NDER4 NDR12 NDR12 NDR4 NDR4 -- -- -- -- -- NDER3 NDR11 -- NDR3 -- -- NDR11 -- NDR3 -- NDER2 NDR10 -- NDR2 -- -- NDR10 -- NDR2 CKS2 NDER1 NDR9 -- NDR1 -- -- NDR9 -- NDR1 CKS1 NDER8 NDER0 NDR8 -- NDR0 -- -- NDR8 -- NDR0 CKS0 WDT
H'A5
8 8
H'A6
8 8
H'A7
8 8
H'A8 H'A9 H'AA H'AB H'AC H'AD H'AE H'AF
8 8
-- WRST SRFMD CMF
-- --
-- --
-- --
-- --
-- -- RFSHE --
-- -- -- --
-- -- RCYCE -- Refresh controller
RSTCSR*2 8 RFSHCR RTMCSR RTCNT RTCOR 8 8 8 8
PSRAME DRAME CAS/WE M9/M8 CMIE CKS2 CKS1 CKS0
Rev. 3.00 Sep 27, 2006 page 739 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
Data Bus Width Bit 7 8 8 8 8 8 8 8 -- -- -- -- SDIR SINV -- SMIF TDRE RDRF ORER FER/ ERS PER TEND MPB MPBT TIE RIE TE RE MPIE TEIE CKE1 CKE0 Bit Names Bit 6 Bit 5 PE Bit 4 O/E Bit 3 STOP Bit 2 MP Bit 1 CKS1 Bit 0 CKS0 Module Name SCI channel 0
Address Register (low) Name H'B0 H'B1 H'B2 H'B3 H'B4 H'B5 H'B6 H'B7 H'B8 H'B9 H'BA H'BB H'BC H'BD H'BE H'BF H'C0 H'C1 H'C2 H'C3 H'C4 H'C5 H'C6 H'C7 H'C8 H'C9 H'CA H'CB H'CC H'CD H'CE H'CF P1DDR P2DDR P1DR P2DR P3DDR P4DDR P3DR P4DR P5DDR P6DDR P5DR P6DR -- P8DDR P7DR P8DR SMR BRR SCR TDR SSR RDR SCMR
C/A GM CHR
/
Reserved area (access prohibited) SMR BRR SCR TDR SSR RDR 8 8 8 8 8 8 TDRE RDRF ORER FER PER TEND MPB MPBT TIE RIE TE RE MPIE TEIE CKE1 CKE0 C/A CHR PE O/E STOP MP CKS1 CKS0 SCI channel 1
Reserved area (access prohibited)
8 8 8 8 8 8 8 8 8 8 8 8
P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR Port 1 P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR Port 2 P17 P27 P16 P26 P15 P25 P14 P24 P13 P23 P12 P22 P11 P21 P10 P20 Port 1 Port 2
P37DDR P36DDR P35DDR P34DDR P33DDR P32DDR P31DDR P30DDR Port 3 P47DDR P46DDR P45DDR P44DDR P43DDR P42DDR P41DDR P40DDR Port 4 P37 P47 -- -- -- -- -- P36 P46 -- P35 P45 -- P34 P44 -- P33 P43 P32 P42 P31 P41 P30 P40 Port 3 Port 4
P53DDR P52DDR P51DDR P50DDR Port 5 P53 P63 -- P52 P62 -- P51 P61 -- P50 P60 -- Port 5 Port 6
P66DDR P65DDR P64DDR P63DDR P62DDR P61DDR P60DDR Port 6 -- P66 -- -- P76 -- -- P65 -- -- P75 -- -- P64 --
8 8 8
-- P77 --
P84DDR P83DDR P82DDR P81DDR P80DDR Port 8 P74 P84 P73 P83 P72 P82 P71 P81 P70 P80 Port 7 Port 8
Rev. 3.00 Sep 27, 2006 page 740 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
Data Bus Width Bit 7 8 8 8 8 8 -- 8 -- 8 -- Bit Names Bit 6 -- Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name
Address Register (low) Name H'D0 H'D1 H'D2 H'D3 H'D4 H'D5 H'D6 H'D7 H'D8 H'D9 H'DA H'DB H'DC H'DD H'DE H'DF H'E0 H'E1 H'E2 H'E3 H'E4 H'E5 H'E6 H'E7 H'E8 H'E9 H'EA H'EB H'EC H'ED H'EE H'EF ABWCR ASTCR WCR WCER P9DDR PADDR P9DR PADR PBDDR -- PBDR -- P2PCR -- P4PCR P5PCR DADR0 DADR1 DACR
P95DDR P94DDR P93DDR P92DDR P91DDR P90DDR Port 9 P95 PA5 -- PB5 -- P94 PA4 -- PB4 -- P93 PA3 -- PB3 -- P92 PA2 -- PB2 -- P91 PA1 -- PB1 -- P90 PA0 -- PB0 -- Port 9 Port A
PA7DDR PA6DDR PA5DDR PA4DDR PA3DDR PA2DDR PA1DDR PA0DDR Port A -- PA7 -- PB7 -- -- PA6 -- PB6 --
PB7DDR PB6DDR PB5DDR PB4DDR PB3DDR PB2DDR PB1DDR PB0DDR Port B -- Port B --
P27PCR P26PCR P25PCR P24PCR P23PCR P22PCR P21PCR P20PCR Port 2 -- -- -- -- -- -- -- -- P47PCR P46PCR P45PCR P44PCR P43PCR P42PCR P41PCR P40PCR Port 4 -- -- -- -- P53PCR P52PCR P51PCR P50PCR Port 5 D/A converter
8 8 8 8 8
DAOE1
DAOE0
DAE
--
--
--
--
--
Reserved area (access prohibited) ADDRAH ADDRAL ADDRBH ADDRBL ADDRCH ADDRCL ADDRDH ADDRDL ADCSR ADCR 8 8 8 8 8 8 8 8 8 8 AD9 AD1 AD9 AD1 AD9 AD1 AD9 AD1 ADF TRGE AD8 AD0 AD8 AD0 AD8 AD0 AD8 AD0 ADIE -- AD7 -- AD7 -- AD7 -- AD7 -- ADST -- AD6 -- AD6 -- AD6 -- AD6 -- SCAN -- AD5 -- AD5 -- AD5 -- AD5 -- CKS -- AD4 -- AD4 -- AD4 -- AD4 -- CH2 -- AD3 -- AD3 -- AD3 -- AD3 -- CH1 -- AD2 -- AD2 -- AD2 -- AD2 -- CH0 -- A/D converter
Reserved area (access prohibited)
8 8 8 8
ABW7 AST7 -- WCE7
ABW6 AST6 -- WCE6
ABW5 AST5 -- WCE5
ABW4 AST4 -- WCE4
ABW3 AST3 WMS1 WCE3
ABW2 AST2 WMS0 WCE2
ABW1 AST1 WC1 WCE1
ABW0 AST0 WC0 WCE0
Bus controller
Rev. 3.00 Sep 27, 2006 page 741 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
Data Bus Width Bit 7 Bit Names Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name
Address Register (low) Name H'F0 H'F1 H'F2 H'F3 H'F4 H'F5 H'F6 H'F7 H'F8 H'F9 H'FA H'FB H'FC H'FD H'FE H'FF
Reserved area (access prohibited) MDCR SYSCR BRCR ISCR IER ISR 8 8 8 8 8 8 -- SSBY A23E -- -- -- -- STS2 A22E -- -- -- -- STS1 A21E -- STS0 -- -- UE -- MDS2 NMIEG -- MDS1 -- -- MDS0 RAME BRLE System control Bus controller
IRQ5SC IRQ4SC IRQ3SC IRQ2SC IRQ1SC IRQ0SC Interrupt controller IRQ5E IRQ4E IRQ3E IRQ2E IRQ1E IRQ0E IRQ5F IRQ4F IRQ3F IRQ2F IRQ1F IRQ0F
Reserved area (access prohibited) IPRA IPRB 8 8 IPRA7 IPRB7 IPRA6 IPRB6 IPRA5 IPRB5 IPRA4 -- IPRA3 IPRB3 IPRA2 IPRB2 IPRA1 IPRB1 IPRA0 --
Reserved area (access prohibited)
Legend: DMAC: DMA controller ITU: 16-bit integrated timer unit TPC: Programmable timing pattern controller WDT: Watchdog timer SCI: Serial communication interface Notes: 1. The address depends on the output trigger setting. 2. For write access to TCSR TCNT, and RSTCR see section 12.2.4, Notes on Register Rewriting. 3. Bits 6 to 0 in FLMCR2 are reserved bits but are readable/writable. 4. Byte data must be used to access FLMCR1, FLMCR2, EBR, and RAMCR. Registers FLMCR1, FLMCR2, EBR, and RAMCR are implemented in the flash memory version only. The mask ROM version does not have these registers.
Rev. 3.00 Sep 27, 2006 page 742 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
B.2
Addresses (For H8/3048F, H8/3048ZTAT, H8/3048 Mask-ROM, H8/3047 Mask-ROM, H8/3045 Mask-ROM, and H8/3044 MaskROM Versions)
Data Bus Width Bit 7 Bit Names Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name
Address Register (low) Name H'1C H'1D H'1E H'1F H'20 H'21 H'22 H'23 H'24 H'25 H'26 H'27 MAR0AR MAR0AE MAR0AH MAR0AL ETCR0AH ETCR0AL IOAR0A DTCR0A
8 8 8 8 8 8 8 8 DTE DTSZ DTID RPE DTIE DTS2 DTS1 DTS0
DMAC channel 0A
Short address mode Full address mode DMAC channel 0B
DTE
DTSZ
SAID
SAIDE
DTIE
DTS2A
DTS1A
DTS0A
H'28 H'29 H'2A H'2B H'2C H'2D H'2E H'2F
MAR0BR MAR0BE MAR0BH MAR0BL ETCR0BH ETCR0BL IOAR0B DTCR0B
8 8 8 8 8 8 8 8 DTE DTSZ DTID RPE DTIE DTS2 DTS1 DTS0
Short address mode Full address mode
DTME
--
DAID
DAIDE
TMS
DTS2B
DTS1B
DTS0B
Rev. 3.00 Sep 27, 2006 page 743 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
Data Bus Width Bit 7 8 8 8 8 8 8 8 8 DTE DTSZ DTID RPE DTIE DTS2 DTS1 DTS0 Short address mode Full address mode DMAC channel 1B Bit Names Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name DMAC channel 1A
Address Register (low) Name H'30 H'31 H'32 H'33 H'34 H'35 H'36 H'37 MAR1AR MAR1AE MAR1AH MAR1AL ETCR1AH ETCR1AL IOAR1A DTCR1A
DTE
DTSZ
SAID
SAIDE
DTIE
DTS2A
DTS1A
DTS0A
H'38 H'39 H'3A H'3B H'3C H'3D H'3E H'3F
MAR1BR MAR1BE MAR1BH MAR1BL ETCR1BH ETCR1BL IOAR1B DTCR1B
8 8 8 8 8 8 8 8 DTE DTSZ DTID RPE DTIE DTS2 DTS1 DTS0
Short address mode Full address mode Flash memory
DTME
--
DAID
DAIDE
TMS
DTS2B
DTS1B
DTS0B
H'40 H'41 H'42 H'43 H'44 H'45 H'46 H'47 H'48 H'49 H'4A H'4B H'4C H'4D H'4E H'4F
FLMCR -- EBR1 EBR2 -- -- -- -- RAMCR -- -- -- -- -- -- --
8
VPP -- LB7 SB7 -- -- -- --
VPPE -- LB6 SB6 -- -- -- -- -- -- -- -- -- -- -- --
-- -- LB5 SB5 -- -- -- -- -- -- -- -- -- -- -- --
-- -- LB4 SB4 -- -- -- -- -- -- -- -- -- -- -- --
EV -- LB3 SB3 -- -- -- -- RAMS -- -- -- -- -- -- --
PV -- LB2 SB2 -- -- -- -- RAM2 -- -- -- -- -- -- --
E -- LB1 SB1 -- -- -- -- RAM1 -- -- -- -- -- -- --
P -- LB0 SB0 -- -- -- -- RAM0 -- -- -- -- -- -- --
8 8
8
FLER -- -- -- -- -- -- --
Rev. 3.00 Sep 27, 2006 page 744 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
Data Bus Width Bit 7 -- -- -- -- -- -- -- -- -- -- -- -- 8 8 8 8 8 8 8 8 8 8 8 8 16 -- -- PSTOP CS7E -- -- -- -- -- -- -- -- Bit Names Bit 6 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- CS6E -- -- MDF -- CCLR1 IOB2 -- -- Bit 5 -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 4 -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 3 -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 2 -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 1 -- -- -- -- -- -- -- -- -- -- -- -- -- DIV1 Bit 0 -- -- -- -- -- -- -- -- -- -- -- -- DASTE DIV0 D/A converter Module Name
Address Register (low) Name H'50 H'51 H'52 H'53 H'54 H'55 H'56 H'57 H'58 H'59 H'5A H'5B H'5C H'5D H'5E H'5F H'60 H'61 H'62 H'63 H'64 H'65 H'66 H'67 H'68 H'69 H'6A H'6B H'6C H'6D H'6E H'6F -- -- -- -- -- -- -- -- -- -- -- -- DASTCR DIVCR MSTCR CSCR TSTR TSNC TMDR TFCR TCR0 TIOR0 TIER0 TSR0 TCNT0H TCNT0L GRA0H GRA0L GRB0H GRB0L TCR1 TIOR1
System MSTOP5 MSTOP4 MSTOP3 MSTOP2 MSTOP1 MSTOP0 control CS4E STR4 SYNC4 PWM4 CMD0 CKEG1 IOB0 -- -- -- STR3 SYNC3 PWM3 BFB4 CKEG0 -- -- -- -- STR2 SYNC2 PWM2 BFA4 TPSC2 IOA2 OVIE OVF -- STR1 SYNC1 PWM1 BFB3 TPSC1 IOA1 IMIEB IMFB -- STR0 SYNC0 PWM0 BFA3 TPSC0 IOA0 IMIEA IMFA ITU channel 0 Bus controller ITU (all channels)
CS5E -- -- FDIR CMD1 CCLR0 IOB1 -- --
16
16
8 8
-- --
CCLR1 IOB2
CCLR0 IOB1
CKEG1 IOB0
CKEG0 --
TPSC2 IOA2
TPSC1 IOA1
TPSC0 IOA0
ITU channel 1
Rev. 3.00 Sep 27, 2006 page 745 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
Data Bus Width Bit 7 8 8 16 -- -- Bit Names Bit 6 -- -- Bit 5 -- -- Bit 4 -- -- Bit 3 -- -- Bit 2 OVIE OVF Bit 1 IMIEB IMFB Bit 0 IMIEA IMFA Module Name ITU channel 1
Address Register (low) Name H'70 H'71 H'72 H'73 H'74 H'75 H'76 H'77 H'78 H'79 H'7A H'7B H'7C H'7D H'7E H'7F H'80 H'81 H'82 H'83 H'84 H'85 H'86 H'87 H'88 H'89 H'8A H'8B H'8C H'8D H'8E H'8F TIER1 TSR1 TCNT1H TCNT1L GRA1H GRA1L GRB1H GRB1L TCR2 TIOR2 TIER2 TSR2 TCNT2H TCNT2L GRA2H GRA2L GRB2H GRB2L TCR3 TIOR3 TIER3 TSR3 TCNT3H TCNT3L GRA3H GRA3L GRB3H GRB3L BRA3H BRA3L BRB3H BRB3L
16
16
8 8 8 8 16
-- -- -- --
CCLR1 IOB2 -- --
CCLR0 IOB1 -- --
CKEG1 IOB0 -- --
CKEG0 -- -- --
TPSC2 IOA2 OVIE OVF
TPSC1 IOA1 IMIEB IMFB
TPSC0 IOA0 IMIEA IMFA
ITU channel 2
16
16
8 8 8 8 16
-- -- -- --
CCLR1 IOB2 -- --
CCLR0 IOB1 -- --
CKEG1 IOB0 -- --
CKEG0 -- -- --
TPSC2 IOA2 OVIE OVF
TPSC1 IOA1 IMIEB IMFB
TPSC0 IOA0 IMIEA IMFA
ITU channel 3
16
16
16
16
Rev. 3.00 Sep 27, 2006 page 746 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
Data Bus Width Bit 7 8 8 8 8 8 8 16 -- -- -- -- -- -- Bit Names Bit 6 -- -- CCLR1 IOB2 -- -- Bit 5 EXB4 -- CCLR0 IOB1 -- -- Bit 4 EXA4 XTGD CKEG1 IOB0 -- -- Bit 3 EB3 -- CKEG0 -- -- -- Bit 2 EB4 -- TPSC2 IOA2 OVIE OVF Bit 1 EA4 OLS4 TPSC1 IOA1 IMIEB IMFB Bit 0 EA3 OLS3 TPSC0 IOA0 IMIEA IMFA Module Name ITU (all channels) ITU channel 4
Address Register (low) Name H'90 H'91 H'92 H'93 H'94 H'95 H'96 H'97 H'98 H'99 H'9A H'9B H'9C H'9D H'9E H'9F H'A0 H'A1 H'A2 H'A3 H'A4 TOER TOCR TCR4 TIOR4 TIER4 TSR4 TCNT4H TCNT4L GRA4H GRA4L GRB4H GRB4L BRA4H BRA4L BRB4H BRB4L TPMR TPCR NDERB NDERA NDRB*1 NDRA*1 NDRB*1 NDRA*1 TCSR*2 TCNT*2 --
16
16
16
16
8 8 8 8 8 8
--
--
--
--
G3NOV
G2NOV
G1NOV
G0NOV
TPC
G3CMS1 G3CMS0 G2CMS1 G2CMS0 G1CMS1 G1CMS0 G0CMS1 G0CMS0 NDER15 NDER14 NDER13 NDER12 NDER11 NDER10 NDER9 NDER7 NDR15 NDR15 NDR7 NDR7 -- -- -- -- OVF NDER6 NDR14 NDR14 NDR6 NDR6 -- -- -- -- WT/IT NDER5 NDR13 NDR13 NDR5 NDR5 -- -- -- -- TME NDER4 NDR12 NDR12 NDR4 NDR4 -- -- -- -- -- NDER3 NDR11 -- NDR3 -- -- NDR11 -- NDR3 -- NDER2 NDR10 -- NDR2 -- -- NDR10 -- NDR2 CKS2 NDER1 NDR9 -- NDR1 -- -- NDR9 -- NDR1 CKS1 NDER8 NDER0 NDR8 -- NDR0 -- -- NDR8 -- NDR0 CKS0 WDT
H'A5
8 8
H'A6
8 8
H'A7
8 8
H'A8 H'A9 H'AA H'AB H'AC H'AD H'AE H'AF
8 8
-- WRST SRFMD CMF
-- RSTOE
-- --
-- --
-- --
-- -- RFSHE --
-- -- -- --
-- -- RCYCE -- Refresh controller
RSTCSR*2 8 RFSHCR RTMCSR RTCNT RTCOR 8 8 8 8
PSRAME DRAME CAS/WE M9/M8 CMIE CKS2 CKS1 CKS0
Rev. 3.00 Sep 27, 2006 page 747 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
Data Bus Width Bit 7 8 8 8 8 8 8 8 -- -- -- -- SDIR SINV -- SMIF TDRE RDRF ORER FER/ ERS PER TEND MPB MPBT TIE RIE TE RE MPIE TEIE CKE1 CKE0 Bit Names Bit 6 Bit 5 PE Bit 4 O/E Bit 3 STOP Bit 2 MP Bit 1 CKS1 Bit 0 CKS0 Module Name SCI channel 0
Address Register (low) Name H'B0 H'B1 H'B2 H'B3 H'B4 H'B5 H'B6 H'B7 H'B8 H'B9 H'BA H'BB H'BC H'BD H'BE H'BF H'C0 H'C1 H'C2 H'C3 H'C4 H'C5 H'C6 H'C7 H'C8 H'C9 H'CA H'CB H'CC H'CD H'CE H'CF P1DDR P2DDR P1DR P2DR P3DDR P4DDR P3DR P4DR P5DDR P6DDR P5DR P6DR -- P8DDR P7DR P8DR SMR BRR SCR TDR SSR RDR -- SMR BRR SCR TDR SSR RDR SCMR
C/A GM CHR
/
8 8 8 8 8 8
C/A
CHR
PE
O/E
STOP
MP
CKS1
CKS0
SCI channel 1
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
TDRE
RDRF
ORER
FER
PER
TEND
MPB
MPBT
--
--
--
--
--
--
--
--
8 8 8 8 8 8 8 8 8 8 8 8
P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR Port 1 P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR Port 2 P17 P27 P16 P26 P15 P25 P14 P24 P13 P23 P12 P22 P11 P21 P10 P20 Port 1 Port 2
P37DDR P36DDR P35DDR P34DDR P33DDR P32DDR P31DDR P30DDR Port 3 P47DDR P46DDR P45DDR P44DDR P43DDR P42DDR P41DDR P40DDR Port 4 P37 P47 -- -- -- -- -- P36 P46 -- P35 P45 -- P34 P44 -- P33 P43 P32 P42 P31 P41 P30 P40 Port 3 Port 4
P53DDR P52DDR P51DDR P50DDR Port 5 P53 P63 -- P52 P62 -- P51 P61 -- P50 P60 -- Port 5 Port 6
P66DDR P65DDR P64DDR P63DDR P62DDR P61DDR P60DDR Port 6 -- P66 -- -- P76 -- -- P65 -- -- P75 -- -- P64 --
8 8 8
-- P77 --
P84DDR P83DDR P82DDR P81DDR P80DDR Port 8 P74 P84 P73 P83 P72 P82 P71 P81 P70 P80 Port 7 Port 8
Rev. 3.00 Sep 27, 2006 page 748 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
Data Bus Width Bit 7 8 8 8 8 8 -- Bit Names Bit 6 -- Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name
Address Register (low) Name H'D0 H'D1 H'D2 H'D3 H'D4 H'D5 H'D6 H'D7 H'D8 H'D9 H'DA H'DB H'DC H'DD H'DE H'DF H'E0 H'E1 H'E2 H'E3 H'E4 H'E5 H'E6 H'E7 H'E8 H'E9 H'EA H'EB H'EC H'ED H'EE H'EF P9DDR PADDR P9DR PADR PBDDR -- PBDR -- P2PCR -- P4PCR P5PCR DADR0 DADR1 DACR -- ADDRAH ADDRAL ADDRBH ADDRBL ADDRCH ADDRCL ADDRDH ADDRDL ADCSR ADCR -- -- ABWCR ASTCR WCR WCER
P95DDR P94DDR P93DDR P92DDR P91DDR P90DDR Port 9 P95 PA5 -- PB5 -- P94 PA4 -- PB4 -- P93 PA3 -- PB3 -- P92 PA2 -- PB2 -- P91 PA1 -- PB1 -- P90 PA0 -- PB0 -- Port B Port 9 Port A
PA7DDR PA6DDR PA5DDR PA4DDR PA3DDR PA2DDR PA1DDR PA0DDR Port A -- PA7 -- -- PA6 -- PB6 --
PB7DDR PB6DDR PB5DDR PB4DDR PB3DDR PB2DDR PB1DDR PB0DDR Port B PB7 --
8
8
P27PCR P26PCR P25PCR P24PCR P23PCR P22PCR P21PCR P20PCR Port 2 -- -- -- -- -- -- -- -- P47PCR P46PCR P45PCR P44PCR P43PCR P42PCR P41PCR P40PCR Port 4 -- -- -- -- P53PCR P52PCR P51PCR P50PCR Port 5 D/A converter
8 8 8 8 8
DAOE1 --
DAOE0 -- AD8 AD0 AD8 AD0 AD8 AD0 AD8 AD0 ADIE -- -- -- ABW6 AST6 -- WCE6
DAE -- AD7 -- AD7 -- AD7 -- AD7 -- ADST -- -- -- ABW5 AST5 -- WCE5
-- -- AD6 -- AD6 -- AD6 -- AD6 -- SCAN -- -- -- ABW4 AST4 -- WCE4
-- -- AD5 -- AD5 -- AD5 -- AD5 -- CKS -- -- -- ABW3 AST3 WMS1 WCE3
-- -- AD4 -- AD4 -- AD4 -- AD4 -- CH2 -- -- -- ABW2 AST2 WMS0 WCE2
-- -- AD3 -- AD3 -- AD3 -- AD3 -- CH1 -- -- -- ABW1 AST1 WC1 WCE1
-- -- AD2 -- AD2 -- AD2 -- AD2 -- CH0 -- -- -- ABW0 AST0 WC0 WCE0 Bus controller A/D converter
8 8 8 8 8 8 8 8 8 8
AD9 AD1 AD9 AD1 AD9 AD1 AD9 AD1 ADF TRGE -- --
8 8 8 8
ABW7 AST7 -- WCE7
Rev. 3.00 Sep 27, 2006 page 749 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
Data Bus Width Bit 7 -- 8 8 8 8 8 8 -- SSBY A23E -- -- -- -- 8 8 IPRA7 IPRB7 -- -- Bit Names Bit 6 -- -- STS2 A22E -- -- -- -- IPRA6 IPRB6 -- -- Bit 5 -- -- STS1 A21E Bit 4 -- -- STS0 -- Bit 3 -- -- UE -- Bit 2 -- MDS2 NMIEG -- Bit 1 -- MDS1 -- -- Bit 0 -- MDS0 RAME BRLE System control Bus controller Module Name
Address Register (low) Name H'F0 H'F1 H'F2 H'F3 H'F4 H'F5 H'F6 H'F7 H'F8 H'F9 H'FA H'FB H'FC H'FD H'FE H'FF -- -- -- -- MDCR SYSCR BRCR ISCR IER ISR -- IPRA IPRB -- --
IRQ5SC IRQ4SC IRQ3SC IRQ2SC IRQ1SC IRQ0SC Interrupt controller IRQ5E IRQ4E IRQ3E IRQ2E IRQ1E IRQ0E IRQ5F -- IPRA5 IPRB5 -- -- IRQ4F -- IPRA4 -- -- -- IRQ3F -- IPRA3 IPRB3 -- -- IRQ2F -- IPRA2 IPRB2 -- -- IRQ1F -- IPRA1 IPRB1 -- -- IRQ0F -- IPRA0 -- -- --
-- -- --
-- -- --
-- -- --
-- -- --
-- -- --
-- -- --
-- -- --
-- -- --
Legend: DMAC: DMA controller ITU: 16-bit integrated timer unit TPC: Programmable timing pattern controller SCI: Serial communication interface WDT: Watchdog timer Notes: 1. The address depends on the output trigger setting. 2. For write access to TCSR, TCNT, and RSTCSR, see section 12.2.4, Notes on Register Rewriting.
Rev. 3.00 Sep 27, 2006 page 750 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
B.3
Function
Register name Address to which the register is mapped Name of on-chip supporting module
Register acronym
TSTR Timer Start Register
H'60
ITU (all channels)
Bit numbers
Bit 7 6 5 4 STR4 0 R/W 3 STR3 0 R/W 2 STR2 0 R/W 1 STR1 0 R/W 0 STR0 0 R/W
Initial bit values
Initial value Read/Write 1
1
1
Names of the bits. Dashes (--) indicate reserved bits.
Possible types of access R W Read only Write only
Counter start 0 0 TCNT0 is halted 1 TCNT0 is counting Counter start 1 0 TCNT1 is halted 1 TCNT1 is counting Counter start 2 0 TCNT2 is halted 1 TCNT2 is counting Counter start 3 0 TCNT3 is halted 1 TCNT3 is counting Counter start 4 0 TCNT4 is halted 1 TCNT4 is counting
R/W Read and write
Full name of bit
Descriptions of bit settings
Rev. 3.00 Sep 27, 2006 page 751 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
MAR0A R/E/H/L--Memory Address Register 0A R/E/H/L
H'20, H'21, H'22, H'23
22 21 20 19 18
DMAC0
Bit Initial value Read/Write
31 1
30 1
29 1
28 1
27 1
26 1
25 1
24 1
23
17
16
Undetermined
R/W R/W R/W R/W R/W R/W R/W R/W MAR0AE
MAR0AR Bit Initial value Read/Write 15 14 13 12 11 10 9 8 7 6 5
4
3
2
1
0
Undetermined
Undetermined
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W MAR0AH Source or destination address MAR0AL
Rev. 3.00 Sep 27, 2006 page 752 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
ETCR0A H/L--Execute Transfer Count Register 0A H/L * Short address mode I/O mode and idle mode
Bit Initial value Read/Write 15 14 13 12 11 10 9 8 7 6
H'24, H'25
DMAC0
5
4
3
2
1
0
Undetermined R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Transfer counter
Repeat mode
Bit Initial value Read/Write R/W R/W R/W 7 6 5 4 3 2 1 0
Undetermined R/W R/W R/W R/W R/W
ETCR0AH Transfer counter Bit Initial value Read/Write R/W R/W R/W 7 6 5 4 3 2 1 0
Undetermined R/W R/W R/W R/W R/W
ETCR0AL Initial count
Rev. 3.00 Sep 27, 2006 page 753 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
ETCR0A H/L--Execute Transfer Count Register 0A H/L (cont) * Full address mode Normal mode
Bit Initial value Read/Write 15 14 13 12 11 10 9 8 7 6
H'24, H'25
DMAC0
5
4
3
2
1
0
Undetermined R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Transfer counter
Block transfer mode
Bit Initial value Read/Write R/W R/W R/W 7 6 5 4 3 2 1 0
Undetermined R/W R/W R/W R/W R/W
ETCR0AH Block size counter Bit Initial value Read/Write R/W R/W R/W 7 6 5 4 3 2 1 0
Undetermined R/W R/W R/W R/W R/W
ETCR0AL Initial block size
Rev. 3.00 Sep 27, 2006 page 754 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
IOAR0A--I/O Address Register 0A
Bit Initial value Read/Write R/W R/W R/W 7 6 5 4 3
H'26
2 1
DMAC0
0
Undetermined R/W R/W R/W R/W R/W
Short address mode: source or destination address Full address mode: not used
Rev. 3.00 Sep 27, 2006 page 755 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
DTCR0A--Data Transfer Control Register 0A * Short address mode
Bit Initial value Read/Write 7 DTE 0 R/W 6 DTSZ 0 R/W 5 DTID 0 R/W 4 RPE 0 R/W 3 DTIE 0 R/W
H'27
DMAC0
2 DTS2 0 R/W
1 DTS1 0 R/W
0 DTS0 0 R/W
Data transfer select
Bit 2 Bit 1 Bit 0 DTS2 DTS1 DTS0 0 0 0 1 1 0 1 1 0 0 1 1 0 1 Data Transfer Activation Source Compare match/input capture A interrupt from ITU channel 0 Compare match/input capture A interrupt from ITU channel 1 Compare match/input capture A interrupt from ITU channel 2 Compare match/input capture A interrupt from ITU channel 3 SCI0 transmit-data-empty interrupt SCI0 receive-data-full interrupt Transfer in full address mode (channel A) Transfer in full address mode (channel A)
Data transfer interrupt enable
0 Interrupt requested by DTE bit is disabled 1 Interrupt requested by DTE bit is enabled
Repeat enable
RPE 0 1 DTIE 0 1 0 1 Description I/O mode Repeat mode Idle mode
Data transfer increment/decrement
0 Incremented: If DTSZ = 0, MAR is incremented by 1 after each transfer If DTSZ = 1, MAR is incremented by 2 after each transfer 1 Decremented: If DTSZ = 0, MAR is decremented by 1 after each transfer If DTSZ = 1, MAR is decremented by 2 after each transfer
Data transfer size
0 Byte-size transfer 1 Word-size transfer
Data transfer enable
0 Data transfer is disabled 1 Data transfer is enabled
Rev. 3.00 Sep 27, 2006 page 756 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
DTCR0A--Data Transfer Control Register 0A (cont) * Full address mode
Bit Initial value Read/Write 7 DTE 0 R/W 6 DTSZ 0 R/W 5 SAID 0 R/W 4 SAIDE 0 R/W 3 DTIE 0 R/W
H'27
DMAC0
2 DTS2A 0 R/W
1 DTS1A 0 R/W
0 DTS0A 0 R/W
Data transfer select 0A 0 Normal mode 1 Block transfer mode Data transfer select 2A and 1A Set both bits to 1 Data transfer interrupt enable 0 Interrupt request by DTE bit is disabled 1 Interrupt request by DTE bit is enabled Source address increment/decrement (bit 5) Source address increment/decrement enable (bit 4) Bit 5 Bit 4 SAID SAIDE Increment/Decrement Enable 0 0 MARA is held fixed Incremented: If DTSZ = 0, MARA is incremented by 1 after each transfer 1 If DTSZ = 1, MARA is incremented by 2 after each transfer 1 MARA is held fixed 0 Decremented: If DTSZ = 0, MARA is decremented by 1 after each transfer 1 If DTSZ = 1, MARA is decremented by 2 after each transfer Data transfer size 0 Byte-size transfer 1 Word-size transfer Data transfer enable 0 Data transfer is disabled 1 Data transfer is enabled
Rev. 3.00 Sep 27, 2006 page 757 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
MAR0B R/E/H/L--Memory Address Register 0B R/E/H/L
H'28, H'29, H'2A, H'2B
22 21 20 19 18
DMAC0
Bit Initial value Read/Write
31 1
30 1
29 1
28 1
27 1
26 1
25 1
24 1
23
17
16
Undetermined R/W R/W R/W R/W R/W R/W R/W R/W MAR0BE
MAR0BR Bit Initial value Read/Write 15 14 13 12 11 10 9 8 7 6 5
4
3
2
1
0
Undetermined
Undetermined
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W MAR0BH Source or destination address MAR0BL
Rev. 3.00 Sep 27, 2006 page 758 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
ETCR0B H/L--Execute Transfer Count Register 0B H/L * Short address mode I/O mode and idle mode
Bit Initial value Read/Write 15 14 13 12 11 10 9 8 7 6
H'2C, H'2D
DMAC0
5
4
3
2
1
0
Undetermined R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Transfer counter
Repeat mode
Bit Initial value Read/Write R/W R/W R/W 7 6 5 4 3 2 1 0
Undetermined R/W R/W R/W R/W R/W
ETCR0BH Transfer counter Bit Initial value Read/Write R/W R/W R/W 7 6 5 4 3 2 1 0
Undetermined R/W R/W R/W R/W R/W
ETCR0BL Initial count
Rev. 3.00 Sep 27, 2006 page 759 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
ETCR0B H/L--Execute Transfer Count Register 0B H/L (cont) * Full address mode Normal mode
Bit Initial value Read/Write 15 14 13 12 11 10 9 8 7 6
H'2C, H'2D
DMAC0
5
4
3
2
1
0
Undetermined R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Not used
Block transfer mode
Bit Initial value Read/Write 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Undetermined R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Block transfer counter
IOAR0B--I/O Address Register 0B
Bit Initial value Read/Write R/W R/W R/W 7 6 5 4 3
H'2E
2 1
DMAC0
0
Undetermined R/W R/W R/W R/W R/W
Short address mode: source or destination address Full address mode: not used
Rev. 3.00 Sep 27, 2006 page 760 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
DTCR0B--Data Transfer Control Register 0B * Short address mode
Bit Initial value Read/Write 7 DTE 0 R/W 6 DTSZ 0 R/W 5 DTID 0 R/W 4 RPE 0 R/W 3 DTIE 0 R/W
H'2F
DMAC0
2 DTS2 0 R/W
1 DTS1 0 R/W
0 DTS0 0 R/W
Data transfer select Bit 2 Bit 1 Bit 0 DTS2 DTS1 DTS0 0 0 0 1 1 0 1 0 1 0 1 0 1 1
Data Transfer Activation Source Compare match/input capture A interrupt from ITU channel 0 Compare match/input capture A interrupt from ITU channel 1 Compare match/input capture A interrupt from ITU channel 2 Compare match/input capture A interrupt from ITU channel 3 SCI0 transmit-data-empty interrupt SCI0 receive-data-full interrupt Falling edge of DREQ input Low level of DREQ input
Data transfer interrupt enable 0 Interrupt requested by DTE bit is disabled 1 Interrupt requested by DTE bit is enabled An interrupt request is issued to the CPU when the DTE bit = 0 Repeat enable RPE DTIE Description 0 0 I/O mode 1 0 1 Repeat mode 1 Idle mode Data transfer increment/decrement 0 Incremented: If DTSZ = 0, MAR is incremented by 1 after each transfer If DTSZ = 1, MAR is incremented by 2 after each transfer 1 Decremented: If DTSZ = 0, MAR is decremented by 1 after each transfer If DTSZ = 1, MAR is decremented by 2 after each transfer Data transfer size 0 Byte-size transfer 1 Word-size transfer Data transfer enable 0 Data transfer is disabled 1 Data transfer is enabled
Rev. 3.00 Sep 27, 2006 page 761 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
DTCR0B--Data Transfer Control Register 0B (cont) * Full address mode
Bit Initial value Read/Write 7 DTME 0 R/W 6
H'2F
DMAC0
5 DAID 0 R/W
4 DAIDE 0 R/W
3 TMS 0 R/W
2 DTS2B 0 R/W
1 DTS1B 0 R/W
0 DTS0B 0 R/W
0 R/W
Data transfer select 2B to 0B Bit 2 Bit 1 Bit 0 Data Transfer Activation Source DTS2B DTS1B DTS0B Normal Mode Block Transfer Mode 0 0 0 Auto-request Compare match/input capture (burst mode) A from ITU channel 0 1 Not available Compare match/input capture A from ITU channel 1 0 Compare match/input capture Auto-request 1 A from ITU channel 2 (cycle-steal mode) 1 Compare match/input capture Not available A from ITU channel 3 0 Not available Not available 0 1 1 Not available Not available Falling edge of DREQ 0 Falling edge of DREQ 1 1 Low level input at DREQ Not available Transfer mode select 0 Destination is the block area in block transfer mode 1 Source is the block area in block transfer mode Destination address increment/decrement (bit 5) Destination address increment/decrement enable (bit 4) Bit 5 Bit 4 DAID DAIDE Increment/Decrement Enable 0 0 MARB is held fixed 1 Incremented: If DTSZ = 0, MARB is incremented by 1 after each transfer If DTSZ = 1, MARB is incremented by 2 after each transfer 1 0 MARB is held fixed 1 Decremented: If DTSZ = 0, MARB is decremented by 1 after each transfer If DTSZ = 1, MARB is decremented by 2 after each transfer Data transfer master enable 0 Data transfer is disabled 1 Data transfer is enabled
Rev. 3.00 Sep 27, 2006 page 762 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
MAR1A R/E/H/L--Memory Address Register 1A R/E/H/L
H'30, H'31, H'32, H'33
22 21 20 19 18
DMAC1
Bit Initial value Read/Write
31 1
30 1
29 1
28 1
27 1
26 1
25 1
24 1
23
17
16
Undetermined R/W R/W R/W R/W R/W R/W R/W R/W MAR1AE
MAR1AR Bit Initial value Read/Write 15 14 13 12 11 10 9 8 7 6 5
4
3
2
1
0
Undetermined
Undetermined
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W MAR1AH MAR1AL
Note: Bit functions are the same as for DMAC0.
Rev. 3.00 Sep 27, 2006 page 763 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
ETCR1A H/L--Execute Transfer Count Register 1A H/L
Bit Initial value Read/Write Bit Initial value Read/Write R/W R/W R/W 15 14 13 12 11 10 9 8 7 6
H'34, H'35
5 4 3 2
DMAC1
1 0
Undetermined R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W 7 6 5 4 3 2 1 0
Undetermined R/W R/W R/W R/W R/W
ETCR1AH Bit Initial value Read/Write R/W R/W R/W 7 6 5 4 3 2 1 0
Undetermined R/W R/W R/W R/W R/W
ETCR1AL Note: Bit functions are the same as for DMAC0.
IOAR1A--I/O Address Register 1A
Bit Initial value Read/Write R/W R/W R/W 7 6 5 4 3
H'36
2 1
DMAC1
0
Undetermined R/W R/W R/W R/W R/W
Note: Bit functions are the same as for DMAC0.
Rev. 3.00 Sep 27, 2006 page 764 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
DTCR1A--Data Transfer Control Register 1A * Short address mode
Bit Initial value Read/Write 7 DTE 0 R/W 6 DTSZ 0 R/W 5 DTID 0 R/W 4 RPE 0 R/W 3 DTIE 0 R/W
H'37
DMAC1
2 DTS2 0 R/W
1 DTS1 0 R/W
0 DTS0 0 R/W
* Full address mode
Bit Initial value Read/Write 7 DTE 0 R/W 6 DTSZ 0 R/W 5 SAID 0 R/W 4 SAIDE 0 R/W 3 DTIE 0 R/W 2 DTS2A 0 R/W 1 DTS1A 0 R/W 0 DTS0A 0 R/W
Note: Bit functions are the same as for DMAC0.
MAR1B R/E/H/L--Memory Address Register 1B R/E/H/L
H'38, H'39, H'3A, H'3B
22 21 20 19 18
DMAC1
Bit Initial value Read/Write
31 1
30 1
29 1
28 1
27 1
26 1
25 1
24 1
23
17
16
Undetermined R/W R/W R/W R/W R/W R/W R/W R/W MAR1BE
MAR1BR Bit Initial value Read/Write 15 14 13 12 11 10 9 8 7 6 5
4
3
2
1
0
Undetermined
Undetermined
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W MAR1BH MAR1BL
Note: Bit functions are the same as for DMAC0.
Rev. 3.00 Sep 27, 2006 page 765 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
ETCR1B H/L--Execute Transfer Count Register 1B H/L
Bit Initial value Read/Write Bit Initial value Read/Write R/W R/W R/W 15 14 13 12 11 10 9 8 7 6
H'3C, H'3D
5 4 3 2
DMAC1
1 0
Undetermined R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W 7 6 5 4 3 2 1 0
Undetermined R/W R/W R/W R/W R/W
ETCR1BH Bit Initial value Read/Write R/W R/W R/W 7 6 5 4 3 2 1 0
Undetermined R/W R/W R/W R/W R/W
ETCR1BL Note: Bit functions are the same as for DMAC0.
IOAR1B--I/O Address Register 1B
Bit Initial value Read/Write R/W R/W R/W 7 6 5 4 3
H'3E
2 1
DMAC1
0
Undetermined R/W R/W R/W R/W R/W
Note: Bit functions are the same as for DMAC0.
Rev. 3.00 Sep 27, 2006 page 766 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
DTCR1B--Data Transfer Control Register 1B * Short address mode
Bit Initial value Read/Write 7 DTE 0 R/W 6 DTSZ 0 R/W 5 DTID 0 R/W 4 RPE 0 R/W 3 DTIE 0 R/W
H'3F
DMAC1
2 DTS2 0 R/W
1 DTS1 0 R/W
0 DTS0 0 R/W
* Full address mode
Bit Initial value Read/Write 7 DTME 0 R/W 6 0 R/W 5 DAID 0 R/W 4 DAIDE 0 R/W 3 TMS 0 R/W 2 DTS2B 0 R/W 1 DTS1B 0 R/W 0 DTS0B 0 R/W
Note: Bit functions are the same as for DMAC0.
Rev. 3.00 Sep 27, 2006 page 767 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
FLMCR--Flash Memory Control Register
Bit 7 VPP Initial value* Read/Write 0 R 6
VPP E
H'40
4 3 EV 0 R/W* 2 PV 0 R/W* 1 E 0 R/W *
Flash memory
0 P 0 R/W *
5
0
0
0 R/W
Program mode 0 Exit from program mode (Initial value) 1 Transition to program mode Erase mode 0 Exit from erase mode 1 Transition to erase mode Program-verify mode 0 Exit from program-verify mode 1 Transition to program-verify mode Erase-verify mode 0 Exit from erase-verify mode 1 Transition to erase-verify mode VPP enable
0 VPP pin 12 V power supply is disabled 1 VPP pin 12 V power supply is enabled
(Initial value)
(Initial value)
(Initial value)
(Initial value)
Programming power 0 Cleared when 12 V is not applied to VPP 1 Set when 12 V is applied to VPP
(Initial value)
Note: * The initial value is H'00 in modes 5, 6, and 7 (on-chip flash memory enabled). In modes 1, 2, 3, and 4 (on-chip flash memory disabled), this register cannot be modified and is always read as H'FF. H8/3048F Include this register H8/3048B mask ROM version Not include this register H8/3048F-ONE H8/3048ZTAT H8/3048 mask ROM version H8/3047 mask ROM version H8/3045 mask ROM version H8/3044 mask ROM version
Rev. 3.00 Sep 27, 2006 page 768 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
FLMCR1--Flash Memory Control Register 1
Bit Initial value* Read/Write 7 FWE 1 R 6 SWE 0 R/W* 5 ESU 0 R/W* 4 PSU 0 R/W* 3 EV 0 R/W*
H'40
2 PV 0 R/W* 1 E 0 R/W*
Flash memory
0
P
0 R/W*
Program mode 0 1 Erase mode 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Erase mode cleared (Initial value) Transition to erase mode (Initial value) Program mode cleared (Initial value) Transition to program mode
Program-verify mode Program-verify mode cleared Transition to program-verify mode (Initial value)
Erase-verify mode Erase-verify mode cleared Transition to erase-verify mode (Initial value)
Program setup bit Program setup cleared Program setup (Initial value)
Erase setup bit Erase setup cleared Erase setup (Initial value)
Software write enable bit Write disabled Write enabled
Flash write enable bit When a low level is input to the FWE pin (hardware protection state) When a high level is input to the FWE pin
Note: * The initial value is H'00 in modes 5, 6, and 7 (on-chip flash memory enabled). In modes 1, 2, 3, and 4 (on-chip flash memory disabled), this register cannot be modified and is always read as H'FF. H8/3048F-ONE Include this register H8/3048B mask ROM version Not include this register H8/3048F H8/3048ZTAT H8/3048 mask ROM version H8/3047 mask ROM version H8/3045 mask ROM version H8/3044 mask ROM version
Rev. 3.00 Sep 27, 2006 page 769 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
FLMCR2--Flash Memory Control Register 2
Bit Initial value Read/Write 7 FLER 0 R 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W
H'41
2 0 R/W
Flash memory
1 0 R/W 0 0 R/W
Reserved bits Flash memory error
0 Flash memory is operating normally. Flash memory program/erase protection (error protection) is disabled. (Initial value) 1 This indicates that an error has occurred during flash memory programming/erasing. Flash memory program/erase protection (error protection) is enabled. Note: Bits 6 to 0 are reserved bits but are readable/writable.
H8/3048F-ONE Include this register H8/3048B mask ROM version Not include this register H8/3048F H8/3048ZTAT H8/3048 mask ROM version H8/3047 mask ROM version H8/3045 mask ROM version H8/3044 mask ROM version
Rev. 3.00 Sep 27, 2006 page 770 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
EBR1--Erase Block Register 1
Bit 7
LB7
H'42
5
LB5
Flash memory
1
LB1
6
LB6
4
LB4
3
LB3
2
LB2
0
LB0
Initial value* Read/Write
0 R/W*
0
0
0
0 R/W*
0 R/W*
0 R/W*
0 R/W*
R/W*
R/W*
R/W*
Large block 7 to 0 0 Block LB7 to LB0 is not selected 1 Block LB7 to LB0 is selected
(Initial value)
Note: * The initial value is H'00 in modes 5, 6, and 7 (on-chip flash memory enabled). In modes 1, 2, 3, and 4 (on-chip flash memory disabled), this register cannot be modified and is always read as H'FF.
H8/3048F H8/3048B mask ROM version H8/3048F-ONE H8/3048ZTAT H8/3048 mask ROM version H8/3047 mask ROM version H8/3045 mask ROM version H8/3044 mask ROM version
Include this register Not include this register
Rev. 3.00 Sep 27, 2006 page 771 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
EBR--Erase Block Register
Bit 7
EB7
H'42
6 5
EB5
Flash memory
1
EB1
4
EB4
3
EB3
2
EB2
0
EB0
EB6
Initial value* Read/Write
0 R/W*
0
0
0
0 R/W*
0 R/W*
0 R/W*
0 R/W*
R/W*
R/W*
R/W*
Erase block specification bits (1) 0 Erase protection state 1 Erasable state
Note: * The initial value is H'00 in modes 5, 6, and 7 (on-chip ROM enabled). In modes 1, 2, 3, and 4 (on-chip ROM disabled), this register cannot be modified and is always read as H'00.
H8/3048F-ONE Include this register H8/3048B mask ROM version Not include this register H8/3048F H8/3048ZTAT H8/3048 mask ROM version H8/3047 mask ROM version H8/3045 mask ROM version H8/3044 mask ROM version
Rev. 3.00 Sep 27, 2006 page 772 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
EBR2--Erase Block Register 2
Bit 7
SB7
H'43
5
SB5
Flash memory
1
SB1
6
SB6
4
SB4
3
SB3
2
SB2
0
SB0
Initial value* Read/Write
0 R/W*
0
0
0
0 R/W*
0 R/W*
0 R/W*
0 R/W*
R/W*
R/W*
R/W*
Small block 7 to 0 0 Block SB7 to SB0 is not selected 1 Block SB7 to SB0 is selected
(Initial value)
Note: * The initial value is H'00 in modes 5, 6, and 7 (on-chip flash memory enabled). In modes 1, 2, 3, and 4 (on-chip flash memory disabled), this register cannot be modified and is always read as H'FF.
H8/3048F H8/3048B mask ROM version H8/3048F-ONE H8/3048ZTAT H8/3048 mask ROM version H8/3047 mask ROM version H8/3045 mask ROM version H8/3044 mask ROM version
Include this register Not include this register
Rev. 3.00 Sep 27, 2006 page 773 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
RAMCR--RAM Control Register
Bit Initial value Read/Write Initial value Read/Write 7 Modes 1 to 4 Modes 5 to 7 1 1 6 1 1 5 1 1 4 1 1 3
H'47
2 RAM2 0 R 0 R/W
Flash memory
1 RAM1 0 R 0 R/W 0 0 0 R/W
RAMS 0 R 0 R/W
Reserved bits
RAM select, RAM2, RAM1 Bit 2 Bit 1 Bit 3 RAM Area RAM Emulation Status RAMS RAM2 RAM1 0 0/1 0/1 H'FFF000 to H'FFF3FF No emulation H'000000 to H'0003FF Mapping RAM 1 0 0 H'000400 to H'0007FF 1 H'000800 to H'000BFF 1 0 H'000C00 to H'000FFF 1
Note: Bits 7 to 4 are reserved and cannot be modified. If data is written to these bits, normal operation is not guaranteed. Bit 0 is a reserved bit but is readable/writable. H8/3048F-ONE Include this register H8/3048B mask ROM version Not include this register H8/3048F H8/3048ZTAT H8/3048 mask ROM version H8/3047 mask ROM version H8/3045 mask ROM version H8/3044 mask ROM version
Rev. 3.00 Sep 27, 2006 page 774 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
RAMCR--RAM Control Register
Bit 7
FLER
H'48
5 4 3
RAMS
Flash memory
1 0
RAM0
6
2
RAM2
1
1
1
RAM1
Initial value Read/Write
0 R/W
0 R/W
0 R/W
0 R/W
0 R/W
RAM select, RAM 2 to RAM 0 Bit 3 Bit 1 Bit 0 Bit 2 RAMS RAM 2 RAM 1 RAM 0 1/0 0 1/0 1/0 1 0 0 0 1 1 0 1 1 0 0 1 1 0 1 Flash memory error 0 Flash memory is not write/erase-protected (is not in error protect mode) 1 Flash memory is write/erase-protected (is in error protect mode)
RAM Area
H'FFF000 to H'FFF1FF H'01F000 to H'01F1FF H'01F200 to H'01F3FF H'01F400 to H'01F5FF H'01F600 to H'01F7FF H'01F800 to H'01F9FF H'01FA00 to H'01FBFF H'01FC00 to H'01FDFF H'01FE00 to H'01FFFF
(Initial value)
H8/3048F Include this register H8/3048B mask ROM version Not include this register H8/3048F-ONE H8/3048ZTAT H8/3048 mask ROM version H8/3047 mask ROM version H8/3045 mask ROM version H8/3044 mask ROM version
Rev. 3.00 Sep 27, 2006 page 775 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
DASTCR--D/A Standby Control Register
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 1
H'5C
2 1
System control
1 1 0 DASTE 0 R/W
D/A standby enable 0 D/A output is disabled in software standby mode (Initial value) 1 D/A output is enabled in software standby mode
DIVCR--Division Control Register
Bit Initial value Read/Write 7 1 6 1 5 1 7 1 3 1
H'5D
2 1
System control
1 DIV1 0 R/W 0 DIV0 0 R/W
Divide 1 and 0 Bit 1 Bit 0 DIV1 DIV0 0 0 1 0 1 1
Frequency Division Ratio 1/1 (Initial value) 1/2 1/4 1/8
Rev. 3.00 Sep 27, 2006 page 776 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
MSTCR--Module Standby Control Register
Bit Initial value Read/Write 7 PSTOP 0 R/W 6 1 5 0 R/W 4 0 R/W 3 0 R/W
H'5E
2 0 R/W 1 0
System control
0 0 R/W
MSTOP5 MSTOP4 MSTOP3 MSTOP2 MSTOP1 MSTOP0 R/W
Module standby 0 0 A/D converter operates normally (Initial value) 1 A/D converter is in standby state Module standby 1 0 Refresh controller operates normally 1 Refresh controller is in standby state Module standby 2 0 DMAC operates normally 1 DMAC is in standby state Module standby 3 0 SCI1 operates normally 1 SCI1 is in standby state Module standby 4 0 SCI0 operates normally 1 SCI0 is in standby state Module standby 5 0 ITU operates normally 1 ITU is in standby state clock stop 0 clock output is enabled (Initial value) 1 clock output is disabled (Initial value) (Initial value) (Initial value)
(Initial value)
(Initial value)
Rev. 3.00 Sep 27, 2006 page 777 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
CSCR--Chip Select Control Register
Bit Initial value Read/Write 7 CS7E 0 R/W 6 CS6E 0 R/W 5 CS5E 0 R/W 4 CS4E 0 R/W 3 1
H'5F
2 1 1 1
System control
0 1
Chip select 7 to 4 enable Bit n CSnE Description 0 Output of chip select signal CSn is disabled 1 Output of chip select signal CSn is enabled
(Initial value) (n = 7 to 4)
TSTR--Timer Start Register
Bit Initial value Read/Write 7 6 5 4 STR4 0 R/W 3 STR3 0 R/W
H'60
2 STR2 0 R/W
ITU (all channels)
1 STR1 0 R/W 0 STR0 0 R/W
1
1
1
Counter start 0 0 TCNT0 is halted 1 TCNT0 is counting Counter start 1 0 TCNT1 is halted 1 TCNT1 is counting Counter start 2 0 TCNT2 is halted 1 TCNT2 is counting Counter start 3 0 TCNT3 is halted 1 TCNT3 is counting Counter start 4 0 TCNT4 is halted 1 TCNT4 is counting
Rev. 3.00 Sep 27, 2006 page 778 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
TSNC--Timer Synchro Register
Bit Initial value Read/Write 7 1 6 1 5 1 4 SYNC4 0 R/W 3 SYNC3 0 R/W
H'61
2 SYNC2 0 R/W
ITU (all channels)
1 SYNC1 0 R/W 0 SYNC0 0 R/W
Timer sync 0 0 TCNT0 operates independently 1 TCNT0 is synchronized Timer sync 1 0 TCNT1 operates independently 1 TCNT1 is synchronized Timer sync 2 0 TCNT2 operates independently 1 TCNT2 is synchronized Timer sync 3 0 TCNT3 operates independently 1 TCNT3 is synchronized Timer sync 4 0 TCNT4 operates independently 1 TCNT4 is synchronized
Rev. 3.00 Sep 27, 2006 page 779 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
TMDR--Timer Mode Register
Bit Initial value Read/Write 7 1 6 MDF 0 R/W 5 FDIR 0 R/W 4 PWM4 0 R/W 3 PWM3 0 R/W
H'62
2 PWM2 0 R/W
ITU (all channels)
1 PWM1 0 R/W 0 PWM0 0 R/W
PWM mode 0 0 Channel 0 operates normally 1 Channel 0 operates in PWM mode PWM mode 1 0 Channel 1 operates normally 1 Channel 1 operates in PWM mode PWM mode 2 0 Channel 2 operates normally 1 Channel 2 operates in PWM mode PWM mode 3 0 Channel 3 operates normally 1 Channel 3 operates in PWM mode PWM mode 4 0 Channel 4 operates normally 1 Channel 4 operates in PWM mode Flag direction 0 OVF is set to 1 in TSR2 when TCNT2 overflows or underflows 1 OVF is set to 1 in TSR2 when TCNT2 overflows Phase counting mode flag 0 Channel 2 operates normally 1 Channel 2 operates in phase counting mode
Rev. 3.00 Sep 27, 2006 page 780 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
TFCR--Timer Function Control Register
Bit Initial value Read/Write 7 1 6 1 5 CMD1 0 R/W 4 CMD0 0 R/W 3 BFB4 0 R/W
H'63
2 BFA4 0 R/W
ITU (all channels)
1 BFB3 0 R/W 0 BFA3 0 R/W
Buffer mode A3 0 GRA3 operates normally 1 GRA3 is buffered by BRA3 Buffer mode B3 0 GRB3 operates normally 1 GRB3 is buffered by BRB3 Buffer mode A4 0 GRA4 operates normally 1 GRA4 is buffered by BRA4 Buffer mode B4 0 GRB4 operates normally 1 GRB4 is buffered by BRB4 Combination mode 1 and 0 Bit 5 Bit 4 CMD1 CMD0 Operating Mode of Channels 3 and 4 0 0 Channels 3 and 4 operate normally 1 0 1 Channels 3 and 4 operate together in complementary PWM mode 1 Channels 3 and 4 operate together in reset-synchronized PWM mode
Rev. 3.00 Sep 27, 2006 page 781 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
TCR0--Timer Control Register 0
Bit Initial value Read/Write 7 1 6 CCLR1 0 R/W 5 CCLR0 0 R/W 4 0 R/W 3 0 R/W
H'64
2 TPSC2 0 R/W 1 TPSC1 0 R/W
ITU0
0 TPSC0 0 R/W
CKEG1 CKEG0
Timer prescaler 2 to 0 Bit 2 Bit 1 Bit 0 TPSC2 TPSC1 TPSC0 0 0 0 1 1 0 1 0 1 0 1 1 0 1 Clock edge 1 and 0 Bit 4 Bit 3 CKEG1 CKEG0 0 0 1 1 -- Counted Edges of External Clock Rising edges counted Falling edges counted Both edges counted TCNT Clock Source Internal clock: Internal clock: /2 Internal clock: /4 Internal clock: /8 External clock A: TCLKA input External clock B: TCLKB input External clock C: TCLKC input External clock D: TCLKD input
Counter clear 1 and 0 Bit 6 Bit 5 CCLR1 CCLR0 TCNT Clear Source 0 0 TCNT is not cleared 1 TCNT is cleared by GRA compare match or input capture 1 0 TCNT is cleared by GRB compare match or input capture 1 Synchronous clear: TCNT is cleared in synchronization with other synchronized timers
Rev. 3.00 Sep 27, 2006 page 782 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
TIOR0--Timer I/O Control Register 0
Bit Initial value Read/Write 7 1 6 IOB2 0 R/W 5 IOB1 0 R/W 4 IOB0 0 R/W 3 1
H'65
2 IOA2 0 R/W 1 IOA1 0 R/W
ITU0
0 IOA0 0 R/W
I/O control A2 to A0 Bit 2 Bit 1 Bit 0 IOA2 IOA1 IOA0 0 0 0 1 0 1 1 0 1 0 1 0 1 1 I/O control B2 to B0 Bit 6 Bit 5 Bit 4 IOB2 IOB1 IOB0 0 0 0 1 0 1 1 0 1 0 1 0 1 1
GRA Function GRA is an output compare register
GRA is an input capture register
No output at compare match 0 output at GRA compare match 1 output at GRA compare match Output toggles at GRA compare match GRA captures rising edge of input GRA captures falling edge of input GRA captures both edges of input
GRB Function GRB is an output compare register
GRB is an input capture register
No output at compare match 0 output at GRB compare match 1 output at GRB compare match Output toggles at GRB compare match GRB captures rising edge of input GRB captures falling edge of input GRB captures both edges of input
Rev. 3.00 Sep 27, 2006 page 783 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
TIER0--Timer Interrupt Enable Register 0
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 1
H'66
2 OVIE 0 R/W 1 IMIEB 0 R/W
ITU0
0 IMIEA 0 R/W
Input capture/compare match interrupt enable A 0 IMIA interrupt requested by IMFA flag is disabled 1 IMIA interrupt requested by IMFA flag is enabled Input capture/compare match interrupt enable B 0 IMIB interrupt requested by IMFB flag is disabled 1 IMIB interrupt requested by IMFB flag is enabled Overflow interrupt enable 0 OVI interrupt requested by OVF flag is disabled 1 OVI interrupt requested by OVF flag is enabled
Rev. 3.00 Sep 27, 2006 page 784 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
TSR0--Timer Status Register 0
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 1
H'67
2 OVF 0 R/(W)* 1 IMFB 0 R/(W)*
ITU0
0 IMFA 0 R/(W)*
Input capture/compare match flag A 0 [Clearing condition] Read IMFA when IMFA = 1, then write 0 in IMFA 1 [Setting conditions] TCNT = GRA when GRA functions as an output compare register. TCNT value is transferred to GRA by an input capture signal, when GRA functions as an input capture register. Input capture/compare match flag B 0 [Clearing condition] Read IMFB when IMFB = 1, then write 0 in IMFB 1 [Setting conditions] TCNT = GRB when GRB functions as an output compare register. TCNT value is transferred to GRB by an input capture signal, when GRB functions as an input capture register. Overflow flag 0 [Clearing condition] Read OVF when OVF = 1, then write 0 in OVF 1 [Setting condition] TCNT overflowed from H'FFFF to H'0000 or underflowed from H'0000 to H'FFFF Note: * Only 0 can be written, to clear the flag.
Rev. 3.00 Sep 27, 2006 page 785 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
TCNT0 H/L--Timer Counter 0 H/L
Bit Initial value Read/Write 15 0 14 0 13 0 12 0 11 0 10 0 9 0 8 0 7 0 6 0
H'68, H'69
5 0 4 0 3 0 2 0 1 0
ITU0
0 0
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Up-counter
GRA0 H/L--General Register A0 H/L
Bit Initial value Read/Write 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1 7 1 6 1
H'6A, H'6B
5 1 4 1 3 1 2 1 1 1
ITU0
0 1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Output compare or input capture register
GRB0 H/L--General Register B0 H/L
Bit Initial value Read/Write 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1 7 1 6 1
H'6C, H'6D
5 1 4 1 3 1 2 1 1 1
ITU0
0 1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Output compare or input capture register
TCR1--Timer Control Register 1
Bit Initial value Read/Write 7 1 6 CCLR1 0 R/W 5 CCLR0 0 R/W 4 CKEG1 0 R/W 3 CKEG0 0 R/W
H'6E
2 TPSC2 0 R/W 1 TPSC1 0 R/W
ITU1
0 TPSC0 0 R/W
Note: Bit functions are the same as for ITU0.
Rev. 3.00 Sep 27, 2006 page 786 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
TIOR1--Timer I/O Control Register 1
Bit Initial value Read/Write 7 1 6 IOB2 0 R/W 5 IOB1 0 R/W 4 IOB0 0 R/W 3 1
H'6F
2 IOA2 0 R/W 1 IOA1 0 R/W
ITU1
0 IOA0 0 R/W
Note: Bit functions are the same as for ITU0.
TIER1--Timer Interrupt Enable Register 1
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 1
H'70
2 OVIE 0 R/W 1 IMIEB 0 R/W
ITU1
0 IMIEA 0 R/W
Note: Bit functions are the same as for ITU0.
TSR1--Timer Status Register 1
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 1
H'71
2 OVF 0 R/(W)* 1 IMFB 0 R/(W)*
ITU1
0 IMFA 0 R/(W)*
Notes: Bit functions are the same as for ITU0. * Only 0 can be written, to clear the flag.
TCNT1 H/L--Timer Counter 1 H/L
Bit Initial value Read/Write 15 0 14 0 13 0 12 0 11 0 10 0 9 0 8 0 7 0 6 0
H'72, H'73
5 0 4 0 3 0 2 0 1 0
ITU1
0 0
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Note: Bit functions are the same as for ITU0.
Rev. 3.00 Sep 27, 2006 page 787 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
GRA1 H/L--General Register A1 H/L
Bit Initial value Read/Write 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1 7 1 6 1
H'74, H'75
5 1 4 1 3 1 2 1 1 1
ITU1
0 1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Note: Bit functions are the same as for ITU0.
GRB1 H/L--General Register B1 H/L
Bit Initial value Read/Write 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1 7 1 6 1
H'76, H'77
5 1 4 1 3 1 2 1 1 1
ITU1
0 1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Note: Bit functions are the same as for ITU0.
TCR2--Timer Control Register 2
Bit Initial value Read/Write 7 1 6 CCLR1 0 R/W 5 CCLR0 0 R/W 4 CKEG1 0 R/W 3 CKEG0 0 R/W
H'78
2 TPSC2 0 R/W 1 TPSC1 0 R/W 0
ITU2
TPSC0 0 R/W
Notes: 1. Bit functions are the same as for ITU0. 2. When channel 2 is used in phase counting mode, the counter clock source selection by bits TPSC2 to TPSC0 is ignored.
Rev. 3.00 Sep 27, 2006 page 788 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
TIOR2--Timer I/O Control Register 2
Bit Initial value Read/Write 7 1 6 IOB2 0 R/W 5 IOB1 0 R/W 4 IOB0 0 R/W 3 1
H'79
2 IOA2 0 R/W 1 IOA1 0 R/W
ITU2
0 IOA0 0 R/W
Note: Bit functions are the same as for ITU0.
TIER2--Timer Interrupt Enable Register 2
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 1
H'7A
2 OVIE 0 R/W 1 IMIEB 0 R/W
ITU2
0 IMIEA 0 R/W
Note: Bit functions are the same as for ITU0.
TSR2--Timer Status Register 2
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 1
H'7B
2 OVF 0 R/(W)* 1 IMFB 0 R/(W)* 0
ITU2
IMFA 0 R/(W)*
The function is the same as ITU0. Overflow flag 0 [Clearing condition] Read OVF when OVF = 1, then write 0 in OVF. [Setting condition] 1 The TCNT value overflows (from H'FFFF to H'0000) or underflows (from H'0000 to H'FFFF) Notes: Bit functions are the same as for ITU0. * Only 0 can be written, to clear the flag.
Rev. 3.00 Sep 27, 2006 page 789 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
TCNT2 H/L--Timer Counter 2 H/L
Bit Initial value Read/Write 15 0 14 0 13 0 12 0 11 0 10 0 9 0 8 0 7 0 6 0
H'7C, H'7D
5 0 4 0 3 0 2 0 1 0
ITU2
0 0
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Phase counting mode: up/down counter Other modes: up-counter
GRA2 H/L--General Register A2 H/L
Bit Initial value Read/Write 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1 7 1 6 1
H'7E, H'7F
5 1 4 1 3 1 2 1 1 1
ITU2
0 1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Note: Bit functions are the same as for ITU0.
GRB2 H/L--General Register B2 H/L
Bit Initial value Read/Write 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1 7 1 6 1
H'80, H'81
5 1 4 1 3 1 2 1 1 1
ITU2
0 1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Note: Bit functions are the same as for ITU0.
Rev. 3.00 Sep 27, 2006 page 790 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
TCR3--Timer Control Register 3
Bit Initial value Read/Write 7 1 6 CCLR1 0 R/W 5 CCLR0 0 R/W 4 CKEG1 0 R/W 3 CKEG0 0 R/W
H'82
2 TPSC2 0 R/W 1 TPSC1 0 R/W
ITU3
0 TPSC0 0 R/W
Note: Bit functions are the same as for ITU0.
TIOR3--Timer I/O Control Register 3
Bit Initial value Read/Write 7 1 6 IOB2 0 R/W 5 IOB1 0 R/W 4 IOB0 0 R/W 3 1
H'83
2 IOA2 0 R/W 1 IOA1 0 R/W
ITU3
0 IOA0 0 R/W
Note: Bit functions are the same as for ITU0.
TIER3--Timer Interrupt Enable Register 3
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 1
H'84
2 OVIE 0 R/W 1 IMIEB 0 R/W
ITU3
0 IMIEA 0 R/W
Note: Bit functions are the same as for ITU0.
Rev. 3.00 Sep 27, 2006 page 791 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
TSR3--Timer Status Register 3
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 1
H'85
2 OVF 0 R/(W)* 1 IMFB 0 R/(W)*
ITU3
0 IMFA 0 R/(W)*
Overflow flag
Bit functions are the same as for ITU0
0 [Clearing condition] Read OVF when OVF = 1, then write 1 in OVF 1 [Setting condition] TCNT overflowed from H'FFFF to H'0000 or underflowed from H'0000 to H'FFFF Note: * Only 0 can be written, to clear the flag.
TCNT3 H/L--Timer Counter 3 H/L
Bit Initial value Read/Write 15 0 14 0 13 0 12 0 11 0 10 0 9 0 8 0 7 0 6 0
H'86, H'87
5 0 4 0 3 0 2 0 1 0
ITU3
0 0
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Complementary PWM mode: up/down counter Other modes: up-counter
GRA3 H/L--General Register A3 H/L
Bit Initial value Read/Write 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1 7 1 6 1
H'88, H'89
5 1 4 1 3 1 2 1 1 1
ITU3
0 1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Output compare or input capture register (can be buffered)
Rev. 3.00 Sep 27, 2006 page 792 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
GRB3 H/L--General Register B3 H/L
Bit Initial value Read/Write 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1 7 1 6 1
H'8A, H'8B
5 1 4 1 3 1 2 1 1 1
ITU3
0 1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Output compare or input capture register (can be buffered)
BRA3 H/L--Buffer Register A3 H/L
Bit Initial value Read/Write 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1 7 1 6 1
H'8C, H'8D
5 1 4 1 3 1 2 1 1 1
ITU3
0 1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Used to buffer GRA
BRB3 H/L--Buffer Register B3 H/L
Bit Initial value Read/Write 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1 7 1 6 1
H'8E, H'8F
5 1 4 1 3 1 2 1 1 1
ITU3
0 1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Used to buffer GRB
Rev. 3.00 Sep 27, 2006 page 793 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
TOER--Timer Output Enable Register
Bit Initial value Read/Write 7 1 6 1 5 EXB4 1 R/W 4 EXA4 1 R/W 3 EB3 1 R/W
H'90
2 EB4 1 R/W
ITU (all channels)
1 EA4 1 R/W 0 EA3 1 R/W
Master enable TIOCA3 0 TIOCA 3 output is disabled regardless of TIOR3, TMDR, and TFCR settings 1 TIOCA 3 is enabled for output according to TIOR3, TMDR, and TFCR settings Master enable TIOCA4 0 TIOCA 4 output is disabled regardless of TIOR4, TMDR, and TFCR settings 1 TIOCA 4 is enabled for output according to TIOR4, TMDR, and TFCR settings Master enable TIOCB4 0 TIOCB4 output is disabled regardless of TIOR4 and TFCR settings 1 TIOCB4 is enabled for output according to TIOR4 and TFCR settings Master enable TIOCB3 0 TIOCB 3 output is disabled regardless of TIOR3 and TFCR settings 1 TIOCB 3 is enabled for output according to TIOR3 and TFCR settings Master enable TOCXA4 0 TOCXA 4 output is disabled regardless of TFCR settings 1 TOCXA 4 is enabled for output according to TFCR settings Master enable TOCXB4 0 TOCXB4 output is disabled regardless of TFCR settings 1 TOCXB4 is enabled for output according to TFCR settings
Rev. 3.00 Sep 27, 2006 page 794 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
TOCR--Timer Output Control Register
Bit Initial value Read/Write 7 1 6 1 5 1 4 XTGD 1 R/W 3 1
H'91
2 1
ITU (all channels)
1 OLS4 1 R/W 0 OLS3 1 R/W
Output level select 3 0 TIOCB 3 , TOCXA 4 , and TOCXB 4 outputs are inverted 1 TIOCB 3 , TOCXA 4 , and TOCXB 4 outputs are not inverted Output level select 4 0 TIOCA 3 , TIOCA 4, and TIOCB4 outputs are inverted 1 TIOCA 3 , TIOCA 4, and TIOCB4 outputs are not inverted External trigger disable 0 Input capture A in channel 1 is used as an external trigger signal in reset-synchronized PWM mode and complementary PWM mode * 1 External triggering is disabled Note: * When an external trigger occurs, bits 5 to 0 in TOER are cleared to 0, disabling ITU output.
Rev. 3.00 Sep 27, 2006 page 795 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
TCR4--Timer Control Register 4
Bit Initial value Read/Write 7 1 6 CCLR1 0 R/W 5 CCLR0 0 R/W 4 CKEG1 0 R/W 3 CKEG0 0 R/W
H'92
2 TPSC2 0 R/W 1 TPSC1 0 R/W
ITU4
0 TPSC0 0 R/W
Note: Bit functions are the same as for ITU0.
TIOR4--Timer I/O Control Register 4
Bit Initial value Read/Write 7 1 6 IOB2 0 R/W 5 IOB1 0 R/W 4 IOB0 0 R/W 3 1
H'93
2 IOA2 0 R/W 1 IOA1 0 R/W
ITU4
0 IOA0 0 R/W
Note: Bit functions are the same as for ITU0.
TIER4--Timer Interrupt Enable Register 4
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 1
H'94
2 OVIE 0 R/W 1 IMIEB 0 R/W
ITU4
0 IMIEA 0 R/W
Note: Bit functions are the same as for ITU0.
TSR4--Timer Status Register 4
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 1
H'95
2 OVF 0 R/(W)* 1 IMFB 0 R/(W)*
ITU4
0 IMFA 0 R/(W)*
Notes: Bit functions are the same as for ITU0. * Only 0 can be written, to clear the flag.
Rev. 3.00 Sep 27, 2006 page 796 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
TCNT4 H/L--Timer Counter 4 H/L
Bit Initial value Read/Write 15 0 14 0 13 0 12 0 11 0 10 0 9 0 8 0 7 0 6 0
H'96, H'97
5 0 4 0 3 0 2 0 1 0
ITU4
0 0
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Note: Bit functions are the same as for ITU3.
GRA4 H/L--General Register A4 H/L
Bit Initial value Read/Write 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1 7 1 6 1
H'98, H'99
5 1 4 1 3 1 2 1 1 1
ITU4
0 1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Note: Bit functions are the same as for ITU3.
GRB4 H/L--General Register B4 H/L
Bit Initial value Read/Write 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1 7 1 6 1
H'9A, H'9B
5 1 4 1 3 1 2 1 1 1
ITU4
0 1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Note: Bit functions are the same as for ITU3.
BRA4 H/L--Buffer Register A4 H/L
Bit Initial value Read/Write 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1 7 1 6 1
H'9C, H'9D
5 1 4 1 3 1 2 1 1 1
ITU4
0 1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Note: Bit functions are the same as for ITU3.
Rev. 3.00 Sep 27, 2006 page 797 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
BRB4 H/L--Buffer Register B4 H/L
Bit Initial value Read/Write 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1 7 1 6 1
H'9E, H'9F
5 1 4 1 3 1 2 1 1 1
ITU4
0 1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Note: Bit functions are the same as for ITU3.
TPMR--TPC Output Mode Register
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 0 R/W
H'A0
2 0 R/W 1 0 R/W 0 0
TPC
G3NOV G2NOV
G1NOV G0NOV R/W
Group 0 non-overlap 0 Normal TPC output in group 0 Output values change at compare match A in the selected ITU channel 1 Non-overlapping TPC output in group 0, controlled by compare match A and B in the selected ITU channel Group 1 non-overlap 0 Normal TPC output in group 1 Output values change at compare match A in the selected ITU channel 1 Non-overlapping TPC output in group 1, controlled by compare match A and B in the selected ITU channel Group 2 non-overlap 0 Normal TPC output in group 2 Output values change at compare match A in the selected ITU channel 1 Non-overlapping TPC output in group 2, controlled by compare match A and B in the selected ITU channel Group 3 non-overlap 0 Normal TPC output in group 3 Output values change at compare match A in the selected ITU channel 1 Non-overlapping TPC output in group 3, controlled by compare match A and B in the selected ITU channel
Rev. 3.00 Sep 27, 2006 page 798 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
TPCR--TPC Output Control Register
Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W 3 1 R/W
H'A1
2 1 R/W 1 1 R/W 0 1
TPC
G3CMS1 G3CMS0 G2CMS1 G2CMS0 G1CMS1 G1CMS0 G0CMS1 G0CMS0 R/W
Group 0 compare match select 1 and 0 Bit 1 Bit 0 G0CMS1 G0CMS0 0 0 1 1 0 1 ITU Channel Selected as Output Trigger TPC output group 0 (TP3 to TP0) is triggered by compare match in ITU channel 0 TPC output group 0 (TP3 to TP0) is triggered by compare match in ITU channel 1 TPC output group 0 (TP3 to TP0) is triggered by compare match in ITU channel 2 TPC output group 0 (TP3 to TP0) is triggered by compare match in ITU channel 3
Group 1 compare match select 1 and 0 Bit 3 Bit 2 G1CMS1 G1CMS0 0 0 1 1 0 1 ITU Channel Selected as Output Trigger TPC output group 1 (TP7 to TP4 ) is triggered by compare match in ITU channel 0 TPC output group 1 (TP7 to TP4 ) is triggered by compare match in ITU channel 1 TPC output group 1 (TP7 to TP4 ) is triggered by compare match in ITU channel 2 TPC output group 1 (TP7 to TP4 ) is triggered by compare match in ITU channel 3
Group 2 compare match select 1 and 0 Bit 5 Bit 4 G2CMS1 G2CMS0 0 0 1 1 0 1 ITU Channel Selected as Output Trigger TPC output group 2 (TP11 to TP8 ) is triggered by compare match in ITU channel 0 TPC output group 2 (TP11 to TP8 ) is triggered by compare match in ITU channel 1 TPC output group 2 (TP11 to TP8 ) is triggered by compare match in ITU channel 2 TPC output group 2 (TP11 to TP8 ) is triggered by compare match in ITU channel 3
Group 3 compare match select 1 and 0 Bit 7 Bit 6 G3CMS1 G3CMS0 0 0 1 1 0 1 ITU Channel Selected as Output Trigger TPC output group 3 (TP15 to TP12) is triggered by compare match in ITU channel 0 TPC output group 3 (TP15 to TP12) is triggered by compare match in ITU channel 1 TPC output group 3 (TP15 to TP12) is triggered by compare match in ITU channel 2 TPC output group 3 (TP15 to TP12) is triggered by compare match in ITU channel 3
Rev. 3.00 Sep 27, 2006 page 799 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
NDERB--Next Data Enable Register B
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W
H'A2
2 0 R/W 1 0 R/W 0 0
TPC
NDER15 NDER14 NDER13 NDER12 NDER11 NDER10 NDER9 NDER8 R/W
Next data enable 15 to 8 Bits 7 to 0 NDER15 to NDER8 Description 0 TPC outputs TP15 to TP8 are disabled (NDR15 to NDR8 are not transferred to PB 7 to PB 0 ) 1 TPC outputs TP15 to TP8 are enabled (NDR15 to NDR8 are transferred to PB 7 to PB 0 )
NDERA--Next Data Enable Register A
Bit Initial value Read/Write 7 NDER7 0 R/W 6 NDER6 0 R/W 5 NDER5 0 R/W 4 0 R/W 3 0 R/W
H'A3
2 NDER2 0 R/W 1 0 R/W 0 0
TPC
NDER4 NDER3
NDER1 NDER0 R/W
Next data enable 7 to 0 Bits 7 to 0 NDER7 to NDER0 Description 0 TPC outputs TP 7 to TP0 are disabled (NDR7 to NDR0 are not transferred to PA 7 to PA 0) TPC outputs TP 7 to TP0 are enabled 1 (NDR7 to NDR0 are transferred to PA 7 to PA 0)
Rev. 3.00 Sep 27, 2006 page 800 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
NDRB--Next Data Register B * Same trigger for TPC output groups 2 and 3 Address H'FFA4
Bit Initial value Read/Write 7 NDR15 0 R/W 6 NDR14 0 R/W 5 NDR13 0 R/W 4 NDR12 0 R/W 3 NDR11 0 R/W
H'A4/H'A6
TPC
2 NDR10 0 R/W
1 NDR9 0 R/W
0 NDR8 0 R/W
Store the next output data for TPC output group 3
Store the next output data for TPC output group 2
Address H'FFA6
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 1 2 1 1 1 0 1
* Different triggers for TPC output groups 2 and 3 Address H'FFA4
Bit Initial value Read/Write 7 NDR15 0 R/W 6 NDR14 0 R/W 5 NDR13 0 R/W 4 NDR12 0 R/W 3 1 2 1 1 1 0 1
Store the next output data for TPC output group 3
Address H'FFA6
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 NDR11 0 R/W 2 NDR10 0 R/W 1 NDR9 0 R/W 0 NDR8 0 R/W
Store the next output data for TPC output group 2
Rev. 3.00 Sep 27, 2006 page 801 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
NDRA--Next Data Register A * Same trigger for TPC output groups 0 and 1 Address H'FFA5
Bit Initial value Read/Write 7 NDR7 0 R/W 6 NDR6 0 R/W 5 NDR5 0 R/W 4 NDR4 0 R/W 3 NDR3 0 R/W
H'A5/H'A7
TPC
2 NDR2 0 R/W
1 NDR1 0 R/W
0 NDR0 0 R/W
Store the next output data for TPC output group 1
Store the next output data for TPC output group 0
Address H'FFA7
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 1 2 1 1 1 0 1
* Different triggers for TPC output groups 0 and 1 Address H'FFA5
Bit Initial value Read/Write 7 NDR7 0 R/W 6 NDR6 0 R/W 5 NDR5 0 R/W 4 NDR4 0 R/W 3 1 2 1 1 1 0 1
Store the next output data for TPC output group 1
Address H'FFA7
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 NDR3 0 R/W 2 NDR2 0 R/W 1 NDR1 0 R/W 0 NDR0 0 R/W
Store the next output data for TPC output group 0
Rev. 3.00 Sep 27, 2006 page 802 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
TCSR--Timer Control/Status Register
Bit Initial value Read/Write 7 OVF 0 R/(W)* 6 WT/ IT 0 R/W 5 TME 0 R/W 4 1 3 1
H'A8
2 CKS2 0 R/W 1 CKS1 0 R/W
WDT
0 CKS0 0 R/W
Timer enable 0 Timer disabled * TCNT is initialized to H'00 and halted 1 Timer enabled * TCNT is counting * CPU interrupt requests are enabled Timer mode select 0 Interval timer: requests interval timer interrupts 1 Watchdog timer: generates a reset signal Overflow flag 0 [Clearing condition] Read OVF when OVF = 1, then write 0 in OVF 1 [Setting condition] TCNT changes from H'FF to H'00
Clock select 2 to 0 0 0 0 1 0 1 1 0 0 1 1 0 1 1
/2 /32 /64 /128 /256 /512 /2048 /4096
Note: * Only 0 can be written, to clear the flag.
Rev. 3.00 Sep 27, 2006 page 803 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
TCNT--Timer Counter
H'A9 (read), H'A8 (write)
6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W
WDT
Bit Initial value Read/Write
7 0 R/W
0 0 R/W
Count value
RSTCSR--Reset Control/Status Register
H'AB (read), H'AA (write)
4 1 3 1 2 1 1 1
WDT
Bit Initial value Read/Write
7 WRST 0 R/(W)*
6 RSTOE 0 R/W
5 1
0 1
Reset output enable 0 External output of reset signal is disabled 1 External output of reset signal is enabled Watchdog timer reset 0 [Clearing conditions] * Reset signal input at RES pin * When WRST = 1, write 0 after reading WRST flag 1 [Setting condition] TCNT overflow generates a reset signal Note: * Only 0 can be written in bit 7, to clear the flag. H8/3048F-ONE Not include this register H8/3048B mask ROM version Include this register H8/3048F H8/3048ZTAT H8/3048 mask ROM version H8/3047 mask ROM version H8/3045 mask ROM version H8/3044 mask ROM version
Rev. 3.00 Sep 27, 2006 page 804 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
RSTCSR--Reset Control/Status Register
H'AB (read), H'AA (write)
4 1 3 1 2 1 1 1
WDT
Bit Initial value Read/Write
7 WRST 0 R/(W)*1
6 0 *2
5 1
0 1
Watchdog timer reset 0 [Clearing conditions] * Reset signal input at RES pin * When WRST = 1, write 0 after reading WRST flag 1 [Setting condition] TCNT overflow generates a reset signal Notes: 1. Only 0 can be written in bit 7, to clear the flag. 2. Bit 6 must not be set to 1; in a write, 0 must always be written in this bit. H8/3048F-ONE Include this register H8/3048B mask ROM version Not include this register H8/3048F H8/3048ZTAT H8/3048 mask ROM version H8/3047 mask ROM version H8/3045 mask ROM version H8/3044 mask ROM version
Rev. 3.00 Sep 27, 2006 page 805 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
RFSHCR--Refresh Control Register
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W
H'AC
2 RFSHE 0 R/W
Refresh controller
1 1 0 RCYCE 0 R/W
SRFMD PSRAME DRAME CAS/WE M9/M8
Refresh cycle enable 0 Refresh cycles are disabled 1 Refresh cycles are enabled for area 3 Refresh pin enable 0 Refresh signal output at the RFSH pin is disabled 1 Refresh signal output at the RFSH pin is enabled Address multiplex mode select 0 8-bit column mode 1 9-bit column mode Strobe mode select 0 2 WE mode 1 2 CAS mode PSRAM enable, DRAM enable Bit 6 Bit 5 PSRAME DRAME RAM Interface 0 0 Can be used as an interval timer (DRAM and PSRAM cannot be directly connected) 1 1 0 1 DRAM can be directly connected PSRAM can be directly connected Illegal setting
Self-refresh mode 0 DRAM or PSRAM self-refresh is disabled in software standby mode 1 DRAM or PSRAM self-refresh is enabled in software standby mode
Rev. 3.00 Sep 27, 2006 page 806 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
RTMCSR--Refresh Timer Control/Status Register
Bit Initial value Read/Write 7 CMF 0 R/(W)* 6 CMIE 0 R/W 5 CKS2 0 R/W 4 CKS1 0 R/W 3 CKS0 0 R/W
H'AD
2 1
Refresh controller
1 1 0 1
Clock select 2 to 0 Bit 5 Bit 4 Bit 3 CKS2 CKS1 CKS0 0 0 0 1 0 1 1 0 0 1 1 0 1 1
Counter Clock Source Clock input is disabled /2 /8 /32 /128 /512 /2048 /4096
Compare match interrupt enable 0 The CMI interrupt requested by CMF is disabled 1 The CMI interrupt requested by CMF is enabled Compare match flag 0 [Clearing condition] Read CMF when CMF = 1, then write 0 in CMF 1 [Setting condition] RTCNT = RTCOR
Note: * Only 0 can be written, to clear the flag.
Rev. 3.00 Sep 27, 2006 page 807 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
RTCNT--Refresh Timer Counter
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W
H'AE
2 0 R/W
Refresh controller
1 0 R/W 0 0 R/W
Count value
RTCOR--Refresh Time Constant Register
Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W 3 1 R/W
H'AF
2 1 R/W
Refresh controller
1 1 R/W 0 1 R/W
Interval at which RTCNT and compare match are set
Rev. 3.00 Sep 27, 2006 page 808 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
SMR--Serial Mode Register
Bit Initial value Read/Write 7 C/A or GM* 0 R/W 6 CHR 0 R/W 5 PE 0 R/W 7 O/ E 0 R/W 3 STOP 0 R/W
H'B0
2 MP 0 R/W 1 CKS1 0 R/W 0
SCI0
CKS0 0 R/W
Multiprocessor mode 0 Multiprocessor function disabled 1 Multiprocessor format selected Stop bit length 0 One stop bit 1 Two stop bits Parity mode 0 Even parity 1 Odd parity Parity enable 0 Parity bit is not added or checked 1 Parity bit is added and checked Character length 0 8-bit data 1 7-bit data Communication mode (when using a serial communication interface) 0 Asynchronous mode 1 Synchronous mode GSM mode (when using a smart card interface) 0 Regular smart card interface operation 1 GSM mode smart card interface operation
Clock select 1 and 0 Bit 1 Bit 0 CKS1 CKS0 Clock Source 0 0 clock 1 /4 clock /16 clock 0 1 /64 clock 1
Note: * The function of this bit differs for the normal serial communication interface and for the smart card interface. Its function is switched with the SMIF bit in SCMR.
Rev. 3.00 Sep 27, 2006 page 809 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
BRR--Bit Rate Register
Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W 3 1 R/W
H'B1
2 1 R/W 1 1 R/W
SCI0
0 1 R/W
Serial communication bit rate setting
Rev. 3.00 Sep 27, 2006 page 810 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
SCR--Serial Control Register
Bit Initial value Read/Write 7 TIE 0 R/W 6 RIE 0 R/W 5 TE 0 R/W 4 RE 0 R/W 3 MPIE 0 R/W
H'B2
2 TEIE 0 R/W 1 CKE1 0 R/W 0
SCI0
CKE0 0 R/W
Clock enable 1 and 0 Bit 1 Bit 0 CKE1 CKE0 Clock Selection and Output 0 Asynchronous mode Internal clock, SCK pin available for generic I/O 0 Synchronous mode Internal clock, SCK pin used for serial clock output Asynchronous mode Internal clock, SCK pin used for clock output 1 Synchronous mode Internal clock, SCK pin used for serial clock output Asynchronous mode External clock, SCK pin used for clock input 0 1 Synchronous mode External clock, SCK pin used for serial clock input Asynchronous mode External clock, SCK pin used for clock input 1 Synchronous mode External clock, SCK pin used for serial clock input Transmit-end interrupt enable 0 Transmit-end interrupt requests (TEI) are disabled 1 Transmit-end interrupt requests (TEI) are enabled Multiprocessor interrupt enable 0 Multiprocessor interrupts are disabled (normal receive operation) 1 Multiprocessor interrupts are enabled Transmit enable 0 Transmitting is disabled 1 Transmitting is enabled Receive enable 0 Receiving is disabled 1 Receiving is enabled
Receive interrupt enable 0 Receive-data-full (RXI) and receive-error (ERI) interrupt requests are disabled 1 Receive-data-full (RXI) and receive-error (ERI) interrupt requests are enabled Transmit interrupt enable 0 Transmit-data-empty interrupt request (TXI) is disabled 1 Transmit-data-empty interrupt request (TXI) is enabled
Rev. 3.00 Sep 27, 2006 page 811 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
TDR--Transmit Data Register
Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W 3 1 R/W
H'B3
2 1 R/W 1 1 R/W
SCI0
0 1 R/W
Serial transmit data
Rev. 3.00 Sep 27, 2006 page 812 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
SSR--Serial Status Register
Bit Initial value Read/Write 7 TDRE 1 R/(W)* 6 RDRF 0 R/(W)* 5 0 R/(W)* 4 0 R/(W)* 3 PER 0 R/(W)*
H'B4
2 TEND 1 R 1 MPB 0 R 0
SCI0
ORER FER/ERS
MPBT 0 R/W
Multiprocessor bit
0 1 Multiprocessor bit value in receive data is 0 Multiprocessor bit value in receive data is 1
Multiprocessor bit transfer
0 1 Multiprocessor bit value in transmit data is 0 Multiprocessor bit value in transmit data is 1
Parity error
0 [Clearing conditions] Reset or transition to standby mode. Read PER when PER = 1, then write 0 in PER. [Setting condition] Parity error: (parity of receive data does not match parity setting O/E bit in SMR)
Transmit end
0 [Clearing conditions] Read TDRE when TDRE = 1, then write 0 in TDRE. The DMAC writes data in TDR. [Setting conditions] Reset or transition to standby mode. TE is cleared to 0 in SCR and FER/ERS is cleared to 0. TDRE is 1 when last bit of 1-byte serial character is transmitted.
1
1
Error signal status (for smart card interface) Framing error (for SCI0)
0 [Clearing conditions] Reset or transition to standby mode. Read FER when FER = 1, then write 0 in FER. [Setting condition] Framing error (stop bit is 0) 0 [Clearing conditions] Reset or transition to standby mode. Read ERS when ERS = 1, then write 0 in ERS. [Setting condition] A low error signal is received.
1
1
Overrun error Receive data register full
0 [Clearing conditions] Reset or transition to standby mode. Read RDRF when RDRF = 1, then write 0 in RDRF. The DMAC reads data from RDR. [Setting condition] Serial data is received normally and transferred from RSR to RDR 0 [Clearing conditions] Reset or transition to standby mode. Read ORER when ORER = 1, then write 0 in ORER. [Setting condition] Overrun error (reception of next serial data ends when RDRF = 1)
1
1
Transmit data register empty
0 [Clearing conditions] Read TDRE when TDRE = 1, then write 0 in TDRE. The DMAC writes data in TDR. [Setting conditions] Reset or transition to standby mode. TE is 0 in SCR Data is transferred from TDR to TSR, enabling new data to be written in TDR.
1
Note: * Only 0 can be written, to clear the flag.
Rev. 3.00 Sep 27, 2006 page 813 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
RDR--Receive Data Register
Bit Initial value Read/Write 7 0 R 6 0 R 5 0 R 4 0 R 3 0 R
H'B5
2 0 R 1 0 R
SCI0
0 0 R
Serial receive data
SCMR--Smart Card Mode Register
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 SDIR 0 R/W
H'B6
2 SINV 0 R/W 1 1
SCI0
0 SMIF 0 R/W
Smart card interface mode select 0 Smart card interface function is disabled 1 Smart card interface function is enabled Smart card data invert 0 Unmodified TDR contents are transmitted Received data is stored unmodified in RDR
(Initial value)
(Initial value)
1 Inverted TDR contents are transmitted Received data are inverted before storage in RDR Smart card data transfer direction 0 TDR contents are transmitted LSB-first (Initial value) Received data is stored LSB-first in RDR 1 TDR contents are transmitted MSB-first Received data is stored MSB-first in RDR
Rev. 3.00 Sep 27, 2006 page 814 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
SMR--Serial Mode Register
Bit Initial value Read/Write 7 C/ A 0 R/W 6 CHR 0 R/W 5 PE 0 R/W 4 O/ E 0 R/W 3 STOP 0 R/W
H'B8
2 MP 0 R/W 1 CKS1 0 R/W
SCI1
0 CKS0 0 R/W
Note: Bit functions are the same as for SCI0.
BRR--Bit Rate Register
Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W 3 1 R/W
H'B9
2 1 R/W 1 1 R/W
SCI1
0 1 R/W
Note: Bit functions are the same as for SCI0.
SCR--Serial Control Register
Bit Initial value Read/Write 7 TIE 0 R/W 6 RIE 0 R/W 5 TE 0 R/W 4 RE 0 R/W 3 MPIE 0 R/W
H'BA
2 TEIE 0 R/W 1 CKE1 0 R/W
SCI1
0 CKE0 0 R/W
Note: Bit functions are the same as for SCI0.
Rev. 3.00 Sep 27, 2006 page 815 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
TDR--Transmit Data Register
Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W 3 1 R/W
H'BB
2 1 R/W 1 1 R/W
SCI1
0 1 R/W
Note: Bit functions are the same as for SCI0.
SSR--Serial Status Register
Bit Initial value Read/Write 7 TDRE 1 R/(W)* 6 RDRF 0 R/(W)* 5 ORER 0 R/(W)* 4 FER 0 R/(W)* 3 PER 0 R/(W)*
H'BC
2 TEND 1 R 1 MPB 0 R
SCI1
0 MPBT 0 R/W
Notes: Bit functions are the same as for SCI0. * Only 0 can be written, to clear the flag.
RDR--Receive Data Register
Bit Initial value Read/Write 7 0 R 6 0 R 5 0 R 4 0 R 3 0 R
H'BD
2 0 R 1 0 R
SCI1
0 0 R
Note: Bit functions are the same as for SCI0.
Rev. 3.00 Sep 27, 2006 page 816 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
P1DDR--Port 1 Data Direction Register
Bit Modes Initial value 1 to 4 Read/Write Modes Initial value 5 to 7 Read/Write 7 1 0 W 6 1 0 W 5 1 0 W 4 1 0 W 3 1 0 W
H'C0
2 1 0 W 1 1 0 W
Port 1
0 1 0 W
P17 DDR P16 DDR P15 DDR P14 DDR P13 DDR P12 DDR P11 DDR P10 DDR
Port 1 input/output select 0 Generic input pin 1 Generic output pin
P2DDR--Port 2 Data Direction Register
Bit Modes Initial value 1 to 4 Read/Write Modes Initial value 5 to 7 Read/Write 7 1 0 W 6 1 0 W 5 1 0 W 4 1 0 W 3 1 0 W
H'C1
2 1 0 W 1 1 0 W
Port 2
0 1 0 W
P27 DDR P26 DDR P25 DDR P24 DDR P23 DDR P22 DDR P21 DDR P20 DDR
Port 2 input/output select 0 Generic input pin 1 Generic output pin
P1DR--Port 1 Data Register
Bit Initial value Read/Write 7 P17 0 R/W 6 P16 0 R/W 5 P15 0 R/W 4 P14 0 R/W 3 P13 0 R/W
H'C2
2 P12 0 R/W 1 P11 0 R/W
Port 1
0 P10 0 R/W
Data for port 1 pins
Rev. 3.00 Sep 27, 2006 page 817 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
P2DR--Port 2 Data Register
Bit Initial value Read/Write 7 P2 7 0 R/W 6 P2 6 0 R/W 5 P2 5 0 R/W 4 P2 4 0 R/W 3 P2 3 0 R/W
H'C3
2 P2 2 0 R/W 1 P2 1 0 R/W
Port 2
0 P2 0 0 R/W
Data for port 2 pins
P3DDR--Port 3 Data Direction Register
Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W 3 0 W
H'C4
2 0 W 1 0 W
Port 3
0 0 W
P3 7 DDR P3 6 DDR P3 5 DDR P3 4 DDR P3 3 DDR P3 2 DDR P3 1 DDR P3 0 DDR
Port 3 input/output select 0 Generic input pin 1 Generic output pin
P4DDR--Port 4 Data Direction Register
Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W 3 0 W
H'C5
2 0 W 1 0 W
Port 4
0 0 W
P4 7 DDR P4 6 DDR P4 5 DDR P4 4 DDR P4 3 DDR P4 2 DDR P4 1 DDR P4 0 DDR
Port 4 input/output select 0 Generic input pin 1 Generic output pin
Rev. 3.00 Sep 27, 2006 page 818 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
P3DR--Port 3 Data Register
Bit Initial value Read/Write 7 P3 7 0 R/W 6 P3 6 0 R/W 5 P3 5 0 R/W 4 P3 4 0 R/W 3 P3 3 0 R/W
H'C6
2 P3 2 0 R/W 1 P3 1 0 R/W
Port 3
0 P3 0 0 R/W
Data for port 3 pins
P4DR--Port 4 Data Register
Bit Initial value Read/Write 7 P4 7 0 R/W 6 P4 6 0 R/W 5 P4 5 0 R/W 4 P4 4 0 R/W 3 P4 3 0 R/W
H'C7
2 P4 2 0 R/W 1 P4 1 0 R/W
Port 4
0 P4 0 0 R/W
Data for port 4 pins
P5DDR--Port 5 Data Direction Register
Bit Modes Initial value 1 to 4 Read/Write Modes Initial value 5 to 7 Read/Write 7 1 1 6 1 1 5 1 1 4 1 1 3 1 0 W
H'C8
2 1 0 W 1 1 0 W
Port 5
0 1 0 W
P5 3 DDR P5 2 DDR P5 1 DDR P5 0 DDR
Port 5 input/output select 0 Generic input 1 Generic output
Rev. 3.00 Sep 27, 2006 page 819 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
P6DDR--Port 6 Data Direction Register
Bit Initial value Read/Write 7 1 6 0 W 5 0 W 4 0 W 3 0 W
H'C9
2 0 W 1 0 W
Port 6
0 0 W
P6 6 DDR P6 5 DDR P6 4 DDR P6 3 DDR P6 2 DDR P6 1 DDR P6 0 DDR
Port 6 input/output select 0 Generic input 1 Generic output
P5DR--Port 5 Data Register
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 P5 3 0 R/W
H'CA
2 P5 2 0 R/W 1 P5 1 0 R/W
Port 5
0 P5 0 0 R/W
Data for port 5 pins
P6DR--Port 6 Data Register
Bit Initial value Read/Write 7 1 6 P6 6 0 R/W 5 P6 5 0 R/W 4 P6 4 0 R/W 3 P6 3 0 R/W
H'CB
2 P6 2 0 R/W 1 P6 1 0 R/W
Port 6
0 P6 0 0 R/W
Data for port 6 pins
Rev. 3.00 Sep 27, 2006 page 820 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
P8DDR--Port 8 Data Direction Register
Bit Modes Initial value 1 to 4 Read/Write Modes Initial value 5 to 7 Read/Write 7 1 1 6 1 1 5 1 1 4 1 W 0 W 3 0 W 0 W
H'CD
2 0 W 0 W 1 0 W 0 W
Port 8
0 0 W 0 W
P8 4 DDR P8 3 DDR P8 2 DDR P8 1 DDR P8 0 DDR
Port 8 input/output select 0 Generic input 1 CS output
Port 8 input/output select 0 Generic input 1 Generic output
P7DR--Port 7 Data Register
Bit Initial value Read/Write 7 P77 * R 6 P76 * R 5 P75 * R 4 P74 * R 3 P73 * R
H'CE
2 P72 * R 1 P71 * R
Port 7
0 P70 * R
Read the pin levels for port 7
Note: * Determined by pins P77 to P70 .
P8DR--Port 8 Data Register
Bit Initial value Read/Write 7 1 6 1 5 1 4 P8 4 0 R/W 3 P8 3 0 R/W
H'CF
2 P8 2 0 R/W 1 P8 1 0 R/W
Port 8
0 P8 0 0 R/W
Data for port 8 pins
Rev. 3.00 Sep 27, 2006 page 821 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
P9DDR--Port 9 Data Direction Register
Bit Initial value Read/Write 7 1 6 1 5 0 W 4 0 W 3 0 W
H'D0
2 0 W 1 0 W
Port 9
0 0 W
P9 5 DDR P9 4 DDR P9 3 DDR P9 2 DDR P9 1 DDR P9 0 DDR
Port 9 input/output select 0 Generic input 1 Generic output
PADDR--Port A Data Direction Register
Bit Modes Initial value 3, 4, 6 Read/Write Modes Initial value 1, 2, Read/Write 5, 7 7 1 0 W 6 0 W 0 W 5 0 W 0 W 4 0 W 0 W 3 0 W 0 W
H'D1
2 0 W 0 W 1 0 W 0 W
Port A
0 0 W 0 W
PA7 DDR PA6 DDR PA5 DDR PA4 DDR PA3 DDR PA2 DDR PA1 DDR PA0 DDR
Port A input/output select 0 Generic input 1 Generic output
P9DR--Port 9 Data Register
Bit Initial value Read/Write 7 1 6 1 5 P9 5 0 R/W 4 P9 4 0 R/W 3 P9 3 0 R/W
H'D2
2 P9 2 0 R/W 1 P9 1 0 R/W
Port 9
0 P9 0 0 R/W
Data for port 9 pins
Rev. 3.00 Sep 27, 2006 page 822 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
PADR--Port A Data Register
Bit Initial value Read/Write 7 PA 7 0 R/W 6 PA 6 0 R/W 5 PA 5 0 R/W 4 PA 4 0 R/W 3 PA 3 0 R/W
H'D3
2 PA 2 0 R/W 1 PA 1 0 R/W
Port A
0 PA 0 0 R/W
Data for port A pins
PBDDR--Port B Data Direction Register
Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W 3 0 W
H'D4
2 0 W 1 0 W
Port B
0 0 W
PB7 DDR PB6 DDR PB5 DDR PB4 DDR PB3 DDR PB2 DDR PB1 DDR PB0 DDR
Port B input/output select 0 Generic input 1 Generic output
PBDR--Port B Data Register
Bit Initial value Read/Write 7 PB 7 0 R/W 6 PB 6 0 R/W 5 PB 5 0 R/W 4 PB 4 0 R/W 3 PB 3 0 R/W
H'D6
2 PB 2 0 R/W 1 PB 1 0 R/W
Port B
0 PB 0 0 R/W
Data for port B pins
Rev. 3.00 Sep 27, 2006 page 823 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
P2PCR--Port 2 Input Pull-Up MOS Control Register
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W
H'D8
2 0 R/W 1 0 R/W
Port 2
0 0 R/W
P2 7 PCR P2 6 PCR P2 5 PCR P2 4 PCR P2 3 PCR P2 2 PCR P2 1 PCR P2 0 PCR
Port 2 input pull-up MOS control 7 to 0 0 Input pull-up transistor is off 1 Input pull-up transistor is on Note: Valid when the corresponding P2DDR bit is cleared to 0 (designating generic input).
P4PCR--Port 4 Input Pull-Up MOS Control Register
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W
H'DA
2 0 R/W 1 0 R/W
Port 4
0 0 R/W
P4 7 PCR P4 6 PCR P4 5 PCR P4 4 PCR P4 3 PCR P4 2 PCR P4 1 PCR P4 0 PCR
Port 4 input pull-up MOS control 7 to 0 0 Input pull-up transistor is off 1 Input pull-up transistor is on Note: Valid when the corresponding P4DDR bit is cleared to 0 (designating generic input).
Rev. 3.00 Sep 27, 2006 page 824 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
P5PCR--Port 5 Input Pull-Up MOS Control Register
Bit Initial value Read/Write 7 6 5 4 3 0 R/W
H'DB
2 0 R/W 1 0 R/W
Port 5
0 0 R/W
1
1
1
1
P5 3 PCR P5 2 PCR P5 1 PCR P5 0 PCR
Port 5 input pull-up MOS control 3 to 0 0 Input pull-up transistor is off 1 Input pull-up transistor is on Note: Valid when the corresponding P5DDR bit is cleared to 0 (designating generic input).
DADR0--D/A Data Register 0
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W
H'DC
2 0 R/W 1 0 R/W 0 0
D/A
R/W
D/A conversion data
DADR1--D/A Data Register 1
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W
H'DD
2 0 R/W 1 0 R/W 0 0
D/A
R/W
D/A conversion data
Rev. 3.00 Sep 27, 2006 page 825 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
DACR--D/A Control Register
Bit Initial value Read/Write 7 DAOE1 0 R/W 6 DAOE0 0 R/W 5 DAE 0 R/W 4 1 3 1
H'DE
2 1 1 1 0 1
D/A
D/A enable Bit 7 Bit 6 Bit 5 DAOE1 DAOE0 DAE 0 0 1 0 1 0 1
1
0
1
Description D/A conversion is disabled in channels 0 and 1 D/A conversion is enabled in channel 0 D/A conversion is disabled in channel 1 D/A conversion is enabled in channels 0 and 1 D/A conversion is disabled in channel 0 D/A conversion is enabled in channel 1 D/A conversion is enabled in channels 0 and 1 D/A conversion is enabled in channels 0 and 1
D/A output enable 0 0 DA0 analog output is disabled 1 Channel-0 D/A conversion and DA0 analog output are enabled D/A output enable 1 0 DA1 analog output is disabled 1 Channel-1 D/A conversion and DA1 analog output are enabled
ADDRA H/L--A/D Data Register A H/L
Bit Initial value Read/Write 15 0 R 14 0 R 13 0 R 12 0 R 11 0 R 10 0 R 9 0 R 8 0 R 7 0 R 6 0 R
H'E0, H'E1
5 0 R 4 0 R 3 0 R 2 0 R 1 0 R
A/D
0 0 R
AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0
ADDRAH A/D conversion data 10-bit data giving an A/D conversion result
ADDRAL
Rev. 3.00 Sep 27, 2006 page 826 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
ADDRB H/L--A/D Data Register B H/L
Bit Initial value Read/Write 15 0 R 14 0 R 13 0 R 12 0 R 11 0 R 10 0 R 9 0 R 8 0 R 7 0 R 6 0 R
H'E2, H'E3
5 0 R 4 0 R 3 0 R 2 0 R 1 0 R
A/D
0 0 R
AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0
ADDRBH A/D conversion data 10-bit data giving an A/D conversion result
ADDRBL
ADDRC H/L--A/D Data Register C H/L
Bit Initial value Read/Write 15 0 R 14 0 R 13 0 R 12 0 R 11 0 R 10 0 R 9 0 R 8 0 R 7 0 R 6 0 R
H'E4, H'E5
5 0 R 4 0 R 3 0 R 2 0 R 1 0 R
A/D
0 0 R
AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0
ADDRCH A/D conversion data 10-bit data giving an A/D conversion result
ADDRCL
ADDRD H/L--A/D Data Register D H/L
Bit Initial value Read/Write 15 0 R 14 0 R 13 0 R 12 0 R 11 0 R 10 0 R 9 0 R 8 0 R 7 0 R 6 0 R
H'E6, H'E7
5 0 R 4 0 R 3 0 R 2 0 R 1 0 R
A/D
0 0 R
AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0
ADDRDH A/D conversion data 10-bit data giving an A/D conversion result
ADDRDL
Rev. 3.00 Sep 27, 2006 page 827 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
ADCSR--A/D Control/Status Register
Bit Initial value Read/Write 7 ADF 0 R/(W)* 6 ADIE 0 R/W 5 ADST 0 R/W 4 SCAN 0 R/W 3 CKS 0 R/W
H'E8
2 CH2 0 R/W 1 CH1 0 R/W 0 CH0 0 R/W
A/D
Clock select 0 Conversion time = 266 states (maximum) 1 Conversion time = 134 states (maximum) Channel select 2 to 0 Group Channel Selection Selection CH2 CH1 CH0 0 0 0 1 0 1 1 0 1 0 1 0 1 1
Scan mode 0 Single mode 1 Scan mode
Description Single Mode Scan Mode AN 0 AN 0 AN 1 AN 0, AN 1 AN 2 AN 0 to AN 2 AN 3 AN 0 to AN 3 AN 4 AN 4 AN 5 AN 4, AN 5 AN 6 AN 4 to AN 6 AN 7 AN 4 to AN 7
A/D start 0 A/D conversion is stopped 1 Single mode: A/D conversion starts; ADST is automatically cleared to 0 when conversion ends Scan mode: A/D conversion starts and continues, cycling among the selected channels, until ADST is cleared to 0 by software, by a reset, or by a transition to standby mode A/D interrupt enable 0 A/D end interrupt request is disabled 1 A/D end interrupt request is enabled A/D end flag 0 [Clearing condition] Read ADF while ADF = 1, then write 0 in ADF 1 [Setting conditions] Single mode: A/D conversion ends Scan mode: A/D conversion ends in all selected channels Note: * Only 0 can be written, to clear flag.
Rev. 3.00 Sep 27, 2006 page 828 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
ADCR--A/D Control Register
Bit Initial value Read/Write 7 TRGE 0 R/W 6 1 5 1 4 1 3 1
H'E9
2 1 1 1 0 1
A/D
Trigger enable 0 A/D conversion cannot be externally triggered 1 A/D conversion starts at the fall of the external trigger signal (ADTRG )
H8/3048F-ONE H8/3048F H8/3048B mask ROM version H8/3048ZTAT H8/3048 mask ROM version H8/3047 mask ROM version H8/3045 mask ROM version H8/3044 mask ROM version
Not include this register Include this register
ADCR--A/D Control Register
Bit Initial value Read/Write 7 TRGE 0 R/W 6 1 5 1 4 1 3 1
H'E9
2 1 1 1 0 0 *
A/D
Trigger enable 0 A/D conversion cannot be externally triggered 1 A/D conversion starts at the fall of the external trigger signal (ADTRG ) Note: * Bit 0 must not be set to 1; in a write, 0 must always be written in this bit. H8/3048F-ONE H8/3048F H8/3048B mask ROM version H8/3048ZTAT H8/3048 mask ROM version H8/3047 mask ROM version H8/3045 mask ROM version H8/3044 mask ROM version Include this register Not include this register
Rev. 3.00 Sep 27, 2006 page 829 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
ABWCR--Bus Width Control Register
Bit 7 ABW7 Initial value Mode 1, 3, 5, 6 1 Mode 2, 4, 7 0 R/W 6 ABW6 1 0 R/W 5 ABW5 1 0 R/W 4 ABW4 1 0 R/W 3 ABW3 1 0 R/W
H'EC
2 ABW2 1 0 R/W
Bus controller
1 ABW1 1 0 R/W 0 ABW0 1 0 R/W
Read/Write
Area 7 to 0 bus width control Bits 7 to 0 ABW7 to ABW0 Bus Width of Access Area 0 Areas 7 to 0 are 16-bit access areas Areas 7 to 0 are 8-bit access areas 1
ASTCR--Access State Control Register
Bit Initial value Read/Write 7 AST7 1 R/W 6 AST6 1 R/W 5 AST5 1 R/W 4 AST4 1 R/W 3 AST3 1 R/W
H'ED
2 AST2 1 R/W
Bus controller
1 AST1 1 R/W 0 AST0 1 R/W
Area 7 to 0 access state control Bits 7 to 0 AST7 to AST0 Number of States in Access Cycle 0 Areas 7 to 0 are two-state access areas Areas 7 to 0 are three-state access areas 1
Rev. 3.00 Sep 27, 2006 page 830 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
WCR--Wait Control Register
Bit Initial value Read/Write 7 1 6 1 5 1 4 1 3 WMS1 0 R/W
H'EE
2 WMS0 0 R/W
Bus controller
1 WC1 1 R/W 0 WC0 1 R/W
Wait mode select 1 and 0 Bit 3 Bit 2 WMS1 WMS0 Wait Mode 0 0 Programmable wait mode 1 1 0 1 No wait states inserted by wait-state controller Pin wait mode 1 Pin auto-wait mode
Wait count 1 and 0 Bit 1 Bit 0 WC1 WC0 Number of Wait States 0 0 No wait states inserted by wait-state controller 1 1 0 1 1 state inserted 2 states inserted 3 states inserted
WCER--Wait-State Controller Enable Register
Bit Initial value Read/Write 7 WCE7 1 R/W 6 WCE6 1 R/W 5 WCE5 1 R/W 4 WCE4 1 R/W 3 WCE3 1 R/W
H'EF
2 WCE2 1 R/W
Bus controller
1 WCE1 1 R/W 0 WCE0 1 R/W
Wait-state controller enable 7 to 0 0 Wait-state control is disabled (pin wait mode 0) 1 Wait-state control is enabled
Rev. 3.00 Sep 27, 2006 page 831 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
MDCR--Mode Control Register
Bit Initial value Read/Write 7 1 6 1 5 0 4 0 3 0
H'F1
2 MDS2 * R
System control
1 MDS1 * R 0 MDS0 * R
Mode select 2 to 0 Bit 2 Bit 1 Bit 0 MD2 MD1 MD0 0 0 0 1 0 1 1 0 1 0 1 1 0 1
Operating mode Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Mode 7
Note: * Determined by the state of the mode pins (MD2 to MD0).
Rev. 3.00 Sep 27, 2006 page 832 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
SYSCR--System Control Register
Bit Initial value Read/Write 7 SSBY 0 R/W 6 STS2 0 R/W 5 STS1 0 R/W 4 STS0 0 R/W 3 UE 1 R/W
H'F2
2 NMIEG 0 R/W
System control
1 1 0 RAME 1 R/W
RAM enable 0 On-chip RAM is disabled 1 On-chip RAM is enabled NMI edge select 0 An interrupt is requested at the falling edge of NMI 1 An interrupt is requested at the rising edge of NMI User bit enable 0 CCR bit 6 (UI) is used as an interrupt mask bit 1 CCR bit 6 (UI) is used as a user bit Standby timer select 2 to 0 Bit 6 Bit 5 Bit 4
Standby Timer H8/3048F-ONE STS2 STS1 STS0 * H8/3048B mask ROM version 0 Waiting time = 8,192 states 0 0 Waiting time = 8,192 states Waiting time = 16,384 states 1 Waiting time = 16,384 states Waiting time = 32,768 states 1 0 Waiting time = 32,768 states Waiting time = 65,536 states 1 Waiting time = 65,536 states 1 Waiting time = 131,072 states Waiting time = 131,072 states 0 0 Waiting time = 262,144 states Waiting time = 1,024 states 1 1 0 Waiting time = 1,024 states Illegal setting Illegal setting 1 Illegal setting
Note: * H8/3048F H8/3048ZTAT H8/3048 mask ROM version H8/3047 mask ROM version H8/3045 mask ROM version H8/3044 mask ROM version Software standby 0 SLEEP instruction causes transition to sleep mode 1 SLEEP instruction causes transition to software standby mode
Rev. 3.00 Sep 27, 2006 page 833 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
BRCR--Bus Release Control Register
Bit 7 6 A22E 1 1 R/W 5 A21E 1 1 R/W 4 1 1 3 1 1
H'F3
2 1 1
Bus controller
1 1 1 0 BRLE 0 R/W 0 R/W
A23E Modes Initial value 1 1, 2, Read/Write 5, 7 1 Modes Initial value 3, 4, 6 Read/Write R/W
Bus release enable 0 The bus cannot be released to an external device 1 The bus can be released to an external device
Address 23 to 21 enable 0 Address output 1 Other input/output
ISCR--IRQ Sense Control Register
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W
H'F4
2 0 R/W
Interrupt controller
1 0 R/W 0 0 R/W
IRQ5SC IRQ4SC IRQ3SC IRQ2SC IRQ1SC IRQ0SC
IRQ 5 to IRQ 0 sense control 0 Interrupts are requested when IRQ 5 to IRQ 0 inputs are low 1 Interrupts are requested by falling-edge input at IRQ 5 to IRQ0
Rev. 3.00 Sep 27, 2006 page 834 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
IER--IRQ Enable Register
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 IRQ5E 0 R/W 4 IRQ4E 0 R/W 3 IRQ3E 0 R/W
H'F5
2 IRQ2E 0 R/W
Interrupt controller
1 IRQ1E 0 R/W 0 IRQ0E 0 R/W
IRQ5 to IRQ 0 enable 0 IRQ 5 to IRQ 0 interrupts are disabled 1 IRQ 5 to IRQ 0 interrupts are enabled
ISR--IRQ Status Register
Bit Initial value Read/Write 7 0 6 0 5 IRQ5F 0 R/(W)* 4 IRQ4F 0 R/(W)* 3 IRQ3F 0 R/(W)*
H'F6
2 IRQ2F 0 R/(W)*
Interrupt controller
1 IRQ1F 0 R/(W)* 0 IRQ0F 0 R/(W)*
IRQ 5 to IRQ 0 flags Bits 5 to 0 IRQ5F to IRQ0F 0 Setting and Clearing Conditions [Clearing conditions] Read IRQnF when IRQnF = 1, then write 0 in IRQnF. IRQnSC = 0, IRQn input is high, and interrupt exception handling is carried out. IRQnSC = 1 and IRQn interrupt exception handling is carried out. [Setting conditions] IRQnSC = 0 and IRQn input is low. IRQnSC = 1 and a falling edge is generated in the IRQn input. (n = 5 to 0) Note: * Only 0 can be written, to clear the flag.
1
Rev. 3.00 Sep 27, 2006 page 835 of 872 REJ09B0325-0300
Appendix B Internal I/O Register
IPRA--Interrupt Priority Register A
Bit Initial value Read/Write 7 IPRA7 0 R/W 6 IPRA6 0 R/W 5 IPRA5 0 R/W 4 IPRA4 0 R/W 3 IPRA3 0 R/W
H'F8
2 IPRA2 0 R/W
Interrupt controller
1 IPRA1 0 R/W 0 IPRA0 0 R/W
Priority level A7 to A0 0 Priority level 0 (low priority) 1 Priority level 1 (high priority)
* Interrupt sources controlled by each bit
Bit 7: IPRA7 Interrupt source IRQ0 Bit 6: IPRA6 IRQ1 Bit 5: IPRA5 IRQ2, IRQ3 Bit 4: IPRA4 IRQ4, IRQ5 Bit 3: IPRA3 Bit 2: IPRA2 Bit 1: IPRA1 ITU channel 1 Bit 0: IPRA0 ITU channel 2
WDT, ITU Refresh channel Controller 0
IPRB--Interrupt Priority Register B
Bit Initial value Read/Write 7 IPRB7 0 R/W 6 IPRB6 0 R/W 5 IPRB5 0 R/W 4 0 R/W 3 IPRB3 0 R/W
H'F9
2 IPRB2 0 R/W
Interrupt controller
1 IPRB1 0 R/W 0 0 R/W
Priority level B7 to B5, B3 to B 1 0 Priority level 0 (low priority) 1 Priority level 1 (high priority)
* Interrupt sources controlled by each bit
Bit 7: IPRB7 Interrupt source ITU channel 3 Bit 6: IPRB6 ITU channel 4 Bit 5: IPRB5 DMAC Bit 4: -- -- Bit 3: IPRB3 SCI channel 0 Bit 2: IPRB2 SCI channel 1 Bit 1: IPRB1 Bit 0: --
A/D -- converter
Rev. 3.00 Sep 27, 2006 page 836 of 872 REJ09B0325-0300
Appendix C I/O Port Block Diagrams
Appendix C I/O Port Block Diagrams
C.1 Port 1 Block Diagram
Software standby Mode 7 Hardware standby External bus released Mode 1 to 4
Internal data bus (upper)
Reset R Q P1 n DDR C WP1D Reset D
Mode 7 R P1 n Q P1 nDR C WP1 D
Mode 1 to 6
RP1
Legend: WP1D: Write to P1DDR WP1: Write to port 1 RP1: Read port 1 Note: n = 0 to 7
Figure C.1 Port 1 Block Diagram (Pins P10 to P17)
Rev. 3.00 Sep 27, 2006 page 837 of 872 REJ09B0325-0300
Internal address bus
Appendix C I/O Port Block Diagrams
C.2
Port 2 Block Diagram
Reset
Internal data bus (upper)
R Q Software standby Mode 7 Hardware standby External bus released P2 n PCR C RP2P WP2P Reset Mode 1 to 4 R Q P2n DDR C WP2D Reset Mode 7 R Q P2 nDR C WP2 D D D
P2 n
Mode 1 to 6
RP2
Legend: WP2P: Write to P2PCR RP2P: Read P2PCR WP2D: Write to P2DDR WP2: Write to port 2 RP2: Read port 2
Note: n = 0 to 7
Figure C.2 Port 2 Block Diagram (Pins P20 to P27)
Rev. 3.00 Sep 27, 2006 page 838 of 872 REJ09B0325-0300
Internal address bus
Appendix C I/O Port Block Diagrams
C.3
Port 3 Block Diagram
Internal data bus (upper)
Reset Hardware standby External bus released R Mode 7 Q Write to external address P3 n DDR C WP3D Reset R Mode 7 P3 n Q P3 nDR C WP3 D D
Mode 1 to 6
RP3
Read external address Legend: WP3D: Write to P3DDR WP3: Write to port 3 RP3: Read port 3 Note: n = 0 to 7
Figure C.3 Port 3 Block Diagram (Pins P30 to P37)
Rev. 3.00 Sep 27, 2006 page 839 of 872 REJ09B0325-0300
Internal data bus (lower)
Appendix C I/O Port Block Diagrams
C.4
Port 4 Block Diagram
8-bit bus 16-bit bus mode mode Mode 7 Mode 1 to 6 Reset
Internal data bus (upper) Internal data bus (lower)
R Q P4 n PCR RP4P C WP4P Reset R Write to external address Q P4 n DDR C WP4D Reset R P4 n Q P4n DR C WP4 D D D
RP4
Read external address Legend: WP4P: Write to P4PCR RP4P: Read P4PCR WP4D: Write to P4DDR WP4: Write to port 4 RP4: Read port 4
Note: n = 0 to 7
Figure C.4 Port 4 Block Diagram (Pins P40 to P47)
Rev. 3.00 Sep 27, 2006 page 840 of 872 REJ09B0325-0300
Appendix C I/O Port Block Diagrams
C.5
Port 5 Block Diagram
Reset Q Software standby Mode 7 RP5P Hardware standby External bus released P5 n PCR C WP5P Mode 1 to 4 D
Internal data bus (upper)
R
Reset R Q P5 n DDR C WP5D Reset R Q P5n DR C D D
Mode 7
P5 n
Mode 1 to 6
WP5
RP5
Legend: WP5P: Write to P5PCR RP5P: Read P5PCR WP5D: Write to P5DDR WP5: Write to port 5 RP5: Read port 5 Note: n = 0 to 3
Figure C.5 Port 5 Block Diagram (Pins P50 to P53)
Rev. 3.00 Sep 27, 2006 page 841 of 872 REJ09B0325-0300
Internal address bus
Appendix C I/O Port Block Diagrams
C.6
Port 6 Block Diagrams
Reset
Internal data bus
R Q P60 DDR C Mode 7 WP6D Reset R P6 0 Q P60 DR C WP6 D D
Bus controller WAIT input enable
RP6 Bus controller Legend: WP6D: Write to P6DDR WP6: Write to port 6 RP6: Read port 6 WAIT input
Figure C.6 (a) Port 6 Block Diagram (Pin P60)
Rev. 3.00 Sep 27, 2006 page 842 of 872 REJ09B0325-0300
Appendix C I/O Port Block Diagrams
Reset
Internal data bus
R Q P6 1 DDR C Mode 7 WP6D Reset R P6 1 Q P61 DR C WP6 D D
Bus controller
Bus release enable
RP6
BREQ input Legend: WP6D: Write to P6DDR WP6: Write to port 6 RP6: Read port 6
Figure C.6 (b) Port 6 Block Diagram (Pin P61)
Rev. 3.00 Sep 27, 2006 page 843 of 872 REJ09B0325-0300
Appendix C I/O Port Block Diagrams
Reset R Q P6 2 DDR C WP6D Reset R P6 2 Q P62 DR C Mode 7 WP6 D Bus controller Bus release enable BACK output D
Internal data bus
RP6
Legend: WP6D: Write to P6DDR WP6: Write to port 6 RP6: Read port 6
Figure C.6 (c) Port 6 Block Diagram (Pin P62)
Rev. 3.00 Sep 27, 2006 page 844 of 872 REJ09B0325-0300
Appendix C I/O Port Block Diagrams
Software standby Mode 7 Hardware standby External bus released
Mode 7
Reset R Q P6 n DDR C WP6D Reset R D
Internal data bus
Mode 7 P6 n Q Mode 1 to 6 P6 nDR C WP6 AS output RD output HWR output LWR output D
RP6
Legend: WP6D: Write to P6DDR WP6: Write to port 6 RP6: Read port 6 Note: n = 6 to 3
Figure C.6 (d) Port 6 Block Diagram (Pins P66 to P63)
Rev. 3.00 Sep 27, 2006 page 845 of 872 REJ09B0325-0300
Appendix C I/O Port Block Diagrams
C.7
Port 7 Block Diagrams
RP7 P7n
Internal data bus
A/D converter Input enable Analog input
Legend: RP7: Read port 7 Note: n = 0 to 5
Figure C.7 (a) Port 7 Block Diagram (Pins P70 to P75)
RP7 P7n
Internal data bus
A/D converter Input enable Analog input
D/A converter Output enable Analog output Legend: RP7: Read port 7 Note: n = 6 and 7
Figure C.7 (b) Port 7 Block Diagram (Pins P76 and P77)
Rev. 3.00 Sep 27, 2006 page 846 of 872 REJ09B0325-0300
Appendix C I/O Port Block Diagrams
C.8
Port 8 Block Diagrams
Reset R Q P8 0 DDR C WP8D Reset R D
P8 0
Q P80 DR C Mode 7 WP8
D
Internal data bus
Refresh controller Output enable RFSH output Interrupt controller IRQ 0 input
RP8
Legend: WP8D: Write to P8DDR WP8: Write to port 8 RP8: Read port 8
Figure C.8 (a) Port 8 Block Diagram (Pin P80)
Rev. 3.00 Sep 27, 2006 page 847 of 872 REJ09B0325-0300
Appendix C I/O Port Block Diagrams
Reset R Q P8 n DDR C WP8D Reset Mode 7 P8 n Mode 1 to 6 Q P8n DR C WP8 R D D
Internal data bus
Bus controller
CS 1 CS 2 CS 3 output
RP8 Interrupt controller IRQ 1 IRQ 2 IRQ 3 input
Legend: WP8D Write to P8DDR WP8: Write to port 8 RP8: Read port 8 Note: n = 1 to 3
Figure C.8 (b) Port 8 Block Diagram (Pins P81 to P83)
Rev. 3.00 Sep 27, 2006 page 848 of 872 REJ09B0325-0300
Appendix C I/O Port Block Diagrams
Reset
Mode 1 to 4
S Q
R D
Internal data bus
P8 4 DDR C WP8D Reset R Mode 7 P8 4 Mode 1 to 6 Q P84 DR C WP8 D
Bus controller CS 0 output
RP8
Legend: WP8D: Write to P8DDR WP8: Write to port 8 RP8: Read port 8
Figure C.8 (c) Port 8 Block Diagram (Pin P84)
Rev. 3.00 Sep 27, 2006 page 849 of 872 REJ09B0325-0300
Appendix C I/O Port Block Diagrams
C.9
Port 9 Block Diagrams
Reset R Q P9 0 DDR C WP9D Reset R P9 0 Q P90 DR C WP9 D SCI0 Output enable Serial transmit data Guard time RP9 D
Legend: WP9D: Write to P9DDR WP9: Write to port 9 RP9: Read port 9
Figure C.9 (a) Port 9 Block Diagram (Pin P90)
Rev. 3.00 Sep 27, 2006 page 850 of 872 REJ09B0325-0300
Internal data bus
Appendix C I/O Port Block Diagrams
Reset R Q P9 1 DDR C WP9D Reset R P9 1 Q P91 DR C WP9 D SCI1 Output enable Serial transmit data D
RP9
Legend: WP9D: Write to P9DDR WP9: Write to port 9 RP9: Read port 9
Figure C.9 (b) Port 9 Block Diagram (Pin P91)
Rev. 3.00 Sep 27, 2006 page 851 of 872 REJ09B0325-0300
Internal data bus
Appendix C I/O Port Block Diagrams
Reset R Q P9 n DDR C WP9D Reset R P9 n Q P9n DR C WP9 D D
Internal data bus
SCI Input enable
RP9
Serial receive data Legend: WP9D: Write to P9DDR WP9: Write to port 9 RP9: Read port 9 Note: n = 2 and 3
Figure C.9 (c) Port 9 Block Diagram (Pins P92 and P93)
Rev. 3.00 Sep 27, 2006 page 852 of 872 REJ09B0325-0300
Appendix C I/O Port Block Diagrams
Reset R Q P9 n DDR C WP9D Reset R P9 n Q P9n DR C WP9 Clock output enable Clock output D D
Internal data bus
SCI Clock input enable
RP9
Clock input Legend: WP9D: Write to P9DDR WP9: Write to port 9 RP9: Read port 9 Note: n = 4 and 5 Interrupt controller IRQ 4 or IRQ 5 input
Figure C.9 (d) Port 9 Block Diagram (Pins P94 and P95)
Rev. 3.00 Sep 27, 2006 page 853 of 872 REJ09B0325-0300
Appendix C I/O Port Block Diagrams
C.10
Port A Block Diagrams
Reset R Q PA n DDR C WPAD Reset R D
Internal data bus
TPC
PAn
Q PA n DR C
D
TPC output enable Next data
WPA Output trigger DMA controller Output enable Transfer end output
ITU RPA Counter clock input Legend: WPAD: Write to PADDR WPA: Write to port A RPA: Read port A Note: n = 0 and 1
Figure C.10 (a) Port A Block Diagram (Pins PA0 and PA1)
Rev. 3.00 Sep 27, 2006 page 854 of 872 REJ09B0325-0300
Appendix C I/O Port Block Diagrams
Reset R Q PA n DDR C WPAD Reset R PAn Q PAn DR C D D
Internal data bus
WPA
TPC
TPC output enable Next data
Output trigger ITU Output enable Compare match output
RPA
Input capture Counter clock input
Legend: WPAD: Write to PADDR WPA: Write to port A RPA: Read port A Note: n = 2 and 3
Figure C.10 (b) Port A Block Diagram (Pins PA2 and PA3)
Rev. 3.00 Sep 27, 2006 page 855 of 872 REJ09B0325-0300
Appendix C I/O Port Block Diagrams
Software standby External bus released Hardware standby
Bus controller Chip select enable Reset R Q PAnDDR C WPAD Reset PAn Q PAnDR C R D Next data TPC output enable D
Internal address bus
Internal data bus
Address output enable CS4 CS5 CS6 output TPC
WPA
Output trigger ITU Output enable Compare match output
PRA Input capture Legend: WPAD: Write to PADDR WPA: Write to port A RPA: Read port A Note: n = 4 to 6
Figure C.10 (c) Port A Block Diagram (Pins PA4 to PA6)
Rev. 3.00 Sep 27, 2006 page 856 of 872 REJ09B0325-0300
Appendix C I/O Port Block Diagrams
Software standby External bus released Hardware standby
Bus controller
Reset R Q PA7DDR C WPAD Reset R Q PA7DR C D D
Internal address bus
Internal data bus
Address output enable
TPC
PA7
TPC output enable Next data
WPA
Output trigger ITU Output enable Compare match output
PRA Input capture Legend: WPAD: Write to PADDR WPA: Write to port A RPA: Read port A
Figure C.10 (d) Port A Block Diagram (Pin PA7)
Rev. 3.00 Sep 27, 2006 page 857 of 872 REJ09B0325-0300
Appendix C I/O Port Block Diagrams
C.11
Port B Block Diagrams
Reset
Q PB n DDR C
D
Internal data bus
WPB
R
WPBD Reset R PBn Q PB n DR C D
TPC
TPC output enable Next data
Output trigger ITU Output enable Compare match output
RPB Input capture
Legend: WPBD: Write to PBDDR WPB: Write to port B RPB: Read port B Note: n = 0 to 3
Figure C.11 (a) Port B Block Diagram (Pins PB0 to PB3)
Rev. 3.00 Sep 27, 2006 page 858 of 872 REJ09B0325-0300
Appendix C I/O Port Block Diagrams
R Q PB n DDR C WPBD Reset R PBn Q PB n DR C D D
Internal data bus
WPB
Reset
TPC
TPC output enable Next data
Output trigger ITU Output enable Compare match output
RPB
Legend: WPBD: Write to PBDDR WPB: Write to port B RPB: Read port B Note: n = 4 and 5
Figure C.11 (b) Port B Block Diagram (Pins PB4 and PB5)
Rev. 3.00 Sep 27, 2006 page 859 of 872 REJ09B0325-0300
Appendix C I/O Port Block Diagrams
R Q PB 6 DDR C WPBD Reset R PB6 Q PB6 DR C D D
Internal data bus
Reset
TPC
TPC output enable Next data
WPB Output trigger Bus controller CS7 output Chip select enable
DMAC RPB
Legend: WPBD: Write to PBDDR WPB: Write to port B RPB: Read port B
DREQ0 input
Figure C.11 (c) Port B Block Diagram (Pin PB6)
Rev. 3.00 Sep 27, 2006 page 860 of 872 REJ09B0325-0300
Appendix C I/O Port Block Diagrams
R Q PB 7 DDR C WPBD Reset R PB7 Q PB7 DR C D D
Internal data bus
Reset
TPC
TPC output enable Next data
WPB Output trigger
RPB DMAC DREQ1 input A/D converter ADTRG input
Legend: WPBD: Write to PBDDR WPB: Write to port B RPB: Read port B
Figure C.11 (d) Port B Block Diagram (Pin PB7)
Rev. 3.00 Sep 27, 2006 page 861 of 872 REJ09B0325-0300
Appendix D Pin States
Appendix D Pin States
D.1 Port States in Each Mode
Port States
Hardware Standby Mode Software Standby Mode H T T keep T 7 P27 to P20 1 to 4 5, 6 T L T T T T keep T keep T 7 P37 to P30 P47 to P40 1 to 6 7 1 to 6 8-bit bus 16-bit bus 7 P53 to P50 1 to 4 5, 6 T T T T T T L T T T T T T T T T keep T keep keep T keep T keep T 7 T T keep BusReleased Mode Program Execution, Sleep Mode RESO A7 to A0 Input port (DDR = 0) A7 to A0 (DDR = 1) I/O port A15 to A8 Input port (DDR = 0) A15 to A8 (DDR = 1) I/O port D15 to D8 I/O port I/O port D7 to D0 I/O port A19 to A16 Input port (DDR = 0) A19 to A16 (DDR = 1) I/O port
Table D.1
Pin Name RESO*
2
Mode -- -- 1 to 4 5, 6
Reset
Clock output T 2 T* T L T T T
Clock output Clock output T T T T -- T T T -- T -- keep T -- T T T --
P17 to P10
Rev. 3.00 Sep 27, 2006 page 862 of 872 REJ09B0325-0300
Appendix D Pin States Hardware Standby Mode T T T Software Standby Mode keep keep keep (BRLE = 0) T (BRLE = 1) 7 P62 1 to 6 T T T T keep keep (BRLE = 0) H (BRLE = 1) 7 P66 to P63 1 to 6 7 P77 to P70 P80 1 to 7 1 to 6 T H* T T T
3
Pin Name P60
Mode 1 to 6 7
Reset T T T
BusReleased Mode keep -- T
Program Execution, Sleep Mode I/O port WAIT I/O port I/O port BREQ
P61
1 to 6
-- L
I/O port I/O port (BRLE = 0) or BACK (BRLE = 1) I/O port AS, RD, HWR, LWR I/O port Input port
T T T T T
keep T keep T
-- T -- 1 T*
keep keep I/O port (RFSHE = 0) (RFSHE = 0) (RFSHE = 0) or RFSH RFSH H (RFSHE = 1) (RFSHE = 1) (RFSHE = 1) keep T (DDR = 0) H (DDR = 1) -- keep (DDR = 0) H (DDR = 1) -- keep (DDR = 0) H (DDR = 1) -- I/O port Input port (DDR = 0) or CS3 to CS1 (DDR = 1) I/O port Input port (DDR = 0) or CS0 (DDR = 1) I/O port
7 P83 to P81 1 to 6
T T
T T
7 P84 1 to 6
T L
T T
keep T (DDR = 0) L (DDR = 1)
7
T
T
keep
Rev. 3.00 Sep 27, 2006 page 863 of 872 REJ09B0325-0300
Appendix D Pin States Hardware Standby Mode T T T Software Standby Mode keep keep H (CS output) T (address output) keep (otherwise) 1, 2, 5, 7 PA7 PB7, PB5 to PB0 PB6 3, 4, 6 1, 2, 5, 7 1 to 7 3, 4, 6 T* 4 L* T T
4
Pin Name P95 to P90 PA3 to PA0 PA6 to PA4
Mode 1 to 7 1 to 7 3, 4, 6
Reset T T
4 T*
BusReleased Mode
1 keep* 1 keep*
Program Execution, Sleep Mode I/O port I/O port CS6 to CS4 (CS output) A23 to A21 (address output) I/O port (otherwise) I/O port A20 I/O port I/O port CS7 (CS output) I/O port (otherwise) I/O port
H (CS output) T (address output) keep (otherwise)
1 keep*
T T T T T
keep T keep keep H (CS output) keep (otherwise)
T
1 keep* 1 keep*
4 T*
H (CS output) keep (otherwise) 1 keep*
1, 2, 5, 7
T
T
keep
Legend: H: High L: Low T: High-impedance state keep: Input pins are in the high-impedance state; output pins maintain their previous state. DDR: Data direction register bit Notes: 1. The bus cannot be released in mode 7. 2. Output is low only for reset by WDT overflow. This RESO output function is only for the mask ROM, ZTAT, and flash memory (dual power supply). 3. During direct power supply, oscillation damping time is "H" or "T". 4. During direct power supply, oscillation damping time differs between "H", "L" and "T".
Rev. 3.00 Sep 27, 2006 page 864 of 872 REJ09B0325-0300
Appendix D Pin States
D.2
Pin States at Reset
Reset in T1 State Figure D.1 is a timing diagram for the case in which RES goes low during the T1 state of an external memory access cycle. As soon as RES goes low, all ports are initialized to the input state. AS, RD, HWR, and LWR go high, and the data bus goes to the high-impedance state. The address bus is initialized to the low output level 0.5 state after the low level of RES is sampled. Sampling of RES takes place at the fall of the system clock ().
Access to external address T1 T2 T3
RES Internal reset signal Address bus H'000000
CS0 High-impedance
CS7 to CS1 AS
High
RD (read access)
High
HWR, LWR (write access) Data bus (write access) I/O port
High High-impedance
High-impedance
Figure D.1 Reset during Memory Access (Reset during T1 State)
Rev. 3.00 Sep 27, 2006 page 865 of 872 REJ09B0325-0300
Appendix D Pin States
Reset in T2 State Figure D.2 is a timing diagram for the case in which RES goes low during the T2 state of an external memory access cycle. As soon as RES goes low, all ports are initialized to the input state. AS, RD, HWR, and LWR go high, and the data bus goes to the high-impedance state. The address bus is initialized to the low output level 0.5 state after the low level of RES is sampled. The same timing applies when a reset occurs during a wait state (TW).
Access to external address T1 T2 T3
RES Internal reset signal Address bus H'000000
CS0 High-impedance
CS7 to CS1
AS
RD (read access)
HWR, LWR (write access) Data bus (write access) I/O port High-impedance
High-impedance
Figure D.2 Reset during Memory Access (Reset during T2 State)
Rev. 3.00 Sep 27, 2006 page 866 of 872 REJ09B0325-0300
Appendix D Pin States
Reset in T3 State Figure D.3 is a timing diagram for the case in which RES goes low during the T3 state of an external memory access cycle. As soon as RES goes low, all ports are initialized to the input state. AS, RD, HWR, and LWR go high, and the data bus goes to the high-impedance state. The address bus outputs are held during the T3 state.The same timing applies when a reset occurs in the T2 state of an access cycle to a two-state-access area.
Access to external address T1 T2 T3
RES Internal reset signal Address bus H'000000
CS0 High-impedance
CS7 to CS1 AS
RD (read access)
HWR, LWR (write access) Data bus (write access) I/O port
High-impedance
High-impedance
Figure D.3 Reset during Memory Access (Reset during T3 State)
Rev. 3.00 Sep 27, 2006 page 867 of 872 REJ09B0325-0300
Appendix E Timing of Transition to and Recovery from Hardware Standby Mode
Appendix E Timing of Transition to and Recovery from Hardware Standby Mode
Timing of Transition to Hardware Standby Mode (1) To retain RAM contents with the RAME bit set to 1 in SYSCR, drive the RES signal low 10 system clock cycles before the STBY signal goes low, as shown below. RES must remain low until STBY goes low (minimum delay from STBY low to RES high: 0 ns).
STBY t1 10tcyc RES t2 0 ns
(2) To retain RAM contents with the RAME bit cleared to 0 in SYSCR, or when RAM contents do not need to be retained, RES does not have to be driven low as in (1). Timing of Recovery from Hardware Standby Mode Drive the RES signal low approximately 100 ns before STBY goes high.
STBY t 100 ns RES tOSC
Rev. 3.00 Sep 27, 2006 page 868 of 872 REJ09B0325-0300
Appendix F Product Code Lineup
Appendix F Product Code Lineup
Table F.1 H8/3048 Group Product Code Lineup
Product Code HD6433048BTE HD6433048BF 3 V version HD6433048BVTE HD6433048BVF H8/3048 F-ONE Flash memory version (single power supply) Flash memory version (dual power supply) PROM version 5 V version HD64F3048BTE HD64F3048BF 3 V version 64F3048TE 64F3048F Mark Code Package (Package Code) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B)
Classification of Products Product Type H8/3048B Type of ROM Mask ROM version Power Supply Specifications 5 V version
HD64F3048BVTE 64F3048VTE HD64F3048BVF 64F3048VF HD64F3048TF HD64F3048F HD64F3048VTF HD64F3048VF HD6473048TF HD6473048F HD6473048VTF HD6473048VF HD6433048(***)TF HD6433048(***)F
H8/3048F
5 V version
HD64F3048TF HD64F3048F
3 V version
HD64F3048VTF HD64F3048VF
H8/3048 ZTAT
5 V version
HD6473048TF HD6473048F
3 V version
HD6473048VTF HD6473048VF
H8/3048
Mask ROM version
5 V version
HD6433048TF HD6433048F
3 V version
HD6433048VTF HD6433048VF
HD6433048(***)VTF 100-pin TQFP (TFP-100B) HD6433048(***)VF HD6433047(***)TF HD6433047(***)F 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B)
H8/3047
Mask ROM version
5 V version
HD6433047TF HD6433047F
3 V version
HD6433047VTF HD6433047VF
HD6433047(***)VTF 100-pin TQFP (TFP-100B) HD6433047(***)VF 100-pin QFP (FP-100B)
Rev. 3.00 Sep 27, 2006 page 869 of 872 REJ09B0325-0300
Appendix F Product Code Lineup
Classification of Products Product Type H8/3045 Type of ROM Mask ROM version Power Supply Specifications 5 V version Product Code HD6433045TF HD6433045F 3 V version HD6433045VTF HD6433045VF H8/3044 Mask ROM version 5 V version HD6433044TF HD6433044F 3 V version HD6433044VTF HD6433044VF Mark Code HD6433045(***)TF HD6433045(***)F HD6433045(***)VTF HD6433045(***)VF HD6433044(***)TF HD6433044(***)F HD6433044(***)VTF HD6433044(***)VF
Package (Package Code) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B)
Note: (***) in mask ROM versions is the ROM code.
Rev. 3.00 Sep 27, 2006 page 870 of 872 REJ09B0325-0300
Appendix G Package Dimensions
Appendix G Package Dimensions
The package dimension that is shown in the Renesas Semiconductor Package Data Book has priority.
JEITA Package Code P-QFP100-14x14-0.50 RENESAS Code PRQP0100KA-A Previous Code FP-100B/FP-100BV MASS[Typ.] 1.2g
HD
*1
D
75
51
76
50 bp b1
c1
NOTE) 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
*2
HE
E
c
Terminal cross section
ZE
Reference Dimension in Millimeters Symbol
100
26
1 ZD
25
F
A1
L L1
Detail F
e
*3
y
bp
x
M
D E A2 HD HE A A1 bp b1 c c1 e x y ZD ZE L L1
Nom Max 14 14 2.70 15.7 16.0 16.3 15.7 16.0 16.3 3.05 0.00 0.12 0.25 0.17 0.22 0.27 0.20 0.12 0.17 0.22 0.15 0 8 0.5 0.08 0.10 1.0 1.0 0.3 0.5 0.7 1.0
Min
A
A2
Figure G.1 Package Dimensions (FP-100B)
Rev. 3.00 Sep 27, 2006 page 871 of 872 REJ09B0325-0300
c
Appendix G Package Dimensions
JEITA Package Code P-TQFP100-14x14-0.50 RENESAS Code PTQP0100KA-A Previous Code TFP-100B/TFP-100BV MASS[Typ.] 0.5g
HD
*1
D 51
75
76
50
NOTE) 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp b1
c1
*2
HE
E
c
Terminal cross section
ZE
Reference Dimension in Millimeters Symbol
100
26
A2
1 ZD Index mark
25
A
F
A1
L L1
Detail F
e
*3
y
bp
x
M
D E A2 HD HE A A1 bp b1 c c1 e x y ZD ZE L L1
Nom Max 14 14 1.00 15.8 16.0 16.2 15.8 16.0 16.2 1.20 0.00 0.10 0.20 0.17 0.22 0.27 0.20 0.12 0.17 0.22 0.15 0 8 0.5 0.08 0.10 1.00 1.00 0.4 0.5 0.6 1.0
Min
Figure G.2 Package Dimensions (TFP-100B)
Rev. 3.00 Sep 27, 2006 page 872 of 872 REJ09B0325-0300
c
Renesas 8-Bit Single-Chip Microcomputer Hardware Manual H8/3048B Group
Publication Date: 1st Edition, August 2002 Rev.3.00, September 27, 2006 Published by: Sales Strategic Planning Div. Renesas Technology Corp. Edited by: Customer Support Department Global Strategic Communication Div. Renesas Solutions Corp.
(c)2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
http://www.renesas.com
Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510
Colophon 6.0
H8/3048B Group Hardware Manual


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